溅射功率对Mo薄膜微结构和性能的影响

 实验采用直流磁控溅射沉积技术在不同溅射功率下制备Mo膜,研究了不同溅射功率下Mo膜的沉积速率、表面形貌及晶型结构,并对其晶粒尺寸和应力进行了研究。利用原子力显微镜观察样品的表面形貌发现随着溅射功率的增加,薄膜表面粗糙度逐渐增大。X射线衍射分析表明薄膜呈立方多晶结构,晶粒尺寸为14.1～17.9 nm;应力先随溅射功率的增大而增大,在40 W时达到最大值(2.383 GPa),后随溅射功率的增大有所减小。     

溅射功率对直流磁控溅射Ti膜结构的影响

 采用直流磁控溅射方法制备了纯Ti膜，研究了不同功率下Ti膜的沉积速率、表面形貌及晶型结构，并对其应力进行了研究。研究表明：薄膜的沉积速率随溅射功率的增加而增加，当溅射功率为20 W时，原子力显微镜(AFM)图像显示Ti膜光洁、致密，均方根粗糙度最小可达0.9 nm。X射线衍射(XRD)分析表明薄膜的晶体结构为六方晶型，Ti膜应力先随溅射功率增大而增大，在60 W时达到最大值（为945.1 MPa），之后随溅射功率的增大有所减小。     

常温溅射DLC膜的工艺研究

常温下,采用磁控溅射技术成功地在Ge基底上制备了类金刚石膜,并研究了溅射功率、碳氢气体与氩气流量比、溅射频率、基底负偏压等工艺参数对类金刚石膜沉积速率的影响和薄膜的光学性能。结果表明：溅射功率、溅射频率、碳氢气体与氩气流量比对沉积速率有显著的影响。沉积速率随着溅射功率的增大而增大,随着溅射频率的减小而增大。随着碳氢气体与氩气流量比、基底负偏压的增大沉积速率先增大后降低。制备的类金刚石膜具有较宽的光谱透明区,Ge基底单面沉积的类金刚石膜其峰值透过率最高达到63．99％。     

磁控溅射功率对β-Ga2O3薄膜特性的影响

近年来,第三代宽禁带半导体材料β-Ga₂O₃受到越来越多的关注,在材料制备、掺杂、刻蚀等方面都有广泛研究.射频磁控溅射是常用的β-Ga₂O₃薄膜制备方法之一,而磁控溅射法制膜往往需要进行退火处理以提高薄膜质量.本文研究溅射功率对射频磁控溅射在C面蓝宝石基底上制备得到的β-Ga₂O₃薄膜特性的影响. X射线衍射(XRD)、原子力显微镜(AFM)和扫描电子显微镜(SEM)表征结果表明,随着溅射功率的增大,半峰宽呈现先增大后减小再增大的趋势,晶粒尺寸变化与之相反.此外,通过积分球式分光光度计,研究了溅射功率对β-Ga₂O₃薄膜光学特性的影响.光学特性方面,薄膜吸光度随着波长的增加,先升高后下降、再升高再下降,最后吸收边在700 nm附近截止,不同溅射功率制备的薄膜吸收光谱都存在两个吸收峰.     

磁控溅射制备氧化硅薄膜生长速率

氧化硅薄膜是半导体工业中常见的薄膜材料,通常采用化学气相沉积方法制备。但是这种制备方法存在缺欠。采用磁控溅射的方法首先在石英衬底上制备了氧化硅薄膜。研究了射频功率、氧气含量和溅射压强对氧化硅薄膜沉积速率的影响。发现沉积速率随着射频功率的增加而增加;随着氧气含量的增加,先减小后增大;当溅射压强在0.4~0.8 Pa之间变化时,沉积速率变化很小,当溅射压强超过0.8 Pa时沉积速率迅速下降。讨论了不同生长条件下造成氧化硅薄膜生长速率变化的原因。     

射频溅射Pd薄膜的电阻率研究

本文研究了溅射Pd薄膜的电阻率与膜厚关系和不同溅射功率下Pd薄膜电阻率,结果表明,电阻率与膜厚的关系与现有的薄膜电阻率尺寸效应的理论基本相符,存在的差异主要是由溅射对衬底温度影响而引起的,并显示玻璃衬底上生长膜也有择优取向,溅射功率的变化对电阻率有一定的影响,进一步讨论溅射过程中衬底温度变化的问题,得出膜电阻率随衬底温度变化的定量关系式。 关键词：     

