二维GaAs 基光子晶体微腔的制作与光谱特性分析

研究了以InAs量子点为有源区的二维GaAs基光子晶体微腔的设计与制作,测试并分析了室温下微腔的光谱特性.观察到了波长约为1137 nm,谱线半高宽度约为1 nm的尖锐低阶谐振模式发光峰.我们比较了不同刻蚀条件下光子晶体微腔的发光谱线,结果表明空气孔洞截面的垂直度是影响光子晶体微腔发光特性的重要因素之一.通过调节干法刻蚀工艺,改变空气孔半径与晶格常数的比率,可以在较大范围内调节谐振模式发光峰位置,达到谐振模式与量子点发光峰调谐的目的.     

氮化硅/钽硅X射线光刻掩模研制及应用

经过三十多年的研发, 接近式X射线光刻技术已经非常成熟,其具有分辨率高、焦深大、工艺宽容度大、产量高等诸多优点.对于X射线掩模吸收体材料, 如果选择金, 只能采用电镀工艺, 而且金会污染硅基集成电路；而钽硅材料可以采用干法刻蚀工艺, 不会污染硅基集成电路, 是一种理想的X射线掩模吸收体材料.本文论述了氮化硅/钽硅X射线掩模制作工艺, 不同于常规工艺, 电子束光刻显影后, 以ZEP520电子束光刻胶作为阻挡层,SF₆/CHF₃作为反应气体, 电感耦合等离子体直接刻蚀钽硅薄膜.初步的实验结果证明了这种X射线掩模制作工艺是可行的.     

A high performance HfSiON/TaN NMOSFET fabricated using a gate-last process

A gate-last process for fabricating HfSiON/TaN n-channel metal-oxide-semiconductor-field-effect transistors(NMOSFETs)is presented.In the process,a HfSiON gate dielectric with an equivalent oxide thickness of 10 A was prepared by a simple physical vapor deposition method.Poly-Si was deposited on the HfSiON gate dielectric as a dummy gate.After the source/drain formation,the poly-Si dummy gate was removed by tetramethylammonium hydroxide(TMAH)wet-etching and replaced by a TaN metal gate.Because the metal gate was formed after the ion-implant doping activation process,the effects of the high temperature process on the metal gate were avoided.The fabricated device exhibits good electrical characteristics,including good driving ability and excellent sub-threshold characteristics.The device’s gate length is 73 nm,the driving current is 117μA/μm under power supply voltages of VGS=VDS=1.5 V and the off-state current is only 4.4 nA/μm.The lower effective work function of TaN on HfSiON gives the device a suitable threshold voltage(~0.24 V)for high performance NMOSFETs.The device’s excellent performance indicates that this novel gate-last process is practical for fabricating high performance MOSFETs.     

Preparation and Characteristics of Nanoscale Diamond-Like Carbon Films for Resistive Memory Applications

We propose diamond-like carbon （DLC） as the resistance change material for nonvolatile memory applications. Nanosecale DLC films are prepared by filtered cathodic vacuum arc technique and integrated to W//DLC/W structure devices. The deposited DLC film has a thickness of about 20nm and high spa fraction content. Reversible bistable resistive switching from a high resistance state to a low resistance state, and vice versa, is observed under appropriate unipolar stimulation pulses. High resistance switching ratio （larger than a thousand times） and low level of switching power （about 11 μW） are demonstrated. We propose that the mechanism of the repetitive resistive switching is the growth and breakage of conductive sp2-like filaments in the predominantly sp3-type insulating carbon upon applications of voltage pulses, which is consistent with the experimental results.     

微纳金属光学结构制备技术及应用

微纳光学结构制备技术一直是微纳光子学器件发展的技术瓶颈.针对微纳光学结构制备技术向小尺寸、高精度和广泛应用发展的趋势,报道了基于电子束、X射线和接近式光学的混合光刻制作微纳金属光学结构技术.针对微纳光子学器件复杂图形开发了微光刻数据处理体系,基于矢量扫描电子束光刻设备在自支撑薄膜上进行1×高分辨率图形形成,利用X射线光...