+3价离子掺杂钨酸铅晶体发光性能和微观缺陷的研究

通过透射光谱、x射线激发发射光谱（XSL）的测试，研究了Bridgman法生长的几种不同+3价离子掺杂钨酸铅晶体的发光性能，并利用正电子湮没寿命谱（PAT）和x光电子能谱（XPS）的实验手段，对不同钨酸铅晶体的微观缺陷进行研究.实验表明，不同的+3价离子掺杂，对钨酸铅晶体发光性能的改善不同，并使得晶体中正电子俘获中心和低价氧的浓度发生不同变化.其中掺镧晶体的正电子俘获中心和低价氧浓度均上升，而掺钇和掺铋晶体的正电子俘获中心和低价氧浓度均下降，掺锑晶体则出现了正电子俘获中心浓度上升、低价氧浓度下降的情况.提 关键词： 钨酸铅晶体 +3价离子掺杂 正电子湮没寿命谱 x光电子能谱     

氢、氧终端掺硼金刚石薄膜的电子结构

利用氢微波等离子体溅射和浓酸中沸煮方法分别制备了氢、氧终端掺硼金刚石薄膜.借助X射线光电子能谱及接触角检测对两种终端薄膜表面进行了分析,通过扫描探针显微镜研究了针尖和样品间的扫描隧道谱.结果表明,氢终端掺硼金刚石表面能带向上弯曲,在高于价带顶位置存在浅受主能级;氧终端表面能带向下弯曲,带隙较宽,带隙中不存在表面态.对两种终端金刚石薄膜的导电机理进行了讨论. 关键词： 氢终端 氧终端 掺硼金刚石薄膜 电子结构     

氢、氧终端掺硼金刚石薄膜的电子结构

利用氢微波等离子体溅射和浓酸中沸煮方法分别制备了氢、氧终端掺硼金刚石薄膜.借助X射线光电子能谱及接触角检测对两种终端薄膜表面进行了分析，通过扫描探针显微镜研究了针尖和样品间的扫描隧道谱.结果表明，氢终端掺硼金刚石表面能带向上弯曲，在高于价带顶位置存在浅受主能级；氧终端表面能带向下弯曲，带隙较宽，带隙中不存在表面态.对两种终端金刚石薄膜的导电机理进行了讨论.     

硼硫协同掺杂金刚石的高压合成与电学性能研究

FeNiMnCo-C体系中,在压力6.5 GPa、温度1280—1300℃的极端物理条件下,采用温度梯度法成功合成了硼(B)、硫(S)协同掺杂金刚石大单晶.通过傅里叶红外光谱测试对高温高压所制备金刚石中的杂质进行了表征.借助霍尔效应对典型金刚石样品的电输运性能进行了测试,测试结果表明:硼硫协同掺杂有利于提高p型金刚石的电导率,而且硼硫在合成体系中的添加比例可以决定金刚石的p, n特性.此外,第一性原理计算结果表明,合成体系中不同比例的硼硫协同掺杂对金刚石的p, n特性以及电导率有着直接的影响,计算结果与实验测试结果相吻合.     

同质与异质外延掺杂CVD金刚石薄膜的结构与性能

采用化学气相沉积(CVD)技术,以高温高压(HTHP)合成的(100)金刚石和p型(100)Si为衬底制备了硫掺杂和硼-硫共掺杂金刚石薄膜,利用原子力显微镜(AFM)、扫描隧道显微镜(STM)及隧道电流谱(CITS)等手段分析同质和异质外延CVD掺杂金刚石薄膜的结构和性能.结果表明:异Si衬底上CVD金刚石的形核密度低,薄膜表面比较粗糙,粗糙度达到18.5nm;同质HTHP金刚石衬底上CVD金刚石薄膜晶粒尺寸约为10—50nm,表面平整,表面粗糙度为1.8nm.拉曼测试和电阻测量的结果显示,在HTHP金刚 关键词： 金刚石 掺杂 外延     

