Raman散射和AFM对多晶硅薄结晶状况的研究

采用等离子体增强化学气相沉积(PECVD)法在普通玻璃衬底上制备了多晶硅(p-si)薄膜。利用拉曼(Raman)散射谱、原子力显微镜(AFM)研究了衬底温度、射频功率和SiH4浓度对薄膜晶化的影响,并对其结果进行分析讨论。研究结果表明,当衬底温度从200℃逐渐提高到400℃、SiH4浓度从5%降到1%,硅膜的晶化率逐渐提高,结构逐渐由非晶向多晶转变,射频功率对薄膜的晶化状况也有很大影响。     

脉冲溅射功率对含硅量子点SiC_x薄膜的结构和光学特性的影响

采用射频和脉冲磁控共溅射法并结合快速光热退火法制备了含硅量子点的SiC_x薄膜.采用掠入射X射线衍射、喇曼光谱、紫外-可见-近红外分光光度计和透射电子显微镜对薄膜进行表征.研究了脉冲溅射功率对薄膜中硅量子点数量、尺寸、晶化率和薄膜光学带隙的影响.结果表明:当溅射功率从70 W增至100 W时,硅量子点数量增多,尺寸增至5.33nm,晶化率增至68.67%,而光学带隙则减至1.62eV;随着溅射功率进一步增至110 W时,硅量子点数量减少,尺寸减至5.12nm,晶化率降至55.13%,而光学带隙却增至2.23eV.在本实验条件下,最佳溅射功率为100 W.     

衬底温度和硼掺杂对p型氢化微晶硅薄膜结构和电学特性的影响

以B₂H₆为掺杂剂,采用射频等离子体增强化学气相沉积技术在玻璃衬底上制备p型氢化微晶硅薄膜.研究了衬底温度和硼烷掺杂比对薄膜的微结构和暗电导率的影响.结果表明：在较高的衬底温度下很低的硼烷掺杂比即可导致薄膜非晶化;在实验范围内,随着衬底温度升高薄膜的晶化率单调下降,暗电导率先缓慢增加然后迅速下降,变化趋势与硼烷掺杂比的影响极为相似.最后着重讨论了p型氢化微晶硅薄膜的生长机理. 关键词： p型氢化微晶硅薄膜 衬底温度 晶化率 电导率     

低温铝诱导晶化制备纳米晶硅薄膜的物相和光学性能研究

采用射频磁控溅射镀膜系统,在玻璃衬底上制备了非晶硅(α-Si)/铝(Al)复合薄膜,结合氮气(N₂)气氛中低温快速光热退火制备了纳米晶硅(nc-Si)薄膜;利用光学显微镜、共焦光学显微仪、X射线衍射(XRD)仪、拉曼散射光谱(Raman)仪和紫外-可见光-近红外分光光度计(UV-VIS-NIR)对纳米晶硅薄膜的表面形貌、物相及光学性能进行了表征,研究了退火工艺对薄膜性能的影响。结果表明： 300 ℃,25 min光热退火可使α-Si/Al膜晶化为纳米晶硅薄膜,晶化率为15.56%,晶粒尺寸为1.75 nm;退火温度从300 ℃逐渐升高到400 ℃,纳米晶硅薄膜晶粒尺寸、晶化率、带隙逐渐增加,表面均匀性、晶格畸变量逐渐减小;退火温度从400 ℃逐渐升高到500 ℃,纳米晶硅薄膜的晶粒尺寸、晶化率继续增加,带隙则逐渐降低;采用纳米晶硅薄膜的吸光模型验证了所制备的纳米晶硅薄膜的光学特性,其光学带隙的变化趋势与吸光模型得出的结果一致。     

衬底温度对电子束沉积ZnSe薄膜性能影响研究

为了研究衬底温度对硒化锌薄膜微观结构和光学特性的影响,采用电子束蒸发技术在K9玻璃基底上制备了单层的硒化锌薄膜。通过研究薄膜的X射线衍射谱、透射光谱特性、表面形貌及粗糙度,分析了不同衬底温度下薄膜微观晶体结构和光学特性的变化规律。实验结果表明:在20～200℃的衬底温度范围内制备的ZnSe薄膜均为具有(111)晶面择优取向的纳米晶薄膜,随着衬底温度升高,基片上原子获得的动能增加,导致薄膜的晶粒尺寸变大、内应力和位错密度降低;同样在不同衬底温度下,薄膜的光学特性也不尽相同,随着衬底温度的升高,折射率和消光系数减小、光学带隙增加、薄膜的表面粗糙度降低。分析表明折射率下降是薄膜中空隙部分所占比例增加所致,而消光系数的下降是薄膜结晶度提高,内部缺陷减少造成的。     

