利用In0.82Ga0.18As与InP衬底之间的应力制作结构材料的缓冲层

采用低压金属有机化学气相淀积(LP-MOCVD)技术,在InP(100)衬底上生长In0.82Ga0.18As,研究生长温度对In0.82Ga0.18As材料表面形貌、结晶质量和电学性能的影响.利用InP(100)衬底与In0.82Ga0.18As材料晶格失配所产生的应变,在不同的生长温度下应变释放程度不同,进而在In...     

高质量InGaN的等离子体辅助分子束外延生长和In的反常并入行为

采用射频等离子体辅助分子束外延技术生长得到了In组分精确可控且高质量的In_xGa_1-xN (x ≤ 0.2) 外延薄膜. 生长温度为580 ℃的In_0.19Ga_0.81N薄膜(10.2) 面非对称衍射峰的半高宽只有587弧秒, 背景电子浓度为3.96× 10¹⁸/cm³. 在富金属生长区域, Ga束流超过N的等效束流时, In组分不为零, 即Ga并没有全部并入外延层; 另外, 稍微增加In束流会降低InGaN的晶体质量. 关键词： InGaN 外延薄膜 射频等离子体辅助分子束外延 In 并入 晶体质量     

空间用GaInP/GaAs/In0.3Ga0.7 As(1 eV)倒装三结太阳电池研制

采用阶变缓冲层技术 (step-graded) 外延生长了具有更优带隙组合的倒装GaInP/GaAs/In_0.3Ga_0.7As(1.0 eV) 三结太阳电池材料, TEM和HRXRD测试表明晶格失配度为2%的In_0.3Ga_0.7As 底电池具有较低的穿透位错密度和较高的晶体质量, 达到太阳电池的制备要求. 通过键合、剥离等工艺制备了太阳电池芯片. 面积为 10.922 cm² 的太阳电池芯片在空间光谱条件下转换效率达到32.64% (AM0, 25 ℃), 比传统晶格匹配的 GaInP/GaAs/Ge(0.67 eV) 三结太阳电池的转换效率提高3个百分点. 关键词： 太阳电池 三结 倒装结构     

纤锌矿In_(0.19)Ga_(0.81)N/GaN量子阱中光学声子和内建电场对束缚极化子结合能的影响

用改进的Lee-Low-Pines变分方法研究纤锌矿In0.19Ga0.81N/GaN量子阱结构中束缚极化子能量和结合能等问题,给出基态结合能、不同支长波光学声子对能量和结合能的贡献随阱宽和杂质中心位置变化的数值结果.在数值计算中包括了该体系中声子频率的各向异性和内建电场对能量和结合能的影响、以及电子和杂质中心与长波光学声子的相互作用.研究结果表明,In0.19Ga0.81N/GaN量子阱材料中光学声子和内建电场对束缚极化子能量和结合能的贡献很大,它们都引起能量和结合能降低.结合能随着阱宽的增大而单调减小,窄阱中减小的速度快,而宽阱中减小的速度慢.不同支声子对能量和结合能的贡献随着阱宽的变化规律不同.没有内建电场时,窄阱中,定域声子贡献小于界面和半空间声子贡献,而宽阱中,定域声子贡献大于界面和半空间声子贡献.有内建电场时,定域声子贡献变小,而界面和半空间声子贡献变大,声子总贡献也有明显变化.在In0.19Ga0.81N/GaN量子阱中,光学声子对束缚极化子能量和结合能的贡献比GaAs/Al0.19Ga0.81As量子阱中的相应贡献(约3.2—1.8和1.6—0.3 meV)约大一个数量级.阱宽(d=8 nm)不变时,在In0.19Ga0.81N/GaN量子阱中结合能随着杂质中心位置Z0的变大而减小,并减小的速度变快.随着Z0的增大,界面和半空间光学声子对结合能的贡献缓慢减小,而定域光学声子的贡献缓慢增大.     

空间用倒装三结太阳能电池及其抗辐射性能研究

使用金属有机化学气相沉积技术,在4英寸GaAs衬底上获得了空间用GaInP/GaAs/In_(0.3)Ga_(0.7)As倒装三结太阳能电池.高分辨X射线衍射和阴极射线发光测试结果表明AlInGaAs应力渐变缓冲层的晶格弛豫度约100%,其整面平均穿透位错密度约5.4×10~6/cm~2.与GaInP/InGaAs/Ge常规三结太阳能电池相比,在AM0光谱、25℃测试条件下,面积24 cm~2的倒装三结太阳能电池转换效率达到32%,输出功率提高了5%.采用1 MeV高能电子对倒装三结电池进行粒子辐照测试,电池各项性能参数随不同辐照剂量发生改变,在1×10~(15)/cm~2辐照总剂量下电池转换效率衰降比例达到15%.     

