少子陷阱特性和铍硅共注半绝缘GaAs空穴陷阱

用深能级瞬态谱（ＤＬＴＳ）技术测量了高温退火的Ｂｅ和Ｓｉ共注入的ＬＥＣ半绝缘ＧａＡｓ（无掺杂）。在多子脉冲作用下的Ａｌ／Ｂｅ－Ｓｉ共注ＬＥＣＳＩＧａＡｓ肖特基势垒中，观测到Ｅ₀₁（０．２９８），Ｅ₀₂（０．３４１），Ｅ₀₃（０．５５５）和Ｅ₀₄（０．８２１）等四个电子陷阱以及两个主要的少子（空穴）陷阱Ｈ＇₀₃（０．５４）和Ｈ″₀₃（０．５７）。两少子陷阱的ＤＬＴＳ信号具有若干特点，比如它们的ＤＬＴＳ·峰难于通过增宽脉冲达到最大高度；以及峰的高度强烈地依赖于温度等。这些现象可以用少子陷阱的少子俘获和热发射理论进行合理地解释。鉴于用ＤＬＴＳ技术测量这种陷阱的困难，我们用恒温电容瞬态技术测定它们的空穴表观激活能分别为０．５４和０．５７ｅＶ。它们是新观测到的和Ｂｅ－Ｓｉ共注ＳＩＧａＡｓ有关缺陷。 关键词：     

同质硅分子束外延层的界面缺陷的研究

对同质硅分子束外延层的界面缺陷进行了测试与分析．对存在高浓度施主型界面缺陷的Ｐ型材料，通过解泊松方程计算了该材料的肖特基势垒的能带图，得到了该缺陷能级上电子的填充与发射随外加反向偏压变化的情况．并分析了用深能级瞬态谱（ＤＬＴＳ）对其进行测试所需的条件，以及与常规的ＤＬＴＳ测试结果的不同之处．提出了可同时对该缺陷上电子的发射和俘获过程进行ＤＬＴＳ测量的方法．实验测量结果表明，该高密度的界面缺陷的能级位置位于Ｅ_c－０．３０ｅＶ． 关键词：     

低压－金属有机物汽相外延生长的Ga＿（1－x）In＿xAs／InP激光器中深能级的研究

应用深能级瞬态谱（ＤＬＴｓ）技术详细研究低压－金属有机物汽相外延（ＬＰ－ＭＯＶＰＥ）生长的Ｇａ＿（０．４７）Ｉｎ＿（０．５３）Ａｓ／Ｉｎｐ量子阱、宽接触和质子轰击条形异质结激光器中的深能级。样品的ＤＬＴＳ表明，在宽接触激光器的ｉ－Ｇａ＿（０．４７）Ｉｎ＿（０．５３）Ａｓ有源层里观察到Ｈ１（Ｅ＿ｖ＋０．０９ｅＶ）和Ｅ１（Ｅ＿ｃ－０．３５ｅＶ）陷阱，它们可能分别与样品生长过程中扩散到ｉ－Ｇａ＿（０．４７）Ｉｎ＿（０．５３）Ａｓ有源层的Ｚｎ和材料本身的原生缺陷有关。而条形激光器的ｉ－Ｇａ＿（０．４７）Ｉｎ＿（０．５３）Ａｓ有源层的Ｈ２（Ｅ＿ｖ＋０．１１ｅＶ）和Ｅ２（Ｅ＿ｖ－０．４２ｅＶ）陷阱则可能是Ｈ１和Ｅ１与质子轰击引起的损伤相互作用的产物。     

低压-金属有机物汽相外延生长的Ga1-xInxAs/InP激光器中深能级的研究

应用深能级瞬态谱（ＤＬＴｓ）技术详细研究低压－金属有机物汽相外延（ＬＰ－ＭＯＶＰＥ）生长的Ｇａ_０．４７Ｉｎ_０．５３Ａｓ／Ｉｎｐ量子阱、宽接触和质子轰击条形异质结激光器中的深能级。样品的ＤＬＴＳ表明，在宽接触激光器的ｉ－Ｇａ_０．４７Ｉｎ_０．５３Ａｓ有源层里观察到Ｈ１（Ｅ_ｖ＋０．０９ｅＶ）和Ｅ１（Ｅ_ｃ－０．３５ｅＶ)陷阱，它们可能分别与样品生长过程中扩散到ｉ－Ｇａ_{０．４ 关键词：}     

