新型复合盖层延伸波长InGaAs红外探测器结构优化设计

设计并模拟计算了延伸波长至2.6 μm的复合盖层材料PIN结构In_0.82Ga_0.18As红外探测器,即PNN型盖层、PIN结构的In_0.82Ga_0.18As红外探测器。研究了不同厚度及载流子浓度的PNN盖层对探测器性能的影响。研究结果表明:在In_0.82Al_0.18As厚度为200 nm且载流子浓度为2E18、InAs_0.6P_0.4 厚度为50 nm且载流子浓度为2E17、In_0.82Ga_0.18As厚度为50 nm且载流子浓度为2E16时,探测器表现出最佳的性能。与传统PIN结构探测器相比,其相对光谱响应度仅降低10%,暗电流降低了1个数量级。计算分析了不同工作温度下的暗电流,结果显示:在120~250 K时,暗电流主要为缺陷隧穿电流;在250~300 K时,暗电流主要为带间隧穿电流;当温度大于300 K时,暗电流主要为产生-复合电流和扩散电流。     

晶格匹配InAlN/GaN异质结肖特基接触反向电流的电压与温度依赖关系

测量了晶格匹配InAlN/GaN异质结肖特基接触的反向变温电流-电压特性曲线,研究了反向漏电流的偏压与温度依赖关系.结果表明:1)电流是电压和温度的强函数,饱和电流远大于理论值,无法采用经典热发射模型解释;2)在低偏压区,数据满足ln(I/E)-E^1/2线性依赖关系,电流斜率和激活能与Frenkel-Poole模型的理论值接近,表明电流应该为FP机制占主导;3)在高偏压区,数据满足ln(I/E)-E^1/2线性依赖关系,电流斜率不随温度改变,表明Fowler-Nordheim隧穿机制占主导;4)反向电流势垒高度约为0.60 eV,远低于热发射势垒高度2.91 eV,表明可导位错应是反向漏电流的主要输运通道,局域势垒由于潜能级施主态电离而被极大降低.     

基于量子限制的受主带间跃迁太赫兹探测器的制备与测量

使用分子束外延生长设备,在GaAs（100）衬底上生长了量子阱宽度为3 nm的GaAs/AlAs多量子阱样品,并在量子阱层中央进行了Be受主的δ-掺杂。根据量子限制受主从束缚态到非束缚态之间的跃迁,设计并制备了δ-掺杂Be受主GaAs/AlAs多量子阱太赫兹光探测器原型器件。在4.2 K温度下,分别对器件进行了太赫兹光电流谱和暗电流-电压曲线的测量。在6 V直流偏压下,空穴载流子沿量子阱层方向输运。当正入射激光频率为6.8 THz时,器件响应率为2×10^-4 V/W（2 μA/W）。通过器件的暗电流-电压曲线计算了器件全散粒噪声电流,在4.2 K、6 V直流偏压下,全散粒噪声电流为5.03 fA·Hz^-1/2。     

SOI基高响应度TFET探测器的设计与仿真

提出一种SOI基的新型隧穿场效应晶体管(TFET)探测器结构,将光电二极管与TFET结合,实现光信号的探测放大。光电二极管的正极与TFET的栅极互连,感光后光电二极管的光生电势调控TFET的沟道势垒,控制TFET的输出电流,实现光信号到电流信号的转化。陡峭的亚阈值摆幅能有效放大输出电流,提高TFET探测器的响应度。应用SILVACO完成探测器结构和性能的模拟仿真。光电二极管的光生电势通过较薄的BOX区形成了TFET的底部栅压,增强了对沟道势垒的控制能力,增大了输出电流,结果表明,探测器对弱光具有较高的响应度,当入射光强小于10mW/cm~2时,响应度可超过10~4 A/W。此外,通过调整光电二极管的反偏电压、在源区与沟道间插入n~+口袋等方法可显著提高探测器的输出电流和响应度。     

不同钝化结构对非极性AlGaN-MSM紫外探测器性能的提升

在r面蓝宝石衬底上,采用金属有机化学气相沉积（MOCVD）法高温生长了未掺杂非极性AlGaN半导体薄膜,在此基础上制备了金属-半导体-金属（MSM）结构的紫外探测器。系统研究了在AlGaN半导体薄膜表面分别磁控溅射SiO₂纳米颗粒与SiO₂钝化层两种钝化手段对非极性AlGaN-MSM结构的紫外探测器性能的影响。实验结果表明：磁控溅射SiO₂纳米颗粒钝化或SiO₂钝化层两种手段都能提升AlGaN-MSM结构紫外探测器性能。暗电流测试表明,SiO₂纳米颗粒和SiO₂钝化层可使器件暗电流下降1~2个数量级,达到nA量级。光谱响应测试发现,在5 V偏压下,探测器在300 nm处具有陡峭的截止边,这表明其具有很好的深紫外特性,光谱响应提高了10³倍,紫外可见抑制比高达10⁵。     

