High-Current Multi-Finger Mesa InGaAs/InP DHBTs

Characteristics of single- and multi-finger mesa InGaAs/InP double heterojunction bipolar transistors （DHBTs） are compared. The current gain decreases with the increasing number nf of the emitter fingers due to the mutual thermal interaction between the fingers. The Kirk current can be as high as 150mA for four-finger DHBT. No degradation of the peak of the current gain cutoff frequency ft is found for multi-finger DHBTs. The peak of the maximum oscillation frequency fmax decreases with an increase of nf due to the increasing parasitic resistance of the base. The results are very helpful for applications of the common-base DHBTs in power amplifiers operating at very high frequencies.     

基于微波法制备纳米银胶的三种病菌的SERS光谱初步研究

使用激发光为785 nm的便携式拉曼光谱仪分别对赤星病菌、谷镰刀病菌和香蕉炭疽悬浮液进行了普通拉曼光谱和表面增强拉曼散射(SERS)光谱检测。实验结果显示,微波法制备的纳米银胶对三种植物病菌均具有较好的增强效果,同时获得了三种病菌信噪比较好的SERS光谱。从整体上看,三种菌谱峰峰强分布具有一定的相似性,如在481 cm-1处均为最强谱峰,500～1 000 cm-1谱峰较弱和1 000～1 600 cm-1谱峰较强。但三者在谱峰的分布和峰形上仍有明显不同,因此通过比较三种病菌的不同SERS谱峰可对其进行快速区分和鉴别。     

Physical modeling based on hydrodynamic simulation for the design of InGaAs/InP double heterojunction bipolar transistors

A physical model for scaling and optimizing InGaAs/InP double heterojunction bipolar transistors(DHBTs) based on hydrodynamic simulation is developed.The model is based on the hydrodynamic equation,which can accurately describe non-equilibrium conditions such as quasi-ballistic transport in the thin base and the velocity overshoot effect in the depleted collector.In addition,the model accounts for several physical effects such as bandgap narrowing,variable effective mass,and doping-dependent mobility at high fields.Good agreement between the measured and simulated values of cutoff frequency,f t,and maximum oscillation frequency,f max,are achieved for lateral and vertical device scalings.It is shown that the model in this paper is appropriate for downscaling and designing InGaAs/InP DHBTs.     

Extrinsic Base Surface Passivation in High Speed ＂Type-II＂ GaAsSb/InP DHBTs Using an InGaAsP Ledge Structure

Type-II GaAsSb/InP DHBTs with selectively-etched InGaAsP ledge structures are fabricated and characterized for the first time. The novel InGaAsP/GaAsSb/InP DHBTs with a 20nm lattice-matched GaAsSb base and a 75 nm InP collector have a dc current gain improvement by a factor of 2 and a cutoff frequency fT of 190 GHz. The InGaAsP ledge design provides a simple but effective approach to suppress the extrinsic base surface recombination and enable GaAsSb/InP DHBTs to further increase the operating frequencies and integration levels for millimeter wave applications.     

大肠杆菌基于微波法制备的纳米银胶的SERS光谱研究

在微波法制备的纳米银上获得了大肠杆菌的表面增强拉曼光谱, 大肠杆菌在650、952、1125、1242、1320、1372、1459 cm-1有明显的拉曼振动峰。其中650 cm-1处的振动峰最强, 1124、1320、1372和1459 cm-1处的四个振动峰较弱, 952、1242 cm-1处的二个振动峰强度居中。位于650 cm-1附近的拉曼峰源自于酪氨酸、鸟嘌呤的振动, 952 cm-1属于缩氨酸基团C=C的伸缩振动,1124 cm-1是蛋白质的C-N和C-C伸缩振动引起的, 1242 cm-1则归属于是酰胺 III蛋白的振动, 1320 cm-1是蛋白质的CH变形振动, 1372 cm-1是由酪氨酸振动引起的, 1459 cm-1则是蛋白质的CH2变形振动。     

一种InP双异质结双极晶体管小信号物理模型及其提取方法

研究了InP双异质结双极晶体管（DHBT）的能带结构对集电极电容的影响,解决了传统方法不能准确提取InP DHBT集电极电容的问题.考虑了基极-发射极和集电极-发射极引线间的交叠电容,并从物理上区分了InP DHBT的本征电阻、外部电阻与寄生电阻,建立了一个基于物理的InP基DHBT小信号模型.同时提出了一套直接提取模型参数的方法,该方法无需引入数学优化,具有清晰的物理意义.提取的结果在很宽的偏置范围内准确地拟合了器件特性,验证了模型的准确性与提取方法的有效性. 关键词： InP双异质结双极晶体管 集电极电容 小信号模型 参数提取     

