SrO/Si(100)表面去氧过程的研究

借助高温扫描隧道显微镜和光电子能谱技术,深入研究了SrO/Si(100)表面向Sr/Si(100)再构表面的动态转化过程.Sr/Si(100)再构表面在硅基氧化物外延生长中起重要作用.在该动态转化过程中,样品在500 ℃的退火温度下,表面出现SrO晶化的现象;在550—590 ℃的退火温度下,SrO/Si(100)开始向Sr/Si(100)转化,界面和表面上的氧以气态的SiO溢出,使得表面出现大量凹槽状缺陷.并且在此动态转化过程中表面的电子态表现出金属特性,这是由于表层硅原子发生断键重排,从而在表面出现悬 关键词： SrO/Si表面 Sr/Si表面 扫描隧道显微镜 去氧过程     

GaSb(100)的表面再构

用低能电子衍射(LEED),光电子能谱(XPS和UPS)研究GaSb(100)表面的各种再构:c(2×6),(1×3)和(2×3)。所有这三种再构表面都以有失列的Sb原子结尾。在Sb气氛中退火可使分子束外延(MBE)制备的、表面Sb原子形成二聚物的c(2×6)再构和离子轰击加退火(IBA)制备的、表面存在Ga岛的(2×3)再构均变为简单的(1×3)再构。 关键词：     

Si(100)表面Se薄膜生长及其在Ti/Si欧姆接触中的应用

本文采用分子束外延(MBE)系统在Si(100)表面淀积Se薄膜. 通过控制衬底和固态Se束源炉的温度,实现了Se材料在Si(100)表面上的自限制超薄薄膜生长;在Se超薄层钝化的Si(100)表面上制备的Ti金属电极具有低的欧姆接触电阻特性,且热稳定性温度提升至400 ℃. 关键词： 硒 钝化 欧姆接触 热稳定性     

原位退火温度对Mg_2Si薄膜结构及方块电阻的影响

采用磁控溅射法和原位退火工艺在钠钙玻璃衬底上制备Mg_2Si半导体薄膜.首先在钠钙玻璃衬底上依次溅射一定厚度的Si、Mg薄膜,冷却至室温后原位退火4h,在400~600℃退火温度下制备出一系列Mg_2Si薄膜样品.采用X射线衍射仪(XRD)、扫描电子显微镜(SEM)对Mg_2Si薄膜样品的晶体结构和表面形貌进行表征,利用四探针测试仪测试薄膜样品的方块电阻,讨论了原位退火温度对Mg_2Si薄膜结构、表面形貌及电学性能的影响.结果表明,采用原位退火方式成功在钠钙玻璃衬底上制备出单一相的Mg_2Si薄膜,退火温度为550℃时,结晶度最好,连续性和致密性最强,方块电阻最小.这对后续Mg_2Si薄膜器件的设计与制备提供了重要的参考.     

Cu/SiO2/Si(111)体系中Cu和Si的扩散及界面反应

室温下利用磁控溅射在p型Si(111)衬底上沉积了Cu薄膜.利用X射线衍射和卢瑟福背散射分别对未退火以及在不同温度点退火后样品的结构进行了表征.在此基础上,研究了Cu/SiO2/Si(111)体系的扩散和界面反应.实验结果表明:当退火温度高于450 ℃时出现明显的扩散现象,并且随着温度的升高,体系扩散现象会更加显著.当退火温度低于450 ℃时没有铜硅化合物生成,当温度达到500 ℃时才有铜硅化合物生成.     