Shaped crystal growth and scintillating properties of Yb:(Gd,Lu)3Ga5O12 solid solutions

Shaped single crystals of (Lu_xGd_1−x)₃Ga₅O₁₂ (0.0x1.0) and (Yb_0.05Lu_xGd_0.95−x)₃Ga₅O₁₂ (0.0x0.9) were grown by the modified micro-pulling-down method. Continuous solid solutions with garnet structure and a linear compositional dependency of crystal lattice parameter in the system Yb:(Gd,Lu)₃Ga₅O₁₂ are formed. Measured optical absorption spectra of the samples show 4f–4f transitions related to Gd³⁺ ion at 275 and 310 nm, and also an onset of charge transfer transitions from oxygen ligands to Gd³⁺ or Yb³⁺ cations below 240 nm. A complete absence of Yb³⁺ charge transfer luminescence under X-ray excitation in any of the investigated samples was explained by the overlapping of charge transfer absorption of Yb³⁺ by that of Gd³⁺ ions. For specific composition of Lu_1.5Gd_1.5Ga₅O₁₂ an intense defect-host lattice-related emission, which achieve of about 40% integrated intensity compared with Bi₄Ge₃O₁₂, was found.     

AlN插入层对AlxGa1-xN/GaN界面电子散射的影响

本文研究AlN作为Al_xGa_1-xN/GaN插入层引起的电子输运性质的变化, 考虑了Al_xGa_1-xN和AlN势垒层的自发极化、压电极化对Al_xGa_1-xN/AlN/GaN双异质结高电子迁移率晶体管(HEMT)中极化电荷面密度、二维电子气(2DEG) 浓度的影响, 分析了AlN厚度与界面粗糙度散射和合金无序散射的关系; 结果表明, 2DEG 浓度、界面粗糙度散射和合金无序散射依赖于AlN层厚度, 插入一层1–3 nm薄的AlN层, 可以明显提高电子迁移率.     

Al0.6Ga0.4N/GaN/Al0.3Ga0.7N/Al0.6Ga0.4N量子阱中的Rashba自旋劈裂

正如人们所知, 可以通过电场或者设计非对称的半导体异质结构来调控体系的结构反演不对称性(SIA)和Rashba自旋劈裂. 本文研究了Al_0.6Ga_0.4N/GaN/Al_0.3Ga_0.7N/Al_0.6Ga_0.4N量子阱中第一子带的Rashba 系数和Rashba自旋劈裂随Al_0.3Ga_0.7N插入层(右阱)的厚度w_s以及外加电场的变化关系, 其中GaN层(左阱)的厚度为40-w_s Å. 发现随着w_s的增加, 第一子带的Rashba系数和Rashba自旋劈裂首先增加, 然后在w_s>20 Å 时它们迅速减小, 但是w_s>30 Å时Rashba自旋劈裂减小得更快, 因为此时k_f也迅速减小. 阱层对Rashba系数的贡献最大, 界面的贡献次之且随w_s变化不是太明显, 垒层的贡献相对比较小. 然后, 我们假w_s=20 Å, 发现外加电场可以很大程度上调制该体系的Rashba系数和Rashba自旋劈裂, 当外加电场的方向同极化电场方向相同(相反)时, 它们随着外加电场的增加而增加(减小). 当外加电场从-1.5×10⁸ V·m^-1到1.5×10⁸ V· m^-1变化时, Rashba系数随着外加电场的改变而近似线性变化, Rashba自旋劈裂先增加得很快, 然后近似线性增加, 最后缓慢增加. 研究结果表明可以通过改变GaN层和Al_0.3Ga_0.7N层的相对厚度以及外加电场来调节Al_0.6Ga_0.4N/GaN/Al_0.3Ga_0.7N/Al_0.6Ga_0.4N量子阱中的Rashba 系数和Rashba自旋劈裂, 这对于设计自旋电子学器件有些启示.     

