低接触电阻率Ni/Ag/Ti/Au反射镜电极的研究

研究了Ag的厚度、退火时间、沉积温度对于Ni/Ag/Ti/Au电极的反射率及与p-GaN欧姆接触性能的影响. 利用分光光度计测量反射率, 采用圆形传输线模型计算比接触电阻率. 结果表明: 随着Ag厚度的增加, Ni/Ag/Ti/Au电极的反射率逐渐增大; 在氧气氛围中, 随着退火时间从1 min增至10 min, 300 ℃退火时, 比接触电阻率持续下降, 而对于400-600 ℃退火, 比接触电阻率先减小后增大; 在300和400 ℃氧气中进行1-10 min 的退火后, Ni/Ag/Ti/Au的反射率变化较小, 退火温度高于400 ℃时, 随着退火时间的增加, 反射率急剧下降; 在400 ℃氧气中3 min退火后, 比接触电阻率可以达到3.6×10^-3 Ω·cm². 此外, 适当提高沉积温度可以增加Ni/Ag/Ti/Au的反射率并降低比接触电阻率, 沉积温度为120 ℃条件下的Ni/Ag/Ti/Au电极在450 nm处反射率达到90.1%, 比接触电阻率为6.4×10^-3 Ω·cm². 综合考虑电学和光学性能, 在沉积温度为120 ℃下蒸镀Ni/Ag/Ti/Au (1/200/100/100 nm)并在400 ℃氧气中进行3 min退火可以得到较优化的电极. 利用此电极制作的垂直结构发光二极管在350 mA电流下的工作电压为2.95 V, 输出光功率为387.1 mW, 电光转换效率达到37.5%.     

金属与半导体Ge欧姆接触制备、性质及其机理分析

金属与Ge材料接触时界面处存在着强烈的费米钉扎效应, 尤其与n型Ge形成的欧姆接触的比接触电阻率高, 是制约Si基Ge器件性能的关键因素之一. 本文对比了分别采用金属Al和Ni 与Si衬底上外延生长的p型Ge和n型Ge材料的接触特性. 发现在相同的较高掺杂条件下, NiGe与n型Ge可形成良好的欧姆接触, 其比接触电阻率 较 Al接触降低了一个数量级, 掺P浓度为2×10¹⁹ cm^-3时达到1.43×10^-5 Ω·cm². NiGe与p型Ge接触和Al接触的比接触电阻率相当, 掺B浓度为4.2×10¹⁸ cm^-3时达到1.68×10^-5 Ω·cm². NiGe与n型Ge接触和Al电极相比较, 在形成NiGe过程中, P杂质在界面处的偏析是其接触电阻率降低的主要原因. 采用NiGe作为Ge的接触电极在目前是合适的选择. 关键词： 金属与Ge接触性质 NiGe 比接触电阻率     

退火温度和退火气氛对Ni/Au与p-GaN之间欧姆接触性能的影响

研究了不同退火温度和气氛对Ni/Au与p-GaN之间欧姆接触性能的影响. 采用圆形传输线模型方法得到不同退火温度和不同退火气氛下的比接触电阻率. 结果表明, 较适宜的退火温度为500 ℃左右, 退火温度太高或太低都会导致比接触电阻率的增大; 较适宜的退火气氛为适量含氧的氮气气氛, 且氧气含量对比接触电阻率大小的影响并不显著. 经过对退火条件的优化, 得到的比接触电阻率可达7.65×10^-4 Ω·cm². 关键词： p-GaN 欧姆接触 圆形传输线模型 快速热退火     

Ni/Au与N掺杂p型ZnO的欧姆接触

研究了Au,In,Ni/Au三种不同金属膜与N掺杂p型ZnO的接触特性,发现Ni/Au双层膜更适合作为其欧姆电极材料,并比较了不同气氛和不同温度退火对Ni/Au电极的影响.发现在O₂中退火电极性能发生蜕变,而在N₂中退火性能得到改善.指出即使在N₂中退火,退火温度的选择也是至关重要的,本实验在400℃,氮气气氛下退火150s,得到了较好的欧姆接触特性.     