光激电流谱的测试

用光激瞬态电流谱ＯＴＣＳ（ｏｐｉｔａｌｔｒａｎｓｉｔｉｏｎｃｕｎｅｎｔｓｐｅｃｔｒｏｓｃｏｐｙ）方法对ＩｎＰ∶Ｆｅ进行了初步测试。目的是研究半绝缘ＩｎＰ∶Ｆｅ中的深能级，了解其作为光电器件、高速器件衬底的稳定性。在低温下，用强光发现半绝缘ＩｎＰ∶Ｆｅ中存在两深能级，分别是ＥＴ＝０．３４ｅＶ的电子陷阱和ＥＴ＝１．１３ｅＶ的空穴陷阱。     

AlGaAs:Sn中DX中心电子俘获势垒的精细结构

采用定电容电压法,测量了n型Al0.26Ga0.74As:Sn中DX中心电子热俘获瞬态,以及不同俘获时间后的电子热发射瞬态;并对瞬态数据进行数值Laplace变换,得到其Laplace缺陷谱（LDS）。通过分析LDS谱,确定了电子热俘获和热发射LDS谱之间的对应关系,从而得到热俘获系数对温度依赖关系,以及与Sn相关的DX中心部分电子热俘获势垒的精细结构;通过第一原理赝势法计算表明,Sn附近的Al/Ga原子的不同配置是电子热俘获势垒精细结构产生的主要原因。     

AlGaAs∶Sn中DX中心电子俘获势垒的精细结构

采用定电容电压法,测量了n型Al026Ga074As∶Sn中DX中心电子热俘获瞬态,以及不同俘获时间后的电子热发射瞬态;并对瞬态数据进行数值Laplace变换,得到其Laplace缺陷谱(LDS).通过分析LDS谱,确定了电子热俘获和热发射LDS谱之间的对应关系,从而得到热俘获系数对温度依赖关系,以及与Sn相关的DX中心部分电子热俘获势垒的精细结构;通过第一原理赝势法计算表明,Sn附近的AlGa原子的不同配置是电子热俘获势垒精细结构产生的主要原因     

纳米SiC蓝光发射的研究

在４．６８ｅＶ的激光激发下，室温ＣＶＤ合成的纳米ＳｉＣ粉体，可发射４７５ｎｍ的蓝光，经６００～１１００℃在Ｎ２气氛下进行快速退火（ＲＴＡ）处理，其荧光强度随退火温度升高而增强，当Ｔ≥９００℃时，荧光强度下降，但发光峰位与退火温度无关．通过ＸＲＤ、ＩＲ、ＴＥＭ、ＸＰＳ等研究，认为纳米ＳｉＣ中与氧有关的缺陷可能是引起４７５ｎｍ蓝光发射的主要原因     

硅直接键合界面附近的深能级研究

利用扩展电阻探针（ＳＲＰ）和深能级瞬态谱（ＤＬＴＳ）技术详细研究了直接键合的ｎ－Ｓｉ／ｎ⁺－Ｓｉ界面附近的深能级。实验结果表明，在直接键合的ｎ－Ｓｉ／ｎ⁺－Ｓｉ界面ｎ－Ｓｉ一侧附近可观察到一个明显的电子陷阱Ｅ１（Ｅ_ｃ－０．３９ｅＶ）。Ｅ１可能是由若干个能级位置相近的陷阱迭加而成的，其浓度在１０¹³－１０¹⁴ｃｍ^-3之间。它可能是与制备键合材料的高温（１０００－１１００℃）处理 关键词：     