Output light power of InGaN-based violet laser diodes improved by using a u-InGaN/GaN/AlGaN multiple upper waveguide

The upper waveguide(UWG) has direct influences on the optical and electrical characteristics of the violet laser diode(LD) by changing the optical field distribution or barrier of the electron blocking layer(EBL). In this study, a series of In GaN-based violet LDs with different UWGs are investigated systematically with LASTIP software. It is found that the output light power(OLP) under an injecting current of 120 mA or the threshold current(Ith) is deteriorated when the UWG is u-In_(0.02)Ga_(0.98)N/GaN or u-In_(0.02)Ga_(0.98)N/Al_xGa_(1-x)N(0 ≤ x ≤ 0.1), which should be attributed to small optical confinement factor(OCF) or severe electron leakage. Therefore, a new violet LD structure with u-In_(0.02)Ga_(0.98)N/GaN/Al_(0.05)Ga_(0.95)N multiple layer UWG is proposed to reduce the optical loss and increase the barrier of EBL. Finally,the output light power under an injecting current of 120 mA is improved to 176.4 mW.     

晶格匹配In_(0.17)Al_(0.83)N/GaN异质结电容散射机制

制备了晶格匹配In_(0.17)Al_(0.83)N/GaN异质结圆形平面结构肖特基二极管,通过测试和拟合器件的电容-频率曲线,研究了电容的频率散射机制.结果表明:在频率高于200 kHz后,积累区电容随频率出现增加现象,而传统的电容模型无法解释该现象.通过考虑漏电流、界面态和串联电阻等影响对传统模型进行修正,修正后的电容频率散射模型与实验结果很好地符合,表明晶格匹配In_(0.17)Al_(0.83)N/GaN异质结电容随频率散射是漏电流、界面态和串联电阻共同作用的结果.     

High performance uncooled InAsSbP/InGaAs photodiodes for the 1.8–3.4 μm wavelength range

Room temperature In_0.97Ga_0.03As photodiodes with an InAs_0.36Sb_0.20P_0.44 transparent window layer operating in the mid-infrared region over the wavelength range 1.8–3.4 μm are reported. The InAs_0.36Sb_0.20P_0.44/In_0.97Ga_0.03As heterojunction photodiodes were grown on p-type (100) InAs substrates by liquid phase epitaxy (LPE). Basic detector characteristics have been measured and compared with other detectors in this wavelength range. The typical detectivity of the photodiodes is 1.2 × 10¹⁰ cm Hz^1/2/W at room temperature, which compares very favourably with that of TE cooled HgCdTe and is at least three times that of cooled PbSe photoconductors. The InAs_0.36Sb_0.20P_0.44/In_0.97Ga_0.03As heterojunction photodiodes offer the advantage of increased sensitivity and extended wavelength response at room temperature compared with that of currently available commercial photodetectors, making them an attractive alternative for a number of mid-infrared applications including optical gas sensors and infrared spectrometers.     

Al组分对MOCVD制备的AlxGa1-xN/AlN/GaN HEMT电学和结构性质的影响

采用金属有机化合物化学气相沉积（MOCVD）方法制备了不同Al组分（x=0.19,0.22,0.25,0.32）的Al_xGa_1-xN/AlN/GaN 结构的高电子迁移率晶体管（HEMT）材料。研究了Al_xGa_1-xN势垒层中Al组分对HEMT材料电学性质和结构性质的影响。研究结果表明,在一定的Al组分范围内,二维电子气（2DEG）浓度和迁移率随着Al组分的升高而增大。然而,过高的Al组分导致HEMT材料表面粗糙度增大,2DEG迁移率降低,该实验现象在另一方面得到了原子力显微镜测试结果的验证。在最佳Al组分（25%）范围内,获得的 HEMT材料的2DEG浓度和室温迁移率分别达到1.2×10¹³ cm^-2和1 680 cm²/（V·s）,方块电阻低至310 Ω/□。     

Control of symmetric properties of metamorphic In_(0.27)Ga_(0.73)As layers by substrate misorientation

Asymmetry in dislocation density and strain relaxation has a significant impact on device performance since it leads to anisotropic electron transport in metamorphic materials. So it is preferred to obtain metamorphic materials with symmetric properties. In this paper, we grew metamorphic In_(0.27)Ga_(0.73) As epilayers with symmetric low threading dislocation density and symmetric strain relaxation in two (110) directions using In Al Ga As buffer layers on 7°misoriented Ga As(001)substrates. To understand the control mechanism of symmetric properties of In_(0.27)Ga_(0.73) As layers by the substrate miscut angles, In_(0.27)Ga_(0.73) As grown on 2°and 15°misoriented substrates were also characterized as reference by atomic force microscopy, transmission electron microscopy, and high resolution triple axis x-ray diffraction. The phase separation and interaction of 60°misfit dislocations were found to be the reasons for asymmetry properties of In_(0.27)Ga_90.73 As grown on 2and 15°substrates, respectively. Photoluminescence results proved that the In_(0.27)Ga_(0.73) As with symmetric properties has better optical properties than the In_(0.27)Ga_(0.73) As with asymmetric properties at room temperature. These results imply that high quality metamorphic In_(0.27)Ga_(0.73) As can be achieved with controllable isotropic electron transport property.     

