In_(0.53)Ga_(0.47)As/InP雪崩光电二极管响应及电学特性

通过分子束外延生长和开管式Zn扩散方法,制备了低暗电流、宽响应范围的In_(0.53)Ga_(0.47)As/InP雪崩光电二极管.在0.95倍雪崩击穿电压下,器件暗电流小于10nA;-5V偏压下电容密度低至1.43×10~(-8) F/cm~2.在1 310nm红外光照及30V反向偏置电压下,雪崩光电二极管器件的响应范围为50nW~20mW,响应度达到1.13A/W.得到了电荷层掺杂浓度、倍增区厚度结构参数与击穿电压和贯穿电压的关系:随着电荷层电荷密度的增加,器件贯穿电压线性增加,而击穿电压线性降低;电荷层电荷面密度为4.8×10~(12)cm~(-2)时,随着倍增层厚度的增加,贯穿电压线性增加,击穿电压增加.通过对器件结构优化,雪崩光电二极管探测器实现25V的贯穿电压和57V的击穿电压,且具有低暗电流和宽响应范围等特性.     

MSM结构ZnO紫外探测器的制备与性质

采用射频磁控溅射在石英衬底上制备了c轴择优取向的ZnO薄膜,利用蚀刻技术制备了MSM结构的光导型紫外探测器。在3V偏压下,器件的暗电流小于250nA,光响应峰值在370nm,响应度是0.34A/W。其紫外(360nm)与可见光(420nm)的抑制比为4个数量级。器件的光响应时间上沿仅为20ns。     

掺铁InP肖特基势垒增强InGaAs MSM光电探测器

采用LP-MOVPE方法及常规器件工艺制成了InP:Fe肖特基势垒增强InGaAsMSM光电探测器。用自建测试系统对其直流和瞬态特性进行了测试,测试结果表明,器件的击穿电压大于10V,2V偏压下暗电流为170nA,对应的暗电流密度约为3mA/cm²;瞬态响应中上升时间tr为21ps,半高宽FWHM为75ps.     

基于标准CMOS工艺的非接触式保护环单光子雪崩二极管

基于深亚微米CMOS工艺,设计了一种采用非接触式P阱保护环来抑制边缘击穿的单光子雪崩二极管结构.采用器件仿真软件Silvaco Atlas分析了保护环间距对器件的电场分布和雪崩触发概率等特性的影响,结合物理模型计算了所设计器件的暗计数概率和光子探测效率.仿真和计算结果表明,保护环间距d=0.6μm时器件性能最优,此时击穿电压为13.5V,暗电流为10-11 A.在过偏压为2.5V时,门控模式下的暗计数概率仅为0.38%,器件在400~700nm之间具有良好的光学响应,500nm时的峰值探测效率可达39%.     

电极布局对硅LED性能的影响

采用0.35μm双栅标准CMOS工艺设计和制备了叶型硅发光器件.叶型硅发光器件由3个楔型器件的组合而成,pn结结构为n阱/p+结.使用奥林巴斯IC显微镜测得了器件的显微图形,并对器件进行了电学特性测试.器件工作在雪崩击穿下,开启电压为8.8 V,能够发出黄色可见光;正向偏置下,器件开启电压为0.8 V.在与已经制备的楔...     

一维纳米氧化锌自驱动紫外探测器的构建与性能研究

本文通过化学气相沉积法制备了ZnO纳米材料, 利用扫描电镜、光致发光谱、X衍射光谱及拉曼光谱等方法对制备的材料进行了表征. 基于制备的单根ZnO线分别构建了三种不同结构的紫外探测器件: Ag-ZnO-Ag肖特基型、PEDOT:PSS/n-ZnO结型和p-Si/n-ZnO结型紫外探测器, 并对器件的性能进行了研究. 结果表明: 三种不同结构的器件都表现出良好的整流特性, 对紫外线均有明显的光响应; 在零偏压下, 都有明显的自驱动特性. 三种器件中, p-Si/n-ZnO型紫外探测器性能最为优异: 在零偏压下, 暗电流约在1.2×10^-3 nA, 光电流在5.4 nA左右, 光暗电流比为4.5×10³, 上升和下降时间分别为0.7 s和1 s. 通过三类器件性能比较, 表明无机p-Si更适合与ZnO构建pn结型自驱动紫外探测器.     

