Plasma processing of the Si(0 0 1) surface for tuning SPR of Au/Si-based plasmonic nanostructures

Au nanoclusters have been deposited on Si(0 0 1) surfaces by sputtering of a metallic Au target using an Ar plasma. Different wet and dry treatments of the Si(0 0 1) surface, including dipping in HF solution and exposure to H₂ and N₂ plasmas, have been applied and the effects of these treatments on the Au nanoparticles/Si interface, the Au nanoclusters aspect ratio and the surface plasmon resonance (SPR) energy and amplitude are investigated exploiting spectroscopic ellipsometry and atomic force microscopy. It is found that the Au nanoclusters aspect ratio depends on the extent of the Au-Si intermixing. The thicker the Au-Si interface layer, the larger the Au nanoparticles aspect ratio and the red-shift of the SPR peak. Furthermore, SiO₂ and the H₂ plasma treatment inhibit the Si-Au intermixing, while HF-dipping and the N₂ plasma treatment favour Au-Si intermixing, yielding silicide formation which increases the Si wetting by Au.     

非晶Si/SiO2超晶格结构的交流电致发光

设计并用磁控溅射方法制备了非晶Ｓｉ／ＳｉＯ２超晶格结构,以高纯多晶Ｓｉ为靶材,当以Ａｒ＋Ｏ２为溅射气氛时,得到ＳｉＯ２膜,仅以Ａｒ为气氛时,得到Ｓｉ膜。重复地开和关Ｏ２气,便交替地得到ＳｉＯ２和Ｓｉ膜。衬底在靶前往返平移,改变平移的速度或者改变溅射的功率,可以控制膜的厚度。通过透民镜的照片可以看出ＳｉＯ２和Ｓｉ膜具有均匀的周期结构,用低角Ｘ－射线反射谱表征了超晶格的周期结构和各层的厚度。透射光谱表     

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采用分子动力学模拟方法研究了样品温度对Ar+与SiC样品表面相互作用的影响。由模拟结果可知,SiC样品中Si原子的溅射产额随着温度的升高而增加,而温度对C原子的溅射产额影响不大。在相同温度下,Si原子的溅射产额要高于C原子的溅射产额。溅射出来的Si原子和C原子主要来源于样品的表层区域,样品中的Si和C原子密度、键密度及它们的成键方式也发生了较大的变化。初始样品中Si和C原子的密度是均匀的,而被轰击过后的样品表面Si原子的密度要高于C原子,而样品中部C原子的密度要高于Si原子。初始样品都是Si-C键,成键方式为Si-Csp3;被轰击过后又有Si-Si和C-C键,成键方式也发生了变化,还有Si-Csp1和Si-Csp2。     

退火及溅射气氛对氮化硅薄膜光致发光的影响

利用射频磁控反应溅射方法制备富硅的氮化硅薄膜。衬底材料为抛光的硅片,靶材为硅靶,在Ar-N₂气环境下,通过改变两种气体的组分比来改变样品成分,并在高纯N₂气氛下对其进行高温退火处理。用X射线光电子能谱(XPS)和X射线衍射(XRD)对样品进行了表征,并测试了样品的光致发光谱 (PL)。实验结果表明：X射线光电子能谱中出现了Si—N键合结构,同时还有少量的Si—O键生成,通过计算得出Si/N比值约为1.51,制备出了富硅的氮化硅薄膜;薄膜未经退火前,在可见光区域没有观察到明显的光致发光峰,经过高温退火后,XRD中新出现的衍射峰证实了纳米硅团簇的生成,PL图谱中在可见光区域出现了光致发光峰的蓝移现象,结合XRD结果,用纳米晶的量子限域效应对上述现象进行了合理解释。     

非晶Si/SiO2超晶格结构的交流电致发光

设计并用磁控溅射方法制备了非晶Si/SiO     

常压下金催化硅纳米线生长实验研究

采用固一液一固（SLS）生长机制,研究常压下金催化硅纳米线的制备方法。实验中将硅基Au薄膜在氩氢气中退火,退火温度为1050℃和1080℃,退火完成后在扫描电镜下观察硅片表面的形貌变化,分析不同退火温度、通气量和金膜厚度下的实验结果,并在此基础上进一步讨论了各变量对硅纳米线的生长影响及其机理。     

Preferred sputtering on binary alloy surfaces of the AlPdSi system

Auger spectroscopy has been used to investigate the behavior of preferred sputtering on surfaces of homogeneous AlPd, SiPd and AlSi alloy films. These combinations of alloys were chosen for studying the effects of mass and bonding differences on preferred sputtering. Experiments have been carried out using a 1 keV Ar ion beam over a range of alloy compositions. Our results can be summarized as follows: (a) The preferred sputtering of these binary alloys cannot be predicted according to the sputter yields of individual elements, e.g. both Al and Si have been observed to be removed preferentially relative to Pd although pure Pd has a higher sputter yield, (b) In the alloys studied, mass difference appears to dominate over bonding difference in controlling the preferred sputtering behavior since the extent of preferred sputtering of Al and Si relative to Pd is about the same. This observation is interpreted on the basis of the binary alloy sputtering theory formulated by Andersen and Sigmund. (c) Judging from the composition change of the sputtered surface, there is no evidence for formation of compounds with specific compositions as a result of preferred sputtering in the AlPd and SiPd alloys investigated.     

