Growth of high-crystallinity uniform GaAs nanowire arrays by molecular beam epitaxy

The self-catalyzed growth of Ga As nanowires(NWs) on silicon(Si) is an effective way to achieve integration between group III–V elements and Si. High-crystallinity uniform Ga As NW arrays were grown by solid-source molecular beam epitaxy(MBE). In this paper, we describe systematic experiments which indicate that the substrate treatment is crucial to the highly crystalline and uniform growth of one-dimensional nanomaterials. The influence of natural oxidation time on the crystallinity and uniformity of Ga As NW arrays was investigated and is discussed in detail. The Ga As NW crystallinity and uniformity are maximized after 20 days of natural oxidation time. This work provides a new solution for producing high-crystallinity uniform III–V nanowire arrays on wafer-scale Si substrates. The highly crystalline uniform NW arrays are expected to be useful for NW-based optical interconnects and Si platform optoelectronic devices.     

液相电化学法制备类金刚石薄膜及其摩擦性能研究

采用自行设计的液相法沉积装置,以甲醇有机溶剂作为碳源,利用液相电化学沉积技术在不锈钢及Si基底上制备了类金刚石薄膜;用扫描电镜、Raman光谱仪表征了沉积薄膜的表面形貌和结构;用UMT-2M摩擦磨损试验机对两种沉积薄膜进行了摩擦性能测试。结果表明:经电化学沉积的类金刚石薄膜均匀、致密,表面粗糙度小;Raman光谱在1 332cm-1处有强的谱峰,与金刚石的特征峰相吻合,其中不锈钢基底上薄膜的sp3含量更高;不锈钢基底沉积膜的摩擦系数为0.12,Si片基底沉积膜的摩擦系数为0.10;不锈钢基底沉积膜的耐磨性较Si片沉积膜高。     

Formation of pyramid-like nanostructures in MBE-grown Si films on Si(001)

The growth of Si homoepitaxial layers on Si(001) substrates by molecular beam epitaxy is analyzed for a set of growth conditions in which diverse nanometer-scale features develop. Using Si substrates prepared by exposure to HF vapor and annealing in ultra-high vacuum, a rich variety of surface morphologies is found for different deposited layer thicknesses and substrate temperatures in a reproducible way, showing a critical dependence on both. Arrays of 3D islands (truncated pyramids), percolated ridge networks, and square pit (inverted pyramid) distributions are observed. We analyze the obtained arrangements and find remarkable similarities to other semiconductor though heteroepitaxial systems. The nanoscale entities (islands or pits) display certain self assembly and ordering, concerning size, shape, and spacing. Film growth sequence follows the ‘islands–coalescence–2D growth’ pathway, eventually leading to optimum flat morphologies for high enough thickness and temperature.     

Heteroepitaxial GaN films on silicon substrates with porous buffer layers

New complex buffer layers based on a porous material have been developed for epitaxial growth of GaN films on Si substrates. The characteristics of gallium nitride heteroepitaxial layers grown on silicon substrates with new buffer layers by metal-organic vapor phase epitaxy are investigated. It is shown that the porous buffer layers improve the electric homogeneity and increase the photoluminescence intensity of epitaxial GaN films on Si substrates to the values comparable with those for reference GaN films on Al₂O₃ substrates. It is found that a fianite layer in a complex buffer is a barrier for silicon diffusion from the substrate into a GaN film.     

Si衬底GaN基LED的结温特性

结温是发光二极管的重要参数之一,它对器件的内量子效率、输出功率、可靠性及LED的其他一些性能有很大的影响。首次报道Si衬底GaN基LED的结温特性。利用正向压降法测量Si衬底上GaN基LED的结温,通过与蓝宝石衬底上GaNLED的结温比较,发现Si衬底GaNLED有更低的结温,原因归结为Si有更好的导热性。同时也表明:用Si作GaNLED的衬底在大功率LED方面具有更大的应用潜力。     

The comparison between CdS thin films grown on Si(111) substrate and quartz substrate by femtosecond pulsed laser deposition

