U形阵列式微机械悬臂梁的研究

为提高悬臂梁的分辨率，实现悬臂梁的多功能性，设计了一种U形阵列式压阻悬臂梁.从理论上对悬臂梁的应力、噪声和灵敏度进行分析，优化了悬臂梁及力敏电阻的几何尺寸.选用多晶硅为力敏材料，基于硅微机械加工技术，制备U形阵列式悬臂梁.测量悬臂梁的噪声及灵敏度，得到多晶硅力敏材料的Hooge因子和应变灵敏度系数，分别为3×10^-3和27.在6V偏压和1000Hz测量带宽条件下，计算悬臂梁的最小可探测位移为0.5nm.同时对多晶硅力敏电阻噪声的产生机理进行了探讨. 关键词： 悬臂梁 噪声 灵敏度 最小可探测位移     

Electro-mechanical coupling analysis of MEMS structures by boundary element method

In this paper, we present the applications of Boundary Element Method (BEM) to simulate the electro-mechanical coupling responses of Micro-Electro-Mechanical systems (MEMS). The algorithm is programmed in our research group based on BEM modeling for electrostatics and elastostatics. Good agreement is shown while the simulation results of the pull-in voltages are compared with the theoretical/experimental ones for some examples. The project supported by the 973 Program (G199033108) and the national Natural Science Foundation of China (10125211)     

基于交叉结构的分子电子器件及其逻辑电路的研究进展

随着大规模集成电路的特征尺寸进入到纳米级，传统的硅基集成电路技术面临挑战，新材料及新结构的研究成为热点，纳电子学分支之一的分子电子器件正在蓬勃发展一场效应晶体管（FET）和交叉结构是目前主要的分子电子器件的结构，而交叉结构有利于集成受到广泛关注。文章概述了基于交叉结构的分子纳米器件工作原理、工艺流程，并着重介绍了逻辑功能的实现方法及其研究进展，最后，总结了交叉结构的前景及所面临的困难。     

Charge storage characteristics of hydrogenated nanocrystalline silicon film prepared by rapid thermal annealing

The early stages of hydrogenated nanocrystalline silicon (nc-Si:H) films deposited by plasma-enhanced chemical vapour deposition were characterized by atomic force microscopy. To increase the density of nanocrystals in the nc-Si:H films, the films were annealed by rapid thermal annealing (RTA) at different temperatures and then analysed by Raman spectroscopy. It was found that the recrystallization process of the film was optimal at around 1000℃. The effects of different RTA conditions on charge storage were characterized by capacitance--voltage measurement. Experimental results show that nc-Si:H films obtained by RTA have good charge storage characteristics for nonvolatile memory.     

微纳加工技术在微纳电子器件领域的应用

微纳加工技术推动着集成电路不断缩小器件尺寸和提高集成度，光学光刻技术依然是目前的主流微纳加工技术，同时有多种替代技术如电子束直写、极紫外光刻和投影电子束技术，文章介绍了自上而下的微纳加工技术的进展及其在微纳器件研制的重要作用。