三级台面InGaAs/InP雪崩光电二极管的低边缘电场设计

设计了一种三级台面的InGaAs/InP雪崩光电二极管,解决了器件边缘电场和暗电流较高的问题.采用Silvaco Atlas器件仿真软件分析了边缘间距、电荷层掺杂浓度及厚度、倍增层掺杂浓度及厚度对器件性能的影响.仿真结果表明,本文设计的三级台面器件在边缘间距为8μm时有最优器件尺寸和较低边缘电场.采用掺杂浓度为1×10~(17)cm~(-3)、厚度为0.2μm的电荷层和掺杂浓度为2×10~(15)cm~(-3)、厚度为0.4μm的倍增层,成功将高电场限制在中心区域,使得反偏电压40V时的边缘电场降低至2.6×105V/cm,仅为中心电场的1/2,增强了器件的抗击穿能力.此外,本文设计的器件在0.9 V_(br)时的暗电流降低至9.25pA,仅为传统两级台面器件的1/3.     

GaAs IMSM光电探测器及其与FET的单片集成研究

采用S.I.GaAs衬底上MBE生长的两层结构外延材料制作了IMSM-PD并与采用离子注入材料制作的IMSM-PD的特性进行了比较,结果表明采用MBE材料的器件特性较优,在5V偏置电压下暗电流小于1nA。已将IMSM-PD与MESFET放大电路进行了单片集成构成光接收器。     

高探测效率CMOS单光子雪崩二极管器件

基于标准0.35μm CMOS工艺设计了一种单光子雪崩二极管器件.采用p+n阱型二极管结构,同时引进保护环与深n阱结构以提高单光子雪崩二极管性能;研究了扩散n阱保护环宽度对雪崩击穿特性的影响;对器件的电场分布、击穿特性、光子探测效率、频率响应等特性进行了分析.仿真结果表明:所设计的单光子雪崩二极管器件结构直径为10μm,扩散n阱保护环宽度为1μm时,雪崩击穿电压为13.2 V,3 dB带宽可达1.6 GHz;过偏压为1 V、2 V时最大探测效率分别高达52%和55%;在波长500~800 nm之间器件响应度较好,波长为680 nm时单位响应度峰值高达0.45 A/W.     

基于量子限制的受主带间跃迁太赫兹探测器的制备与测量

使用分子束外延生长设备,在GaAs（100）衬底上生长了量子阱宽度为3 nm的GaAs/AlAs多量子阱样品,并在量子阱层中央进行了Be受主的δ-掺杂。根据量子限制受主从束缚态到非束缚态之间的跃迁,设计并制备了δ-掺杂Be受主GaAs/AlAs多量子阱太赫兹光探测器原型器件。在4.2 K温度下,分别对器件进行了太赫兹光电流谱和暗电流-电压曲线的测量。在6 V直流偏压下,空穴载流子沿量子阱层方向输运。当正入射激光频率为6.8 THz时,器件响应率为2×10^-4 V/W（2 μA/W）。通过器件的暗电流-电压曲线计算了器件全散粒噪声电流,在4.2 K、6 V直流偏压下,全散粒噪声电流为5.03 fA·Hz^-1/2。     

双面硅多条探测器的测试

介绍了由中国科学院近代物理研究所和北京大学微电子研究院联合研制的双面硅多条探测器的初步测试过程及测试结果。测试内容包括: 探测器的电特性、 能量分辨率、 二维能谱、 条间串扰（crosstalk）。在-25 V全耗尽偏压下, 各条的反向漏电流均小于10 nA, 对于5.486 MeV的α粒子, 正面各条的能力分辨率在1.5%左右, 条间串扰在6%左右; 背面各条能量分辨率稍差, 在3%左右, 其条间串扰在1%左右。同时对进口的Micron BB1直流耦合单边读出的双面硅条探测器做了相同测试, 并进行了性能对比。The testing of a doubled-sided multi-strip silicon detector manufactured by Institute of Modern Physics of CAS and Peking University were introduced. The electrical characteristics and energy resolution, two dimensional spectrum, crosstalk were presented. The reverse leak current of each strip is smaller than 10 nA under bias voltage of 25 V. The energy resolution of strips on the front side is about 1.5%, but a little worse for the backside strips, about 3%. The level of crosstalk is about 6% for the front side, 1% for the backside. Same tests were carried out on the commercial Micron BB1 detector and a comparison was presented.     

