总剂量效应致0.13μm部分耗尽绝缘体上硅N型金属氧化物半导体场效应晶体管热载流子增强效应

空间科学的进步对航天用电子器件提出了更高的性能需求, 绝缘体上硅(SOI)技术由此进入空间科学领域, 这使得器件的应用面临深空辐射环境与地面常规可靠性的双重挑战. 进行SOI N型金属氧化物半导体场效应晶体管电离辐射损伤对热载流子可靠性的影响研究, 有助于对SOI器件空间应用的综合可靠性进行评估. 通过预辐照和未辐照、不同沟道宽长比的器件热载流子试验结果对比, 发现总剂量损伤导致热载流子损伤增强效应, 机理分析表明该效应是STI辐射感生电场增强沟道电子空穴碰撞电离率所引起. 与未辐照器件相比, 预辐照器件在热载流子试验中的衬底电流明显增大, 器件的转移特性曲线、输出特性曲线、跨导特性曲线以及关键电学参数V_T, GM_max, ID_SAT退化较多. 本文还对宽沟道器件测试中衬底电流减小以及不连续这一特殊现象进行了讨论.     

AlGaAs/InGaAs/GaAs赝配高电子迁移晶体管的kink效应研究

利用二维器件模拟软件MEDICI对AlGaAs/InGaAs/GaAs赝配高电子迁移晶体管器(PHEMT)件进行了仿真，研究了PHEMT器件的掺杂浓度与电子浓度分布，PHEMT器件内部的电流走向及传输特性，重点研究了不同温度和不同势垒层浓度情况下PHEMT器件的kink效应.研究结果表明：kink效应主要与处于高层深能级中的陷阱俘获/反俘获过程有关，而不是只与碰撞电离有关. 关键词： 高电子迁移率晶体管 kink效应 二维电子气     

负微分迁移率和碰撞电离对GaAs光导开关非线性特性的影响

对GaAs光导开关非线性工作时,负微分迁移率和碰撞电离的作用进行了数值分析,给出了考虑和未考虑碰撞电离作用时的外电路电流输出波形,以及载流子和电场的空间分布和随时间演变的情况.计算表明GaAs材料的负微分迁移率引起的微分负阻,会导致阴极附近电场的动态增强,使得阴极附近的电场达到本征碰撞电离发生的阈值电场,从而引发本征碰撞电离的发生.分析结果表明,碰撞电离可以极大地延长电流输出的时间,但仅考虑负微分迁移率特性的本征碰撞电离过程不足以完全解释观察到的所有非线性现象,必须进一步考虑其它高电场效应.     

磷化铟复合沟道高电子迁移率晶体管击穿特性研究

用密度梯度量子模型定量研究了磷化铟(InP)复合沟道高电子迁移率晶体管(HEMT)的击穿特性，考虑了复合沟道内碰撞电离以及沟道量子效应，重点研究了器件击穿电压随In_0.7Ga_0.3As沟道厚度的变化关系，提出了提高击穿电压的方法，采用商用器件模拟软件Sentaurus模拟了器件的开态击穿电压，对比了实验和模拟的结果. 研究表明：适当减小In_0.7Ga_0.3As沟道层的厚度可以在保持器件饱和电流基本不变的前提下大幅度提高开态击穿电压，这对于提高InP基HEMT的功率性能具有重要意义. 关键词： 磷化铟 高电子迁移率晶体管 密度梯度模型 击穿     

钎锌矿相GaN电子高场输运特性的Monte Carlo 模拟研究

应用全带多粒子Monte Carlo模拟方法,研究了钎锌矿相GaN 材料电子的高场输运特性. 模拟中利用了基于第一性原理总能量赝势方法计算得到的纤锌矿GaN的能带结构数据. 用Cartier的方法,计算碰撞电离散射率. 计算得到了电子平均漂移速度和电子平均能量与电场的关系曲线. 电离系数的分析表明当电场强度大于1 MV/cm时,才会有明显的碰撞电离发生,量子产额的分析表明当电子的能量大于7 eV时,量子产额随能量增加迅速增大. 研究了在0—4 MV/cm电场强度范围内电子在各导带的分布,低场下电子全部位于 关键词： 碰撞电离 高场输运 能带结构 Monte Carlo模拟     

高压双扩散漏端MOS晶体管双峰衬底电流的形成机理及其影响

利用0.15μm标准CMOS工艺制造出了工作电压为30V的双扩散漏端MOS晶体管(double diffused drain MOS, DDDMOS).观察到DDDMOS的衬底电流-栅压曲线(I_b-V_g曲线)有两个峰.通过实验和TCAD模拟揭示了DDDMOS衬底电流的形成机理,发现衬底电流第一个峰的成因与传统MOS器件相同;第二个峰来自于发生在漂移区远离沟道一侧高场区的碰撞离化电流.通过求解泊松方程和电流连续性方程,分析了器件的物理和几何参数对导致衬底电流重新上升的漂移区电场的影响.在分析了DDDMOS衬底电流的第二个峰形成机理的基础上,考察了其对器件的可靠性的影响. 关键词： 高压器件 衬底电流 可靠性     

