氮化物抛物量子阱中类氢杂质态能量

采用变分方法研究氮化物抛物量子阱(GaN/Al_xGa_1-xN)材料中类氢杂质态的能级,给出基态能量、第一激发态能量、结合能和跃迁能量等物理量随抛物量子阱宽度变化的函数关系.研究结果表明,基态能量、第一激发态能量、基态结合能和1s→2p±跃迁能量随着阱宽L的增大而减小,最后接近于GaN中3D值.GaN/Al_0.3Ga_0.7N抛物量子阱对杂质态的束缚程度比GaAs/Al_0.3Ga_0.7As抛物量子阱强,因此,在GaN/Al_0.3-Ga_0.7N抛物量子阱中束缚于杂质中心处的电子比在GaAs/Al_0.3Ga_0.7As抛物量子阱中束缚于杂质中心处的电子稳定.     

Al_xGa_(1-x)As(100)表面性质的研究

用紫外光电子能谱研究了Al_(0.7)Ga_(0.3)As的表面态结构,观察到Al_(0.7)Ga_(0.3)As在价带中的两个表面态结构。在1500L原子氢吸附后消失。研究了这两个表面态结构在热退火消除表面损伤过程中的变化。结合LEED和XPS的实验结果,确定在450℃左右的热退火可以有效地消除损伤,获得一个完整的Al_(0.7)Ga_(0.3)As(100)表面。     

聚焦Ga+离子束注入方法研制半导体量子线结构

采用聚焦Ga⁺离子束注入方法,在GaAs/Al_0.3Ga_0.7As多量子阱材料上尝试制备半导体量子线。通过低温光致发光谱,测量了量子线的光电特性,并观察了由于沟道效应导致的深层量子阱的光谱蓝移。 关键词：     

Al0.6Ga0.4N/GaN/Al0.3Ga0.7N/Al0.6Ga0.4N量子阱中的Rashba自旋劈裂

正如人们所知, 可以通过电场或者设计非对称的半导体异质结构来调控体系的结构反演不对称性(SIA)和Rashba自旋劈裂. 本文研究了Al_0.6Ga_0.4N/GaN/Al_0.3Ga_0.7N/Al_0.6Ga_0.4N量子阱中第一子带的Rashba 系数和Rashba自旋劈裂随Al_0.3Ga_0.7N插入层(右阱)的厚度w_s以及外加电场的变化关系, 其中GaN层(左阱)的厚度为40-w_s Å. 发现随着w_s的增加, 第一子带的Rashba系数和Rashba自旋劈裂首先增加, 然后在w_s>20 Å 时它们迅速减小, 但是w_s>30 Å时Rashba自旋劈裂减小得更快, 因为此时k_f也迅速减小. 阱层对Rashba系数的贡献最大, 界面的贡献次之且随w_s变化不是太明显, 垒层的贡献相对比较小. 然后, 我们假w_s=20 Å, 发现外加电场可以很大程度上调制该体系的Rashba系数和Rashba自旋劈裂, 当外加电场的方向同极化电场方向相同(相反)时, 它们随着外加电场的增加而增加(减小). 当外加电场从-1.5×10⁸ V·m^-1到1.5×10⁸ V· m^-1变化时, Rashba系数随着外加电场的改变而近似线性变化, Rashba自旋劈裂先增加得很快, 然后近似线性增加, 最后缓慢增加. 研究结果表明可以通过改变GaN层和Al_0.3Ga_0.7N层的相对厚度以及外加电场来调节Al_0.6Ga_0.4N/GaN/Al_0.3Ga_0.7N/Al_0.6Ga_0.4N量子阱中的Rashba 系数和Rashba自旋劈裂, 这对于设计自旋电子学器件有些启示.     