GaP薄膜的射频磁控溅射沉积及其计算机模拟

以GaP为靶材采用射频磁控溅射法制备GaP红外光学薄膜，通过保持Ar Ⅰ 750nm发射光谱线强度不变获得了不同工艺参数，并对沉积过程进行了计算机模拟.功率较小、气压较大时，Ga和P的溅射率、输运效率及沉积到衬底时的能量均较小，Ga的溅射率及输运效率均大于P的，使薄膜沉积速率较低、薄膜中Ga的含量大于P的，GaP薄膜产生较大吸收.功率较大、气压较小时，Ga和P的溅射率、输运效率及沉积到衬底时的能量均增大，Ga的溅射率大于P的、但其输运效率小于P的，使GaP薄膜的沉积速率增大、薄膜中Ga与P的含量接近化学计量比，GaP薄膜的吸收降低，因此有利于制备厚度较大的GaP薄膜. 关键词： GaP 薄膜 射频磁控溅射 计算机模拟     

玉米蛋白质基底上射频磁控溅射法制备ZnO薄膜

采用射频磁控溅射方法在蛋白质基底上成功地制备了ZnO薄膜,研究了不同靶基距、氩氧比和溅射功率条件对ZnO薄膜性质的影响。结果表明,较小的靶基距有助于ZnO薄膜的c轴择优取向生长。我们还发现,沉积于玉米蛋白质基底的ZnO薄膜存在不同程度的张应力,当Ar/（Ar+O₂）为0.7时,ZnO薄膜内的张应力最小。ZnO近带边发光峰有不同程度的红移,我们认为,这是由于晶界势垒和氧空位V_o造成的。随着溅射功率的增大,薄膜生长速率显著加快,晶粒尺寸增大,ZnO的近带边发光峰位逐渐趋向于理论值。     

射频反应性溅射沉积的Cd2SnO4薄膜物理性质与缺陷特性研究

在Ar+O₂混合气氛中射频反应性溅射Cd-Sn合金靶制备了透明导电Cd₂SnO₄(简称CTO)薄膜。用X射线衍射测量了CTO膜的结构。实验结果表明,这种薄膜的电学和光学性质依赖于混合气体中的氧浓度、衬底温度以及沉积后的热处理。获得的CTO膜最低电阻率为1.74×10^-6Ω·cm,可见光光谱区最高透射率为95％。对于氧浓度为6％、衬底温度为400℃时沉积的CTO膜,经热处理后,其光隙能由热处理前的2.37eV增大为2.6 关键词：     

Cu-W薄膜表面形貌的分形表征与电阻率

磁控溅射制备铜钨薄膜，用原子力显微镜和功率谱密度法分析薄膜生长表面形貌的分形维数，发现频段的选择基本不影响分形维数与溅射时间的关系.随溅射时间延长，薄膜厚度增加，分形维数增大，电阻率随分形维数的增大而升高.分析分形维数与电阻率的关系，认为对同一物质的导电薄膜，其表面形貌与电阻率存在对应关系. 关键词： Cu-W薄膜 分形维数 功率谱密度 电阻率     

Effect of deposition power and pressure on rate deposition and resistivity of titanium thin films grown by DC magnetron sputtering

ABSTRACT

Based on magnetron sputtering deposition technology, titanium (Ti) thin films are deposited on silicon (Si) substrate using different preparation conditions such as sputtering power and pressure. The influence of altering these conditions on deposition rate and microstructure is studied. The results show that sputtering power significantly affects the rate of deposition and the resistivity. The deposition rate of the Ti thin film increases when the resistivity decreases under sputtering powers of 150–225?W with a pressure of 0.8?Pa and Argon (Ar) flux of 80 sccm. As sputtering power was increased further (from 225 to 250?W), the deposition rate reduced and the resistivity augmented. Pressure also has influence on the deposition rate and resistivity – when pressure increases from 0.6 to 0.8?Pa, the deposition rate escalates while the resistivity reduces; when the pressure is raised from 0.8 to 1.0?Pa with Ar flux of 100 sccm, the deposition rate decreases and resistivity increases. The surface chemical compositions and the structures of the Ti film were studied by using X-ray photoelectron spectroscopy (XPS) and X-ray diffractometer (XRD). Observing the cross-section of the thin-film samples produced by scanning electron microscope (SEM) reveals the influence of the preparation conditions used on the microstructure and confirms the influence of sputtering power and pressure on the resistivity.     