掺杂CVD金刚石薄膜的应力分析

在不同实验条件下，用微波等离子体化学气相沉积(MPCVD)技术在Si基体上制备了S掺杂和B-S共掺杂CVD金刚石薄膜，利用X射线衍射仪和拉曼光谱仪研究掺杂对CVD金刚石薄膜的应力影响.研究结果发现，随着S掺杂浓度的增加，薄膜中sp²杂化碳含量和缺陷增多，CVD金刚石薄膜压应力增加；小尺寸的B原子与大尺寸的S原子共掺杂时，微量B的加入改变了CVD金刚石薄膜的应力状态，共掺杂形成B-S复合体进入金刚石晶体后降低金刚石晶体的晶格畸变程度，减少S原子在晶界上偏聚数量和晶体中非金刚石结构相含量，降低由于杂质、缺陷及sp²杂化碳含量产生的晶格畸变和薄膜压应力，提高晶格完整性. 关键词： 金刚石薄膜 掺杂 应力     

不同硫压退火对溅射沉积ZnS薄膜性能的影响

ZnS作为一种宽带隙半导体,以其优异的光电性能近年来受到广泛关注,在太阳能电池、光催化剂以及传感器方面有着广阔的应用前景.本文首先以射频磁控溅射方法沉积了ZnS薄膜,然后在600℃温度和不同硫压下进行退火,通过X射线衍射、扫描电子显微镜、能量散射X射线谱、紫外-可见透射光谱以及慢正电子多普勒展宽谱对ZnS薄膜的晶体结构、表面形貌、晶粒尺寸、成分、透光率以及缺陷进行分析.结果表明:硫气氛后退火能够改善ZnS薄膜结晶性,退火后ZnS薄膜光学带隙为3.43—3.58 eV.当硫压高于0.49 atm(1 atm=1.01×10⁵ Pa)时,ZnS内部硫间隙原子以及表面单质硫降低了薄膜在可见光区的透光率.慢正电子多普勒展宽谱结果还表明,ZnS薄膜的缺陷浓度由表层到内层逐渐降低,薄膜缺陷随着硫压增加而降低.同时,3γ湮没证明了薄膜内部较为致密,硫化会导致薄膜开孔率增加.吸附硫通过内扩散占据了晶体中硫空位缺陷的位置,导致缺陷浓度降低,进而改善了薄膜质量.     

退火温度对硼掺杂纳米金刚石薄膜微结构和p型导电性能的影响

采用热丝化学气相沉积法制备硼掺杂纳米金刚石 (BDND) 薄膜, 并对薄膜进行真空退火处理, 系统研究退火温度对BDND薄膜微结构和电学性能的影响. Hall效应测试结果表明掺B浓度为5000 ppm (NHB) 的样品的电阻率较掺B浓度为500 ppm (NLB) 的样品的低, 载流子浓度高, Hall迁移率下降. 1000 ℃退火后, NLB和NHB 样品的迁移率分别为53.3和39.3 cm²·V^-1·s^-1, 薄膜的迁移率较未退火样品提高, 电阻率降低. 高分辨透射电镜、紫外和可见光拉曼光谱测试结果表明, NLB样品的金刚石相含量较NHB样品高, 高的硼掺杂浓度使薄膜中的金刚石晶粒产生较大的晶格畸变. 经1000 ℃退火后, NLB和NHB薄膜中纳米金刚石相含量较未退火时增大, 说明薄膜中部分非晶碳转变为金刚石相, 为晶界上B扩散到纳米金刚石晶粒中提供了机会, 使得纳米金刚石晶粒中B浓度提高, 增强纳米金刚石晶粒的导电能力, 提高薄膜电学性能. 1000 ℃退火能够恢复纳米金刚石晶粒的晶格完整性, 减小由掺杂引起的内应力, 从而提高薄膜的电学性能. 可见光Raman光谱测试结果表明, 1000℃退火后, Raman谱图中反式聚乙炔 (TPA) 的1140 cm^-1峰消失, 此时薄膜电学性能较好, 说明TPA减少有利于提高薄膜的电学性能. 退火后金刚石相含量的增大、金刚石晶粒的完整性提高及TPA含量的大量减少有利于提高薄膜的电学性能. 关键词： 硼掺杂纳米金刚石薄膜 退火 微结构 电学性能     