Ti与莫来石陶瓷衬底的界面反应

在抛光的200℃莫来石陶瓷衬底上电子束蒸发淀积200nm的Ti膜，并在高真空中退火，利用二次离子质谱（SIMS）、俄歇电子能谱（AES）和X射线衍射分析（XRD）研究了从200—650℃Ti与莫来石的固相界面反应．结果表明，在淀积过程中，最初淀积的Ti与衬底表面的氧形成Ti—O键，并有微量元素态Al，Si原子析出，界面区很窄；450℃，1h退火后，界面区有所展宽，但变化不大；650℃，1h退火后，界面发生强烈反应，样品主要由TiO＋Ti，Ti₃Al，Ti₃Al＋TiSi₂和莫来石陶瓷衬底四层结构组成 关键词：     

用HREELS,XPS,LEED研究Al-GaAs(100)(4×1)界面反应

高分辨率电子能量损失谱(HRFELS)能直接判定Al-GaAS(100)界面反应的生成物。本文结合X射线光电子能谱(XPS)的测量,采用HREELS来测量界面的禁带宽度,研究了Al-GaAs(100)(4×1)界面的形成过程。结果判定了室温下Al-GaAs(100)界面生成的为AlAs。而退火后,界面上生成AlCaAs合金。实验中还用低能电子衍射(LEED)观察了室温下Al在GaAs(100)(4×1)面上的淀积过程,发现随着Al淀积量的增加,表面是从无序到有序转化的。 关键词：     

预注入对Si_(1-x)C_x合金形成的影响

室温下在单晶Si中注入 (0 6— 1 5 )at%的C原子 ,部分样品在C离子注入之前在其中注入2 9Si 离子产生损伤 ,然后在相同条件下利用高温退火固相外延了Si1 -xCx 合金 ,研究了预注入对Si1 -xCx 合金形成的影响 .如果注入C离子的剂量小于引起Si非晶化的剂量 ,在 95 0℃退火过程中注入产生的损伤缺陷容易与C原子结合形成缺陷团簇 ,难于形成Si1 -xCx 合金 ,预注入形成的损伤有利于合金的形成 .随着C离子剂量的增大 ,注入产生的损伤增强 ,预注入反而不利于Si1 -xCx 合金的形成 ,但当注入C原子的浓度超过固相外延的溶解度时 ,预注入的影响可以忽略 .退火温度升高到 10 5 0℃ ,无论预注入还是未预注入样品 ,C含量低的合金相仍然保留 ,而C含量高的合金相大部分消失 .     

Yb注入Si后的退火结晶、杂质迁移及光致发光规律

用卢瑟福背散射/沟道技术和光致发光测试技术研究了室温下350keVYb~+以1×10~(15)Yb·cm~(-2)的剂量注入单晶硅后,在不同快速热退火温度下表面非晶层的固相外延结晶,结晶过程中Yb的迁移和其光致发光发射。在800,900和1000℃快速热退火温度下,表面非晶层的固相外延结晶都在掺杂区域发生中断,同时观察到Yb在晶体/非晶界面和表面的双偏析新现象,并且Yb的光致发光强度随退火温度的增加而增加。但在1200℃退火温度下,表面非晶层则完全结晶,伴随着结晶过程Yb几乎全部堆积到了表面附近,并导致了 关键词：     

锰的硅化物薄膜在Si(100)-2×1表面生长的STM研究

锰的硅化物在微电子器件、自旋电子学器件等领域具有良好的应用前景, 了解锰的硅化物薄膜在硅表面的生长规律是其走向实际应用的关键步骤之一. 本文采用分子束外延方法在Si(100)-2× 1表面沉积了约4个原子层的锰薄膜, 并利用超高真空扫描隧道显微镜研究了该薄膜与硅衬底之间在250-750℃范围内的固相反应情况. 室温下沉积在硅衬底表面的锰原子与衬底不发生反应, 薄膜由无序的锰团簇构成; 当退火温度高于290℃时, 锰原子与衬底开始发生反应, 生成外形不规则的枝晶状锰硅化物和富锰的三维小岛; 325℃时, 衬底上开始形成平板状的MnSi小岛; 525℃时, 枝晶状锰硅化物完全消失, 出现平板状的MnSi_1.7大岛; 高于600℃时, 富锰的三维小岛和平板状的MnSi小岛全部消失, 仅剩下平板状的MnSi_1.7大岛. 这些结果说明退火温度决定了薄膜的形态和结构. 在大约600℃退火时岛的尺寸随着退火时间的延长而逐渐增大, 表明岛的生长遵从扩散限制的Ostwald熟化机理.     