MBE和MOCVD生长的AlGaAs／GaAsGRIN—SCH SQW激光器深中心的比较

应用深能级瞬态谱（ＤＬＴＳ）技术详细研究分子束外延（ＭＢＥ）和金属有机物化学汽相淀积（ＭＯＣＶＤ）生长的ＡｌＧａＡｓ／ＧａＡｓ ｇｒａｄｅｄ ｉｎｄｅｘ ｓｅｐａｒａｔｅ ｃｏｎｆｉｎｅｍｅｎｔ ｈｅｔｅｒｏｓｔｒｕｃｔｕｒｅ ｓｉｎｇｌｅ ｑｕａｎｔｕｍ ｗｅｌｌ（ＧＲＩＮ－ＳＣＨ ＳＱＷ）激光器的深中心。结果表明，在激光器的ｎ－ＡｌＧａＡｓ层里除众所周知的ＤＸ中心外，还存在着较大浓度和俘获截面     

Effects of rapid thermal annealing on the energy levels of InAs/InP self-assembled quantum dots

We have studied the effects of thermal annealing on the electrical properties of InAs/InP self-assembled quantum dots (QDs) using deep level transient spectroscopy (DLTS). It was found from the DLTS measurements that the activation energy of the QD signal varied from 0.47 to 0.60 eV and the emission cross section changed from 1.01×10⁻¹⁵ to 9.63×10⁻¹⁴ cm² when the annealing temperature increased up to 700 °C. As a result of the thermal annealing process at the temperature ranging from 500 to 600 °C, the higher activation energy and the larger emission cross section of the QD related signal were observed for the annealed samples compared to those for the as-grown sample. On the basis of the capture barrier height for the QDs structure being lowered from 0.24 to 0.06 eV at the annealing temperature of 700 °C, thermal damage was considered as the reason. The appropriate annealing process can provide a clue for the engineering of the energy levels in the self-assembled QD structures.     

DX centers in selectively Si-doped GaAs---AlAs superlattices

DX center has been characterized in four GaAs---AlAs superlattices grown by MBE at 580°C. The structures are uniformly Si-doped or selectively Si-doped in the AlAs layers or in the middle of the GaAs layers or on both sides of the interfaces. Deep level transient spectroscopy measurements (DLTS) put in evidence one dominant electron trap, with an activation energy for thermal emission of about 0.42eV for all the superlattices. This defect shows a thermally activated capture cross section and a large concentration except for the case where the only GaAs layers are doped. For the first time, a study of the capture reveals a capture activation energy of 0.36-0.37 eV, which allows us to locate the DX level nearly 60 meV below the conduction miniband. From these results, we show that the observed DX center is related to silicon in the AlAs layers. For the case when the AlAs barriers are not doped, the DX level is due to the Si diffusion from the middle of the wells towards the barriers, the Si atoms having diffused during the growth.     

Inductively coupled plasma induced deep levels in epitaxial n-GaAs

The electronic properties of defects introduced by low energy inductively coupled Ar plasma etching of n-type (Si doped) GaAs were investigated by deep level transient spectroscopy (DLTS) and Laplace DLTS. Several prominent electron traps (E_c—0.046 eV, E_c—0.186 eV, E_c—0.314 eV. E_c—0.528 eV and E_c—0.605 eV) were detected. The metastable defect E_c—0.046 eV having a trap signature similar to E1 is observed for the first time. E_c—0.314 eV and E_c—0.605 eV are metastable and appear to be similar to the M3 and M4 defects present in dc H-plasma exposed GaAs.     

Low temperature photoluminescence study of Ga As defect states

Low temperature(77 K)photoluminescence measurements have been performed on different GaAs substrates to evaluate the GaAs crystal quality.Several defect-related luminescence peaks have been observed,including 1.452 eV,1.476 eV,1.326 eV peaks deriving from 78 meV Ga_(As) antisite defects,and 1.372 eV,1.289 eV peaks resulting from As vacancy related defects.Changes in photoluminescence emission intensity and emission energy as a function of temperature and excitation power lead to the identification of the defect states.The luminescence mechanisms of the defect states were studied by photoluminescence spectroscopy and the growth quality of GaAs crystal was evaluated.     