纳米晶硅薄膜中氢含量及键合模式的红外分析

采用传统射频等离子体化学气相沉积技术在100—350℃的衬底温度下高速沉积氢化硅薄膜. 傅里叶变换红外光谱和Raman谱的研究表明,纳米晶硅薄膜中的氢含量和硅氢键合模式与薄膜的晶化特性有密切关系,当薄膜从非晶相向晶相转变时,氢的含量减少了一半以上,硅氢键合模式以SiH₂为主. 随着衬底温度的升高和晶化率的增加,纳米晶硅薄膜中氢的含量以及其结构因子逐渐减少. 关键词： 氢化纳米晶硅薄膜 红外透射谱 氢含量 硅氢键合模式     

磁控共溅射法沉积的硅量子点SiN_x薄膜的光谱特性

采用双极脉冲和射频磁控共溅射沉积法在不同温度的Si(100)衬底和石英衬底上制备了富硅SiNx薄膜。在氮气氛中,于1 050℃下采用快速光热退火热处理,获得了包含硅量子点的SiNx薄膜。采用Fourier变换红外光谱、Raman光谱、掠入射X射线衍射和光致发光光谱对退火后的薄膜样品进行了表征。结果显示:Fourier变换红外光谱中出现了富硅Si—N键,表明薄膜为富硅SiNx薄膜;当衬底温度不低于200℃时,薄膜样品的拉曼光谱中出现了硅纳米晶的Si—Si振动横光学模,掠入射X射线衍射中出现了明显的Si(111)和Si(311)的衍射峰,证实了硅量子点的形成;发现存在一最佳衬底温度(300℃),该条件下获得的硅量子点的数量和晶化率最高;衬底温度为300和400℃的样品的光致发光光谱中均有3个可见荧光峰,结合拉曼光谱结果,用纳米晶硅的量子限域效应和辐射复合缺陷态对荧光峰进行了合理解释;由光致发光光谱计算出的衬底温度为300和400℃的样品的硅量子点平均尺寸分别为3.5和3.4nm。这些结果有助于优化含硅量子点的SiNx薄膜的制备参数,在硅基光电子器件的应用方面有重要意义。     

退火对磁控溅射HfSi_xO_y薄膜光学性质的影响

采用射频反应磁控溅射方法在硅衬底制备了HfSixOy薄膜,用X射线光电子能谱(XPS)分析了HfSixOy薄膜的成分,用X射线衍射(XRD)检测了薄膜的结构,并用椭圆偏振光谱仪研究了退火处理对薄膜光学性质的影响。XRD谱显示,HfSixOy薄膜经700℃高温退火处理后仍为非晶态,而在900℃高温退火处理后出现晶化。采用Tauc-Lorentz(TL)色散模型对测试得到的曲线进行拟合并分析得出薄膜的光学常数,结果表明,薄膜的折射率随退火温度的升高而增加,而消光系数随退火温度的升高呈降低趋势。薄膜的光学带隙随着退火温度的升高增加,采用外推法得到薄膜沉积态和经500℃,700℃,900℃退火后的带隙分别为5.62,5.65,5.68,5.98eV。     

室温射频磁控溅射制备纳米晶ZnSX薄膜及其性能研究

为获得性能优异的透明介质薄膜,采用射频磁控溅射技术,以ZnS陶瓷靶为靶材,在玻璃衬底上室温沉积纳米晶富锌ZnS薄膜,通过X射线衍射仪、场发射扫描电子显微镜、拉曼光谱仪、分光光度计、光谱椭偏仪重点研究了不同射频功率对制备的纳米晶ZnS_X薄膜的晶相结构、表面形貌及光学性能的影响。结果表明:射频功率对ZnS_X薄膜晶相形成和结晶度具有重要影响;随着溅射功率的增加,ZnS_X薄膜中Zn和S元素的比例、特征拉曼峰的强度以及折射率的值都先增大后减小,薄膜的光学带隙从3.86 eV降低至3.76 eV;当溅射功率为150 W时,为ZnS_X薄膜具有立方相结构及高结晶度的最优条件,薄膜的Zn/S比接近于标准化学计量比,达到1.23,可见光平均透过率大于80%,550 nm下ZnS_X薄膜的光学折射率为2.03。     