MoS2/MoTe2垂直异质结的电荷传输及其调制

二维材料异质结器件具有纳米级厚度及范德瓦耳斯接触表面,因而表现出独特的光电特性.本文构建了栅压可调的MoS₂/MoTe₂垂直异质结器件,利用开尔文探针力显微镜(KPFM)技术结合电输运测量,揭示了MoS₂/MoTe₂异质结分别在黑暗和532 nm激光照射条件下的电荷输运行为,发现随着栅压的变化异质结表现出从n-n⁺结到p-n结的反双极性特征.系统地解释了MoS₂/MoTe₂异质结的电荷输运机制,包括n-n⁺结和p-n结在正偏和反偏下条件下的电荷输运过程、随栅压变化而发生的转变的结区行为、接触势垒对电荷输运的影响、n-n⁺结和p-n结具有不同整流特征的原因、偏压对带间隧穿的重要作用及光生载流子对电学输运行为的影响等.本文所使用的方法可推广到其他二维异质结体系,为提高二维半导体器件性能及其应用提供了重要的参考和借鉴.     

弱耦合GaAs/AlGaAs/InGaAs双势阱隧穿结构的磁隧穿特性研究

研究了低温(15 K)条件下弱耦合GaAs/AlGaAs/InGaAs双势阱结构的纵向磁隧穿特性. 研究表明,器件在零偏压下处于共振状态. 通过分析不同偏压下的磁电导振荡曲线,可以得到双量子阱中的基态束缚能级随偏压的变化规律,从而可以确定隧穿电流峰对应的隧穿机制. 所得结果可为弱耦合双量子点器件的制备提供基础. 关键词： 双量子阱 隧穿结构 磁电导振荡     

多层石墨烯纳米带光电探测器理论与性能分析

多层石墨烯具有超宽的光谱吸收范围及独特的光电性能,是制作下一代光电探测器件的理想材料。以石墨烯的带间隧穿理论为基础,提出了一个多层石墨烯纳米带结构的光电探测器模型,纳米带的两端与源极和漏极相连,夹在半导体基质和上下栅极之间。利用这个模型,建立了多层石墨烯纳米带探测器的光电转换机制,讨论了上栅极电压不同时探测器的工作原理,研究了源-漏极间光电流及暗电流与入射光能量的关系,探讨了探测器的偏置电压,耗尽层长度以及带隙取值对暗电流的影响,并分析了不同参数下探测器响应率以及探测率随入射光能量的变化关系。结果表明,探测器的响应率随纳米带层数的增加而增加,受带隙,耗尽层长度和偏置电压的影响,最大的响应率约为103 A·W-1; 通过限制上栅压,带隙等变量可以控制系统暗电流,增大探测器的探测率,最高探测率约为109 cm·Hz1/2·W-1。多层石墨烯纳米带结构可以增强探测器对入射光的吸收,提高探测器的灵敏度以及对弱光的探测能力,实现对太赫兹到远红外波段入射光的有效探测,探测性能远高于许多量子结构和窄带半导体结构的光电探测器。     

甚长波量子阱红外探测器的暗电流特性研究

基于载流子在量子结构中的输运理论研究了甚长波量子阱红外探测器(峰值响应波长15μm，量子阱个数大于40)的载流子的输运性质.研究结果表明，在甚长波量子阱红外探测器中，电流密度一般很低，暗电流主要来源于能量高于势垒边的热激发电子.通过薛定谔方程和泊松方程以及电流的连续性方程的自洽求解，发现外加偏压下电子浓度在甚长波器件各量子阱的分布发生较大变化，电场在整个器件结构上呈非均匀分布，靠近发射极层的势垒承担的电压远远高于均匀分布的情形.平带模型假定电压在器件体系上均匀分布，导致小偏压下的理论计算值远远低于实验值. 关键词： 甚长波量子阱红外探测器 量子波输运 暗电流     