RF-sputtered CrB2 diffusion barrier for Ni/Au Ohmic contacts on p-CuCrO2

Ohmic contacts to p-type CuCrO₂ using Ni/Au/CrB₂/Ti/Au contact metallurgy are reported. The samples were annealed in the 200–700 °C range for 60 s in flowing oxygen ambient. A minimum specific contact resistance of 2 × 10⁻⁵ Ω cm² was obtained after annealing at 400 °C. Further increase in the annealing temperature (>400 °C) resulted in the degradation of contact resistance. Auger Electron Spectroscopy (AES) depth profiling showed that out-diffusion of Ti to the surface of the contact stacks was evident by 400 °C, followed by Cr at higher temperature. The CrB₂ diffusion barrier decreases the specific contact resistance by almost two orders of magnitude relative to Ni/Au alone.     

Self-aligned-gate AlGaN/GaN heterostructure field-effect transistor with titanium nitride gate

Self-aligned-gate heterostructure field-effect transistor(HFET) is fabricated using a wet-etching method.Titanium nitride(TiN) is one kind of thermal stable material which can be used as the gate electrode.A Ti/Au cap layer is fixed on the gate and acts as an etching mask.Then the T-shaped gate is automatically formed through over-etching the TiN layer in 30% H_2O_2 solution at 95 ℃.After treating the ohmic region with an inductively coupled plasma(ICP) method,an Al layer is sputtered as an ohmic electrode.The ohmic contact resistance is approximately 0.3 Ω·mm after annealing at a low-temperature of 575 ℃ in N_2 ambient for 1 min.The TiN gate leakage current is only 10~(-8) A after the low-temperature ohmic process.The access region length of the self-aligned-gate(SAG) HFET was reduced from 2 μm to 0.3 μm compared with that of the gate-first HFET.The output current density and transconductance of the device which has the same gate length and width are also increased.     

H_2气氛退火处理对Nb掺杂TiO_2薄膜光电性能的影响

采用电子束沉积方法,以钛酸锶(SrTiO3)为衬底制备铌(Nb)掺杂TiO2薄膜并研究后续H2气氛退火处理对其薄膜样品光电性能的影响.结果发现H2气氛热退火处理能有效改善Nb掺杂TiO2薄膜的导电率,最佳电阻率达到5.46×10-3Ω·cm,在可见光范围内的透光率为60%—80%.导电性能的改善与H2气氛退火处理后多晶薄膜的晶粒尺寸变大和大量的氧空位形成及H原子掺杂有关.     

Etching mask optimization of InAs/GaSb superlattice mid-wavelength infared 640×512 focal plane array

In this paper we focused on the mask technology of inductively coupled plasma(ICP) etching for the mesa fabrication of infrared focal plane arrays(FPA).By using the SiO_2 mask,the mesa has higher graphics transfer accuracy and creates less micro-ripples in sidewalls.Comparing the IV characterization of detectors by using two different masks,the detector using the SiO_2 hard mask has the R_0A of 9.7×10~6 Ω·cm~2,while the detector using the photoresist mask has the R_0A of3.2 × 10~2 Ω·cm~2 in 77 K.After that we focused on the method of removing the remaining SiO_2 after mesa etching.The dry ICP etching and chemical buffer oxide etcher(BOE) based on HF and NH4 F are used in this part.Detectors using BOE only have closer R_0A to that using the combining method,but it leads to gaps on mesas because of the corrosion on AlSb layer by BOE.We finally choose the combining method and fabricated the 640×512 FPA.The FPA with cutoff wavelength of 4.8 μm has the average R_0A of 6.13 × 10~9 Ω·cm~2 and the average detectivity of 4.51 × 10~9 cm·Hz~(1/2).W~(-1)at 77 K.The FPA has good uniformity with the bad dots rate of 1.21%and the noise equivalent temperature difference(NEDT) of 22.9 mK operating at 77 K.     

