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This paper reports a procedure of soft x-ray lithography
for the fabrication of organic crossbar structure. Electron beam
lithography is employed to fabricate the mask for soft x-ray
lithography, with direct writing technology to lithograph positive
resist, polymethyl methacrylate on the polyimide film. Then Au is
electroplated on the polyimide film. Hard contact mode exposure is
used in x-ray lithography to transfer the graph from the mask to the
wafer. The 256-bits organic memory is achieved with the critical
dimension of 250~nm. 相似文献
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