A comparative study of YBa2Cu3O7-δ/YSZ bilayer films deposited on silicon-on-insulator substrates with and without HF pretreatment

Highly epitaxial YBa2Cu3O7-δ (YBCO) and yttria-stabilized zirconia (YSZ) bilayer thin films have been deposited on silicon-on-insulator (SOI) substrates by using in situ pulsed laser deposition (PLD) technique. In the experiment, the native amorphous SiO2 layers on some of the SOI substrates are removed by dipping them in a 10% HF solution for 15 s. Comparing several qualities of films grown on substrates with or without HF pretreatment, such as thin film crystallinity, general surface roughness, temperature dependence of resistance, surface morphology, as well as average crack spacing and crack width, naturally leads to the conclusion that preserving the native SiO2 layer on the surface of the SOI substrate can not only simplify the experimental process but can also achieve fairly high quality YSZ and YBCO thin films.     

Raman scattering of polycrystalline GaSb thin films grownby co-evapouration process

<正>This paper reports that GaSb thin films have been co-deposited on soda-lime glass substrates.The GaSb thin film structural properties are characterized by Raman spectroscopy.The Sb-A_1g/GaSb-TO ratio decreases rapidly with the increase of substrate temperature,which suggests a small amount of crystalline Sb in the GaSb thin film and suggests that Sb atoms in the thin film decrease.In Raman spectra,the transverse optical（TO） mode intensity is stronger than that of the longitudinal optical（LO） mode,which indicates that all the samples are disordered.The LO/TO intensity ratio increases with increasing substrate temperature which suggests the improved polycrystalline quality of the GaSb thin film.A downshift of the TO and LO frequencies of the polycrystalline GaSb thin film to single crystalline bulk GaSb Raman spectra is also observed.The uniaxial stress in GaSb thin film is calculated and the value is around 1.0 GPa.The uniaxial stress decreases with increasing substrate temperature.These results suggest that a higher substrate temperature is beneficial in relaxing the stress in GaSb thin film.     

Phase Structural Characteristics of ZrV2 Thin Film Prepared by Magnetron Sputtering

The thin film metal hydride has become an emerging field of research in metal hydride batteries for its good mechanical and hydrogenation properties. ZrV2 thin films have been prepared using a dc magnetron sputtering method, and the phase structure is investigated. Only amorphous or crystalline Zr and V mixture phases are achieved when substrates are heated during either to 400℃ or to 550℃. The annealing causes segregation of Zr and V in the film induced by strain-driven diffusion and interdiffusion between substrate Mo and film elements at high temperature, which results in the formation of mixture phases ofC14, C15, Zr and V, but the content of C15 phase is not higher compared with that in the bulk material.     

Effects of Substrate Temperature on Helium Content and Microstructure of Nanocrystalline Titanium Films

Helium-charged nanocrystalline titanium films have been deposited by HeAr magnetron co-sputtering. The effects of substrate temperature on the helium content and microstructure of the nanocrystalline titanium films have been studied. The results indicate that helium atoms with a high concentration are evenly incorporated in the deposited titanium films. When the substrate temperature increases from 60℃ to 350℃ while the other deposition＇parameters are fixed, the helium content decreases gradually from 38.6 at.% to 9.2at.%, which proves that nanocrystalline Ti films have a great helium storage capacity. The 20 angle of the Bragg peak of （002） crystal planes of the He-charged Ti film shifts to a lower angle and that of （100） crystal plane is unchanged as compared with that of the pure Ti film, which indicates that the lattice parameter c increases and a keeps at the primitive value. The grain refining and helium damage result in the diffraction peak broadening.     

The Influence of Au-Doping on Morphology and Visible-Light Reflectivity of TiN Thin Films Deposited by Direct-Current Reactive Magnetron Sputtering

Ti, TiN and Au-TiN （Au content： from 0.5%to 7.7%） thin films were deposited on stainless steel substrates by dc reactive magnetron sputtering with a metal Ti target. The crystal structure, surface morphology and visiblelight reflectivity of the films for different film compositions are studied in detail. Distinctly different surface morphologies appear for the Ti, TiN and Au-TiN thin films. It can be observed that the surface morphology of the TiN film is affected by the Au-doping, when the Au content increases from 0% to 7.7%, surface roughness enlarges from 62.4 to 82.8 nm. Moreover, visible-light reflectivity varies significantly with increasing A u contents in the TiN films. However, the rettectivity of the TiN thin film at 550-800 nm is higher than that of the Au-TiN thin film. The present work illustrates the dependence of metal elements on the surface morphology and on the reflectivity of Au-TiN thin films. It is speculated that the addition of Au can suppress the formation and growth of TiN grains so that it changes the surface morphology and the Au-TiN thin film has potential applications in spectral selective coating.     