不同散射机理对 Al2O3/InxGa1-xAs nMOSFET 反型沟道电子迁移率的影响

通过考虑体散射、界面电荷的库仑散射以及 Al₂O₃/In_xGa_1-xAs 界面粗糙散射等主要散射机理, 建立了以 Al₂O₃为栅介质In_xGa_1-xAs n 沟金属-氧化物-半导体场效应晶体管 (nMOSFETs) 反型沟道电子迁移率模型, 模拟结果与实验数据有好的符合. 利用该模型分析表明, 在低至中等有效电场下, 电子迁移率主要受界面电荷库仑散射的影响; 而在强场下, 电子迁移率则取决于界面粗糙度散射. 降低界面态密度, 减小 Al₂O₃/In_xGa_1-xAs 界面粗糙度, 适当提高In含量并控制沟道掺杂在合适值是提高 InGaAs nMOSFETs 反型沟道电子迁移率的主要途径. 关键词： InGaAs MOSFET 反型沟道电子迁移率 散射机理     

空间用GaInP/GaAs/In0.3Ga0.7 As(1 eV)倒装三结太阳电池研制

采用阶变缓冲层技术 (step-graded) 外延生长了具有更优带隙组合的倒装GaInP/GaAs/In_0.3Ga_0.7As(1.0 eV) 三结太阳电池材料, TEM和HRXRD测试表明晶格失配度为2%的In_0.3Ga_0.7As 底电池具有较低的穿透位错密度和较高的晶体质量, 达到太阳电池的制备要求. 通过键合、剥离等工艺制备了太阳电池芯片. 面积为 10.922 cm² 的太阳电池芯片在空间光谱条件下转换效率达到32.64% (AM0, 25 ℃), 比传统晶格匹配的 GaInP/GaAs/Ge(0.67 eV) 三结太阳电池的转换效率提高3个百分点. 关键词： 太阳电池 三结 倒装结构     

磷化铟复合沟道高电子迁移率晶体管击穿特性研究

用密度梯度量子模型定量研究了磷化铟(InP)复合沟道高电子迁移率晶体管(HEMT)的击穿特性，考虑了复合沟道内碰撞电离以及沟道量子效应，重点研究了器件击穿电压随In_0.7Ga_0.3As沟道厚度的变化关系，提出了提高击穿电压的方法，采用商用器件模拟软件Sentaurus模拟了器件的开态击穿电压，对比了实验和模拟的结果. 研究表明：适当减小In_0.7Ga_0.3As沟道层的厚度可以在保持器件饱和电流基本不变的前提下大幅度提高开态击穿电压，这对于提高InP基HEMT的功率性能具有重要意义. 关键词： 磷化铟 高电子迁移率晶体管 密度梯度模型 击穿     

缓冲层InxGa1-xAs组分对In0.82Ga0.18As结晶质量和表面形貌的影响

采用低压金属有机化学气相沉积(LP-MOCVD)技术,两步生长法在InP衬底上制备In_0.82Ga_0.18As材料.研究缓冲层In_xGa_1-xAs的In组分对In_0.82Ga_0.18As结晶质量和表面形貌的影响.X射线衍射(XRD)用于表征材料的组分和结晶质量.用扫描电子显微镜(SEM)观察样品的表面形貌.实验结果表明,低温生长的缓冲层In_xGa_1-xAs的In组分影响高温生长的外延层In_0.82Ga_0.18As的结晶质量和表面形貌.测量得到四个样品的外延层In_0.82Ga_0.18As的X射线衍射谱峰半峰全宽(FWHM)为0.596°,0.68°,0.362°和0.391°,分别对应缓冲层In组分x=0.28,0.53,0.82,0.88,当缓冲层In组分是0.82时,FWHM最窄,表明样品的结晶质量最好.SEM观察四个样品的表面形貌,当缓冲层In组分是0.82时,样品的表面平整,没有出现交叉平行线或蚀坑等缺陷,表面形貌最佳.     