Influences of increasing gate stem height on DC and RF performances of InAlAs/InGaAs InP-based HEMTs

The T-gate stem height of In Al As/In Ga As In P-based high electron mobility transistor(HEMT) is increased from165 nm to 250 nm. The influences of increasing the gate stem height on the direct current(DC) and radio frequency(RF)performances of device are investigated. A 120-nm-long gate, 250-nm-high gate stem device exhibits a higher threshold voltage(Vth) of 60 m V than a 120-nm-long gate devices with a short gate stem, caused by more Pt distributions on the gate foot edges of the high Ti/Pt/Au gate. The Pt distribution in Schottky contact metal is found to increase with the gate stem height or the gate length increasing, and thus enhancing the Schottky barrier height and expanding the gate length,which can be due to the increased internal tensile stress of Pt. The more Pt distributions for the high gate stem device also lead to more obvious Pt sinking, which reduces the distance between the gate and the In Ga As channel so that the transconductance(gm) of the high gate stem device is 70 m S/mm larger than that of the short stem device. As for the RF performances,the gate extrinsic parasitic capacitance decreases and the intrinsic transconductance increases after the gate stem height has been increased, so the RF performances of device are obviously improved. The high gate stem device yields a maximum ft of 270 GHz and fmax of 460 GHz, while the short gate stem device has a maximum ft of 240 GHz and the fmax of 370 GHz.     

Heterogeneous integration of InP HEMTs on quartz wafer using BCB bonding technology

Heterogeneous integrated InP high electron mobility transistors(HEMTs)on quartz wafers are fabricated successfully by using a reverse-grown InP epitaxial structure and benzocyclobutene(BCB)bonding technology.The channel of the new device is In_0.7Ga_0.3As,and the gate length is 100 nm.A maximum extrinsic transconductance gm,max of 855.5 mS/mm and a maximum drain current of 536.5 mA/mm are obtained.The current gain cutoff frequency is as high as 262 GHz and the maximum oscillation frequency reaches 288 GHz.In addition,a small signal equivalent circuit model of heterogeneous integration of InP HEMTs on quartz wafer is built to characterize device performance.     

Impact of symmetric gate-recess length on the DC and RF characteristics of InP HEMTs

We fabricated a set of symmetric gate-recess devices with gate length of 70 nm.We kept the source-to-drain spacing(L_SD)unchanged,and obtained a group of devices with gate-recess length(L_recess)from 0.4μm to 0.8μm through process improvement.In order to suppress the influence of the kink effect,we have done SiN_X passivation treatment.The maximum saturation current density(ID_max)and maximum transconductance(g_m,max)increase as L_recess decreases to 0.4μm.At this time,the device shows ID_max=749.6 mA/mm at V_GS=0.2 V,V_DS=1.5 V,and g_m,max=1111 mS/mm at V_GS=?0.35 V,V_DS=1.5 V.Meanwhile,as L_recess increases,it causes parasitic capacitance C_gd and g_d to decrease,making f_max drastically increases.When L_recess=0.8μm,the device shows f_T=188 GHz and f_max=1112 GHz.     

100-nm T-gate InAlAs/InGaAs InP-based HEMTs with f_T = 249 GHz and f_(max) = 415 GHz

InAlAs/InGaAs high electron mobility transistors(HEMTs) on an InP substrate with well-balanced cutoff frequency fTand maximum oscillation frequency fmax are reported. An InAlAs/InGaAs HEMT with 100-nm gate length and gate width of 2 × 50 μm shows excellent DC characteristics, including full channel current of 724 mA/mm, extrinsic maximum transconductance gm.max of 1051 mS/mm, and drain–gate breakdown voltage BVDG of 5.92 V. In addition, this device exhibits fT= 249 GHz and fmax = 415 GHz. These results were obtained by fabricating an asymmetrically recessed gate and minimizing the parasitic resistances. The specific Ohmic contact resistance was reduced to 0.031 Ω·mm. Moreover,the fTobtained in this work is the highest ever reported in 100-nm gate length InAlAs/InGaAs InP-based HEMTs. The outstanding gm.max, fT, fmax, and good BVDG make the device suitable for applications in low noise amplifiers, power amplifiers, and high speed circuits.