采用Al/TaN叠层电极提高Si基Ge PIN光电探测器的性能

金属与Ge材料接触由于存在强烈的费米钉扎效应, 导致金属电极与n型Ge接触引入较大的接触电阻, 限制了Si基Ge探测器响应带宽. 本文报道了在SOI衬底上外延Ge单晶薄膜并制备了不同台面尺度的Ge PIN光电探测器. 对比了电极分别为金属Al和Al/TaN叠层的具有相同器件结构的SOI基Ge PIN光电探测器的暗电流、响应度以及响应带宽等参数. 发现在Al与Ge之间增加一薄层TaN可有效减小n型Ge的接触电阻, 将台面直径为24 μ的探测器在1.55 μ的波 长和-1 V偏压下的3 dB响应带宽提高了4倍. 同时, 器件暗电流减小一个数量级, 而响应度提高了2倍. 结果表明, 采用TaN薄层制作金属与Ge接触电极, 可有效钝化金属与Ge界面, 减轻费米钉扎效应, 降低金属与n-Ge接触的势垒高度, 因而减小接触电阻和界面复合电流, 提高探测器的光电性能.     

Atomic layer deposited HfO2 based metal insulator semiconductor GaN ultraviolet photodetectors

A report on GaN based metal insulator semiconductor (MIS) ultraviolet (UV) photodetectors (PDs) with atomic layer deposited (ALD) 5-nm-thick HfO₂ insulating layer is presented. Very low dark current of 2.24 × 10⁻¹¹ A and increased photo to dark current contrast ratio was achieved at 10 V. It was found that the dark current was drastically reduced by seven orders of magnitude at 10 V compared to samples without HfO₂ insulating layer. The observed decrease in dark current is attributed to the large barrier height which is due to introduction of HfO₂ insulating layer and the calculated barrier height was obtained as 0.95 eV. The peak responsivity of HfO₂ inserted device was 0.44 mA/W at bias voltage of 15 V.     

GaN基p-i-n型雪崩探测器的制备与表征

制备和表征了p-i-n型的GaN基雪崩探测器.器件在-5V下的暗电流约为0.05 nA,-20 V下的暗电流小于0.5 nA.响应增益-偏压曲线显示,可重复的雪崩增益起始于80 V附近,在85 V左右增益达到最大为120,表明所制备的器件具有较好的质量.C-V测量用来确定载流子的分布和耗尽信息,结果显示,P型层在15 ...     

Effects of thermal annealing on the properties of GaN MSM UV photodetectors

Metal-semiconductor-metal-structured GaN ultraviolet photodetectors have been fabricated on sapphire substrates by metalorganic chemical vapor deposition. The properties of GaN photodetectors have been improved through thermal annealing. With a 3 V bias, the very low dark current is about 200 pA, the maximum responsivity of 0.19 A/W is achieved at 362 nm, and the corresponding detectivity is 1.2×10¹¹ cm Hz^1/2/W. The physical mechanism of the effects of thermal annealing also has been studied.     

An Anomalous Gain Mechanism in GaN Schottky Barrier Ultraviolet Photodetectors

The gain mechanism in GaN Schottky barrier ultraviolet photodetectors is investigated by focused light beam. When the incident light illuminates the central region of the Schottky contact electrode, the responsiyity changes very little with the increase of reverse bias voltage. However, when the incident light illuminates the edge region of the electrode, the responsivity increases remarkably with the increase of reverse bias voltage, and the corresponding quantum efficiency could be even higher than 100%. It is proposed that the surface states near the edge of the electrode may lead to a reduction of effective Schottky barrier height and an enhancement of electron injection, resulting in the anomalous gain.     

Ultraviolet photoconductive detector based on Al doped ZnO films prepared by sol-gel method

We report a study on the fabrication and characterization of ultraviolet photodetectors based on ZnO:Al films. Using sol-gel technique, highly c-axis oriented ZnO films with 5 mol% Al doping were deposited on Si(1 1 1) substrates. The photoconductive UV detectors based on ZnO:Al thin films, having a metal-semiconductor-metal (MSM) structure with interdigital (IDT) configuration, were fabricated by using Au as a contact metal. The characteristics of dark and photocurrent of the UV detector and the UV photoresponse of the detector were investigated. The linear current-voltage (I-V) characteristics under both forward and reverse bias exhibit ohmic metal-semiconductor contacts. Under illumination using monochromatic light with a wavelength of 350 nm, photo-generated current was measured at 58.05 μA at a bias of 6 V. The detector exhibits an evident wide-range spectral responsivity and shows a trend similar to that in transmittance and photoluminescence spectrum.     

