纳米锗颗粒镶嵌薄膜的吸收光谱研究

用离子束溅射技术和热处理方法，制备出颗粒尺寸和镶嵌密度均可控制的高质量Ｇｅ－ＳｉＯ２纳米颗粒镶嵌薄膜，在室温下测量了不同粒度纳米锗颗粒镶嵌薄膜样品的吸收光谱，观测到在可见光区有较强的光吸收和吸收带边蓝移。研究表明：镶嵌在经缘介质薄膜中的纳米锗颗粒的能量带是量子化的，随着纳米锗粒子平均尺寸的减小，其吸收带隙增加，吸收带边蓝移的程序相应增大。     

锗酸盐晶体压致非晶化的研究

高压拉曼散射研究表明．ＣｕＧｅＯ３，Ｌｉ２ＧｅＯ３和Ｌｉ６Ｇｅ２Ｏ７三种晶体分别在７，１２和１１ＧＰａ压力下转变为非晶。在高于起始转变压力以上一定范围压致非晶是可逆的，ＣｕＧｅＯ３，Ｌｉ２ＧｅＯ３和Ｌｉ６Ｇｅ２Ｏ７压致非晶的不可逆转变压力分别为１４．１，２０和２０ＧＰａ。压致非晶ＣｕＧｅＯ３的重新晶化温度在６００℃附近。锗酸及系列晶体的压致非晶化与它们的成份和结构有关，随着在这一系列晶体中Ｌｉ２Ｏ含量的增加，压致非晶化的压力趋于减小。     

纳米Ge颗粒镶嵌薄膜的Raman散射光谱研究

研究了镶嵌在ＳｉＯ_２介质中的不同尺寸（４—１６ｎｍ）纳米Ｇｅ颗粒的Ｒａｍａｎ散射谱特征，与大块标准Ｇｅ晶体的散射峰相比，观察到了理论预期的纳米半导体粒子的Ｒａｍａｎ散射峰的宽化和红移现象．采用声子限域模型较好地解释了实验结果．探讨了ＳｉＯ_２介质基体作用于镶嵌Ｇｅ粒子的压应力以及纳米Ｇｅ粒子的表面界面效应对Ｒａｍａｎ散射光谱的峰形、峰位变化所产生的影响 关键词：     

TiN/SiC纳米多层膜的生长结构与力学性能

研究了TiN/SiC纳米多层膜中立方SiC（B1cubic SiC）的形成及其对TiN/SiC多层膜力学性能的影响.结果表明：在TiN/SiC多层膜中，非晶态的SiC层在厚度小于0.6nm时形成立方结构并与TiN形成共格外延生长的超晶格柱状晶，使多层膜产生硬度和弹性模量显著升高的超硬效应，最高硬度超过60GPa.SiC随着层厚的增加转变为非晶相，从而阻止了多层膜的共格外延生长，使薄膜呈现TiN纳米晶和SiC非晶组成的层状结构特征，同时多层膜的硬度和弹性模量下降.TiN/SiC纳米多层膜产生的超硬效应与立方 关键词： 立方碳化硅 TiN/SiC纳米多层膜 外延生长 超硬效应     

用拉曼散射光谱估算纳米Ge晶粒平均尺寸

用射频共溅射技术和真空退火方法制备了埋入ＳｉＯ２基底中的纳米Ｇｅ复合膜（ｎｃ－Ｇｅ／ＳｉＯ２）测量了不同温度退火后该复合膜的拉曼散射光谱，其结果与晶体Ｇｅ的拉曼谱相比，纳米Ｇｅ的拉曼峰红移峰形变宽，用拉曼谱的参数计算了纳米Ｇｅ晶粒的平均尺寸，所得结果与声子限域理论模型符合。     

TiN/TiB2异结构纳米多层膜的共格生长与力学性能

采用多靶磁控溅射法制备了一系列具有不同TiB2调制层厚度的TiN/TiB2纳米多层膜.利用x射线衍射仪、高分辨电子显微镜和微力学探针研究了TiB2层厚变化对多层膜生长结构和力学性能的影响.结果表明,在fcc-TiN层(111)生长面的模板作用下,原为非晶态的TiB2层在厚度小于2.9nm时形成hcp晶体态,并与fcc-TiN形成共格外延生长;其界面共格关系为{111}TiN∥{0001}TiB2,〈110〉TiN∥〈1120〉TiB.由于共格界面存在晶格失配度,多层膜中形成拉、压交变的应力场,导致多层膜产生硬度和弹性模量升高的超硬效应,最高硬度和弹性模量分别达到46.9GPa和465GPa.继续增加TiB2层的厚度,TiB2形成非晶态并破坏了与TiN层的共格外延生长,多层膜形成非晶TiN层和非晶TiB2层交替的调制结构,其硬度和弹性模量相应降低.     

