等离子体浸没离子注入非导电聚合物的适应性及栅网诱导效应的研究

本文建立了绝缘材料等离子体浸没离子注入过程的动力学Particle-in-cell(PIC)模型, 将二次电子发射系数直接与离子注入即时能量建立关联, 研究了非导电聚合物厚度、介电常数和二次电子发射系数对表面偏压电位的影响规律以及栅网诱导效应. 研究结果表明: 非导电聚合物较厚时, 表面自偏压难以实现全方位离子注入, 栅网诱导可以间接为非导电聚合物提供偏压, 并抑制二次电子发射, 为厚大非导电聚合物表面等离子体浸没离子注入提供了有效途径.     

二次电子发射和负离子存在时的鞘层结构特性

 建立了包括电子、离子、器壁发射二次电子以及负离子多种成分的等离子体无碰撞鞘层的基本模型,讨论了二次电子发射和负离子对1维稳态等离子体鞘层结构的影响,并且分析了多种成分等离子体鞘层内的二次电子和负离子的相互作用。结果表明：二次电子发射系数的增加和负离子含量的增加,都将导致鞘层的厚度有所减小;二次电子发射系数超过临界发射系数之后,鞘层不再是离子鞘。随着器壁材料二次电子发射系数的增加,鞘层中的负离子密度分布也逐渐增加;负离子的增加,导致二次电子临界发射系数有所增加。另外,在等离子体鞘层中二次电子发射和负离子的存在,也影响着鞘层中电子的放电特性与器壁材料的腐蚀。     

介质靶表面的充电效应对等离子体浸没离子注入过程中鞘层特性的影响

针对等离子体浸没离子注入技术在绝缘体表面制备硅薄膜工艺，采用一维脉冲鞘层模型描述介质靶表面的充电效应对鞘层厚度、注入剂量及靶表面电位等物理量的影响.数值模拟结果表明：随着等离子体密度的增高，表面的充电效应将导致鞘层厚度变薄、表面电位下降以及注入剂量增加，而介质的厚度对鞘层特性的影响则相对较小. 关键词： 等离子体浸没离子注入 脉冲鞘层 绝缘介质 充电效应     

脉冲偏压上升沿特性对等离子体浸没离子注入鞘层扩展动力学的影响

等离子体浸没离子注入(PIII)是用于材料表面改性的一种廉价高效、非视线的技术.采用等离子体粒子模型，通过假设电子密度服从Boltzmann分布，求解Poisson方程和Newton方程，跟踪离子在等离子体鞘层中的运动形态及特性并进行统计分析，研究了不同上升速率和形状的6种波形上升沿对鞘层时空演化、离子注入能量和剂量的影响.结果表明，在PIII过程中，脉冲上升沿影响了等离子体鞘层的扩展，且不同波形诱导的鞘层厚度间存在最大差值.电场强度在鞘层的外边缘区域存在陡降区，离子的运动为非匀加速过程.可以通过调整脉冲 关键词： 等离子体浸没离子注入 鞘层 粒子模型 上升沿     

有限尺寸方靶等离子体离子注入动力学的三维粒子模拟研究

采用三维粒子模拟模型研究了有限尺寸方靶等离子体浸没离子注入过程中的鞘层动力学行为,得到了鞘层尺寸和方靶表面的注入剂量、注入能量以及注入角度等信息,并与二维无限长方靶注入结果进行了对比.模拟结果表明,与无限长方靶不同,有限尺寸方靶周围鞘层很快扩展为球形,但鞘层厚度明显减小.在模拟的50ω^-1_pi时间尺度内靶表面注入剂量很不均匀,中心区域注入剂量最小,四个边角附近位置注入剂量最大.这种剂量不均匀性是由于鞘层扩展为球形,使得鞘层内离子被聚焦并注入到边角附 关键词： 等离子体浸没离子注入 数值模拟 三维粒子模拟 有限尺寸方靶     

霍尔推进器中磁化二次电子对鞘层特性的影响

为进一步研究霍尔推进器壁面二次电子发射对推进器性能的影响,采用流体模型数值模拟了二次电子磁化效应的等离子体鞘层特性.得到二次电子磁化鞘层的玻姆判据.讨论了不同的磁场强度和方向、二次电子发射系数以及不同种类等离子体推进器的鞘层结构.结果表明:随器壁二次电子发射系数的增大,鞘层中粒子密度增加,器壁电势升高,鞘层厚度减小;鞘层电势及粒子密度随着磁场强度和方位角的增加而增加;而对于不同种类的等离子体,壁面电势和鞘层厚度也不同.这为霍尔推进器的磁安特性实验提供了理论解释. 关键词： 霍尔推进器 磁鞘 二次电子     