Role of Ga vacancies in enhancing the leakage current of GaN Schottky barrier ultraviolet photodetectors

The leakage current of GaN Schottky barrier ultraviolet photodetectors is investigated. It is found that the photodetectors adopting undoped GaN instead of lightly Si-doped GaN as an active layer show a much lower leakage current even when they have a higher dislocation density. It is also found that the density of Ga vacancies in undoped GaN is much lower than in Si-doped GaN. The Ga vacancies may enhance tunneling and reduce effective Schottky barrier height, leading to an increase of leakage current. It suggests that when undoped GaN is used as the active layer, it is necessary to reduce the leakage current of GaN Schottky barrier ultraviolet photodetector.     

ITON Schottky contacts for GaN based UV photodetectors

Lateral Schottky ultraviolet detectors were fabricated in GaN using indium-tin-oxynitride (ITON) as a contact metal. The GaN semiconductor material was grown on 2 in. sapphire substrate by metal-organic chemical vapor deposition (MOCVD). The Schottky contact has been realized using ITON that has been deposited using sputter techniques. I-V characteristics have been measured with and without UV illumination. The device shows photo-to-dark current ratios of 10³ at −1 V bias. The spectral responsivity of the UV detectors has been determined. The high spectral responsivity of more than 30 A/W at 240 nm is explained by a high internal gain caused by generation-recombination centers at the ITON/GaN interface. Persistent photocurrent effect has been observed in UV light (on-off) switching operation, time constant and electron capture coefficient of the transition has been determined.     

Nitride-based ultraviolet Schottky barrier photodetectors with LT-AlN cap layers

We present the characteristics of novel GaN-based ultraviolet (UV) Schottky barrier photodetectors (PDs) with a low-temperature (LT-)AlN cap layer. Comparing them with conventional Schottky barrier PDs, it was found that we achieved smaller dark current and larger UV to visible rejection ratio from the PDs with the LT-AlN cap layer. The dark leakage current for the Schottky barrier PDs with the LT-AlN cap layer was shown to be about four orders of magnitude smaller than that for the conventional Schottky barrier PDs. With −5 V applied bias, the measured responsivity and UV to visible rejection ratio are 0.16 A /W and 7.74×10² for the Schottky barrier PDs with the LT-AlN cap layer, respectively. This result can be attributed to the thicker and higher potential barrier when the LT-AlN cap layer was inserted.     

Au/TiO2 nanorod‐based Schottky‐type UV photodetectors

TiO₂ nanorods (NRs) were synthesized on fluorine‐doped tin oxide (FTO) pre‐coated glass substrates using hydrothermal growth technique. Scanning electron microscopy studies have revealed the formation of vertically‐aligned TiO₂ NRs with length of ～2 µm and diameter of 110–128 nm, homogenously distributed over the substrate surface. 130 nm thick Au contacts using thermal evaporation were deposited on the n‐type TiO₂ NRs at room temperature for the fabrication of NR‐based Schottky‐type UV photodetectors. The fabricated Schottky devices functioned as highly sensitive UV photodetectors with a peak responsivity of 134.8 A/W (λ = 350 nm) measured under 3 V reverse bias. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Transport mechanism of reverse surface leakage current in AlGaN/GaN high-electron mobility transistor with SiN passivation

The transport mechanism of reverse surface leakage current in the AlGaN/GaN high-electron mobility transistor(HEMT) becomes one of the most important reliability issues with the downscaling of feature size.In this paper,the research results show that the reverse surface leakage current in AlGaN/GaN HEMT with SiN passivation increases with the enhancement of temperature in the range from 298 K to 423 K.Three possible transport mechanisms are proposed and examined to explain the generation of reverse surface leakage current.By comparing the experimental data with the numerical transport models,it is found that neither Fowler-Nordheim tunneling nor Frenkel-Poole emission can describe the transport of reverse surface leakage current.However,good agreement is found between the experimental data and the two-dimensional variable range hopping(2D-VRH) model.Therefore,it is concluded that the reverse surface leakage current is dominated by the electron hopping through the surface states at the barrier layer.Moreover,the activation energy of surface leakage current is extracted,which is around 0.083 eV.Finally,the SiN passivated HEMT with a high Al composition and a thin AlGaN barrier layer is also studied.It is observed that 2D-VRH still dominates the reverse surface leakage current and the activation energy is around 0.10 eV,which demonstrates that the alteration of the AlGaN barrier layer does not affect the transport mechanism of reverse surface leakage current in this paper.