场板抑制GaN高电子迁移率晶体管电流崩塌的机理研究

通过实验和数值器件仿真研究了钝化GaN高电子迁移率晶体管(HEMTs)、栅场板GaN HEMTs和栅源双层场板GaN HEMTs电流崩塌现象的物理机理,建立了电流崩塌强度与帽层中载流子浓度、陷阱电离率和电场的内在联系.研究结果表明,场板可以有效调制帽层中横向和纵向电场的强度分布,并可有效调制纵向电场的方向,减弱栅极附近电场强度,增加场板下方电场强度,这会减弱栅极附近自由电子的横向运动,增强场板下方自由电子的纵向运动,进而可以有效调制帽层中自由电子浓度的分布,提高陷阱的电离率,减小器件的电流崩塌. 关键词： 电流崩塌 钝化器件 场板器件 陷阱电离率     

6H-SiC高场输运特性的多粒子蒙特卡罗研究

采用非抛物性能带模型,对6H-SiC高场电子输运特性进行了多粒子蒙特卡罗(Ensemble Monte Carlo)研究.研究表明：温度为296 K时,电子横向漂移速度在电场为2.0×104 V/cm处偏离线性区,5.0×105 V/cm处达到饱和.由EMC方法得到的电子横向饱和漂移速度为1.95×107 cm/s,纵向为6.0×106 cm/s,各向异性较为显著.当电场小于1.0×106 V/cm时,碰撞电离效应对高场电子漂移速度影响较小.另一方面,高场下电子平均能量的各向异性非常明显.电场大于2.0×105 V/cm时,极化光学声子散射对电子横向能量驰豫时间影响较大.当电场一定时,c轴方向的电子碰撞电离率随着温度的上升而增大.对非稳态高场输运特性的分析表明：阶跃电场强度为1.0×106 V/cm时,电子横向瞬态速度峰值接近3.0×107 cm/s,反应时间仅为百分之几皮秒量级.     

LT-GaAs飞秒光电导之电场响应特性

利用飞秒光电导自相关技术研究了LT GaAs飞秒光电导开关时间随外加偏置电场的变化规律 .实验结果显示当外加偏置电场从0.5×10⁴ V/cm 上升到9.5×10⁴ V/cm 时，光电导 开关时间开始在200fs附近缓慢变化再迅速增加到750fs.这是由于随着外加电场增加，Fren kel-Poole效应导致的EL2缺陷中心库仑吸引势垒降低和电场增强的碰撞电离效应显著增强 ，导致载流子俘获截面减小，载流子寿命增加之故. 关键词： 光电导自相关技术 载流子俘获时间 Frenkel-Poole效应 电子碰撞电离效应     

AlGaN/GaN场板结构高电子迁移率晶体管的场板尺寸优化分析

对不同场板尺寸的AlGaN/GaN 场板结构高电子迁移率晶体管进行了研究,建立简化模型分析场板长度对沟道电场分布的影响.结果表明,调整钝化层厚度和场板长度都可以调制沟道电场的分布形状,当场板长度较小时,随着长度的增大器件击穿电压随之增加,而当长度增大到一定程度后器件击穿电压不再增加.通过优化场板长度,器件击穿电压提高了64%,且实验结果与模拟结果相符. 关键词： AlGaN/GaN 击穿电压 场板长度     

The electron ionization rate in multilayered semiconductor structures

We present theoretical results of the electron impact ionization rate in GaAs/AlGaAs multiquantum well structures as a function of applied electric field for various geometries, i.e., well and barrier widths. In addition, we present preliminary measurements of the current-voltage characteristics of MBE grown devices which demonstrate very low leakage current as well as sharp breakdwon behavior. It is found that the net ionization rate, determined by averaging over the constitutent GaAs and AlGaAs layers, approaches the weighted average of the constituent bulk rates at high electric field strengths; the potential discontinuity is relatively unimportant. The electron ionization rate within the well regions alone is still higher than that in bulk GaAs, but is insufficiently enhanced to compensate for the much lower rate in the AlGaAs layers. As the field is lowered to 250.0 kV/cm, the average ionization rate in the multiquantum well structure becomes larger than in the bulk.     

外加高压电场下空气中激光等离子体通道寿命研究

通过对飞秒激光在空气中产生的等离子体通道两端外加高压,来研究通道的寿命变化情况。实验得到,当在等离子体通道两端外加高压时(350 kV/m),等离子体通道寿命延长了近3倍。理论模拟和分析结果表明在外加电场条件下,碰撞电离得到增强,吸附作用相对减弱,解离复合系数随着电子平均能量的增加而下降的趋势更为剧烈,这进一步引起了等离子体通道寿命的延长。实验结果与理论分析共同表明了利用外加电场对空气中激光等离子体通道寿命进行延长的可行性。     