Structure,phase evolution and properties of Ta films deposited using hybrid high-power pulsed and DC magnetron co-sputtering

Crystalline phase and microstructure control are critical for obtaining desired properties of Ta films deposited by magnetron sputtering. Structure, phase evolution and properties of Ta films deposited by using hybrid high power impulse magnetron sputtering (HiPIMS) and direct current magnetron sputtering (DCMS) under different fractions of DCMS power were investigated, where Ta ion to Ta neutral ratios of the deposition flux were changed. The results revealed that the number of Ta ions arriving on the substrate/growing film plays an important role in structure and phase evolution of Ta films. It can effectively avoid the unstable arc discharge under low pressure and show a higher deposition rate by combining HiPIMS and DCMS compared with only HiPIMS. Meanwhile, the high hardness α -Ta films can be directly deposited by hybrid co-sputtering compared to those prepared by DCMS. In the co-sputtering technology, pure α -Ta phase films with extremely fine, dense and uniform crystal grains were obtained, which showed smooth surface roughness (3.22 nm), low resistivity (38.98 μΩ · cm) and abnormal high hardness (17.64 GPa).     

感应耦合等离子体增强射频磁控溅射沉积ZrN薄膜及其性能研究

利用感应耦合等离子体(ICP)增强射频磁控溅射技术在Si(111)片和M2钢表面制备了ZrN薄膜,研究了基片的温度和ICP功率对ZrN薄膜的结构以及性能影响.研究发现：在基片温度≤300℃沉积的ZrN薄膜择优取向为(111);基片温度达到450℃时薄膜出现ZrN(200)衍射峰,ZrN(111)晶面的织构系数明显降低.传统磁控溅射沉积薄膜为柱状结构,当ICP为200 W,基片温度为300℃时沉积薄膜中柱状晶体消失;随着基片温度的升高,N/Zr元素比例降低,并且薄膜的电阻率下降;相对于传统溅射,ICP增强射 关键词： 感应耦合等离子体 磁控溅射 ZrN 微结构     

Effects of deposition parameters on tantalum films deposited by direct current magnetron sputtering in Ar–O2 mixture

The structure, composition, and temperature coefficient of resistance of tantalum films sputtered in Ar–O₂ mixture were studied as a function of deposition parameters and substrates temperature. As the sputtering power increased from 25 to 100 W, the samples deposited at 300 °C only consisted of the β phase, the preferred-growth orientation of films changed from (2 0 0) to (2 0 2) and the temperature coefficient of resistance reduced from −289.8 to −116.7 ppm/°C. The decrease of the oxygen and other impurity in the films was observed as the increase of the sputtering power. In addition, the O/Ta ratio decrease and grain size reduction in the films related to a change of electrical resistivity were observed at substrate temperatures in the range of 300–500 °C. These results suggested that the electrical properties were due to the oxygen and other impurity content and grain size in the films rather than to growth orientation. At 650 °C, the deposited films contained both partial stable body-centered-cubic α phase with low resistivity and tetragonal β phase of Ta. The presence of α phase of Ta causes a sharp decrease of the electrical resistivity and a significant change in the microstructure of the samples.     

沉积参数对碳氮化硅薄膜化学结构及光学性能的影响

利用微波电子回旋共振（MW ECR）等离子体增强非平衡磁控溅射法制备了碳氮化硅（SiCN）薄膜。研究结果表明：硅靶溅射功率和氮气流量对薄膜化学结构、光学、力学等性能有很大影响。傅里叶变换红外光谱（FT IR）和X射线光电子能谱（XPS）表征显示，随着硅靶溅射功率由150W增加到350W，薄膜中C Si N键含量由14.3%增加到43.6％; 氮气流量的增大（2～15sccm）易于形成更多的sp2C＝N键和sp1C≡N键。在改变硅靶溅射功率和氮气流量的条件下，薄膜光学带隙最大值分别达到2.1eV和2.8eV。     

Influence of deposition pressure and power on characteristics of RF-Sputtered Mo films and investigation of sodium diffusion in the films

Mo films deposited by DC sputtering are widely used as back contact in CIGS and CZTS based thin film solar cells. However, there have been only a few studies on the deposition of Mo films by RF sputtering method. In this context, Mo films on SLG substrates were prepared as a function of deposition pressure and power by using RF magnetron sputtering method to contribute to this shortcoming. Mo films were deposited at 250 °C substrate temperature by using 20, 15, 10 mTorr Ar pressures at 120 W RF power and 10 mTorr Ar pressure at 100 W RF power. Structural, morphological and reflectivity properties of RF-sputtered Mo films were clarified by XRD, AFM, FE-SEM and UV–Vis measurements. In addition, due to sodium incorporation from SLG substrate to the absorber layer through Mo back contact layer is so essential in terms of improving the conversion efficiency values of CIGS and CZTS thin film solar cell devices, the effects of Na diffusion in the films were analyzed with SIMS depth profile. The electrical properties of the films such as mobility, carrier density and resistivity were determined by Hall Effect measurements. It was found that Mo films prepared at 120 W, 10 mtorr and 250 °C substrate temperature and then annealed at 500 °C for 30 min, had resistivity as low as 10⁻⁵ Ω cm, as well as higher amount of Na incorporation than other films.     