蓝宝石衬底上GaN/AlxGa1-xN超晶格插入层对AlxGa1-xN外延薄膜应变及缺陷密度的影响

室温300K下,由于Al_xGa_1-xN的带隙宽度可以从GaN的3.42eV到AlN的6.2eV之间变化,所以Al_xGa_1-xN是紫外光探测器和深紫外LED所必需的外延材料.高质量高铝组分Al_xGa_1-xN材料生长的一大困难就是Al_xGa_1-xN与常用的蓝宝石衬底之间大的晶格失配和热失配.因而采用MOCVD在GaN/蓝宝石上生长的Al_xGa_1-xN薄膜由于受张应力作用非常容易发生龟裂.GaN/Al_xGa_1-xN超晶格插入层技术是释放应力和减少Al_xGa_1-xN薄膜中缺陷的有效方法.研究了GaN/Al_xGa_1-xN超晶格插入层对GaN/蓝宝石上Al_xGa_1-xN外延薄膜应变状态和缺陷密度的影响.通过拉曼散射探测声子频率从而得到材料中的残余应力是一种简便常用的方法,Al_xGa_1-xN外延薄膜的应变状态可通过拉曼光谱测量得到.Al_xGa_1-xN外延薄膜的缺陷密度通过测量X射线衍射得到.对于具有相同阱垒厚度的超晶格,例如4nm/4nm,5nm/5nm,8nm/8nm的GaN/Al_0.3Ga_0.7N超晶格,研究发现随着超晶格周期厚度的增加Al_xGa_1-xN外延薄膜缺陷密度降低,Al_xGa_1-xN外延薄膜处于张应变状态,且5nm/5nmGaN/Al_0.3Ga_0.7N超晶格插入层Al_xGa_1-xN外延薄膜的张应变最小.在保持5nm阱宽不变的情况下,将垒宽增大到8nm,即十个周期的5nm/8nmGaN/Al_0.3Ga_0.7N超晶格插入层使Al_xGa_1-xN外延层应变状态由张应变变为压应变.由X射线衍射结果计算了Al_xGa_1-xN外延薄膜的刃型位错和螺型位错密度,结果表明超晶格插入层对螺型位错和刃型位错都有一定的抑制效果.透射电镜图像表明超晶格插入层使位错发生合并、转向或是使位错终止,且5nm/8nmGaN/Al_0.3Ga_0.7N超晶格插入层导致Al_xGa_1-xN外延薄膜中的刃型位错倾斜30°左右,释放一部分压应变.     

应力导致InAs/In0.15Ga0.85As量子点结构中In0.15Ga0.85As阱层的合金分解效应研究

利用固源分子束外延技术，在In_0.15Ga_0.85As/GaAs量子阱生长了两个InAs/In_0.15Ga_0.85As量子点(DWELL)样品.通过改变其中一个InAs DWELL样品中的In_0.15Ga_0.85As阱层的厚度和生长温度，获得了量子点尺寸增大而且尺寸分布更均匀的结果.结合光致发光光谱(PL)和压电调制光谱(PzR)实验结果，发现该样品量子点的光学性质也同时得到 关键词： 合金分解效应 0.15Ga_0.85As量子点')" href="#">InAs/In_0.15Ga_0.85As量子点 光致发光光谱 压电调制光谱     

AlGaN barrier thickness dependent surface and interface trapping characteristics of AlGaN/GaN heterostructure

The aluminium gallium nitride (AlGaN) barrier thickness dependent trapping characteristic of AlGaN/GaN heterostructure is investigated in detail by frequency dependent conductance measurements. The conductance measurementsin the depletion region biases (−4.8 V to −3.2 V) shows that the Al_0.3Ga_0.7N(18 nm)/GaN structure suffers from both the surface (the metal/AlGaN interface of the gate region) and interface (the AlGaN/GaN interface of the channel region) trapping states, whereas the AlGaN/GaN structure with a thicker AlGaN barrier (25 nm) layer suffers from only interface (the channel region of AlGaN/GaN) trap energy states in the bias region (−6 V to −4.2). The two extracted time constants of the trap levels are (2.6–4.59) μs (surface) and (113.4–33.8) μs (interface) for the Al_0.3Ga_0.7N(18 nm)/GaN structure in the depletion region of biases (−4.8 V to −3.2 V), whereas the Al_0.3Ga_0.7N (25 nm)/GaN structure yields only interface trap states with time constants of (86.8–33.3) μs in the voltage bias range of −6.0 V to −4.2 V. The extracted surface trapping time constants are found to be very muchless in the Al_0.3Ga_0.7N(18 nm)/GaN heterostructure compared to that of the interface trap states. The higher electric field formation across the AlGaN barrier causes de-trapping of the surface trapped electron through a tunnelling process for the Al_0.3Ga_0.7N(18 nm)/GaN structure, and hence the time constants of the surface trap are less.     