脉冲激光晶化超薄非晶硅膜的分子动力学研究

利用准分子脉冲激光晶化非晶硅薄膜是制备高密度尺寸可控的硅基纳米结构的有效方法之一.本文将脉冲激光对非晶硅超薄膜的影响处理为热传导问题,采用了基于Tersoff势函数的分子动力学方法模拟了在非晶氮化硅衬底上2.7 nm超薄非晶硅膜的脉冲激光晶化过程.研究了不同激光能量对非晶硅薄膜晶化形成纳米硅的影响,发现在合适的激光能量窗口下,可以获得高密度尺寸可控的纳米硅薄膜,进而模拟了在此能量作用下非晶硅膜中成核与生长的机理与微观过程,并对晶化所获得的纳米硅薄膜的微结构进行了分析. 关键词： 非晶硅 分子动力学 脉冲激光晶化     

沉积温度对微晶硅薄膜结构特性的影响

采用PECVD技术，在玻璃衬底上沉积μc-Si:H薄膜. 用拉曼光谱、SEM和UV分光光度计对不同沉积温度下沉积的薄膜的结构特性进行分析. 研究发现：沉积温度较低时，随着沉积温度的升高，薄膜的晶化率增加；当沉积温度超过某一温度值时，随着温度的进一步升高，薄膜的晶化率降低. 这时，表面反应由表面扩散限制转变为流量控制. 该温度值随着硅烷含量的降低而降低. 关键词： 氢化微晶硅薄膜 拉曼散射谱 晶化率 UV分光光度计     

Modulating microstructure and optical properties of hydrogenated nanocrystalline silicon photovoltaic materials prepared under hydrogen diluted silane PECVD by various DC bias

Hydrogenated nanocrystalline silicon (nc-Si:H) thin films were fabricated by plasma enhanced chemical vapor deposition under the various negative substrate bias voltages with hydrogen as a diluent of silane. The microstructure and optical properties of nc-Si:H thin films were studied by Raman scattering spectroscopy, X-ray diffraction (XRD), transmission electron microscopy, and optical transmission spectroscopy. Raman spectra and XRD pattern reveal that applying negative bias voltages at the moderate level favors the enhancement of crystalline volume fraction, increase of crystallite sizes and decrease of residual stress. We also demonstrated that the negative direct current bias can be used to modulate the volume fraction of voids, refractive index, absorption coefficient, compactness and ordered degree of nc-Si:H films. It is found that the film deposited at −80 V shows not only high crystallinity, size of crystallite, and static index n₀ but also low residual stress and volume fraction of voids. Furthermore, the microstructural evolution mechanism of nc-Si:H thin films prepared at different bias voltages is tentatively explored.     

On the stoichiometry condition for the formation of cubic boron nitride films

The stoichiometry of boron nitride (BN) films, which are deposited with self-bias-assisted radio frequency (rf) magnetron sputtering of a hexagonal boron nitride (hBN) target, has been investigated with Auger electron spectroscopy (AES) and the MCs⁺-mode of secondary ion mass spectroscopy (MCs⁺-SIMS) for the sake of a better understanding of the growth mechanism of cubic boron nitride (cBN). The cubic fraction of the films is determined with Fourier-transform infrared spectroscopy (FTIR). It is shown that full stoichiometry of the deposited films is decisive for cBN-growth. A substrate bias voltage can increase the N concentration of a growing film under N-deficient deposition conditions. This effect is shown to be temperature dependent. PACS 52.77.Dq; 81.15.Cd; 68.55.Nq     

Microstructure and lateral conductivity control of hydrogenated nanocrystalline silicon oxide and its application in a-Si:H/a-SiGe:H tandem solar cells

Phosphorous-doped hydrogenated nanocrystalline silicon oxide(n-nc-SiO_x:H) films are prepared via radio frequency plasma enhanced chemical vapor deposition(RF-PECVD). Increasing deposition power during n-nc-SiO_x:H film growth process can enhance the formation of nanocrystalline and obtain a uniform microstructure of n-nc-SiO_x:H film. In addition,in 20 s interval before increasing the deposition power, high density small grains are formed in amorphous SiO_x matrix with higher crystalline volume fraction(I_c) and have a lower lateral conductivity. This uniform microstructure indicates that the higher Ic can leads to better vertical conductivity, lower refractive index, wider optical band-gap. It improves the back reflection in a-Si:H/a-SiGe:H tandem solar cells acting as an n-nc-SiO_x:H back reflector prepared by the gradient power during deposition. Compared with the sample with SiO_x back reflector, with a constant power used in deposition process,the sample with gradient power SiO_x back reflector can enhance the total short-circuit current density(Jsc) and the initial efficiency of a-Si:H/a-SiGe:H tandem solar cells by 8.3% and 15.5%, respectively.     