Two kinds of cadmium sulfate (CdS) thin films have been grown at 600 °C onto Si(111) and quartz substrates using femtosecond pulsed laser deposition (PLD). The influence of substrates on the structural and optical properties of the CdS thin films grown by femtosecond pulsed laser deposition have been studied. The CdS thin films were characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM), photoluminescence (PL) and Raman spectroscopy. Although CdS thin films deposited both on Si(111) and quartz substrates were polycrystalline and hexagonal as shown by the XRD , SEM and AFM results, the crystalline quality and optical properties were found to be different. The size of the grains for the CdS thin film grown on Si(111) substrate were observed to be larger than that of the CdS thin film grown on quartz substrate, and there is more microcrystalline perpendicularity of c-axis for the film deposited on the quartz substrate than that for the films deposited on the Si substrate. In addition, in the PL spectra, the excitonic peak is more intense and resolved for CdS film deposited on quartz than that for the CdS film deposited on Si(111) substrate. The LO and TO Raman peaks in the CdS films grown on Si(111) substrate and quartz substrate are different, which is due to higher stress and bigger grain size in the CdS film grown on Si(111) substrate, than that of the CdS film grown on the amorphous quartz substrate. All this suggests that the substrates have a significant effect on the structural and optical properties of thin CdS films. PACS 81.15.Fg; 81.05.Ea; 78.20.-e; 78.67.-n; 42.62.-b     

转移基板材质对Si衬底GaN基LED芯片性能的影响

在Si衬底上生长了GaN基LED外延材料,分别转移到新的硅基板和铜基板上,制备了垂直结构蓝光LED芯片。研究了这两种基板GaN基LED芯片的光电性能。在切割成单个芯片之前,对大量尺寸为(300μm×300μm)的这两种芯片分别通高达1 A的大电流在测试台上加速老化1 h。结果显示,铜基板Si衬底GaN基LED芯片有更大的饱和电流,光输出效率更高,工作电压随驱动电流的变化不大,光输出在老化过程中衰减更小。铜基板芯片比硅基板芯片可靠性更高,在大功率半导体照明器件中前景诱人。     

Substrate-induced stress in silicon nanocrystal/SiO₂ multilayer structures

A Raman frequency upshift in the nc-Si phonon mode is observed at room temperature, which is attributed to a strong compressive stress in the Si nanocrystals. The 10-period amorphous-Si(3 nm)/amorphous-SiO2 (3 nm) layers are deposited by high-vacuum radio-frequency magnetron sputtering on quartz and sapphire substrates at different temperatures. The samples are then annealed in N2 atmosphere at 1100°C for 1 h for Si crystallization. It is demonstrated that the presence of a supporting substrate at the high growth temperature can induce different types of stresses in the Si nanocrystal layers. The strain is attributed to the difference in the thermal expansion coefficient between the substrate and the Si/SiO2 SL film. Such a substrate-induced stress indicates a new method for tuning the optical and electronic properties of Si nanocrystals for strained engineering.     

Localization of the electromagnetic field in the vicinity of gold nanoparticles: Surface modification of different substrates

Theoretical predictions and experimental results for nanosized modification of metal (Au), semiconductor (Si), or dielectric (soda lime glass) substrates using near-electromagnetic field enhancement in the vicinity of gold nanoparticles are presented. The near field properties for the system consisting of an isolated gold nanoparticle or nanoparticle aggregate deposited on the substrates, which is irradiated by electromagnetic wave, are investigated using Finite Difference Time Domain Simulation technique. The influence of the substrate material on the near field distribution characteristics is predicted. The results reveal that the field on the substrate surface is enhanced in the three investigated cases, but its spatial distribution and magnitude depend on the substrate material. In the case of the metal and semiconductor substrate the enhanced near field is strongly localized in the vicinity of the contact point with the particle, in an area with diameter smaller than the particle's one. The intensity of the enhanced field on the glass is more than an order of magnitude lower than the case of using silicon substrate. The properties of the near field on the substrate surface also depend on the particle arrangement. For a two-dimensional gold nanoparticle array, when the particles are closely arrayed, the intensity of the enhanced field on the substrate surface is minimal. With the increase of the interparticle distance the near field intensity increases. The validity of the obtained theoretical results is confirmed experimentally.     

硅衬底氮化镓基LED薄膜转移至柔性黏结层基板后其应力及发光性能变化的研究

本文将硅(Si)衬底上外延生长的氮化镓(GaN)基发光二极管(LED)薄膜转移至含有柔性黏结层的基板上, 获得了不受衬底和支撑基板束缚的LED薄膜. 利用高分辨率X射线衍射仪(HRXRD)研究了薄膜转移前后的应力变化, 同时对其光致发光(PL)光谱的特性进行了研究. 结果表明: 硅衬底GaN基LED薄膜转移至柔性基板后, GaN受到的应力会由转移前巨大的张应力变为转移后微小的压应力, InGaN/GaN量子阱受到的压应力则增大; 尽管LED薄膜室温无损转移至柔性基板其InGaN阱层的In组分不会改变, 然而按照HRXRD倒易空间图谱通用计算方法会得出平均铟组发生了变化; GaN基LED薄膜从外延片转移至柔性基板时其PL谱会发生明显红移.     