高光电探测效率CMOS单光子雪崩二极管器件

基于0.18μm CMOS工艺技术,制作了单光子雪崩二极管,可对650~950nm波段的微弱光进行有效探测.该器件采用P~+/N阱结构,P~+层深度较深,以提高对长光波的光子探测效率与响应度;采用低掺杂深N阱增大耗尽层厚度,可以提高探测灵敏度;深N阱与衬底形成的PN结可有效隔离衬底,降低衬底噪声;采用P阱保护环结构以预防过早边缘击穿现象.通过理论分析确定器件的基本结构参数及工艺参数,并对器件性能进行优化设计.实验结果表明,单光子雪崩二极管的窗口直径为10μm,器件的反向击穿电压为18.4V左右.用光强为0.001 W/cm~2的光照射,650nm处达到0.495A/W的响应度峰值;在2V的过偏压下,650~950nm波段范围内光子探测效率均高于30%,随着反向偏压的适当增大,探测效率有所提升.     

掺铁InP肖特基势垒增强InGaAs MSM光电探测器

采用ＬＰ－ＭＯＶＰＥ方法及常规器件工艺制成了ＩｎＰ：Ｆｅ肖特基势垒增强ＩｎＧａＡｓＭＳＭ光电探测器。用自建测试系统对其直流和瞬态特性进行了测试，测试结果表明，器件的击穿电压大于１０Ｖ，２Ｖ偏压下暗电流为１７０ｎＡ，对应的暗电流密度约为３ｍＡ／ｃｍ２；瞬态响应中上升时间ｔｒ为２１ｐｓ，半高宽ＦＷＨＭ为７５ｐｓ。     

Bias temperature instability analysis on memory properties improved by hydrogen annealing treatment in Ti/HfOx /Pt capacitors

The influence of the hydrogen annealing treatment on the reliability of Ti/HfO_x /Pt capacitors is investigated by analyzing bias temperature instability (BTI). As compared to the N₂‐annealed sample, in the case of hydrogen‐annealed samples, both the set/reset voltages and currents are reduced from 6.5 V/–1.6 V to 3.8 V/–1.2 V and from 4 mA/170 nA to 800 µA/30 nA at 0.1 V, respectively. Of particular interest is the dramatic reduction in the set voltage variation from 3.3 V to 1.8 V. In addition, in BTI experiments, the current shift at the high resistance state (HRS) is reduced from 1.5 µA to 40 nA under a bias stress of –1 V/1000 s and from 40 µA to 0.5 µA under a temperature stress of 120 °C/1000 s. These results show that the hydrogen annealing treatment is very effective in improving the reliability of RRAM cells because it reduces the leakage current under bias temperature stress. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

4H-SiC肖特基二极管的电荷收集特性

针对极端环境下耐辐照半导体核探测器的研制需求,采用耐高温、耐辐照的4H碳化硅(4H-SiC)宽禁带材料制成肖特基二极管,研究了该探测器对241Am源粒子的电荷收集效率。从电容-电压曲线得出该二极管外延层净掺杂数密度为1.991015/cm3。从正向电流-电压曲线获得该二极管肖特基势垒高度为1.66 eV,理想因子为1.07,表明该探测器具备良好的热电子发射特性。在反向偏压高达700 V时,该二极管未击穿,其漏电流仅为21 nA,具有较高的击穿电压。在反向偏压为0~350 V范围内研究了该探测器对3.5 MeV 粒子电荷收集效率,在0 V时为48.7%,在150 V时为99.4%,表明该探测器具有良好的电荷收集特性。     

High-speed waveguide-integrated Ge/Si avalanche photodetector

Waveguide-integrated Ge/Si heterostructure avalanche photodetectors(APDs) were designed and fabricated using a CMOS-compatible process on 8-inch SOI substrate. The structure of the APD was designed as separate-absorption-chargemultiplication(SACM) using germanium and silicon as absorption region and multiplication region, respectively. The breakdown voltage(V_b) of such a device is 19 V at reverse bias and dark current appears to be 0.71 μA at 90% of the V_b. The device with a 10-μm length and 7-μm width of Ge layer shows a maximum 3-dB bandwidth of 17.8 GHz at the wavelength of 1550 nm. For the device with a 30-μm-length Ge region, gain-bandwidth product achieves 325 GHz.     