表面凹陷对等离子体浸没离子注入均匀性的影响

利用二维流体模型和数值计算方法模拟了等离子体浸没离子注入（ＰⅢ）Ｋ ,具有圆弧凹槽的平面靶周围的鞘层扩展情况,计算了鞘层扩展过程中的电热分布、离子速度和离子密度变化获得了沿靶表面的离子入射角度和注入剂量的分布情况,为等离子体浸没离子注入处理复杂形状靶提供了理论基础。     

不同成分等离子体鞘层的玻姆判据

在一维平板鞘层中采用流体模型分别研究了不同成分无碰撞等离子体鞘层的玻姆判据.通过拟牛顿法数值模拟了含有电子、离子、负离子以及二次电子的等离子体鞘层玻姆判据.结果表明二次电子发射增加了鞘层离子马赫数的临界值,且器壁发射二次电子温度越高,离子马赫数临界值越小.负离子使离子马赫数临界值减小.而在含有二次电子和负离子的等离子体鞘层中,当负离子较少时,二次电子发射对离子马赫数临界值影响较大;当负离子增加时,离子马赫数的临界值则主要受负离子的影响. 关键词： 鞘层 等离子体 玻姆判据     

电子的非广延分布对等离子体鞘层中二次电子发射的影响

采用一维流体模型研究了非广延分布电子对等离子体鞘层中二次电子发射的影响.通过数值模拟,研究了非广延分布电子对考虑二次电子发射的等离子体鞘层玻姆判据、器壁电势、器壁二次电子临界发射系数以及等离子体鞘层中二次电子密度分布的影响.研究结果发现,当电子分布偏离麦克斯韦分布(q=1,广延分布)时,非广延参量q的改变对器壁二次电子发射有着重要的影响.不论电子分布处于超广延(q 1),还是处于亚广延状态(q 1),随着非广延参量q的增加,都会出现鞘边临界马赫数跟着减小,同时对于随着二次电子发射系数的增加,临界马赫数跟着增加.器壁电势随着参量q的增加而增加.器壁二次电子临界发射系数则随着非广延参量的增加而减小,并且等离子体中所含的离子种类质量数越大,非广延参量的变化对器壁二次电子临界发射系数的值影响越小.此外,随着非广延参量的增加,鞘层厚度减小,鞘层中二次电子数密度增加.通过对数值模拟结果分析,发现电子分布处于超广延分布状态对等离子体鞘层中二次电子发射特性的影响要比电子处于亚广延分布状态要更明显.     

半圆形容器等离子体源离子注入过程中离子动力学的两维PIC计算机模拟

利用两维particle-in-cell方法研究了半圆形容器表面等离子体源离子注入过程中鞘层的时空演化规律. 详尽考察了鞘层内随时间变化的电势分布和离子密度分布规律,离子在鞘层中的运动轨迹和运动状态,得到了半圆容器内、外表面和边缘平面上各点离子注入剂量分布规律,获得了工件表面各点注入离子的入射角分布规律. 研究结果揭示了半圆容器边缘附近鞘层中离子聚焦现象,以及离子聚焦现象导致工件表面注入剂量分布和注入角度分布存在很大不均匀的基本物理规律. 关键词： 等离子体源离子注入 鞘层 两维particle-in-cell方法 离子运动轨迹     

Plasma immersion ion implantation with dielectric substrates

Plasma immersion ion implantation (PIII) is a novel implantation technique for high-dose/high-current implants. Using the SPICE circuit simulator to model the PIII process, the sheath voltage and ion energy distribution are examined. Implanting into a dielectric substrate results in a significant voltage buildup in the wafer, reducing the effective implant energy. Increasing the pulse voltage raises the dose/pulse, but at the cost of an expanded implant energy spread. Increasing the plasma ion density also raises the dose/pulse, but at the cost of a wider implant energy spread and a lower coupling efficiency. Increasing the substrate thickness reduces both the coupling efficiency and dose/pulse while broadening the energy spread. The large voltage generated across the dielectric substrate decreases the charge neutralization time significantly, reducing the possibility of gate oxide damage     