磷离子注入纳米金刚石薄膜的n型导电性能与微结构研究

系统研究了磷离子注入并在不同温度退火后的纳米金刚石薄膜的微结构和电学性能.研究表明,当退火温度达到800 ℃以上时,薄膜呈良好的n型电导.Raman光谱和电子顺磁共振谱的结果表明,薄膜中金刚石相含量越高和完整性越好,薄膜电阻率越低. 这说明纳米金刚石晶粒为薄膜提供了电导.1000 ℃退火后,薄膜晶界中的非晶石墨相有序度提高,碳悬键数量降低,薄膜电阻率升高.薄膜导电机理为磷离子注入的纳米金刚石晶粒提供了n型电导,非晶碳晶界为其电导提供了传输路径. 关键词： 纳米金刚石薄膜 n型 磷离子注入     

调控硼硫掺杂比实现金刚石n型转变的研究

金刚石半导体由于其特殊的机械性能使其在极端环境下有较广的应用前景. 虽然通过硼(B)元素掺杂较易得到p型金刚石半导体,但具有优异电学性能的n型半导体却鲜见报道. 硼、硫（S）原子因半径及外层电子互补,其协同掺杂易合成p型或n型半导体,但其物理机理尚不清晰.在课题组已有实验报道基础上,借助第一性原理探究了B-S不同比例单掺杂及共掺杂金刚石的形成能、晶体内的存在形式及电子结构,从原子尺度揭示了金刚石由p型向n型半导体转变的阈值掺杂比例. 通过实验与理论的对比发现B在晶格内趋向团聚,而过量的S掺杂则发生析出.     

金刚石薄膜电致发光研究

报道了金刚石薄膜电致发光现象.为进一步提高金刚石薄膜蓝区电致发光强度,分别采用了硼氮双掺杂法和稀土掺杂法制备出了金刚石薄膜电致发光器件,并采用低电容率的本征金刚石薄膜和氧化硅薄膜为绝缘层的夹层式器件结构.研究结果显示:采用稀土铈掺杂可以有效地提高金刚石薄膜蓝区电致发光强度,其蓝区最大电致发光强度可达3.5 cd/m2;采用低电容率绝缘膜的夹层式结构,能有效地提高电子进入发光层时的能量,并有助于提高器件发光的稳定性和发光寿命.     

p-Type doping of diamond films with a novel organoboron source

p-Type polycrystalline diamond films were prepared by hot-filament CVD method using a liquid cyclic organic borinate ester as the doping source. The obtained films were identified as diamond films by means of SEM and Raman spectroscopy. The resistivity of the doped films can be adjusted by changing the temperature of the boron source.     

The effect of boron ion implantation and annealing on the microstructure and electrical characteristics of the diamond films

Diamond films were doped by boron ion-implantation with the energy of 120 keV. The implantation dose ranged from 10¹⁴ to 10¹⁷ cm⁻². After the implantation, the diamond films were annealed at different temperatures (600–750°C) for different times (2–15 min). Scanning Electronic Microscope, Raman and Secondary Ion Mass-spectrum were used to investigate the effect of boron ion implantation and annealing on the microstructure of the diamond films. The electrical resistivities of the diamond films were also measured. It was found that the best dose of boron ion-implantation into the diamond film was around 10¹⁶ cm⁻². The appropriate annealing temperature and time was 700°C and 2–5 min, respectively. After implantation, the resistivities were reduced to 0.1 Ω cm (almost nine orders lower than the unimplanted diamond films). These results show that boron ion implantation can be an effective way to fabricate P-type diamond films.     