铜-钼源漏电极对非晶氧化铟镓锌薄膜晶体管性能的改善

在铜(Cu)和非晶铟镓锌氧化物(a-IGZO)之间插入30 nm厚的钼(Mo)接触层, 制备了具有Cu-Mo源漏电极的a-IGZO薄膜晶体管(TFT). Mo接触层不仅能够抑制Cu与a-IGZO有源层之间的扩散, 而且提高了Cu电极与玻璃基底以及栅极绝缘层的结合强度. 制备的Cu-Mo结构TFT与纯Cu 结构TFT相比, 具有较高的迁移率(～9.26 cm²·V^-1·s^-1)、更短的电流传输长度(～0.2 μm)、更低的接触电阻(～1072 Ω)和有效接触电阻率(～1×10^-4Ω·cm²), 能够满足TFT 阵列高导互联的要求.     

流延法制备高锂离子电导Li_(1.4)Al_(0.4)Ti_(1.6)(PO_4)_3固态电解质及其环氧树脂改性

以溶胶凝胶法合成的高纯Li_(1.4)Al_(0.4)Ti_(1.6)(PO_4)_3(LATP)纳米晶体粉末为原料,通过流延法成膜,在950℃下煅烧5 h合成LATP固态电解质片;对其进行环氧树脂改性后,能量色散X射线光谱元素图像表明环氧树脂完全浸入LATP内部,可以有效防止水渗透.研究发现流延法合成的LATP固态电解质在25℃?C时电导率高达8.70×10~(-4)S·cm~(-1)、活化能为0.36 eV、相对密度为89.5%.经过环氧树脂改性后电导率仍高达3.35×10-4S·cm-1、活化能为0.34 e V、相对密度为93.0%.高电导隔水的环氧树脂改性LATP固态电解质可作为锂金属保护薄膜用于新型高比容量电池.     

Er3+/Yb3+共掺锗碲酸盐玻璃的光谱性质及Judd-Ofelt理论分析

用高温熔融法制备了一种Er³⁺/Yb³⁺共掺的70TeO₂-5Li₂O-10B₂O₃-15GeO₂玻璃,测试和分析了其热稳定性、吸收光谱、荧光光谱以及红外吸收谱。应用Judd-Ofelt理论计算了玻璃中Er³⁺的强度参数、自发辐射跃迁几率、辐射寿命以及荧光分支比,同时比较了OH^-的存在对玻璃发光特性的影响。结果表明:这种玻璃具有较好的热稳定性,较宽的荧光半峰全宽和较大的受激发射截面,是一种较为合适的宽带光纤放大器的基质材料,OH^-的存在使得Er³⁺离子的荧光强度降低,荧光寿命减小。     

掺Er3+碲酸盐玻璃的光谱性质与Judd-Ofelt理论分析

用高温熔融法制备了碲酸盐玻璃(70TeO₂-9B₂O₃-6Nb₂O₅-5Na₂O-10ZnO-1%(质量分数)Er₂O₃)样品。测试了玻璃样品的吸收光谱和荧光光谱。应用Judd-Ofelt理论计算了Er³⁺离子的谱线强度、自发辐射跃迁几率、荧光分支比、辐射寿命等光谱参数,并拟合了相应的强度参数Ω_t(t=2,4,6)(Ω₂=8.01×10^-20cm²,Ω₄=2.09×10^-20cm²,Ω₆=1.15×10^-20cm²)。结果发现该碲酸盐玻璃具有较大的Ω₂值,说明Er—O键的共价性强于它在硅酸盐、锗酸盐、氟化物、铋酸盐和磷酸盐玻璃中的共价性。Er³⁺在碲酸盐玻璃中⁴I_13/2→⁴I_15/2跃迁几率约为492s^-1,表明Er³⁺可能有较强的1.5μm发射。分析了Er³⁺在碲酸盐玻璃中能级⁴I_13/2→⁴I_15/2发射的荧光半峰全宽(FWHM=73nm),并应用McCumber理论计算了Er³⁺的受激发射截面(σ_e=1.08×10^-20cm²),发现其FWHM×σ_e远大于Er³⁺在铋酸盐、磷酸盐、锗酸盐和硅酸盐玻璃中的受激发射截面,说明碲酸盐玻璃是一种制备宽带光纤放大器的优良基质材料。     

