磁控反应溅射AlN缓冲层对GaN基LED器件性能的影响

以直流磁控反应溅射法(RMS)在图形化蓝宝石衬底上制备的AlN薄膜作为缓冲层,采用金属有机化学气相沉积法(MOCVD)外延生长了GaN基LED。与MOCVD生长的低温GaN缓冲层相比,RMS制备的AlN缓冲层具有表面更平整、颗粒更小的形核岛,有利于促进GaN外延的横向生长,减少了形核岛合并时的界面数量和高度差异,降低了缺陷和位错产生的几率。研究结果表明,溅射AlN缓冲层取代传统低温GaN缓冲层后,外延生长的GaN材料具有更高的晶体质量,LED器件在亮度、漏电和抗静电能力等光电特性上均有明显提升。     

三甲基镓流量对GaN外延层和GaN缓冲层生长的影响

采用金属有机物气相外延法在蓝宝石衬底上生长了以GaN为缓冲层的GaN薄膜.研究了不同三甲基镓流量下所生长缓冲层对GaN外延层质量的影响.对样品采用X线双晶衍射法测试其结晶质量,光致发光法测试其光学特性.实验结果显示高三甲基镓流量下生长的缓冲层可以提高GaN外延层的质量.对缓冲层进行的原子力显微镜测试分析表明不同三甲基镓流量会显著地影响缓冲层的生长模式.根据试验结果构造了一个GaN缓冲层的生长模型.     

金属有机化合物相外延生长GaN薄膜的电子微结构研究

研究了金属有机化合物气相外延（ＭＯＶＰＥ）方法在（０００１）氧化铝基底上生长的ＧａＮ薄膜的微结构，目的在于解释ＧａＮ缓冲层在二步法生和过程中的作用及其对外延层晶体质量的影响。在缓冲层中观察到了高密度的结构缺陷，并发现了两种晶体结构（立方和六角）的ＧａＮ。进而对两种结构ＧａＮ的成因进行讨论，并对缓冲层和外延层中结构缺陷的关系进行了研究。     

利用MOCVD在r面蓝宝石上生长的α面GaN中两步AlN缓冲层的优化

采用两步AlN缓冲层(一层低温AlN和一层高温AlN)在r面蓝宝石衬底上生长了非极性的α面GaN,并利用高分辨X射线衍射和光致荧光谱对所生长的材料进行了研究.两步AIN缓冲层在我们之前的工作中已被证明比单步高温AlN或低温GaN缓冲层更有利于减小材料各向异性和提高晶体质量,本文进一步优化了两步AlN缓冲层的结构,并得到了各向异性更小,晶体质量更好的α面GaN薄膜.分析表明,两步AlN缓冲层中的低温AlN层在减小各向异性中起着关键作用.低温AlN层能抑制了优势方向(c轴)的原子迁移,有利于劣势方向(m轴)的原子迁移,从而减小了Al原子在不同方向迁移能力的差异,并为其后的高温AlN缓冲层和GaN层提供"生长模板",以得到各向异性更小、晶体质量更好的α面GaN材料.     

金属有机物化学气相沉积同质外延GaN薄膜表面形貌的改善

为了获得高质量的GaN薄膜材料,研究了金属有机物气相沉积系统中GaN插入层对GaN衬底同质外延层表面宏观缺陷和晶体质量的影响.研究发现,插入层生长温度是影响GaN同质外延膜表面形貌和晶体质量的关键因素.由于生长模式与插入层生长温度相关,随着插入层生长温度的降低,外延膜生长模式由准台阶流模式转变为层状模式,GaN同质外延膜表面丘壑状宏观缺陷逐渐减少,但微观位错密度逐渐增大.通过对插入层温度和厚度的优化,进一步调控外延层的生长模式,最终有效降低了外延层表面的宏观缺陷,获得了表面原子级光滑平整、位错密度极低的GaN同质外延膜,其X射线衍射摇摆曲线(002),(102)晶面半峰宽分别为125arcsec和85arcsec,表面粗糙度均方根大小为0.23nm.     

利用MOCVD在r面蓝宝石上生长的α面GaN中两步AlN缓冲层的优化

采用两步AlN缓冲层(一层低温AlN和一层高温AlN)在r面蓝宝石衬底上生长了非极性的α面GaN,并利用高分辨X射线衍射和光致荧光谱对所生长的材料进行了研究.两步AIN缓冲层在我们之前的工作中已被证明比单步高温AlN或低温GaN缓冲层更有利于减小材料各向异性和提高晶体质量,本文进一步优化了两步AlN缓冲层的结构,并得到...     

国产SiC衬底上利用AIN缓冲层生长高质量GaN外延薄膜

采用高温AlN作为缓冲层在国产SiC衬底上利用金属有机物化学气相外延技术生长GaN外延薄膜.通过优化AlN缓冲层的生长参数得到了高质量的GaN外延薄膜,其对称(0002)面和非对称(1012)面X射线衍射摇摆曲线的半峰宽分别达到130 arcsec和252 arcsec,这是目前报道的在国产SiC衬底上生长GaN最好的...     

