SiO2-羟基表面上金属原子的第一性原理研究

采用第一性原理方法研究了SiO2-羟基表面上几种金属原子的吸附性质,发现In和Ga在SiO2-羟基表面上的结合很弱,而Fe,Co,Ni在该表面上与Si,O形成强的化学键.等势能面和扩散势垒计算表明In(Ga)的扩散激活能只有0.1-0.3 eV,表明这两种原子容易在表面上扩散.这些结果可以定性地解释纳米合成中的一些实验现象.     

Li掺杂对MgH2(001)表面H2分子扩散释放影响的第一性原理研究

本文利用基于密度泛函理论的第一性原理分别研究了MgH₂(001)表面H原子扩散形成H₂分子释放出去的可能路径及金属Li原子掺杂对其影响. 研究结果表明: 干净MgH₂(001)表面第一层释放H原子形成H₂分子有两种可能路径, 其释放能垒分别为2.29和2.50 eV; 当将Li原子替代Mg原子时, 两种H原子扩散释放路径的能垒分别降到了0.31和0.22 eV, 由此表明Li原子掺杂使MgH₂(001)表面H原子扩散形成H₂释放更加容易.     

Si-W/Si/SiO2/Si(100)的横截面电子显微镜研究

本文用横截面电子显微镜法分析了Si-W/Si/SiO₂/Si(100)在440—1000℃退火后的晶化过程,以及各个界面的变化情况.发现Si-W合金膜中,WSi₂并未优先在表面、界面处形成晶核.当退火温度不高于700℃时,反应在合金膜内发生,表面、界面起伏和缓.退火温度高达800—1000℃时,界面、表面出现原子扩散,造成剧烈的界面起伏;表面则出现小的热沟槽,Si/SiO₂界面也出现高分辨电子显微镜才能观察到的起伏.表面、界面的原子迁移的动力来源于晶界与表面、界面张力.由于SiO₂中Si—O键很稳定,不易发生Si和O在界面处的互扩散,所以Si/SiO₂界面起伏很小. 关键词：     

Mn(SiO2)3(M=Fe,Co,Ni;n=1-3)团簇的几何结构、光电性质及磁性

基于密度泛函理论中的广义梯度近似系统研究M_n(SiO₂)₃(M=Fe,Co,Ni;n=1-3)团簇的几何结构、光电性质和磁学性质.结果表明:Fe,Co原子相对于Ni原子更易于在(SiO₂)₃团簇上聚集;通过分析团簇的分裂途径及其产物,发现稳定性较好的氧化硅是一种很好的用于负载过渡金属"岛膜"的载体材料;M_n(SiO₂)₃团簇的能隙恰好位于近红外光谱范围内.通过磁性分析发现,该复合团簇的磁矩主要局域在过渡金属原子周围,而且,Fe₂(SiO₂)₃和Co₃(SiO₂)₃具有相对较大的磁矩,这主要源于过渡金属原子的d轨道间相互耦合.能隙和磁性两方面性质进一步肯定了二氧化硅磁性复合材料在医学界被用作光动力靶向治疗的可观前景.     

热退火处理对AuGeNi/n-AlGaInP欧姆接触性能的影响

本文在n-(Al0.27Ga0.73)0.5In0.5P表面通过电子束蒸发Ni/Au/Ge/Ni/Au叠层金属并优化退火工艺成功制备了具有较低接触电阻的欧姆接触,其比接触电阻率在445℃退火600 s时达到1.4×10–4 W·cm2.二次离子质谱仪测试表明,叠层金属Ni/Au/Ge/Ni/Au与n-AlGaInP界面发生固相反应,Ga,In原子由于热分解发生外扩散并在晶格中留下Ⅲ族空位.本文把欧姆接触形成的原因归结为Ge原子内扩散占据Ga空位和In空位作为施主提高N型掺杂浓度.优化退火工艺对低掺杂浓度n-(Al0.27Ga0.73)0.5In0.5P的欧姆接触性能有显著改善效果,但随着n-(Al0.27Ga0.73)0.5In0.5P掺杂浓度提高,比接触电阻率与退火工艺没有明显关系.本文为n面出光的AlGaInP薄膜发光二极管芯片的n电极制备提供了一种新的方法,有望大幅简化制备工艺,降低制造成本.     