AIN/Si3N4 纳米多层膜的外延生长与力学性能

采用射频磁控溅射方法制备单层AlN,Si3N4薄膜和不同调制周期的AlN/S3N4纳米多层膜.采用X射线衍射仪、高分辨透射电子显微镜和纳米压痕仪对薄膜进行表征.结果发现,多层膜中Si3N4层的晶体结构和多层膜的硬度依赖于Si3N4层的厚度.当AlN层厚度为4.0 nm、Si3N4层厚度为0.4nm时,AlN和Si3N4层共格外延生长,多层膜形成穿过若干个调制周期的柱状晶结构,产生硬度升高的超硬效应.随着Si3N4层厚的增加,Si3N4层逐步形成非晶并阻断了多层膜的共格外延生长,多层膜的硬度迅速降低,超硬效应消失.采用材料热力学和弹性力学计算了Si3N4层由晶态向非晶转变的临界厚度.探讨了AlN/Si3N4纳米多层膜出现超硬效应的机理.     

TiN/TiB2异结构纳米多层膜的共格生长与力学性能

采用多靶磁控溅射法制备了一系列具有不同TiB₂调制层厚度的TiN/TiB_{2纳米多层膜.利用x射线衍射仪、高分辨电子显微镜和微力学探针研究了TiB2层厚变化对多层膜生长结构和力学性能的影响.结果表明，在fcc-TiN层(111)生长面的模板 作用下，原为非晶态的TiB2层在厚度小于2.9nm时形成hcp晶体态，并与fcc-TiN 形成共格外延生长；其界面共格关系为{111}TiN//{0001}TiB2，〈110〉TiN//〈1120〉TiB2.由于共格界面存在晶格失配 度，多层膜中形成拉、压交变的应力场，导致多层膜产生硬度和弹性模量升高的超硬效应， 最高硬度和弹性模量分别达到46.9GPa和465GPa.继续增加TiB2层的厚度，TiB2形成非晶态并破坏了与TiN层的共格外延生长，多层膜形成非晶TiN层和非晶TiB< sub>2层交替的调制结构，其硬度和弹性模量相应降低. 关键词： 2}纳米多层膜')" href="#">TiN/TiB₂纳米多层膜 共格生长 晶体化 力学性能     

从非晶态多层膜制备超晶格的中温退火法

从非晶态多层膜制备超晶格的中温退火法俄勒冈大学化学系和村料科学所Ｊｏｈｎｓｏｎ小组在《Ｓｃｉｅｎｃｅ》发表研究报告称：利用中温退火使非晶态多层膜转化为ＮｂＳｅ２／ＴｉＳｅ２超晶格．最初的多层膜由Ｓｅ／Ｎｂ／Ｓｅ／Ｔｉ／Ｓｅ…组成，其厚度严格受控，使反...     

Preparation of a Single Layer of Luminescent Nanocrystalline Si Structures by Laser Irradiation Method

KrF excimer laser annealing on ultrathin hydrogenated amorphous Si films with various initial Si thicknesses is carried out to obtain a single layer of nanocrystalline Si structures. It is found that Si nanograins can be obtained with the area density as high as 10^11 cm^-2 under the irradiation with suitable laser fluence. Raman and planar transmission electron microscopy are used to characterize the formation process of Si nanocrystals from amorphous phase. Moreover, a strong photoluminescence is observed at room temperature from well-relaxed nanocrystalline Si structures.     

Electrical peculiarities in Al/Si/Ge/…/Ge/Si and Al/SiGe/Si structures

The current–voltage (I–V) and capacitance–voltage (C–V) behaviour of different Si/Ge multilayers and SiGe single layers prepared on p-type Si substrates by magnetron sputtering and annealing, has been studied in the temperature range of 80–320 K by using Al Schottky contacts as test structures. Although a significant influence of the microstructure of the Si/Ge multilayers and SiGe layers was obtained on the electrical behaviour of the structures, the structures exhibited similar specific features.     

Effect of composition modulation on the structural and optical properties of Si/Ge bilayers

We report structural as well as optical studies on Si/Ge bilayer structures having different individual layer thicknesses. The Raman spectrum of [Ge (5 nm)/Si (5 nm)] bilayer structure shows amorphous nature, while the [Si (5 nm)/Ge (5 nm)] bilayer structure shows a mixed nanocrystalline/amorphous behaviour of the layers. As the thickness of the individual layers increases to 10 nm, the introduction of large number of Si atoms at the interface results in reduction of Ge crystallization as well as higher intensity of interfacial SiGe alloy formation. This may be regarded as a consequence of the island growth induced surface roughening in the later case (i.e. in [Si (10 nm)/Ge (10 nm)] bilayer) as also revealed by corresponding atomic force microscopy (AFM) images. These results are also supported by Photoluminescence (PL) spectra recorded using two different photon energies of 300 and 488 nm along with the optical absorption measurements giving higher values of band gap as compared to their corresponding bulks, revealing the effect of quantum confinement in the deposited layers.     