Optoelectronic properties of SnO_2 thin films sprayed at different deposition times

This article presents the elaboration of tin oxide(SnO_2) thin films on glass substrates by using a home-made spray pyrolysis system. Effects of film thickness on the structural, optical, and electrical film properties are investigated. The films are characterized by several techniques such as x-ray diffraction(XRD), atomic force microscopy(AFM), ultravioletvisible(UV–Vis) transmission, and four-probe point measurements, and the results suggest that the prepared films are uniform and well adherent to the substrates. X-ray diffraction(XRD) patterns show that SnO_2 film is of polycrystal with cassiterite tetragonal crystal structure and a preferential orientation along the(110) plane. The calculated grain sizes are in a range from 32.93 nm to 56.88 nm. Optical transmittance spectra of the films show that their high transparency average transmittances are greater than 65% in the visible region. The optical gaps of SnO_2 thin films are found to be in a range of 3.64 e V–3.94 e V. Figures of merit for SnO_2 thin films reveal that their maximum value is about 1.15 × 10-4-1?atλ = 550 nm. Moreover, the measured electrical resistivity at room temperature is on the order of 10-2?·cm.     

溶胶凝胶法制备以HfO2为绝缘层和ZITO为有源层的高迁移率薄膜晶体管

采用溶胶凝胶法制备了h-k氧化铪HfO₂薄膜, 经500℃退火后, 获得了高透过率、表面光滑、低漏电流和相对高介电常数的HfO₂薄膜. 并采用氧化铪作为绝缘层和锌铟锡氧化物作为有源层成功地制备了底栅顶接触结构薄膜晶体管器件. 获得的薄膜晶体管器件的饱和迁移率大于100 cm²·V^-1·s^-1, 阈值电压为-0.5 V, 开关比为5×10⁶, 亚阈值摆幅为105 mV/decade. 表明采用溶胶凝胶制备的薄膜晶体管具备高的迁移率, 其迁移率接近低温多晶硅薄膜晶体管的迁移率.     

Crystal growth,spectral properties and Judd–Ofelt analysis of Pr: CaF_2-YF_3

The 0.6 at.% Pr~(3+)-doped CaF_2-YF_3 crystal was successfully grown by the temperature gradient technique(TGT).X-ray diffraction analysis showed that the grown crystal still had cubic structure. The absorption spectrum, emission spectrum, Judd–Ofelt analysis and fluorescence decay curve at room temperature were discussed. The fluorescence lifetime of Pr: CaF_2-YF_3 crystal was 45.46 μs, and the σem ·τ of ~3P_0→~3H_6 and ~3P_0→~3F_2 transitions were calculated to be 80.92 × 10~(-20) cm~2·μs and 388.7 × 10~(-20) cm~2·μs, respectively. The FWHMs are 20.1 nm and 6.8 nm, which are higher than those of Pr: LiYF_4, Pr:LiLuF_4, Pr: LiGdF_4 and Pr: BaY_2F_8 crystals. The results show that the Pr: CaF_2-YF_3 crystal is expected to achieve 605 nm orange light and 642 nm red light laser operation.     

Electrode contact study for SiGe thin film operated at high temperature

A study on the electrode contact of the sputtered SiGe thin film is reported for application of devices working at high temperature. Surface morphological characterization with optical microscope and AFM (atomic force microscope) together with the electrical characterization by TLM measurements (transmission line method) were performed before and after aging at 500 °C for 24 h using various sputtered multilayer electrodes, Ti/Au/Ti, Ta/Pt/Ta and Ti/Pt/Ti, on 300-nm B-doped SiGe thin film deposited by magnetron sputtering and furnace crystallisation at high temperature. After aging at 500 °C for 24 h, the Ti/Au/Ti multilayer electrodes seriously degraded to be non-ohmic contact, showing rough surface morphology. The Ti/Pt/Ti metal layers showed the lowest specific contact, resistivity before and after aging, 1.46 × 10⁻³ Ω cm² and 1.68 × 10² Ω cm² respectively.     