AlN插入层对硅衬底GaN薄膜生长的影响

利用金属有机化合物气相外延沉积技术在2inch(5.08cm)Si(111)图形衬底上生长了GaN外延薄膜,在Al组分渐变AlGaN缓冲层与GaN成核层之间引入了AlN插入层,研究了AlN插入层对GaN薄膜生长的影响。结果表明,随着AlN插入层厚度的增加,GaN外延膜(002)面与(102)面X射线衍射摇摆曲线半峰全宽明显变小,晶体质量变好,同时外延膜在放置过程中所产生的裂纹密度逐渐减小直至不产生裂纹。原因在于AlN插入层的厚度对GaN成核层的生长模式有明显影响,较厚的AlN插入层使GaN成核层倾向于岛状生长,造成后续生长的nGaN外延膜具有更多的侧向外延成分,从而降低了GaN外延膜中的位错密度,减少了GaN外延膜中的残余张应力。同时还提出了一种利用荧光显微镜观察黄带发光形貌来表征GaN成核层形貌和生长模式的新方法。     

用MOVPE方法外延生长Si掺杂的立方相GaN

用MOVPE方法采取一种两步生长过程生长了未掺杂和Si掺杂的GaN.在生长了一个20nm厚的缓冲层后,外延生长了1μm厚的立方GaN外延层.利用二次离子质谱测定了掺杂的程度.并用X射线衍射和光致发光测量来表征了未掺杂和Si掺杂GaN的结构和光学质量.     

AlGaN表面坑状缺陷及GaN缓冲层位错缺陷对AlGaN/GaN HEMT电流崩塌效应的影响

利用金属有机气相外延(MOVPE)技术生长了具有不同AlGaN表面坑状缺陷和GaN缓冲层位错缺陷密度的AlGaN/GaN 高电子迁移率晶体管(HEMT)样品,并对比研究了两种缺陷对器件栅、漏延迟电流崩塌效应的影响.栅延迟测试表明,AlGaN表面坑状缺陷会引起栅延迟电流崩塌效应和源漏电阻的增加,而且表面坑状缺陷越多,栅延迟电流崩塌程度和源漏电阻的增加越明显.漏延迟测试显示,AlGaN表面坑状缺陷对漏延迟电流崩塌影响不大,而GaN缓冲层位错缺陷主要影响漏延迟电流崩塌.研究结果表明,AlGaN表面坑状缺陷和Ga 关键词： AlGaN/GaN HEMT 电流崩塌 坑状缺陷 位错缺陷     

The influence of AlN/GaN superlattice intermediate layer on the properties of GaN grown on Si（111） substrates

AlN/GaN superlattice buffer is inserted between GaN epitaxial layer and Si substrate before epitaxial growth of GaN layer. High-quality and crack-free GaN epitaxial layers can be obtained by inserting AlN/GaN superlattice buffer layer. The influence of AlN/GaN superlattice buffer layer on the properties of GaN films are investigated in this paper. One of the important roles of the superlattice is to release tensile strain between Si substrate and epilayer. Raman spectra show a substantial decrease of in-plane tensile strain in GaN layers by using AlN/GaN superlattice buffer layer. Moreover, TEM cross-sectional images show that the densities of both screw and edge dislocations are significantly reduced. The GaN films grown on Si with the superlattice buffer also have better surface morphology and optical properties.     

GaN基异质结缓冲层漏电分析

通过对GaN基异质结材料C-V特性中耗尽电容的比较,得出AlGaN/GaN异质结缓冲层漏电与成核层的关系.实验结果表明,基于蓝宝石衬底低温GaN成核层和SiC衬底高温AlN成核层的异质结材料比基于蓝宝石衬底低温AlN成核层异质结材料漏电小、背景载流子浓度低.深入分析发现,基于薄成核层的异质结材料在近衬底的GaN缓冲层中具有高浓度的n型GaN导电层,而基于厚成核层的异质结材料的GaN缓冲层则呈高阻特性.GaN缓冲层中的n型导电层是导致器件漏电主要因素之一,适当提高成核层的质量和厚度可有效降低GaN缓冲层的背景载流子浓度,提高GaN缓冲层的高阻特性,抑制缓冲层漏电. 关键词： AlGaN/GaN异质结 GaN缓冲层 漏电 成核层     

Characterization of GaN/AlGaN epitaxial layers grown by metalorganic chemical vapour deposition for high electron mobility transistor applications

GaN and AlGaN epitaxial layers are grown by a metalorganic chemical vapour deposition (MOCVD) system. The crystalline quality of these epitaxially grown layers is studied by different characterization techniques. PL measurements indicate band edge emission peak at 363.8 nm and 312 nm for GaN and AlGaN layers respectively. High resolution XRD (HRXRD) peaks show FWHM of 272 and 296 arcsec for the (0 0 0 2) plane of GaN and GaN in GaN/AlGaN respectively. For GaN buffer layer, the Hall mobility is 346 cm²/V-s and carrier concentration is 4.5 × 10¹⁶/cm³. AFM studies on GaN buffer layer show a dislocation density of 2 × 10⁸/cm² by wet etching in hot phosphoric acid. The refractive indices of GaN buffer layer on sapphire at 633 nm are 2.3544 and 2.1515 for TE and TM modes respectively.     