(n)nc-Si：H/(p)c-Si异质结中载流子输运性质的研究

采用常规等离子体增强化学气相沉积工艺,以高H₂稀释的SiH₄作为反应气体源和PH₃作为磷原子的掺杂剂,在p型(100)单晶硅((p)c-Si)衬底上, 成功地生长了施主掺杂型纳米硅膜((n)nc-Si:H),进而制备了(n)nc-Si:H/(p)c-Si异质结,并在230—420Ｋ温度范围内实验研究了该异质结的Ｉ-Ｖ特性.结果表明,(n)nc-Si:H/(p)c- Si异质结为一典型的突变异质结构,具有良好的温度稳定性和整流特性.正向偏压下 关键词： (n)nc-Si:H/(p)c-Si异质结 能带模型 电流输运机构 温度特性     

Polarization and p-type doping effects on photoresponse of separate absorption and multiplication AlGaN solar-blind avalanche photodiodes

The photoresponse characteristics of separate absorption and multiplication (SAM) AlGaN solar-blind avalanche photodiodes (APDs) were investigated in detail. The p-i-n-i-n avalanche photodiodes were examined using the newly designed model of avalanche photodiodes in AlGaN. The research results showed that the dark current density was about 3.51 × 10^?8 A/cm², the light current density was 5.86 × 10^?5 A/cm² under near-zero bias, and the avalanche breakdown occurred at about 135.0 V under reverse bias, which were all consistent with the experimental data. To investigate the effects influencing the photoresponse characteristics of the APDs, their photo responsivity spectra under different biases were simulated. The APD featured a window region over the wavelength range from 260 to 280 nm with a high rejection ratio on the short-wavelength side. Meanwhile, the dependence of APD responsivity on the polarization charge revealed that the negative polarization charges strongly affected the responsivity. Increased negative polarization charges at the Al_0.4Ga_0.6N/Al_0.6Ga_0.4N interface markedly lowered the responsivity, whereas charges of the same polarity at the GaN/Al_0.4Ga_0.6N interface enhanced the responsivity. Furthermore, the dependence of responsivity on p-type doping was analyzed by comparison with the effects of negative polarization charges on the conduction band of the APDs. Finally, the inversion layer models are used to interpret the effects of these on the APD responsivity. This research is useful for exploring polarization and p-type doping effects in SAM AlGaN structures and realization of high responsivity solar-blind APDs.     

具有高开启/关断电流比的Al2O3/AlGaN/GaN金属氧化物半导体高电子迁移率晶体管

采用原子层淀积(ALD)方法,制备了Al₂O₃为栅介质的高性能AlGaN/GaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT)。在栅压为-20 V时,MOS-HEMT的栅漏电比Schottky-gate HEMT的栅漏电低4个数量级以上。在栅压为+2 V时,Schottky-gate HEMT的栅漏电为191μA;在栅压为+20 V时,MOS-HEMT的栅漏电仅为23.6 nA,比同样尺寸的Schottky-gate HEMT的栅漏电低将近7个数量级。AlGaN/GaN MOS-HEMT的栅压摆幅达到了±20 V。在栅压V_gs=0 V时, MOS-HEMT的饱和电流密度达到了646 mA/mm,相比Schottky-gate HEMT的饱和电流密度(277 mA/mm)提高了133%。栅漏间距为10μm的AlGaN/GaN MOS-HEMT器件在栅压为+3 V时的最大饱和输出电流达到680 mA/mm,特征导通电阻为1.47 mΩ·cm²。Schottky-gate HEMT的开启与关断电流比仅为10⁵,MOS-HEMT的开启与关断电流比超过了10⁹,超出了Schottky-gate HEMT器件4个数量级,原因是栅漏电的降低提高了MOS-HEMT的开启与关断电流比。在V_gs=-14 V时,栅漏间距为10μm的AlGaN/GaN MOS-HEMT的关断击穿电压为640 V,关断泄露电流为27μA/mm。