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采用PIC/MCC模型,通过数值模拟的方法研究了束线离子和靶台复合加速离子注入过程中靶台偏压大小对注入过程离子动力学行为的影响,重点考察了不同偏压作用下离子的注入能量、注入剂量、注入角度以及注入范围的变化.结果表明,靶台上施加脉冲偏压后,在束流离子的作用下空间电荷分布发生变化,束流正下方的电势线会发生凹曲,凹曲的电场同时又作用于空间中的带电粒子,影响粒子的运动;靶台偏压越高,零电势线距离靶台越远,靶台电场对离子的作用范围越大.离子的注入剂量、注入能量随着靶台偏压的增大而增大,而偏压对离子注入角度的影响并不大,大部分离子都以垂直入射的方式注入到靶台表面.另外,离子注入到靶台上的面积会因束流离子在靶台电场中飞行偏转而增大,并且偏压越大注入面积增大越明显.     

Process and electrical (modulator) efficiency of plasma immersionion implantation

Plasma immersion ion implantation (PIII) has been shown to be an effective surface modification technique. In PIII processes, the implantation voltage has a large impact on the process and electrical (modulator) efficiency. For experiments in which the sample temperature is raised to a constant value by ion bombardment only - without external heating - our simulation studies reveal that the low-voltage mode featuring a higher ion current density gives rise to a higher electrical efficiency with regard to both single- and batch-processing. The low-voltage mode also produces a thinner plasma sheath and lower energy loss to the passive resistor. The hardware capacitance is responsible for the reduction in the electrical efficiency. For PIII experiments conducted under typical conditions, e.g., plasma density of 5.0×10 ⁹ cm^-3, implanted area of 0.08 m², and employing a 10 kΩ pull-down resistor for operations between 1 kV and 100 kV, the efficiency of the power modulator is quite low and generally less than 50% exclusive of the inefficiency stemming from secondary electrons. Our results demonstrate that the low-voltage, small pulse-duration operating mode has higher implantation efficiency compared to conventional high-voltage PIII. This can be attributed to the higher effective implantation efficiency η_e resulting from the smaller secondary electron coefficient at a lower voltage and higher electrical efficiency η_p, in the low-voltage, short-pulsewidth operating mode. Our work suggests that both the total implantation efficiency η_total and modification efficacy can be improved by elevated-temperature, high-frequency, low-voltage PIII     

Low pressure plasma immersion ion implantation of silicon

Mono-energetic plasma immersion ion implantation (PIII) into silicon can be attained only under collisionless plasma conditions. In order to reduce the current load on the high voltage power supply and modulator and sample heating caused by implanted ions, the plasma pressure must be kept low (<1 mtorr). Low pressure PIII is therefore the preferred technique for silicon PIII processing such as the formation of silicon on insulator. Using our model, we simulate the characteristics of low pressure PIII and identify the proper process windows of hydrogen PIII for the ion-cut process. Experiments are conducted to investigate details in three of the most important parameters in low pressure PIII: pulse width, voltage, and gas pressure. We also study the case of an infinitely long pulse, that is, dc PIII     

Sheath structure in plasma with two species of positive ions and secondary electrons

The properties of a collisionless plasma sheath are investigated by using a fluid model in which two species of positive ions and secondary electrons are taken into account. It is shown that the positive ion speeds at the sheath edge increase with secondary electron emission(SEE) coefficient, and the sheath structure is affected by the interplay between the two species of positive ions and secondary electrons. The critical SEE coefficients and the sheath widths depend strongly on the positive ion charge number, mass and concentration in the cases with and without SEE. In addition, ion kinetic energy flux to the wall and the impact of positive ion species on secondary electron density at the sheath edge are also discussed.     

Heat flow through a plasma sheath in the presence of secondary electron emission from plasma‐wall interaction

The formation of a plasma sheath in front of a negative wall emitting secondary electron is studied by a one‐dimensional fluid model. The model takes into account the effect of the ion temperature. With the secondary electron emission (SEE ) coefficient obtained by integrating over the Maxwellian electron velocity distribution for various materials such as Be, C, Mo, and W, it is found that the wall potential depends strongly on the ion temperature and the wall material. Before the occurrence of the space‐charge‐limited (SCL ) emission, the wall potential decreases with increasing ion temperature. The variation of the sheath potential caused by SEE affects the sheath energy transmission and impurity sputtering yield. If SEE is below SCL emission , the energy transmission coefficient always varies with the wall materials as a result of the effect of SEE , and it increases as the ion temperature is increased. By comparison of with and without SEE , it is found that sputtering yields have pronounced differences for low ion temperatures but are almost the same for high ion temperatures.