Effect of Substrates on CuInSe2 Nanoparticle Thin Films by Radio Frequency Reactive Sputtering

CuInSe2(CIS) nanoparticle thin films have been prepared by radio frequency reactive magnetron sputtering from compound ternary fan-shaped targets on low-temperature substrates with pure argon gas as the atmosphere.The stoichiometry of the ternary compound semiconductor quantum dots can easily be controlled by the ratios of the ternary elements and sputtering parameters.CIS nanoparticle thin films regularly shaped and distributed reasonably uniform in size on substrates of 7059 glass etc can be grown in this way.The average particle diameter can be varied between 40-80 nm by an appropriate choice of the substrate temperature,power density and total CIS coverage.the optical and electrical properties of the CIS films have also been studied.     

Modelling of an obliquely deposited thin film in three dimensions by kinetic Monte Carlo method

A simulation of the growth of an obliquely deposited thin film in a three-dimensional lattice was made using kinetic Monte Carlo method. Cu growth in three dimensions on a (001) substrate with high deposition rates has been simulated in this model. We mainly investigated the variation of three-dimensional morphology and microstructure offilms with incidence angle of sputtered flux. The relation of roughness and densities of films with incidence angle was also investigated. The simulation results show that the surface roughness increases and the relative density of thin film decreases with increasing incidence angle, respectively; the columnar structures were separated by void regions for large incidence angle and high deposition rate. The simulation results are in good agreement with experimental results.However, the orientation angle of columns is not completely consistent with the classical tangent rule.     

Fabrication of Single Crystalline silicon on Glass by Smart—Cut Technique

Single crystalline silicon films are transferred on to a glass substrate by the smart-cut technique,which is based on H^ ions implantation,anodic bonding and layer transfer,Structures of the resulting thin film silicon on galss(SOG) are characterized by transmission-electron microscopy,scanning electron microscopy and Raman spectroscopy.The results show that SOG substrates fabricated by the smart-cut have advantages of steep top Si/glass interface and good monocrystalline Si quality.The Hall-effect measurement indicates that the single crystalline SOG substrates have a better electrical property compared with polycrystalline silicon SOG substrates.     

PINNING EFFECT OF LEAD LANTHANUM TITANATE THIN FILMS DEPOSITED ON DIFFERENT SUBSTRATES

Pinning effect of lead lanthanum titanate (PLT) ferroelectric thin films with excess PbO of 20 mol% has been studied for deposition on diffe rent substrates. Silicon, sapphire and quartz were used as substrates on which P t/Ti or LaNiO₃ thin films were deposited as bottom electrodes. Electron probe analysis results showed that there was still a certain amount of excess Pb in PLT films after annealing at 550 ℃ for 1 h, and the amount of it was dependent on the substrate used. The distribution of excess Pb in the films was investig ated by Auger electron spectroscopy depth profile. It was shown that the substrates and the bottom electrodes had significant effects on the content and distrib ution of excess Pb in PLT films. The excess Pb and its accumulation at the inter face between the film and bottom electrode may act as pinning centers and have a pinning effect on domains, which can be observed by abnormal P-E hysteresis loops and abnormal C-V curves. The excess Pb content in the films and the accumulation of Pb at the interface were high in PLT films deposited on Pt/Ti/S i, and considerable pinning effect was observed. As LaNiO₃ would absorb most part of the excess Pb in PLT films, the content of excess Pb in the films deposited on LaNiO₃/Si was very low and the pinning effect was hardly observed.     

Influence of Concentration of Vanadium in Zinc Oxide on Structural and Optical Properties with Lower Concentration

ZnO films doped with different vanadium concentrations are deposited onto glass substrates by dc reactive magnetron sputtering using a zinc target doped with vanadium. The vanadium concentrations are examined by energy dispersive spectroscopy （EDS） and the charge state of vanadium in ZnO thin films is characterized by x-ray photoelectron spectroscopy. The results of x-ray diffraction （XRD） show that all the films have a wurtzite structure and grow mainly in the c-axis orientation. The grain size and residual stress in the deposited films are estimated by fitting the XRD results. The optical properties of the films are studied by measuring the transmittance. The optical constants （refractive index and extinction coefficient） and the film thickness are obtained by fitting the transmittance. All the results are discussed in relation with the doping of the vanadium.     

Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques

Cu film and Ti/Cu film on polyimide substrate were prepared by ion implantation and ion beam assisted deposition (IBAD) techniques. Three-dimension white-light interfering profilometer was used to measure thickness of each film. The thickness of the Cu film and Ti/Cu film ranged between 490 nm and 640 nm. The depth profile, surface morphology, roughness, adhesion, nanohardness, and modulus of the Cu and Ti/Cu films were measured by scanning Auger nanoprobe (SAN), atomic force microscopy (AFM), and nanoindenter, respectively. The polyimide substrates irradiated with argon ions were analyzed by scanning electron microscopy (SEM) and AFM. The results suggested that both the Cu film and Ti/Cu film were of good adhesion with polyimide substrate, and ion beam techniques were suitable to prepare thin metal film on polyimide.     

Specific features of the determination of the mechanical characteristics of thin films by the nanoindentation technique

The hardness and the elastic modulus of Cu thin films on Si, Ti, Cu, and Al substrates are investigated. It is demonstrated that the use of the Oliver-Pharr method in combination with the technique for evaluating the true hardness makes it possible to determine uniquely the hardness of Cu thin films at different ratios between the hardnesses of the film and the substrate. The elastic modulus of thin films can be correctly measured by the Oliver-Pharr method only in the case where the film and the substrate exhibit identical elastic properties. In order to determine the elastic moduli of films with the use of the parameter P/S ², the film and the substrate should have close values of both the hardness and the elastic modulus.     

The comparison between CdS thin films grown on Si(111) substrate and quartz substrate by femtosecond pulsed laser deposition

Two kinds of cadmium sulfate (CdS) thin films have been grown at 600 °C onto Si(111) and quartz substrates using femtosecond pulsed laser deposition (PLD). The influence of substrates on the structural and optical properties of the CdS thin films grown by femtosecond pulsed laser deposition have been studied. The CdS thin films were characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM), photoluminescence (PL) and Raman spectroscopy. Although CdS thin films deposited both on Si(111) and quartz substrates were polycrystalline and hexagonal as shown by the XRD , SEM and AFM results, the crystalline quality and optical properties were found to be different. The size of the grains for the CdS thin film grown on Si(111) substrate were observed to be larger than that of the CdS thin film grown on quartz substrate, and there is more microcrystalline perpendicularity of c-axis for the film deposited on the quartz substrate than that for the films deposited on the Si substrate. In addition, in the PL spectra, the excitonic peak is more intense and resolved for CdS film deposited on quartz than that for the CdS film deposited on Si(111) substrate. The LO and TO Raman peaks in the CdS films grown on Si(111) substrate and quartz substrate are different, which is due to higher stress and bigger grain size in the CdS film grown on Si(111) substrate, than that of the CdS film grown on the amorphous quartz substrate. All this suggests that the substrates have a significant effect on the structural and optical properties of thin CdS films. PACS 81.15.Fg; 81.05.Ea; 78.20.-e; 78.67.-n; 42.62.-b     

基底对光学薄膜弱吸收测量的影响

 对表面热透镜技术测量光学薄膜弱吸收低频调制时不同基底对测量的影响进行了理论分析。用Lambda—900分光光度计测量了K9和石英基底的Ti₃O₅单层膜的吸收值，将该组样品作为定标片；用表面热透镜装置分别测量了BK7和石英空白基底及HfO₂，ZnO两组不同基底不同厚度单层膜样品的吸收。通过分析比较同一工艺条件下镀制的不同基底薄膜样品用与其同种和不同种基底定标片定标测量的结果，表明在低频测量时需要用与测量样品同种基底的定标片定标；不同厚度样品的测量结果表明，在不能严格满足热薄条件时,测量结果需引入修正值。     

XPS and SIMS characterisation of TiOxNy solar absorber films

Solar thermal collectors have been prepared with thin TiO_xN_y films deposited using ion beam assisted deposition, on Si and Cu substrates. The films are amorphous and x and y were controlled by altering the O₂/N₂ ratio in the gas source. After annealing at temperatures of 200 – 400 °C, films have been depth profiled using Secondary Ion Mass Spectrometry. Profiles reveal the degradation of the film, particularly for films on Cu substrates, by migration of the substrate atoms through the films, to the sample surface. In general, films with x<1 and y>1 show improved temperature stability, ultimately at the expense of a reduced transmission window. Contrary to previous suggestions in the literature, the degradation mechanism initially involves the formation of a nitrogen rich phase, rather than an oxide at the film surface. On copper substrates, the nature of the films and of this phase, formed by diffusion of the substrate atoms, have been investigated by X-ray photoelectron spectroscopy (XPS). These investigations reveal complex behaviour in the early stages of film failure, with the suggestion that the initial films, at least near the surface, are two phase, and the reaction layer mixes the TiO_xN_y with some Ti replacement by ions from the Cu substrate.     