In0.53Ga0.47As/InP量子阱与体材料的1 MeV电子束辐照光致发光谱研究

为获得对In_0.53Ga_0.47As/InP材料在电子束辐照下的光致发光谱变化规律, 开展了1 MeV电子束辐照试验, 注量为 5×10¹²-9×10¹⁴ cm^-2. 样品选取量子阱材料和体材料, 在辐照前后, 进行了光致发光谱测试, 得到了不同结构In_0.53Ga_0.47As/InP材料在1 MeV电子束辐照下的不同变化规律; 对比分析了参数退化的物理机理. 结果显示: 试验样品的光致发光峰强度随着辐照剂量增大而显著退化. 体材料最先出现快速退化, 而五层量子阱在注量达到6×10¹⁴ cm^-2时, 就已经退化至辐照前的9%. 经分析认为原因有: 1)电子束进入样品后, 与材料晶格发生能量传递, 破坏晶格完整性, 致使产生的激子数量减少, 光致发光强度降低; 电子束辐照在材料中引入缺陷, 增加了非辐射复合中心密度, 导致载流子迁移率降低. 2)量子阱的二维限制作用使载流子运动受限, 从而能够降低载流子与非辐射复合中心的复合概率; 敏感区域截面积相同条件下, 体材料比量子阱材料辐射损伤更为严重. 3)量子阱的层数越多, 则异质结界面数越多, 相应的产生的界面缺陷数量也随之增多, 辐射损伤越严重.     

Formation and decay kinetics of nickel nitrides resulting from nitrogen ion implantation. The nickel–nitrogen phase diagram

Structural transformations in nickel films exposed to N⁺ ions were investigated through the use of electron diffraction, electron microscopy, Rutherford backscattering (RBS) of He⁺ ions, thermal desorption spectroscopy (TDS).

With an increasing exposure dose, there occurred a smooth transition of the FCC structure of Ni to the HCP phase -Ni₃N with the lattice parameters a=0.266 nm and c=0.430 nm. The completion of the transition was observed once the implanted nitrogen concentration corresponding to the stoichiometric ratio of Ni₃N was attained, this giving evidence for the chemical nature of the structural change observed.

During annealing, structure variations were traced, enabling one to observe the following four nickel nitrides: (1) -Ni₃N with a disordered arrangement of nitrogen atoms (HCP-phase with a=0.266 nm and c=0.430 nm), (2) β-Ni₃N with an ordered arrangement of nitrogen atoms (two hexagonal lattices: one with a=0.266 nm, c=0.430 nm, and the other with a=0.466 nm and c=0.43 nm), (3) Ni₄N having a primitive cubic lattice structure with a=0.377 nm, (4) Ni₈N having the FCC structure with a=0.725 nm.

The results of an investigation have led to building up a phase diagram for the Ni–N system.     

缓冲层InxGa1-xAs组分对In0.82Ga0.18As结晶质量和表面形貌的影响

采用低压金属有机化学气相沉积(LP-MOCVD)技术,两步生长法在InP衬底上制备In_0.82Ga_0.18As材料.研究缓冲层In_xGa_1-xAs的In组分对In_0.82Ga_0.18As结晶质量和表面形貌的影响.X射线衍射(XRD)用于表征材料的组分和结晶质量.用扫描电子显微镜(SEM)观察样品的表面形貌.实验结果表明,低温生长的缓冲层In_xGa_1-xAs的In组分影响高温生长的外延层In_0.82Ga_0.18As的结晶质量和表面形貌.测量得到四个样品的外延层In_0.82Ga_0.18As的X射线衍射谱峰半峰全宽(FWHM)为0.596°,0.68°,0.362°和0.391°,分别对应缓冲层In组分x=0.28,0.53,0.82,0.88,当缓冲层In组分是0.82时,FWHM最窄,表明样品的结晶质量最好.SEM观察四个样品的表面形貌,当缓冲层In组分是0.82时,样品的表面平整,没有出现交叉平行线或蚀坑等缺陷,表面形貌最佳.     