Stage2沉积速率对低温生长CIGS薄膜特性及器件的影响

研究了三步法第二步沉积速率对低温生长Cu(In,Ga)Se₂薄膜结构、 电学特性和器件特性的影响. 通过改变第二步沉积速率发现, 提高沉积速率可以显著促进薄膜晶粒生长, 提高晶粒紧凑程度降低晶界复合, 同时有效改善两相分离现象, 提高电池的开路电压和短路电流, 有助于Cu(In,Ga)Se₂电池光电转换效率的提高. 但同时研究表明, 随着第二步沉积速率的增加, 会促进暂态Cu_2-xSe晶粒的生长, 引起Cu(In,Ga)Se₂薄膜表面粗糙度增大, 并阻碍Na向Cu(In,Ga)Se₂薄膜表面的扩散, 造成施主缺陷钝化效应降低, 薄膜载流子浓度下降和电阻率升高, 且过高的沉积速率会引起电池内部复合增加并产生分流路径, 造成开路电压下降进而引起电池效率恶化. 最终, 通过最佳化第二步沉积速率, 在衬底温度为420℃时, 得到最高转换效率为11.24%的Cu(In,Ga)Se₂薄膜太阳电池.     

衬底对Cu(In,Ga)Se2薄膜织构的影响

分别在苏打石灰玻璃、Mo箔、无择优取向的Mo薄膜以及(110)择优取向的Mo薄膜四种不同衬底上，采用共蒸发工艺沉积约2 μm厚的Cu(In,Ga)Se₂薄膜，用X射线衍射仪测量薄膜的织构，研究衬底对Cu(In,Ga)Se₂薄膜织构的影响.在以上四种衬底上沉积的Cu(In,Ga)Se₂薄膜的(112)衍射峰强度依次逐渐减弱，(220/204)衍射峰从无到有且强度逐渐增强.在苏打石灰玻璃和Mo箔衬底上的Cu(In,Ga)Se_{2关键词： 择优取向 Cu(In 2}薄膜')" href="#">Ga)Se₂薄膜 太阳电池     

不同钝化结构对非极性AlGaN-MSM紫外探测器性能的提升

在r面蓝宝石衬底上,采用金属有机化学气相沉积（MOCVD）法高温生长了未掺杂非极性AlGaN半导体薄膜,在此基础上制备了金属-半导体-金属（MSM）结构的紫外探测器。系统研究了在AlGaN半导体薄膜表面分别磁控溅射SiO₂纳米颗粒与SiO₂钝化层两种钝化手段对非极性AlGaN-MSM结构的紫外探测器性能的影响。实验结果表明：磁控溅射SiO₂纳米颗粒钝化或SiO₂钝化层两种手段都能提升AlGaN-MSM结构紫外探测器性能。暗电流测试表明,SiO₂纳米颗粒和SiO₂钝化层可使器件暗电流下降1~2个数量级,达到nA量级。光谱响应测试发现,在5 V偏压下,探测器在300 nm处具有陡峭的截止边,这表明其具有很好的深紫外特性,光谱响应提高了10³倍,紫外可见抑制比高达10⁵。     

溅射后硒化法制备的CIGS薄膜中Ga元素扩散研究

溅射后硒化制备Cu(In,Ga)Se2吸收层工艺过程中,Ga元素在吸收层底部富集现象是较为普遍的.本文从预制层工艺和硒化工艺两个方面研究了Ga元素在Cu(In,Ga)Se2吸收层中扩散的影响因素.结果表明,预制层中的Cu/(In+Ga)和硒化温度对Ga元素扩散的影响较为显著,而预制层中的Ga/(In+Ga)对Ga元素扩散的影响较小,Ga元素的扩散系数制约了其在Cu(In,Ga)Se2吸收层表面的含量.通过工艺优化提高吸收层表面的Ga含量,制备获得了光电转换效率为12.42%的Cu(In,Ga)Se2薄膜太阳能电池.     

Co/S钝化GaAs(100)界面形成的SRPES研究

利用同步辐射光电发射谱研究了Co与CH\-3CSNH\-2处理的S钝化GaAs(100)的界面形成.发现 其界面反应较弱,Co覆盖层达到0.8nm时,形成稳定的界面.GaAs表面上和S原子形成桥 键的Ga原子与Co发生交换反应并扩散到覆盖层中,形成Co—S键.Co覆盖层表面无偏析As的出现,与Co/GaAs(100)界面不同,这表明GaAs表面的S钝化可有效地阻止As原子向覆盖层的扩散. 关键词：     

Adsorption states and Ga depletion during oxygen adsorption on clean polar GaAs surfaces