多晶薄膜屈服强度的一个模型

从位错运动的应力功和应变能关系导出了附着在基体上并有钝化层薄膜的屈服强度公式.该式表明多晶薄膜的屈服强度由两个影响因子（晶粒取向和位错类型）和三个强化因子（钝化层强化，基体强化和晶粒强化）确定.和已报道的实验结果基本一致表明了该模型的合理性. 关键词： 多晶薄膜 屈服强度     

基底材料对磁控共溅射Al-Cu-Fe薄膜特性的影响

 采用磁控共溅射工艺来制备Al-Cu-Fe薄膜,选用抛光状态的纯Al、纯Cu和不同粗糙度的不锈钢基作为基底材料。通过原子力显微镜分析薄膜的表面形貌,利用扫描电镜能谱仪分析薄膜的元素含量;通过MTS纳米力学综合测试系统分析薄膜的结合强度和摩擦因数。分析结果表明：不锈钢作为基底材料的薄膜与基体的结合强度最大,其次为纯铝和纯铜。纯铜基底薄膜的摩擦因数最大,达到0.17,其余两种薄膜的摩擦因数均不大于0.03。而薄膜表面形貌与基底材料的原始形貌有直接的联系,基底原始粗糙度越小,薄膜的表面组织也越细;基底原始粗糙度越大,薄膜表面形成的晶粒的团聚越明显。     

Chiral surfaces and metal/ceramic heteroepitaxy in the Pt/SrTiO3(621) system

Low-energy electron diffraction (LEED), atomic force microscopy (AFM), and X-ray diffraction (XRD) have been used to investigate the structural and morphological character of a naturally chiral ceramic SrTiO₃(621) substrate and of Pt and Cu thin films deposited on its surface. AFM experiments showed that as-received chirally-oriented SrTiO₃(621) substrates display atomically smooth surface morphologies, while LEED patterns revealed that the surface structure has a net chirality. Pt(621) and Cu(621) thin films were grown heteroepitaxially on SrTiO₃(621) substrates, as confirmed by XRD. AFM showed that the film surfaces were atomically smooth and LEED illustrated that the Pt films exhibit surface chirality, and by implication that the atomically-flat chirally-oriented Cu films also have chiral surfaces. The characteristics of the observed LEED patterns, where splitting of diffraction spots is considered to arise from the kinked step features of naturally chiral fcc metal surfaces, are discussed with respect to existing models. These results indicate that the chiral SrTiO₃(621) ceramic surface drives the growth of single-enantiomer, chiral, metal (621) thin films.     

Effect of substrate temperature on the surface and interface oxidation of NiTi thin films

NiTi shape memory alloy thin films are deposited on pure Cu substrate at substrate ambient temperatures of 300 °C and 450 °C. The surface and interface oxidation of NiTi thin films are characterized by X-ray photoelectron spectroscopy (XPS). After a subsequent annealing treatment the crystallization behavior of the films deposited on substrate at different temperatures is studied by X-ray diffraction (XRD). The effects of substrate temperature on the surface and interface oxidation of NiTi thin films are investigated. In the film surface this is an oxide layer composed of TiO₂. The Ni atom has not been detected on surface. In the film/substrate interface there is an oxide layer with a mixture Ti₂O₃ and NiO in the films deposited at substrate temperatures 300 °C and 450 °C. In the films deposited at ambient temperature, the interface layer contains Ti suboxides (TiO) and metallic Ni.     

The effect of substrate material on pulsed laser deposition of HgCdTe films

This paper describes some recent results of the HgCdTe thin film grown directly on different substrates (sapphire, GaAs and Si) by pulsed laser deposition (PLD). The influences of the substrate material on the properties of HgCdTe thin films were investigated by X-ray diffraction (XRD), selected area electron diffraction (SAED), atomic force microscopy (AFM) and energy dispersive X-ray spectroscopy (EDS). It was found that the quality of the HgCdTe film has a strong relation to the structure and properties of the substrate. The experiment results indicate that the HgCdTe epitaxial thin films grown directly on the sapphire substrates have a high quality, and the composition of the films is close to that of the target. While the quality of the HgCdTe films deposited on the Si and GaAs substrates are not very good.