直流磁控溅射厚度对Cu(Inx,Ga1-x)Se2背接触Mo薄膜性能的影响

采用直流磁控溅射工艺, 在一定条件下通过控制溅射时间, 在钠钙玻璃上制备了不同厚度的用于Cu(In_x, Ga_1-x)Se₂薄膜太阳电池背接触材料的Mo薄膜, 并利用X射线衍射 (XRD)、场发射扫描电子显微镜 (SEM)、四探针测试仪、台阶仪研究了厚度对溅射时间、薄膜微结构、电学性能及力学性能的交互影响. Mo薄膜的厚度与溅射时间呈线性递增关系; 随厚度的增大, Mo薄膜 (110) 和 (211) 面峰强均逐渐增大, 择优生长从(110)方向逐渐向 (211)方向转变, 方块电阻值只随 (110) 方向上的生长而急剧减小直到一特定值约2 Ω/⇑, 电导率随薄膜的 (110) 择优取向程度的降低而线性减小直到一特定值约0.96×10^-4 Ω·cm; Mo薄膜内部是一种多孔的长形簇状颗粒和颗粒间隙交织的结构, 并处于拉应力态, 其内部应变随薄膜厚度的增大而减小. 关键词： Mo薄膜 CIGS背接触 厚度 微结构     

Deposition of copper films by unbalanced d.c. magnetron sputtering

The electrical resistivity of as deposited polycrystalline copper thin films as a function of varying the process parameters has been investigated. Trying to minimize the resistivity of the copper thin films is important in the semiconductor industry, due to the fact that low resistivity copper can be employed to great advantage for new metallization schemes in advanced ultralarge scale integrated circuits. This paper presents the optimum choice of parameters that are necessary to achieve low resistivities of the thin films in reproducible experiments. All the depositions were performed using an unbalanced d.c. planar magnetron sputtering source (consisting of a circular copper target (98% purity, 0.01% Fe, 0.005% Ni, 0.005% Si) with a diameter of 100mm fitted with two electromagnets). The copper thin films were deposited onto glass substrates with argon being used as the sputtering gas. The resistivity was studied as a function of the pressure of the sputtering gas, the substrate bias, the substrate to target distance, the magnetron power, and the substrate temperature. It was found that depositions producing thin films with a resistivity of that approaching the bulk material (1.7×10^–8m) were obtained if the sputtering gas pressure was below 0.2 Pa. The effect of the substrate bias was insignificant at these pressures. The crystallographic structure of the copper thin films, determined by X-ray diffraction, is also reported.The authors would like to thank Dr. Soukup for his support during this research. We would also like to express our gratitude to Mr. A. Rajský for improving the design of the sputtering device. This work was partially financed by a grant from the Grant Agency of the Czech Republic No. 202/93/0508.     

Effect of substrate bias voltages on the diffusion barrier properties of Zr-N films in Cu metallization

Zr-N diffusion barriers were deposited on the Si substrates by rf reactive magnetron sputtering under various substrate bias voltages. Cu films were subsequently sputtered onto the Zr-N films by dc pulse magnetron sputtering without breaking vacuum. The Cu/Zr-N/Si specimens were then annealed up to 650 °C in N₂ ambient for an hour. The effects of deposition bias on growth rate, film resistivity, microstructure, and diffusion barrier properties of Zr-N films were investigated. An increase in negative substrate bias resulted in a decrease in deposition rate together with a decrease in resistivity. It was found that the sheet resistances of Cu/Zr-N(−200 V)/Si contact system were lower than those of Cu/Zr-N(−50 V)/Si specimens after annealing at 650 °C. Cu/Zr-N(−200 V)/Si contact systems showed better thermal stability so that the Cu₃Si phase could not be detected.     

Composition, structure and magnetic properties of sputter deposited Ni-Mn-Ga ferromagnetic shape memory thin films

Polycrystalline Ni-Mn-Ga thin films were deposited by the d.c. magnetron sputtering on well-cleaned substrates of Si(1 0 0) and glass at a constant sputtering power of 36 W. We report the influence of sputtering pressure on the composition, structure and magnetic properties of the sputtered thin films. These films display ferromagnetic behaviour only after annealing at an elevated temperature and a maximum saturation magnetization of 335 emu/cc was obtained for the films investigated. Evolution of martensitic microstructure was observed in the annealed thin films with the increase of sputtering pressure. The thermo-magnetic curves exhibited only magnetic transition in the temperature range of 339-374 K. The thin film deposited at high sputtering pressure of 0.025 mbar was found to be ordered L2₁ austenitic phase.