1MeV Si+衬底加温注入Al0.3Ga0.7As/GaAs超晶格和GaAs的晶格损伤研究

用卢瑟福背散射／沟道技术研究了１ＭｅＶＳｉ⁺在衬底加温和室温下以不同剂量注入Ａｌ_0.3Ｇ_0.7Ａｓ／ＧａＡｓ超晶格和ＧａＡｓ后的晶格损伤。在衬底加温下，观察到Ａｌ_0.3Ｇａ_0.7Ａｓ／ＧａＡｓ超晶格和ＧａＡｓ都存在一个动态退火速率与缺陷产生速率相平衡的剂量范围，以及两种速率失去平衡的临界剂量。超晶格比ＧａＡｓ更难以损伤，并且它的两种速率失去平衡的临界剂量也大于ＧａＡｓ中的相应临界剂量，用热尖峰与碰撞模型解释了晶格损伤积累与注入剂量和衬底温度的关系。用ＣＮＤＯ／２量子化学方法计算了ＧａＡｓ和Ａｌ_xＧａ_1-xＡｓ中化学键的相对强度，并根据计算结果解释了注入过程中Ａｌ_0.3Ｇａ_0.7Ａｓ／ＧａＡｓ超晶格和ＧａＡｓ中晶格损伤程度的差别。 关键词：     

The influence of chemical treatment and thermal annealing on AlxGa1−xN surfaces: An XPS study

The influences of chemical treatment and thermal annealing of Al_xGa_1−xN (x = 0.20) have been investigated by X-ray photoelectron spectroscopy (XPS). XPS analysis showed that successive chemical treatments and annealing produced changes in the stoichiometry of the Al_xGa_1−xN surface, with the surface concentration of N increasing and Al and Ga decreasing with increasing temperature. Band bending occurred at the Al_xGa_1−xN surface, in parallel with the observed changes in stoichiometry. These results are discussed in the context of the creation of surface states via the activation of vacancies and induced by defects. These findings point towards the possibility of selecting and/or engineering the band structure at Al_xGa_1−xN surfaces through a combination of surface preparation and annealing.     

Coherent oscillations of holes in GaAs0.86P0.14/Al0.7Ga0.3As surface quantum well

We show that in a GaAs_0.86P_0.14/Al_0.7Ga_0.3As near-surface quantum well, there is coherent oscillation of holes observed in time-resolved reflectivity signal when the top barrier of the quantum well is sufficiently thin. The quantum well states interact with the surface states under the influence of the surface electric field. The time period of the observed oscillation is 120±10 fs.     

Performance comparison of Pt/Au and Ni/Au Schottky contacts on AlxGa1-x N/GaN heterostructures at high temperatures

In contrast with Au/Ni/Al 0.25 Ga 0.75 N/GaN Schottky contacts,this paper systematically investigates the effect of thermal annealing of Au/Pt/Al 0.25 Ga 0.75 N/GaN structures on electrical properties of the two-dimensional electron gas in Al 0.25 Ga 0.75 N/GaN heterostructures by means of temperature-dependent Hall and temperature-dependent current-voltage measurements.The two-dimensional electron gas density of the samples with Pt cap layer increases after annealing in N 2 ambience at 600℃ while the annealing treatment has little effect on the two-dimensional electron gas mobility in comparison with the samples with Ni cap layer.The experimental results indicate that the Au/Pt/Al 0.25 Ga 0.75 N/GaN Schottky contacts reduce the reverse leakage current density at high annealing temperatures of 400-600℃.As a conclusion,the better thermal stability of the Au/Pt/Al 0.25 Ga 0.75 N/GaN Schottky contacts than the Au/Ni/Al 0.25 Ga 0.75 N/GaN Schottky contacts at high temperatures can be attributed to the inertness of the interface between Pt and AlxGa1-xN.     