Ultraviolet photoelectron spectroscopy (UPS), thermal desorption spectroscopy (TDS) and Auger (AES) measurements were used to study oxygen adsorption on sputtered an annealed GaAs(111)Ga, (1̄1̄1̄)As, and (100) surfaces. Two forms of adsorbed oxygen are seen in UPS. One of them is associatively bound and desorbs at 400–550 K mainly as molecular O₂. It is most probably bound to surface As atoms as indicated by the small amounts of AsO which desorb simultaneously. The second form is atomic oxygen bound in an oxidic environment. It desorbs at 720–850 K in the form of Ga₂O. Electron irradiation of the associatively bound oxygen transforms it into the oxidic form. This explains the mechanism of the known stimulating effect of low energy electrons on the oxidation of these surfaces. During oxygen exposure a Ga depletion occurs at the surface which indicates that oxygen adsorption is a more complex phenomenon then is usually assumed. The following model for oxygen adsorption is proposed: oxygen impinges on the surface, removes Ga atoms and thus creates sites which are capable of adsorbing molecular oxygen on As atoms of the second layer and are surrounded by Ga atoms of the first layer. This molecular oxygen is stable and simultaneously forms the precursor state for the dissociation to the oxidic form.     

Theoretical study of hydrogen dissociation and diffusion on Nb and Ni co-doped Mg(0001): A synergistic effect

The interaction of H₂ with clean, Ni and Nb doped Mg(0001) surface are investigated by first-principles calculations. Individual Ni and Nb atoms within the outermost surface can reduce the dissociation barrier of the hydrogen molecule. They, however, prefers to substitute for the Mg atoms within the second layer, leading to a weaker catalytic effect for the dissociation of H₂, a bottleneck for the hydriding of MgH₂. Interestingly, co-doping of Ni and Nb stabilizes Ni at the first layer, and results in a significant reduction of the dissociation barrier of H₂ on the Mg surface, coupled with an increase of the diffusion barrier of H. Although codoped Ni and Nb shows no remarkable advantage over single Nb here, it implies that the catalytic effect could be optimized by co-doping of “modest” transition metals with balanced barriers for dissociation of H₂ and diffusion of H on Mg surfaces.     

Monte Carlo simulation for temperature dependence of Ga diffusion length on GaAs(0 0 1)

Diffusion length of Ga on the GaAs(0 0 1)-(2×4)β2 is investigated by a newly developed Monte Carlo-based computational method. The new computational method incorporates chemical potential of Ga in the vapor phase and Ga migration potential on the reconstructed surface obtained by ab initio calculations; therefore we can investigate the adsorption, diffusion and desorption kinetics of adsorbate atoms on the surface. The calculated results imply that Ga diffusion length before desorption decreases exponentially with temperature because Ga surface lifetime decreases exponentially. Furthermore, Ga diffusion length L along and [1 1 0] on the GaAs(0 0 1)-(2×4)β2 are estimated to be and L_[110]200 nm, respectively, at the incorporation–desorption transition temperature (T860 K).     

Density functional theory prediction for diffusion of lithium on boron-doped graphene surface

The density functional theory (DFT) investigation shows that graphene has changed from semimetal to semiconductor with the increasing number of doped boron atoms. Lithium and boron atoms acted as charge contributors and recipients, which attracted to each other. Further investigations show that, the potential barrier for lithium diffusion on boron-doped graphene is higher than that of intrinsic graphene. The potential barrier is up to 0.22 eV when six boron atoms doped (B₆C₂₆), which is the lowest potential barrier in all the doped graphene. The potential barrier is dramatically affected by the surface structure of graphene.     

Field emission and field ion microscope study of Ga,In and Sn on W: Structure,work function,diffusion and binding energy

Gallium, indium and tin were deposited on a tungsten tip by making a contact between the tip and these metals in the liquid state. The activation energies of diffusion of the adsorbates on tungsten were found to be 0.29 eV for Ga, 0.35 eV for In and 0.71 eV for Sn. The adsorbates were field-evaporated by gradually increasing a positive tip voltage by a small increment each time and the variation of the work function with the decreasing coverage was examined for each evaporation stage. The result indicates that the adatoms assume one of two different adsorption states. The adatoms bound as strongly as in a bulk crystal were field-evaporated at a low evaporation field. The remaining adatoms form a more strongly bound covering layer which maximizes the average work function of the covered surfaces, 4.75 eV for Ga, 4.63 eV for In and 5.10 eV for Sn, and are field-evaporated at a significantly higher field. The covering layer of the strongly bound adatoms were observed on the areas from the {001} to {114} planes and were hardly noticed on the {011} and 112 areas. The arrangement of the strongly bound adatoms, particularly on the {114} planes, is found to be a precise replica of the substrate arrangement. Thus, the surface density of the adatoms is exactly the surface density of the substrate atoms. The observed results suggest that an adatom occupying a tungsten lattice site and contacting four substrate tungsten atoms can establish unusually strong bonding with the substrate.     