Thermal stress reduction of GaAs epitaxial growth on V-groove patterned Si substrates

We investigate the thermal stresses for GaAs layers grown on V-groove patterned Si substrates by the finite-element method. The results show that the thermal stress distribution near the interface in a patterned substrate is nonuniform,which is far different from that in a planar substrate. Comparing with the planar substrate, the thermal stress is significantly reduced for the Ga As layer on the patterned substrate. The effects of the width of the V-groove, the thickness, and the width of the SiO₂ mask on the thermal stress are studied. It is found that the SiO₂ mask and V-groove play a crucial role in the stress of the Ga As layer on Si substrate. The results indicate that when the width of V-groove is 50 nm, the width and the thickness of the SiO₂ mask are both 100 nm, the Ga As layer is subjected to the minimum stress. Furthermore,Comparing with the planar substrate, the average stress of the Ga As epitaxial layer in the growth window region of the patterned substrate is reduced by 90%. These findings are useful in the optimal designing of growing high-quality Ga As films on patterned Si substrates.     

Substrate-induced stress in silicon nanocrystal/SiO2 multilayer structure

A Raman frequency upshift of nc-Si phonon mode is observed at room temperature, which is attributed to a strong compressive stress in Si nanocrystals. The 10-period amorphous-Si(3 nm)/amorphous-SiO₂ (3 nm) layers are deposited by high vacuum radio-frequency magnetron sputtering on quartz and sapphire substrates at different temperatures. The samples are then annealed in N₂ atmosphere at 1100 ℃ for 1 h for Si crystallization. It is demonstrated that the presence of a supporting substrate at the high grown temperature can induce different types of stresses in the Si nanocrystal layers. The strain is attributed to the difference in thermal expansion coefficient between the substrate and the Si/SiO₂ SL film. Such a substrate-induced stress indicates a new method to tune the optical and the electronic properties of Si nanocrystals for strained engineering.     

Retarded thermal oxidation of strained Si substrate

Strained Si is recognized as a necessary technology booster for modern integrated circuit technology. However, the thermal oxidation behaviors of strained Si substrates are not well understood yet despite their importance. In this study,we for the first time experimentally find that all types of strained Si substrates(uniaxial tensile, uniaxial compressive,biaxial tensile, and biaxial compressive) show smaller thermal oxidation rates than an unstrained Si substrate. The possible mechanisms for these retarded thermal oxidation rates in strained Si substrates are also discussed.     

Direct assembly of in situ templated CdSe quantum dots via crystalline lamellae structure of polyamide 66

A simple concept is proposed for templating in situ synthesised CdSe quantum dots (QDs) into an organised nano-pattern using the crystalline lamellae structure of polyamide 66 (PA66). The morphology obtained for PA66 and the hybrid material on Si/SiO _x solid substrate was characterised by means of atomic force microscope. Controlling the PA66 concentration in solution and the organic–inorganic interactions are found to be the keys factors to direct the assembly of CdSe QDs along the PA66 linear crystalline structure. This simple approach could be opened a new avenue for a large spectrum of innovative high-tech applications.     

Interface effect on structural and electronic properties of graphdiyne adsorbed on SiO_2 and h-BN substrates:A first-principles study

We use the first-principles calculation method to study the interface effect on the structure and electronic properties of graphdiyne adsorbed on the conventional substrates of rough SiO2 and flat h-BN. For the SiO2 substrate, we consider all possible surface terminations, including Si termination with dangling bond, Si terminations with full and partial hydrogenation, and oxygen terminations with dimerization and hydrogenation. We find that graphdiyne can maintain a flat geometry when absorbed on both h-BN and SiO2 substrates except for the Si termination with partial hydrogenation(Si-H) SiO2 substrate. A lack of surface corrugation in graphdiyne on the substrates, which may help maintain its electronic band character, is due to the weak Van der Waals interaction between graphdiyne and the substrate. Si-H SiO2 should be avoided in applications since a covalent type bonding between graphdiyne and SiO2 will totally vary the band structure of graphdiyne.Interestingly, the oxygen termination with dimerization SiO2 substrate has spontaneous p-type doping on graphdiyne via interlayer charge transfer even in the absence of extrinsic impurities in the substrate. Our result may provide a stimulus for future experiments to unveil its potential in electronic device applications.     