Conductivity of boron-doped polycrystalline diamond films: influence of specific boron defects

The resistivity of boron doped polycrystalline diamond films changes with boron content in a very complex way with many unclear factors. From the large number of parameters affecting boron doped polycrystalline diamond film’s conductivity we focused on the role of boron atoms inside diamond grains in terms of boron contribution to the continuum of diamond electronic states. Using a combination of theoretical and experimental techniques (plane-wave Density Functional Theory, Neutron Depth Profiling, resistivity and Hall effect measurements, Atomic Force Microscopy and Raman spectroscopy) we studied a wide range of B defect parameters — the boron concentration, location, structure, free hole concentration and mobility. The main goal and novelty of our work was to find the influence of B defects (structure, interactions, charge localisation and spins) in highly B-doped diamonds — close or above the metal-insulator transition – on the complex material charge transport mechanisms.     

Electroluminescence of double-doped diamond thin films

A new electroluminescence device is fabricated by microwave plasma chemical vapour deposition system and electron beam vapour deposition system. It is comprised of highly doped silicon/diamond/boron/nitrogen-doped diamond/indium tin oxide thin films. Effects of process parameters on morphologies and structures of the thin films are detected and analysed by scanning electron microscopy, Raman spectrometer and x-ray photoelectron spectrometer. A direct-current (DC) power supply is used to drive the electroluminescence device. The blue light emission with a luminance of 1.2 cd·m 2 is observed from this double-doped diamond thin film electroluminescence device at an applied voltage of 105 V.     

Study of polycrystalline boron-doped diamond films by Raman spectroscopy and optical absorption spectroscopy

The effect of the degree of doping polycrystalline diamond films by boron on their Raman and absorption spectra has been studied in the visible region (from 200 to 1000 nm). As the boron concentration increases in a polycrystalline diamond film, its Raman spectrum exhibits a number of new specific features caused by the effect of boron atoms on the diamond lattice. The dependences that relate these features to the boron concentration in the films are given. Moreover, the absorption spectra of the films have revealed a peak whose maximum corresponds to photons with an energy near 2 eV.     

Dependence of the superconducting transition temperature on the doping level in single-crystalline diamond films

Homoepitaxial diamond layers doped with boron in the 10(20)-10(21) cm(-3) range are shown to be type II superconductors with sharp transitions (approximately 0.2 K) at temperatures increasing from 0 to 2.1 K with boron contents. The critical concentration for the onset of superconductivity in those 001-oriented single-crystalline films is about 5-7 10(20) cm(-3). The H-T phase diagram has been obtained from transport and ac-susceptibility measurements down to 300 mK.     

硼掺入量对含硼金刚石单晶热稳定性的影响

 在铁基触媒原材料中添加不同含量的六方氮化硼,采用粉末冶金方法制备片状触媒,在六面顶压机上合成出含硼金刚石单晶。用体视显微镜对金刚石单晶的结构、形貌进行观察,并用电子探针（EPMA）和波谱仪（WDS）分析了金刚石（111）晶面的硼含量,发现金刚石表面有硼元素存在,且其含量随着触媒中掺硼量的增加而变化。在测定了含硼金刚石单晶的静压强度的基础上,采用冲击韧性测定仪和差热分析仪对不同掺硼量触媒合成出的金刚石单晶在空气中的热稳定性进行了系统的对比研究。结果表明,触媒掺硼量对金刚石的机械强度和热稳定性有重要影响,随着掺硼量的变化,其机械强度和热稳定性均存在一个最佳值。     

Optical Properties of Boron-Doped Gallium Selenide

The electronic-absorption and luminescence spectra and the kinetics of relaxation of photocurrent in GaSe single crystals and thin films doped with boron atoms are experimentally investigated. Crystals are doped either in the course of synthesis or upon growing single crystals by the Bridgman method. Thin GaSe films are obtained by thermal evaporation of the compound preliminarily doped with boron. An absorption band with the maximum at λ = 925 nm, which is attributed to boron contaminations, is revealed from the comparison of the electronic-absorption spectra of a GaSe crystal and thin films doped with boron. When the crystals are excited with Nd:YAG laser pulses of a duration of 12 ns, it is established that recombination of nonequilibrium current carriers in pure crystals occurs through rapid and slow recombination channels and in crystals doped with boron only through rapid channels. In the region near λ = 932 nm, photoluminescence is observed in the crystals doped with boron, and its half-bandwidth is 15 Å.