Modulation of the coupling of a near-surface GaAs/Ga0.7Al0.3As quantum well with its free surface

The states confined in a GaAs/Ga_0.7Al_0.3 quantum well interact with the states localized at the free surface of its topmost barrier when the thickness of this barrier is decreased below ≈400Å. We show here that this interaction and hence the behaviour of carriers confined in the well can be modulated by in situ treatments applied to this free surface.     

Confinement-enhanced dots-in-a-well QDIPs with operating temperature over 200 K

LWIR InAs/Al_0.3Ga_0.7As/In_0.15Ga_0.85As confinement-enhanced DWELL (CE-DWELL) QDIPs with operation temperatures higher than 200 K are reported. A thin Al_0.3Ga_0.7As barrier layer was inserted above the InAs QDs to improve the confinement of QD states in the In_0.15Ga_0.85As DWELL structure and the device performance. The better confinement of the electronic states increases the oscillator strength of the infrared absorption. The higher excited state energy also improves the escape probability of the photoelectrons. Compared with the conventional DWELL QDIPs, the quantum efficiency increases for more than 20 times and the detectivity is an order of magnitude higher at 77 K. With better device parameters of CE-DWELL, it is possible to achieve high quantum efficiency, high operating temperature and long wavelength detection at the same time.     

Dependence of propagation loss on etching depth in Al0.3Ga0.7As/GaAs/Al0.3Ga0.7As strip-loaded type waveguides

Al_0.3Ga_0.7As/GaAs/Al_0.3Ga_0.7As strip-loaded waveguides were fabricated using a broad-beam electron cyclotron resonance (ECR) ion source. It was found that a very smooth etching profile can be obtained by ECR ion etching and the etching rate of Al_0.3Ga_0.7As is 70 nm min^-1. The propagation losses of strip-loaded type III–V compound semiconductor waveguides with various etching depths were studied by the Fabry-Perot cavity method. It was observed that the reflectance at the cleavage increases slightly with etching depth for TE polarization. The propagation loss is measured as 1.5 dB cm^-1 for etching depth of 0.7 m, less than 1 dB cm^-1 for 0.8 m, and 3.5 dB cm^-1 for 1.1 m.     

Ultra-fast nonlinear response around 1.5 μm in 2D AlGaAs/AlOx photonic crystal

We report the fast switching capabilities of a two-dimensional Al_0.3Ga_0.7As photonic crystal slab around 1.5 μm. The slab is supported by an AlOx low-index thick layer that plays the role of an efficient heat sink. By pumping at 0.8 μm in the absorption of the Al_0.3Ga_0.7As quantum wells, the optical response is modified in the transparency region: a 200% change in the reflectivity is obtained with a total response time of 8ps.     

Identification and elimination of inductively coupled plasma-induced defects in AlxGa1 - xN/GaN heterostructures

By using temperature-dependent Hall,variable-frequency capacitance-voltage and cathodoluminescence (CL) measurements,the identification of inductively coupled plasma (ICP)-induced defect states around the Al x Ga 1-x N/GaN heterointerface and their elimination by subsequent annealing in Al x Ga 1-x N/GaN heterostructures are systematically investigated.The energy levels of interface states with activation energies in a range from 0.211 to 0.253 eV below the conduction band of GaN are observed.The interface state density after the ICP-etching process is as high as 2.75×10 12 cm 2 ·eV 1.The ICP-induced interface states could be reduced by two orders of magnitude by subsequent annealing in N 2 ambient.The CL studies indicate that the ICP-induced defects should be Ga-vacancy related.