Si(110)和Si(111)衬底上制备InGaN/GaN蓝光发光二极管

分别在Si(110)和Si(111)衬底上制备了In Ga N/Ga N多量子阱结构蓝光发光二极管(LED)器件.利用高分辨X射线衍射、原子力显微镜、室温拉曼光谱和变温光致发光谱对生长的LED结构进行了结构表征.结果表明,相对于Si(111)上生长LED样品,Si(110)上生长的LED结构晶体质量较好,样品中存在较小的张应力,具有较高的内量子效率.对制备的LED芯片进行光电特性分析测试表明,两种衬底上制备的LED芯片等效串联电阻相差不大,在大电流注入下内量子效率下降较小;但是,相比于Si(111)上制备LED芯片,Si(110)上LED芯片具有较小的开启电压和更优异的发光特性.对LED器件电致发光(EL)发光峰随驱动电流的变化研究发现,由于Si(110)衬底上LED结构中阱层和垒层存在较小的应力/应变而在器件中产生较弱的量子限制斯塔克效应,致使Si(110)上LED芯片EL发光峰随驱动电流的蓝移量更小.     

Growth of sputter-deposited Ni-Ti thin films: Effect of a SiO2 buffer layer

In-situ X-ray diffraction (XRD) during the growth of Ni-Ti thin films was chosen in order to investigate their texture development using a deposition chamber installed at a synchrotron radiation beamline. Near-equiatomic films were co-sputtered from Ni-Ti and Ti targets. The texture evolution during deposition is clearly affected by the substrate type and the ion bombardment of the growing film. On naturally oxidized Si(100) substrates, the Ni-Ti B2 phase starts by stacking onto (h00) planes, and as the thickness increases evolves into a (110) fibre texture. For the deposition on thermally oxidized Si(100) substrates, this pronounced cross-over is only observed when a substrate bias voltage (-45 V) is applied. The oxide layer plays an important role on the development of the (100) orientation of the B2 phase during deposition on heated substrates (≈470 °C). If this layer is not thick enough (naturally oxidized Si substrate) or if a bias voltage is applied, a cross-over and further development of the (110) fibre texture is observed, which is considered as an orientation that minimizes surface energies. Electrical resistivity measurements showed different behaviour during phase transformation for the Ni-Ti film deposited on thermally oxidized Si without bias and those on thermally oxidized Si(100) with bias and on naturally oxidized Si(100) without bias. This is related to stresses resultant from the fact that the Ni-Ti films are attached to the substrates as well as with the existence of distinct textures. PACS 81.15.Cd; 61.10.Nz; 68.55.Jk     

Crystal structure and magnetic properties of SmCo-based films deposited on hot Si (1 0 0) substrates

SmCo-based films were deposited on Si (1 0 0) substrates by the rf magnetron sputtering process. The growth conditions are improved for the films deposited on hot Si substrates without the annealing process. The dependence of crystal structure and intrinsic coercivity on substrate temperature is chiefly investigated. It is suggested that TbCu₇ type structural films can be obtained with enhanced in-plane magnetic properties with proper substrate temperature.     

衬底材料对制备立方氮化硼薄膜的影响

较系统地研究了不同衬底材料对制备氮化硼薄膜的影响。用热丝增强射频等离子体CVD法,以NH3,B2H6和H2为反应气体,在Si,Ni,Co和不锈钢等衬底材料上,成功生长出高质量的立方氮化硼薄膜,还用13.56MHz的射频溅射系统将c-BN薄膜沉积在Si衬底上,靶材为h-BN(纯度为99.99％）,溅射气体为氩气和氮气的混合气体,所得到的氮化硼薄膜中立方相含量高于90%,用X射线衍射谱和傅里叶变换红谱对样品进行了分析表明,衬底材料与c-BN的晶格匹配情况,对于CVD生长立方氮化硼薄膜影响很大,而对溅射生长立方氮化硼薄膜影响不大。     

Substrate and pretreatment dependence of Cu nucleation by metal–organic chemical vapor deposition

The nucleation of copper (Cu) with (hfac)Cu(VTMS) organometallic precursor is investigated for Si, SiO₂, TiN, and W₂N substrates. As the deposition temperature is increased, the dominant growth mechanism is observed to change from the nucleation of Cu particles to the clustering of Cu nuclei around 180 °C independent of the employed substrates. It is also observed that the cleaning of substrate surfaces with the diluted HF solution improves the selectivity of Cu nucleation between TiN and SiO₂ substrates. Dimethyldichlorosilane treatment is found to passivate the surface of TiN substrate, contrary to the generally accepted belief, when the TiN substrate is cleaned by H₂O₂ solution before the treatment.