High-Current Multi-Finger Mesa InGaAs/InP DHBTs

Characteristics of single- and multi-finger mesa InGaAs/InP double heterojunction bipolar transistors （DHBTs） are compared. The current gain decreases with the increasing number nf of the emitter fingers due to the mutual thermal interaction between the fingers. The Kirk current can be as high as 150mA for four-finger DHBT. No degradation of the peak of the current gain cutoff frequency ft is found for multi-finger DHBTs. The peak of the maximum oscillation frequency fmax decreases with an increase of nf due to the increasing parasitic resistance of the base. The results are very helpful for applications of the common-base DHBTs in power amplifiers operating at very high frequencies.     

Growth condition optimization and mobility enhancement through inserting AlAs monolayer in the InP-based In_xGa_(1-x)As/In_(0.52)Al_(0.48)As HEMT structures

The structure of In P-based In_xGa_(1-x) As/In0.52Al0.48 As pseudomorphic high electron mobility transistor(PHEMT)was optimized in detail.Effects of growth temperature,growth interruption time,Si δ-doping condition,channel thickness and In content,and inserted Al As monolayer(ML) on the two-dimensional electron gas(2DEG) performance were investigated carefully.It was found that the use of the inserted Al As monolayer has an enhancement effect on the mobility due to the reduction of interface roughness and the suppression of Si movement.With optimization of the growth parameters,the structures composed of a 10 nm thick In0.75Ga0.25 As channel layer and a 3 nm thick Al As/In0.52Al0.48 As superlattices spacer layer exhibited electron mobilities as high as 12500 cm~2·V-1·s~(-1)(300 K) and 53500 cm~2·V~(-1_·s~(-1)(77 K) and the corresponding sheet carrier concentrations(Ns) of 2.8×10~(12)cm~(-2)and 2.9×1012cm~(-2),respectively.To the best of the authors' knowledge,this is the highest reported room temperature mobility for In P-based HEMTs with a spacer of 3 nm to date.     

Effects of growth conditions on optical quality and surface morphology of InGaAsBi

The effects of Bi flux and pressure of AsH_3 on Bi incorporation,surface morphology and optical properties of InGa As Bi grown by gas source molecular beam epitaxy are studied.It is found that using relatively low pressure of AsH_3 and high Bi flux can strengthen the effect on the incorporation of Bi and increase its content linearly with Bi flux until it nearly reaches a saturation value.The result from Rutherford backscattering spectroscopy(RBS) confirms that the Bi incorporation can increase up to 1.13%.By adjusting Bi and As flux,we could improve the surface morphology of In Ga As Bi sample.Room temperature photoluminescence shows strong and broad light emission at energy levels much smaller than the In Ga As bandgap.     

SOIM新结构的制备及其性能的研究

制备在以SiO2为绝缘埋层的SOI材料上的电子器件存在着自加热问题.为减少自加热效应和满足一些特殊器件/电路的要求，利用多孔硅外延转移技术制备出以二氧化硅和氮化硅为多绝缘埋层的SOI新结构.高分辨率透射电镜和扩展电阻测试结果表明得到的SOIM新结构具有很好的结构和电学性能，退火后的氮化硅埋层为非晶结构.     

Composite-Collector InGaAs/InP Double Heterostructure Bipolar Transistors with Current-Gain Cutoff Frequency of 242 GHz

To eliminate the conduction band spike at the base-collector interface, an InP/InGaAs double heterostructure bipolar transistor （DHBT） with an InGaAsP composite collector is designed and fabricated using the conventional mesa structure. The DHBT with emitter area of 1.6×15μm^2 exhibits current-gain cutoff frequency ft = 242 OHz at the high collector current density Jc = 2.1 mA/μm^2, which is to our knowledge the highest ft reported for the mesa InP DHBT in China. The breakdown voltage in common-emitter configuration is more than 5 V. The high-speed InP/InGaAs DHBT with high current density digital circuits. is very suitable for the application in ultra high-speed     

Characterization of low-resistance ohmic contacts to heavily carbon-doped n-type InGaAsBi films treated by rapid thermal annealing

Carbon-doped In Ga As Bi films on In P:Fe(100)substrates have been grown by gas source molecular beam epitaxy(GSMBE).The electrical properties and non-alloyed Ti/Pt/Au contact resistance of n-type carbon-doped In Ga As Bi films were characterized by Van der Pauw-Hall measurement and transmission line method(TLM)with and without rapid thermal annealing(RTA).It was found that the specific contact resistance decreases gradually with the increase of carrier concentration.The electron concentration exhibits a sharp increase,and the specific contact resistance shows a noticeable reduction after RTA.With RTA,the In Ga As Bi film grown under CBr4 supply pressure of 0.18 Torr exhibited a high electron concentration of 1.6×10²¹ cm^-3 and achieved an ultra-low specific contact resistance of 1×10^-8Ω·cm²,revealing that contact resistance depends greatly on the tunneling effect.