MOCVD生长Si衬底上HT-AlN缓冲层低生长压力对GaN薄膜的影响

采用金属有机化学气相沉积（MOCVD）技术在Si（111）衬底上外延GaN薄膜,对高温AlN（HT-AlN）缓冲层在小范围内低生长压力（6.7~16.6 kPa）条件下对GaN薄膜特性的影响进行了研究。研究结果表明GaN外延层的表面形貌、结构和光学性质对HT-AlN缓冲层的生长压力有很强的的依赖关系。增加HT-AlN缓冲层的生长压力,GaN薄膜的光学和形貌特性均有明显改善,当HT-AlN缓冲层的生长压力为13.3 kPa时,得到无裂纹的GaN薄膜,其（002）和（102）面的X射线衍射峰值半高宽分别为735 arcsec和778 arcsec,由拉曼光谱计算得到的张应力为0.437 GPa,原子力显微镜（AFM）观测到表面粗糙度为1.57 nm。     

GaP layers grown on GaN with and without buffer layers

The growth of GaP layer on GaN with and without buffer layers by metal-organic chemical vapour deposition (MOCVD) has been studied. Results indicate that the GaP low temperature buffer layer can provide a high density of nucleation sites for high temperature (HT) GaP growth. These sites can promote the two-dimensional (2D) growth of HT GaP and reduce the surface roughness. A GaP single crystal layer grown at 680°C is obtained using a 40-nm thick GaP buffer layer. The full-width at half-maximum (FWHM) of the (111) plane of GaP layer, measured by DCXRD, is 560 arcsec. The GaP layer grown on GaN without low temperature GaP buffer layer shows a rougher surface. However, the FWHM of the (111) plane is 408 arcsec, which is the indication of better crystal quality for the GaP layer grown on GaN without a low temperature buffer layer. Because it provides less nucleation sites grown at high growth temperature, the three-dimensional (3D) growth is prolonged. The crystalline quality of GaP is lightly improved when the surface of GaN substrate is pretreated by PH3 , while it turned to be polycrystalline when the substrate is pretreated by TEGa.     

Growth and optical properties of filamentary GaN nanocrystals grown on a hybrid SiC/Si(111) substrate by molecular beam epitaxy

The potential to grow filamentary GaN nanocrystals by molecular beam epitaxy on a silicon substrate with a nanosized buffer layer of silicon carbide has been demonstrated. Morphological and optical properties of the obtained system have been studied. It has been shown that the intensity of the photoluminescence spectrum peak of such structures is higher than that of the best filamentary GaN nanocrystals without the buffer silicon carbide layer by a factor of more than two.     

Microstructural and compositional characteristics of GaN films grown on a ZnO-buffered Si (111) wafer

Polycrystalline GaN thin films have been deposited epitaxially on a ZnO-buffered (111)-oriented Si substrate by molecular beam epitaxy. The microstructural and compositional characteristics of the films were studied by analytical transmission electron microscopy (TEM). A SiO(2) amorphous layer about 3.5 nm in thickness between the Si/ZnO interface has been identified by means of spatially resolved electron energy loss spectroscopy. Cross-sectional and plan-view TEM investigations reveal (GaN/ZnO/SiO(2)/Si) layers exhibiting definite a crystallographic relationship: [111](Si)//[111](ZnO)//[0001](GaN) along the epitaxy direction. GaN films are polycrystalline with nanoscale grains ( approximately 100 nm in size) grown along [0001] direction with about 20 degrees between the (1l00) planes of adjacent grains. A three-dimensional growth mode for the buffer layer and the film is proposed to explain the formation of the as-grown polycrystalline GaN films and the functionality of the buffer layer.     

Band transitions in wurtzite GaN and InN determined by valence electron energy loss spectroscopy

Valence electron energy loss spectroscopy (VEELS) was applied to determine band transitions in wurtzite InN, deposited by molecular beam epitaxy on (0001) sapphire substrates or GaN buffer layers. The GaN buffer layer was used as VEELS reference. At room temperature a band transition for wurtzite InN was found at (1.7±0.2 eV) and for wurtzite GaN at (3.3±0.2 eV) that are ascribed to the fundamental bandgap. Additional band transitions could be identified at higher and lower energy losses. The latter may be related to transitions involving defect bands. In InN, neither oxygen related crystal phases nor indium metal clusters were observed in the areas of the epilayers investigated by VEELS. Consequently, the obtained results mainly describe the properties of the InN host crystal.