激光二极管触发光导开关实验研究

介绍了利用大功率半导体激光二极管触发3 mm间隙GaAs光导开关、产生非线性电脉冲输出的实验,激光二极管输出功率为70 W,上升前沿约20 ns,脉冲半高宽（FWHM）约40 ns。随着开关两端偏置场强增加,输出电压也线性增加,当偏置场强超过一定阈值,增至约2.53 kV/mm时,经过一个较小的电压峰值和时间延迟后,输出电压急剧增加,产生雪崩现象。实验结果表明:GaAs开关非线性输出的产生与载流子聚集和碰撞电离有关,偏置电场的提高增加了开关芯片中载流子聚集数量,加剧了碰撞离化程度,从而使开关从线性模式进入雪崩模式。     

Nonparabolic multivalley balance-equation approach to impact ionization: Application to wurtzite GaN

Extended nonparabolic multivalley balance equations including impact ionization (II) process are presented and are applied to study electron transport and impact ionization in wurtzite-phase GaN with a , L-M, and conduction band structure at high electric field up to 1000kV/cm. Hot-electron transport properties and impact ionization coefficient are calculated taking account of the scatterings from ionized impurity, polar optical, deformation potential, and intervalley interactions. It is shown that, for wurtzite GaN when the electric field approximately equals 530kV/cm, the II process begins to contribute to electron transport and results in an increase of the electron velocity and a decrease of the electron temperature, in comparison with the case without the II process. Similar calculations for GaAs are also carried out and quantitative agreement is obtained between the calculated II coefficients by this present approach and the experimental data. Relative to GaAs, GaN has a higher threshold electric field for II and a smaller II coefficient. Received: 27 April 1998 / Revised: 17 July 1998 / Accepted: 13 August 1998     

Impact ionization and electroluminescence in single barrier tunnelling structures

At high electric fields, hot electrons injected into the undoped regions of n-i-n structures can give rise to impact ionization of the host lattice and electron-hole pair production. The holes created by impact ionization recombine with majority carrier electrons, leading to electroluminescence (EL) from the device at fields in excess of 10⁵V/cm. In the present work, we show that the study of such EL in GaAs/AlGaAs/GaAs single barrier tunnelling structures provides a simple and effective quantitative method to determine impact ionization coefficients in GaAs. Structures with undoped regions of length 100, 150 and 200nm are shown to give very similar results for the impact ionization coefficient. The values obtained for the impact ionization coefficient are shown to be consistent with those obtained by carrier multiplication methods.     

Mechanism for the streamer propagation toward the anode and cathode due to background electron multiplication

A simple mechanism for the propagation of an ionization wave in a dense gas due to the multiplication of background electrons in a nonuniform electric field is proposed. The mechanism does not depend on the sign of the field projection onto the streamer propagation direction. The streamer propagation is caused by the enhancement of the electric field at the streamer head. It is shown that, in a prebreakdown field, the intense multiplication of electrons takes place in both electropositive and electronegative gases. The prebreakdown multiplication can provide a fairly high density of background electrons; this allows one to treat the background as a continuous medium when considering streamer propagation as a multiplication wave. The initial ionization is enabled by the natural background of ionizing radiation and cosmic rays. An analytical expression for the velocity of the ionization front is obtained based on a simple equation for the multiplication of background electrons. This expression is in good agreement with numerical simulations performed within both a simple model of background electron multiplication and a more comprehensive drift-diffusion model. In particular, the drift-diffusion model predicts the propagation of the ionization front from a small-radius anode to the cathode due to the multiplication of background electrons. The velocity of the ionization wave front is calculated as a function of the electric field at the streamer head for helium, xenon, nitrogen, and sulfur hexafluoride. It is shown that some features of streamer propagation (e.g., its jerky motion) can be related to the recently found nonmonotonic dependence of ionization frequency on the electric field.     

Observation of the transition from impact-ionization-dominated to field-ionization-dominated impurity breakdown in silicon

It is shown that by measuring the genration rate vs stepped voltage amplitude it is possible to separate the impurity impact ionization from the pure field ionization. Also, the phosphorus impact ionization coefficient in silicon at high electric fields was measured and compared with the Monte Carlo calculations.     

Air ionization in a near-critical electric field

A set of experimental dependences of the air ionization effective rate on the electric field strength is presented. The concept of the critical breakdown field is discussed. It is indicated that experimental data are quantitatively inconsistent with analytical results based on this concept. This inconsistency is eliminated if the ionization balance takes into account not only dissociative adhesion of electrons to oxygen molecules but also their detachment from the molecules that gained a charge during the charge exchange process. Based on the results obtained, a new physical interpretation of the critical field is suggested. A formula for the effective rate of air ionization in near-critical fields is derived.     

Combined breakdown in bismuth—Antimony semiconductor alloys

S-shaped current-voltage characteristics for Bi_1?xSb_x alloys are studied theoretically and experimentally. The phenomenon is shown to occur due to the combined interband breakdown, the impact ionization being caused both by the external electric field and the Hall field. The latter is governed by the proper magnetic field of the plasma current. The negative differential resistance (NDR) occurs for the range of currents where the impact ionization is growing intensively but the pinch effect is not yet developed to full extent. The phenomenon is enhanced if the impact ionization rate in the Hall field is greater than in the applied one.