超薄EuF3电极修饰层对有机场效应晶体管性能的提升

采用EuF₃薄层修饰低功函数金属Ag源、漏电极,制备了CuPc有机场效应晶体管,研究了不同厚度EuF₃对器件性能的影响。结果表明,EuF₃的厚度由0 nm增至0.6 nm时,接触电阻由23.65×10⁵ Ω·cm减 至3.86×10⁵ Ω·cm,使得器件载流子迁移率由1.5×10^-3 cm²·V^-1·s^-1提高到4.65×10^-3 cm²·V^-1·s^-1。 UPS测试结果表明,薄层EuF₃在Ag与有机半导体间形成了界面偶极势垒,使源漏电极表面功函数增大,空穴注入势垒降低,Ag电极与有机半导体层界面的接触电阻减小,进而提升了空穴的注入效率。     

High-Temperature Characteristics of Ti/Al/Ni/Au Ohmic Contacts to n-GaN

We present the high-temperature characteristics of Ti/Al/Ni/Au（15 nm/220 nm/40 nm/50 nm） multiplayer contacts to n-type GaN （Nd = 3.7 × 10^17 cm^-3, Nd = 3.0 × 10^18 cm^-3）. The contact resistivity increases with the measurement temperature. Furthermore, the increasing tendency is related to doping concentration. The higher the doped, the slower the contact resistivity with decreasing measurement temperature. Ti/Al/Ni/Au ohmic contact to heavy doping n-GaN takes on better high temperature reliability. According to the analyses of XRD and AES for the n-GaN/Ti/Al/Ni/Au, the Au atoms permeate through the Ni layer which is not thick enough into the AI layer even the Ti layer.     

生长条件对脉冲激光沉积制备ZnO：Al薄膜光电性能的影响

本文研究了脉冲激光沉积(PLD)生长过程中, 铝掺量、氧压及衬底温度等实验参数对ZnO:Al(AZO)薄膜生长的影响, 并利用扫描电子显微镜、原子力显微镜、X射线衍射、霍尔效应、光透射光谱等实验手段对其透明导电性能进行了探讨. 变温霍尔效应和光透射测量表明, 当靶材中铝掺量大于0.5 wt%时, 所制备AZO薄膜中铝施主在80 K时已完全电离, 因Bernstein-Moss (BM) 效应其带隙变大, 均为重掺杂简并半导体. 进一步系统研究了氧压和衬底温度对AZO薄膜透明导电性能的影响, 实验发现当氧压为1 Pa, 衬底温度为200 ℃时, AZO 导电性能最好, 其霍尔迁移率为28.8 cm²/V·s, 薄膜电阻率最小可达2.7×10^-4 Ω·cm, 且在可见光范围内光透过率超过了85%. 氧压和温度的增加, 都会导致薄膜电阻率变大. 关键词： 脉冲激光沉积法 ZnO：Al薄膜 透光性 导电性     

不同退火方式对Ni/SiC接触界面性质的影响

采用快速热退火(rapid thermal annealing, RTA)法和脉冲激光辐照退火(laser spark annealing, LSA)法, 在n型4H-SiC的Si面制备出Ni电极欧姆接触. 经传输线法测得RTA样品与LSA样品的比接触电阻分别为5.2×10^-4 Ω·cm², 1.8× 10^-4 Ω·cm². 使用扫描电子显微镜、原子力显微镜、透射电子显微镜、拉曼光谱等表征手段, 比较了两种退火方式对电极表面形貌、电极/衬底截面形貌和元素成分分布、SiC衬底近表层碳团簇微结构的影响. 结果表明, 相比于RTA, LSA法制备出的欧姆接触在电极表面形貌、界面形貌、电极层组分均匀性等方面都具有明显优势, 有望使LSA成为一种非常有潜力的制备欧姆接触的退火处理方法.