退火对Pb辐照Al2O3单晶发光特性的影响

研究了230MeV的²⁰⁸Pb²⁷⁺辐照Al₂O₃样品及随后在600,900,1100K高温条件下退火后的光致发光特性。从辐照样品的测试结果可以清楚地看到在波长为390,450nm处出现了强的发光峰。辐照量为1×10¹³ions/cm²时,样品的发光峰最强。经过600K退火2h后测试结果显示,380nm发光峰剧烈增强,而其他发光峰显示不明显。在900K退火条件下,380nm的发光峰开始减弱,而在360,510nm出现了明显的发光峰,至到1100K退火完毕后380nm的发光峰完全消失,而360,510nm的发光峰相对增强。从被辐照样品的FTIR谱中看到,波数在460~510cm^-1间的吸收是振动模式,经过离子辐照后,吸收带展宽,随着辐照量的增大,Al₂O₃振动吸收峰消失,说明Al₂O₃振动模式被完全破坏。1000~1300cm^-1之间为Al—O—Al桥氧的伸缩振动模式,辐照后吸收带向高波数方向移动,说明其振动模式受到影响。辐照剂量较小的样品,损伤程度相对较低,经退火晶化后,振动模式基本恢复到单晶状态;辐照剂量较高的样品,损伤程度大,退火处理后表面变得较粗糙,振动模式并未出现,说明结构破坏严重。     

Growth condition optimization and mobility enhancement through inserting AlAs monolayer in the InP-based In_xGa_(1-x)As/In_(0.52)Al_(0.48)As HEMT structures

The structure of In P-based In_xGa_(1-x) As/In0.52Al0.48 As pseudomorphic high electron mobility transistor(PHEMT)was optimized in detail.Effects of growth temperature,growth interruption time,Si δ-doping condition,channel thickness and In content,and inserted Al As monolayer(ML) on the two-dimensional electron gas(2DEG) performance were investigated carefully.It was found that the use of the inserted Al As monolayer has an enhancement effect on the mobility due to the reduction of interface roughness and the suppression of Si movement.With optimization of the growth parameters,the structures composed of a 10 nm thick In0.75Ga0.25 As channel layer and a 3 nm thick Al As/In0.52Al0.48 As superlattices spacer layer exhibited electron mobilities as high as 12500 cm~2·V-1·s~(-1)(300 K) and 53500 cm~2·V~(-1_·s~(-1)(77 K) and the corresponding sheet carrier concentrations(Ns) of 2.8×10~(12)cm~(-2)and 2.9×1012cm~(-2),respectively.To the best of the authors' knowledge,this is the highest reported room temperature mobility for In P-based HEMTs with a spacer of 3 nm to date.     

Improved thermal property of strained InGaAlAs/AlGaAs quantum wells for 808-nm vertical cavity surface emitting lasers

The 808-nm vertical cavity surface emitting laser (VCSEL) with strained In_0.13Ga_0.75Al_0.12As/Al_0.3Ga_0.7As quantum wells is designed and fabricated. Compared with the VCSELs with Al_0.05Ga_0.95As/Al_0.3Ga_0.7As quantum wells, the VCSEL with strained In_0.13Ga_0.75Al_0.12As/Al_0.3Ga_0.7As quantum wells is demonstrated to possess higher power conversion efficiency (PCE) and better temperature stability. The maximum PCE of 43.8% for 10-μm VCSEL is achieved at an ambient temperature of 30 ℃. The size-dependent thermal characteristics are also analyzed by characterizing the spectral power and output power. It demonstrates that small oxide-aperture VCSELs are advantageous for temperature-stable performance.     

Localized exciton dynamics in InGaN quantum well structures

InGaN multiple quantum well laser diode (LD) wafer that lased at 400 nm was shown to have the InN mole fraction, x, of only 6% in the wells. Nanometer-probe compositional analysis showed that the fluctuation of x was as small as 1% or less, which is the resolution limit. However, the wells exhibited a Stokes-like shift (SS) of 49 meV and an effective localization depth E₀ was estimated by time-resolved photoluminescence (TRPL) measurement to be 35 meV at 300 K. Since the effective electric field due to polarization in the wells is estimated to be as small as 286 kV/cm, SS is considered to originate from an effective bandgap inhomogeneity. Because the well thickness fluctuation was insufficient to produce SS or E₀, the exciton localization is considered to be an intrinsic phenomenon in InGaN material. Indeed, bulk cubic In_0.1Ga_0.9N, which does not suffer any polarization field or thickness fluctuation effect, exhibited an SS of 140 meV at 77 K and similar TRPL results. The origin of the localization is considered to be due to the large bandgap bowing and In clustering in InGaN material. Such shallow and low density localized states are leveled by injecting high density carriers under the lasing conditions for the 400 nm LDs.