Optical emission spectroscopy study on depositionprocess of microcrystalline silicon

This paper reports that the optical emission spectroscopy (OES) is used to monitor the plasma during the deposition process of hydrogenated microcrystalline silicon films in a very high frequency plasma enhanced chemical vapour deposition system. The OES intensities (SiH\sj{*}, H微晶硅 VHF-PECVD 发射光谱学 薄膜物理学microcrystalline silicon, VHF-PECVD, optical emission spectroscopy2005-11-092005-11-092005-12-12This paper reports that the optical emission spectroscopy （OES） is used to monitor the plasma during the deposition process of hydrogenated microcrystalline silicon films in a very high frequency plasma enhanced chemical vapour deposition system. The OES intensities （Sill^＊, H^＊ and H^＊β） are investigated by varying the deposition parameters. The result shows that the discharge power, silane concentrations and substrate temperature affect the OES intensities. When the discharge power at silane concentration of 4% increases, the OES intensities increase first and then are constant, the intensities increase with the discharge power monotonously at silane concentration of 6%. The SiH^＊ intensity increases with silane concentration, while the intensities of H^＊α and H^＊β increase first and then decrease. When the substrate temperature increases, the SiH^＊ intensity decreases and the intensities of H^＊α and H^＊β are constant. The correlation between the intensity ratio of IH^＊α/ISiH^＊ and the crystalline volume fraction （Xc） of films is confirmed.     

Fluid simulation of the pulsed bias effect on inductively coupled nitrogen discharges for low-voltage plasma immersion ion implantation

Planar radio frequency inductively coupled plasmas(ICP) are employed for low-voltage ion implantation processes,with capacitive pulse biasing of the substrate for modulation of the ion energy. In this work, a two-dimensional(2D) selfconsistent fluid model has been employed to investigate the influence of the pulsed bias power on the nitrogen plasmas for various bias voltages and pulse frequencies. The results indicate that the plasma density as well as the inductive power density increase significantly when the bias voltage varies from 0 V to-4000 V, due to the heating of the capacitive field caused by the bias power. The N+fraction increases rapidly to a maximum at the beginning of the power-on time, and then it decreases and reaches the steady state at the end of the glow period. Moreover, it increases with the bias voltage during the power-on time, whereas the N_2~+ fraction exhibits a reverse behavior. When the pulse frequency increases to 25 kHz and40 kHz, the plasma steady state cannot be obtained, and a rapid decrease of the ion density at the substrate surface at the beginning of the glow period is observed.     

射频激发热丝化学气相沉积制备硅薄膜过程中光发射谱的研究

采用射频(rf)激发,在热丝化学气相沉积(HWCVD)制备微晶硅薄膜的过程中产生发光基元,测量了rf激发HWCVD (rf-HWCVD)的光发射谱,比较了相同工艺条件下rf-HWCVD和等离子体增强CVD(PECVD)的光发射谱,分析了rf功率、热丝温度和沉积气压对rf-HWCVD光发射谱的影响.结果表明,在射频功率<0.1W/cm²时,rf-HWCVD发射光谱反映了HWCVD高的气体分解效率和高浓度原子氢的特点,能够解释气压变化与微晶硅薄膜微结构的关系,是研究HWCVD气相过程的有 关键词： HWCVD OES 微晶硅     

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用射频等离子体增强非平衡磁控溅射在Si100基底上沉积了金属Cu膜。研究了偏压,射频功率和磁场等沉积参数对膜性能的影响。用扫描电子显微镜(SEM)、原子力显微镜(AFM)、X射线衍射(XRD)和电子能谱(EM)检测了膜的表面形貌,结构和成分。结果表明,射频放电有利于表面均匀光滑、电导率高的Cu沉积膜的形成;沉积参数对沉积膜的性能有重要的影响。     

Low pressure plasma etching of silicon carbide

A low pressure etching of silicon carbide is qualitatively characterized by using a neural network. To construct a predictive model, the etch process was characterized by means of a 2⁵ full factorial experiment. Experimental factors that were varied include radio frequency (rf) source power, bias power, pressure, O₂ fraction, and gap between the plasma source and wafer. An additional 15 experiments were conducted to test the appropriateness of the trained model. An optimized etch rate model has a root mean-squared error of 12.78 nm/min. Model response surface behaviors were certified by actual measurements. Several noticeable features at lower pressure etching include a lower etch rate, inverse relationship between the source power level and the dc bias, and a smaller etch rate variation with the source power. The effect of the bias power on the etch rate or dc bias was affected little by the pressure level. Etch mechanisms for the gap variations were quite different depending on the bias powers. Several etching aspects useful for plasma control were revealed. PACS 52.75.R