气源分子束外延生长的InPBi薄膜材料中的深能级中心

利用深能级瞬态谱(DLTS)研究了气源分子束外延(GSMBE)生长的InP1-xBix材料中深能级中心的性质。在未有意掺杂的InP中测量到一个多数载流子深能级中心E1,E1的能级位置为Ec-0.38 e V,俘获截面为1.87×10~(-15)cm~2。在未有意掺杂的InP0.9751Bi0.0249中测量到一个少数载流子深能级中心H1,H1的能级位置为Ev+0.31 eV,俘获截面为2.87×10~(-17)cm~2。深中心E1应该起源于本征反位缺陷PIn,深中心H1可能来源于形成的Bi原子对或者更复杂的与Bi相关的团簇。明确这些缺陷的起源对于InPBi材料在器件应用方面具有重要的意义。     

Double carriers pulse DLTS for the characterization of electron-hole recombination process in GaAsN grown by chemical beam epitaxy

A nitrogen-related electron trap (E1), located approximately 0.33 eV from the conduction band minimum of GaAsN grown by chemical beam epitaxy, was confirmed by investigating the dependence of its density with N concentration. This level exhibits a high capture cross section compared with that of native defects in GaAs. Its density increases significantly with N concentration, persists following post-thermal annealing, and was found to be quasi-uniformly distributed. These results indicate that E1 is a stable defect that is formed during growth to compensate for the tensile strain caused by N. Furthermore, E1 was confirmed to act as a recombination center by comparing its activation energy with that of the recombination current in the depletion region of the alloy. However, this technique cannot characterize the electron−hole (e-h) recombination process. For that, double carrier pulse deep level transient spectroscopy is used to confirm the non-radiative e-h recombination process through E1, to estimate the capture cross section of holes, and to evaluate the energy of multi-phonon emission. Furthermore, a configuration coordinate diagram is modeled based on the physical parameters of E1.     

双异质结AlxGa1-xAs/GaAs发光管中与氧有关能级的测量

用DLTS和单次脉冲瞬态电容技术研究了液相外延生长的双异质结AlxGa1-xAs/GaAs发光管,掺Si的n-Al0.05Ga0.95As有源层中的深能级。着重分析了一个与氧有关的电子陷阱,其发射激活能为EC-ED=0.29eV。我们发现该电子陷阱随正向注入脉冲宽度tp的增加DLTS峰向低温移动,即在确定的温度下发射率随tp的增加而增加。用DLTS首次测得该能级的俘获瞬态谱,发现俘获峰随反向撤空脉冲宽度tR的增加向低温端移动,即在确定的温度下俘获率随tR的增加而增加,并且俘获激活能从△Eσ=0.28eV变化到0.26eV,用位形坐标图讨论了引起变化的原因。     

Electronic and annealing properties of the E0.31 defect introduced during Ar plasma etching of germanium

Low energy (±80 eV) Ar plasma etching has been successfully used to etch several semiconductors, including GaAs, GaP, and InP. We have studied the only prominent defect, E_0.31, introduced in n-type Sb-doped Ge during this process by deep level transient spectroscopy (DLTS). The E_0.31 defect has an energy level at 0.31 eV below the conduction band and an apparent capture cross-section of 1.4×10⁻¹⁴ cm². The fact that no V-Sb defects and no interstitial-related defects were observed implies that the etch process did not introduce single vacancies or single interstitials. Instead it appears that higher order vacancy or interstitial clusters are introduced due to the large amount of energy deposited per unit length along the path of the Ar ions in the Ge. The E_0.31 defect may therefore be related to one of these defects. DLTS depth profiling revealed the E_0.31 concentration had a maximum (6×10¹³ cm⁻³) close to the Ge surface and then it decreased more or less exponentially into the Ge. Finally, annealing at 250 °C reduced the E_0.31 concentration to below the DLTS detection limit.     

Characterization of the potential well of a deep-level defect using field dependence of the thermal carrier emission rate

The electric field enhanced thermal emission rate was measured for the E_c -0.35 eV level of GaAs using a new reverse-bias pulsed DLTS technique. It is shown that the observed field and its temperature dependencies are probably the result of the Poole-Frenkel emission from a polarization potential well. From this study and with other annealing and the capture cross-section data, it is concluded that the defect is probably of a neutral-impurity type.