低温超薄高效Cu(In,Ga)Se2太阳电池的实现

衬底温度保持恒定, 在Se气氛下按照一定的元素配比顺序蒸发Ga, In, Cu制备厚度约为0.7 μrm的Cu(In_0.7Ga_0.3)Se₂ (CIGS)薄膜. 利用X射线衍射仪分析薄膜的晶体结构及物相组成, 扫描电子显微镜表征薄膜形貌及结晶质量, 二次离子质谱仪测试薄膜内部元素分布, 拉曼散射谱 分析薄膜表面构成, 带积分球附件的分光光度计测量薄膜光学性能. 研究发现在Ga-In-Se预制层内, In主要通过晶界扩散引起Ga/(Ga+In)分布均匀化. 衬底温度高于450 ℃时, 薄膜呈现单一的Cu(In_0.7Ga_0.3)Se₂相; 低于400℃, 薄膜存在严重的Ga的两相分离现象, 且高含Ga相主要存在于薄膜的上下表面; 低于300 ℃, 薄膜结晶质量进一步恶化. 薄膜表层的高含Ga相Cu(In_0.5Ga_0.5)Se₂以小晶粒形式均匀分布于薄膜表面, 增加了薄膜的粗糙度, 在电池内形成陷光结构, 提高了超薄电池对光的吸收. 加上带隙值较小的低含Ga相的存在, 使电池短路电流密度得到较大改善. 衬底温度在550 ℃–350 ℃变化时, 短路电流密度J_SC是影响超薄电池转换效率的主要因素; 而衬底温度T_sub低于300 ℃时, 开路电压V_OC和填充因子FF降低已成为电池性能减退的主要原因. T_sub为350 ℃时制备的0.7 μm左右的超薄CIGS电池转换效率达到了10.3%. 关键词： 2薄膜')" href="#">Cu(In,Ga)Se₂薄膜 衬底温度 超薄 太阳电池     

Extended X-ray absorption fine structure (EXAFS) and X-ray absorption near-edge structure (XANES) study of melt-spun Fe85Ga15 ribbons

The local structure in melt-spun Fe₈₅Ga₁₅ ribbons with a width ∼3 mm and thickness ∼60 μm produced in argon atmosphere was studied by analyzing EXAFS and XANES data. The following results were obtained: Ga–Ga bonds were not detected excluding the tendency to form clusters of Ga atoms; Ga substitutes Fe creating a local strain of about +1% on the first shell Fe–Ga bond, whereas on the second Fe–Ga shell strain quickly relaxes down to +0.3%; XANES spectra are compatible with a random substitution of Fe atoms by Ga atoms in the A2 structure. From the AFM investigation, we observed that at the surface (free side) of the ribbon the particles are elongated along the ribbon (∼2 μm×∼5 μm) and each particle is formed by small grains of average size of 200 nm.     

Reaction of sputtered Pt films on GaAs

Pt/GaAs interface reaction has been investigated between 250–500°C. Schottky barrier Impatt diodes for microwave applications with this structure have an operating temperature of ～250°C and the solid state reaction at the interface can lead to degradation of the device. Using RF sputtered Pt films on (100) GaAs, the reaction has been investigated with the help of X-ray diffraction, Auger spectroscopy, Rutherford backscattering and electrical resistivity measurements.The reaction starts by a rapid diffusion and dissolution of Ga in Pt and is slowed down by the formation of PtAs₂ at the interface which acts as a barrier for further Ga diffusion and reaction. Five different Pt-Ga phases and PtAs₂ were identified at various stages of the reaction. The final reaction products are PtAs₂ and GaPt. The reaction becomes self limited (up to 500°C) for Pt films thicker than ～2000 Å, probably due to extremely slow diffusion of Ga through the interfacial PtAs₂. Electrical resistivity data seem to indicate that Pt₃Ga is more resistive than PtGa which is the final equilibrium Pt-Ga compound observed in this reaction.     

Interaction kinetics of As4 and Ga on {100} GaAs surfaces using a modulated molecular beam technique

A modulated molecular beam technique, using mass spectrometric detection of desorbed species, had been applied to a study of the kinetics of Ga and As₄ interactions on {100} GaAs surfaces. Time domain mass spectrometer signals were processed using fourier transform techniques to provide information on surface lifetimes, sticking coefficients, desorption energies and reaction orders. In the temperature range 300–450 K As₄ is nondissociatively chemisorbed on Ga atoms from a weakly bound precursor state, but above 450 K there is a pairwise dissociation-recombination reaction between As₄ molecules adsorbed on adjacent Ga lattice sites. At temperatures higher than 600 K a temperature dependent Ga adatom population is formed by the desorption of As₂ from the surface. Thus above 450 K it is possible to produce GaAs from beams of the elements, but below this temperature the compound does not form.