Exchange coupling in multilayers with semiconductors

Intrinsic and heat-induced exchange coupling exists between ferromagnetic films separated by non-magnetic semiconducting spacer layers. Magnetic coupling across thin amorphous layers of Si, SiO, Ge and Ge/Si heterostructures is described. Antiferromagnetic coupling occurs in a limited thickness range for Si and Si/Ge heterostructures, and ferromagnetic coupling is found for SiO, Ge, and certain thicknesses of Si and Si/Ge heterostructures. The coupling strength is very weak, of the order of a few 10^–6 J/m². It exhibits a pronounced temperature dependence with a positive temperature coefficient for both ferro- and antiferromagnetic couplings. The observations indicate that resonant tunneling through defect states in the spacer material mediates the exchange coupling.     

Thermal stability of SiGe films on an ultra thin Ge buffer layer on Si grown at low temperature

The thermal stability of SiGe films on an ultra thin Ge buffer layer on Si fabricated at low temperature has been studied. The microstructure and morphology of the samples were investigated by high-resolution X-ray diffraction, Raman spectra and atomic force microscopy, and using a diluted Secco etchant to reveal dislocation content. After thermal annealing processing, it is observed that undulated surface, threading dislocations (TDs) and stacking faults (SFs) appeared at the strained SiGe layer, which developed from the propagation of a misfit dislocation (MD) during thermal annealing, and no SFs but only TDs formed in strain-relaxed sample. And it is found that the SiGe films on the Ge layer grown at 300 °C has crosshatch-free surface and is more stable than others, with a root mean square surface roughness of less than 2 nm and the threading dislocation densities as low as ∼10⁵ cm⁻². The results show that the thermal stability of the SiGe films is associated with the Ge buffer layer, the relaxation extent and morphology of the SiGe layer.     

分子束外延生长SiGe合金中位错密度的研究

Schimmel腐蚀液腐蚀结合高倍光学显微镜观察发现，不同尺寸的掩膜窗内生长的SiGe外延层中的位错密度在整个外延层中从SiGe/Si界面到SiGe外延层表面由少到多，再由多到少明显地分成3个区，无掩膜窗限制的大面积区内的SiGe层则只呈现2个区，掩膜材料与掩膜窗尺寸不同，这3个区的位错密度也不同，掩膜形成过程中产生的应力对衬底晶格的影响，以及掩膜边界对衬底与外延层的影响是造成这种不同的根本原因。     

含纳米硅微粒的富硅二氧化硅的蓝色薄膜交流电致发光

用磁控射频反应溅射制备了含纳米硅微粒的富硅ＳｉＯ２薄膜并获得蓝色的交流薄膜电致发光，通过热退火结合喇曼散射等手段判定蓝色发光谱带与富硅ＳｉＯ２薄膜的纳米硅晶粒有关。     

Carrier transport of doped nanocrystalline Si formed by annealing of amorphous Si films at various temperatures

Phosphorus- and boron-doped hydrogenated amorphous silicon thin films were prepared by the plasma-enhanced chemical vapor deposition method. As-deposited samples were thermally annealed at various temperatures to get nanocrystalline Si with sizes around 10 nm. X-ray photoelectron spectroscopy measurements demonstrated the presence of boron and phosphorus in the doped films. It is found that the nanocrystallization occurs at around 600 °C for the B-doped films, while it is around 700-800 °C for the P-doped samples. For the P-doped samples, the dark conductivity decreases at first and then increases with the annealing temperature. While for the B-doped samples, the dark conductivity monotonously increases with increasing annealing temperature. As a result, the carrier transport properties of both P- and B-doped nanocrystalline Si films are dominated by the gradual activation of dopants in the films. The conductivity reaches 22.4 and 193 S cm⁻¹ for P- and B-doped sample after 1000 °C annealing.     

Formation and properties of high density Si nanodots

Laser induced crystallization of ultrathin hydrogenated amorphous Si films or amorphous Si-based multilayered structures were used to get high density Si nanodots. The present technique can get size controllable Si nanodots embedded in various dielectric materials with uniform distribution which was revealed by cross-section transmission electron microscopy. Room temperature photoluminescence and electroluminescence were achieved with the emission wavelength in a visible light region both from a-SiN/Si nanodots/a-SiN sandwiched and Si nanodots/SiO₂ multilayered structures. The luminescence was associated with the radiative recombination of generated electron-hole pairs in Si nanodots or the luminescent surface states. The electroluminescence intensity is increased with increasing the injection current implying the bipolar carrier injection plays an important role in enhancing the luminescence efficiency. The formed Si nanodots by the present approach can be applied for many kinds of devices such as high efficient light emitting diodes and solar cells.