A leed-aes study of thin Pd films on Si(111) and (100) substrates

A system Pd (deposit)-Si (substrate) has been studied by LEED and AES. Pd₂Si formed on Si(111) became epitaxial after a short time of annealing at a temperature between 300 and 700°C, while the Pd₂Si formed on Si(100) did not, in both cases the surfaces of the Pd₂Si being covered with a very thin Si layer. A sequence of superstructures (3√3 × 3√3), (1 × 1), and (2√3 × 2√3) was observed successively in Pd/Si(111) as the annealing temperature was increased. A (√3 × √3) structure was obtained by sputtering the 3√3 surface slightly. It was found that the √3 structure corresponds to Pd²Si(0001)-(1 × 1) grown epitaxially on Si(111), and that the 3√3 structure comes from the thin Si layer accumulated over the silicide surface, while the 2√3 and 1 structures arise from a submonolayer of Pd adsorbed on Si(111). Superstructures observed on a Pd/Si(100) system are also studied.     

Scanning tunneling microscopy observation of ultrathin epitaxial CoSi<Subscript>2</Subscript>(111) films grown at a high temperature

Scanning tunneling microscopy (STM) is used to study the basic laws of growth of ultrathin epitaxial CoSi₂(111) films with Co coverages up to 4 ML formed upon sequential deposition of Co and Si atoms taken in a stoichiometric ratio onto the Co–Si(111) surface at room temperature and subsequent annealing at 600–700°C. When the coverage of Co atoms is lower than ~2.7 ML, flat CoSi₂ islands up to ~3 nm high with surface structure 2 × 2 or 1 × 1 grow. It is shown that continuous epitaxial CoSi₂ films containing 3–4 triple Si–Co–Si layers grow provided precise control of deposition. CoSi₂ films can contain inclusions of the local regions with (2 × 1)Si reconstruction. At a temperature above 700°C, a multilevel CoSi₂ film with pinholes grows because of vertical growth caused by the difference between the free energies of the CoSi₂(111) and Si(111) surfaces. According to theoretical calculations, structures of A or B type with a coordination number of 8 of Co atoms are most favorable for the CoSi₂(111)2 × 2 interface.     

FI-STM STUDY OF HYDROGEN ADSORPTION ON Si(100) SURFACE

Chemisorption of atomic hydrogen on the Si(100)2×1 surface has been investigated in detail by using a field ion-scanning tunneling microscope (FI-STM). The results showed that the adsorption geometry changed from the 2×1 monohydride phase to the 1×1 dihydride phase with increasing exposure of hydrogen. The data of desorption of the hydrogen-saturated Si surface showed that on annealing at 670K the surface becomes highly disordered: the 1×1 dihydride structure is eliminated and the 2×1 reconstructed monohydride is also hardly to identify. When the temperature rises to as high as 730 K, the surface is domi-nated by the 2×1 structure with missing dimer rows, and some adatom chains occur on the Si substrate ler-races. We attribute the formation of these atomic chains to an epitaxial growth of Si atoms which are formed by the dissociation of SiH_x (x= 1, 2, 3 or 4) compounds on the Si surface.     

LEED investigation of germanium surfaces cleaned by sublimation of sulphide films; structural transitions on clean Ge(110) surface

Sublimation of deposited germanium sulphide films at the temperatures as low as 350°C results in the appearance of LEED patterns of clean surfaces of germanium. In the interface between Ge(111) or Ge(110) and germanium sulphide, ordered structures are observed, namely Ge(111)?(2 × 1)S and Ge(110)?(10 × 5)S. The conclusion about the structure of the Ge(100) germanium sulphide interface cannot be made unambiguously. The structures of clean Ge(110) surfaces are described. The annealing of clean surfaces of Ge(110) at different temperatures leads to the formation of one of two possible surface structures. After annealing at temperatures below 380°C and above 430°C the Ge(110)?c(8 × 10) clean superstructure is observed. After annealing at temperatures from 380 up to 430°C the surface (110) is rearranged in vicinal planes of the (17 15 1) type with the (2 × 1) superstructure. These structures undergo reversible transitions from one to another at temperatures of about 380 and 430°C.     

硅衬底GaN基LED N极性n型欧姆接触研究

在Si衬底GaN基垂直结构LED的N极性n型面上,利用电子束蒸发的方法制作了Ti/Al电极,通过了I-V曲线研究了有无AlN缓冲层对这种芯片欧姆接触的影响.结果显示,去除AlN缓冲层后的N极性n型面与Ti/Al电极在500到600 ℃范围内退火才能形成欧姆接触.而保留AlN缓冲层的N极性n型面与Ti/Al电极未退火时就表现为较好的欧姆接触,比接触电阻率为2×10^-5 Ω·cm²,即使退火温度升高至600 ℃,也始终保持着欧姆接触特性.因此,AlN缓冲层的存在是Si衬底GaN基垂直结构LED获得高热稳定性n型欧姆接触的关键. 关键词： 硅衬底 N极性 AlN缓冲层 欧姆接触     

Epitaxial growth of Xe on the Si(111) 7×7 surface observed by LEED

The epitaxial growth up to 20 monolayers of Xe on the Si(111) 7×7 surface at several temperatures between 25 and 50 K has been studied by LEED. A variety of different LEED patterns demonstrate that there is a significant influence of the silicon structure on the Xe growth mode. The 7×7 superstructure has a very peculiar influence depending on temperature, so that a periodic sequence of stacking faults is observed in the xenon even in thicker layers.     

Fe在Ru(1010)表面上沉积的LEED，ARUPS研究

Fe在Ru(1010)表面上的沉积,经过LEED和ARUPS的测量研究.结果表明,经过退火Fe在Ru(1010)表面根据覆盖度大小分别形成(1×1)和P(2×1)结构.当覆盖度大于10个单层时,表面结构不再保持与衬底相关的晶格常数与对称性,形成fcc铁的(111)外延结构.铁覆盖度较小时,费米能级附近的价电子能级与清洁时相似,外延fcc铁表面则形成了与表面有关的价电子能级. 关键词：     

氮离子轰击钼(001)和钼(110)表面形成的有序结构

用能量为1千电子伏,束流为6微安的氮离子轰击含有痕量碳和氧的钼(001)和钼(110)表面10至15分钟,在俄歇能谱中出现了很强的氮的俄歇峰。从室温直到350℃退火,低能电子衍射观察表明,表面是无序层。样品加热到530℃和650℃之间,在钼(001)表面上得到c(2×2)-氮,p(2×2)-氮和(4(2^1/2)×2^1/2)R45°-氮、氧三种结构的低能电子衍射图;在密堆的钼(110)面得到单一结构的c(7×3)-氮的低能电子衍射图。低能电子衍射图与热脱附密切相关 关键词：     

On the electronic and geometric structure of the Si(113) surface

The Si(113) surface of a p-type sample was studied by AES, LEED and ARUPS. On the clean surface, a (3 × 2) and a (3 × 1) LEED pattern coexist for a large range of annealing temperatures. Annealing to 900 K results in (3 × 1), while temperatures higher than 1050 K favour the (3 × 2) superstructure. ARUPS reveals two weakly dispersing surface resonances around 0.9 and 2.6 eV below E_F which are connected with the (3 × 2) and (3 × 1) structures, respectively. The work function was determined as φ = 4.81 eV and the photoionization threshold as ξ = 5.36 eV. The bands are bent downwards by 0.43 eV at room temperature.     

Metal induced step arrangement on Si(1 1 1) surface observed by LEED

Adsorbed structures of Ba on Si(1 1 1) surfaces have been observed by LEED. In elevating the annealing temperature after a few monolayers (MLs) deposition at room temperature (√3×2√3)R30°, 2×8 and 3×1 patterns were observed as reported by Weitering [H.H. Weitering, Surf. Sci. 355 (1996) L271]. Additionally a one-dimensional 10×1 pattern was observed in the temperature range between the appearance of two-dimensional 2×8 and 3×1 patterns. This pattern is considered to be produced by a combination of the periodical terrace with a width of 10 unit lengths separating each step and a 5×1 reconstruction on the terrace.