A comparative study of electroluminescence from Ge／SiO2 and Si／SiO2 films

Ge/SiO_2 and Si/SiO_2 films were deposited using the two-target alternation magnetron sputtering technique. The Au/Ge/SiO_2/p-Si and Au/Si/SiO_2/p-Si structures were fabricated and their electroluminescence (EL) characteristics were comparatively studied. Both Au/Ge/SiO_2/p-Si and Au/Si/SiO_2/p-Si structures have rectifying property. All the EL spectra from the two types of the structure have peak positions around 650－660 nm. The EL mechanisms of the structures are discussed.     

Emission Theory of Amorphous Material Sputtering: the Dependence of the Sputtering Coefficient on the Angle of Primary Ion Beam Incidence

The dependences of the sputtering coefficient on the types of accelerated ions, their energy, and the angle of incidence on a target are calculated. For Ar–Si, Хе–С, and H–W systems, acceptable coincidence between the calculated and experimental data is obtained. Two mechanisms for secondary-particle ejection from solids are established; they determine the dependences of the base sputtering coefficient for the base on the energy and the angle of primary ion incidence on the target.     

Preparation of atomically clean and flat Si(1 0 0) surfaces by low-energy ion sputtering and low-temperature annealing

Si(1 0 0) surfaces were prepared by wet-chemical etching followed by 0.3–1.5 keV Ar ion sputtering, either at elevated or room temperature (RT). After a brief anneal under ultrahigh vacuum (UHV) conditions, the resulting surfaces were examined by scanning tunneling microscopy. We find that wet-chemical etching alone cannot produce a clean and flat Si(1 0 0) surface. However, subsequent 300 eV Ar ion sputtering at room temperature followed by a 700 °C anneal yields atomically clean and flat Si(1 0 0) surfaces suitable for nanoscale device fabrication.     

Influence of working gas pressure on the performance of W/Si multilayers

The effect of Ar pressure on the performance of W/Si multilayers is investigated. W/Si multilayers were deposited by a high vacuum DC magnetron sputtering system. The Ar pressure was changed from 1.0 to 5.0 mTorr with an interval of 1.0 mTorr during the deposition process. Electron probe microanalysis and Rutherford backscattering are performed to determine the Ar content incorporated within these multilayers. The results demonstrate that less Ar is incorporated within the sample when more Ar is used in the plasma, which could be explained by the increase of the collision probability and the decrease in the kinetic energy of Ar ions arriving at the substrate when more Ar exists. The grazing incident X-ray reflectivity (GIXR) at 0.154 nm is used to determine the structural parameters of the layers. The results show that the structures of these multilayers prepared at different Ar pressure are very similar and that the interface roughness increases quickly when the Ar pressure is higher than 3.0 mTorr. The measurements of the extreme ultraviolet (EUV) reflectivity indicate that the reflectivity decreases when Ar pressure increases. The fitting results of GIXR and EUV reflectivity curves indicate that with an increase of Ar pressure, the density and decrement of the refractive index are increased for W and decreased for Si, which is mainly due to (1) the decrease in Ar content incorporated within these multilayers which affects their performance and (2) the increase of collision probability for sputtered W and Si, the decrease of their average kinetic energy arriving at the substrate, and thus the loosing of their layers.     

Influence of substrate crystallography on the room temperature synthesis of AlN thin films by reactive sputtering

A pulsed DC reactive ion beam sputtering system has been used to synthesize aluminium nitride (AlN) thin films at room temperature by reactive sputtering. After systematic study of the processing variables, high-quality polycrystalline films with preferred c-axis orientation have been grown successfully on silicon and Au/Si substrates with an Al target under a N₂/(N₂ + Ar) gas flow ratio of 55%, 2 mTorr processing pressure and keeping the temperature of the substrate holder at room temperature. The crystalline quality of the AlN layer as well as the influence of the substrate crystallography on the AlN orientation has been characterized by high-resolution X-ray diffraction (HR-XRD). Best ω-FWHM (Full Width at Half Maximum) values of the (0 0 0 2) reflection rocking curve in the 1 μm thick AlN layers are 1.3°. Atomic Force Microscopy (AFM) measurements have been used to study the surface morphology of the AlN layer and Transmission Electron Microscopy (TEM) measurements to investigate the AlN/substrate interaction. AlN grew off-axis from the Si substrate but on-axis to the surface normal. When the AlN thin film is deposited on top of an Au layer, it grows along the [0 0 0 1] direction but showing a two-domain structure with two in-plane orientations rotated 30° between them.     

(Au,Si)/SiO2复合纳米颗粒薄膜的光谱特性

采用复合靶共溅射法制备了(Au，Si)／SiO2复合纳米颗粒薄膜样品，并对其荧光谱作了测量．在理论上分别计算了在强限域效应下和弱限域效应下Si纳晶吸收光谱的峰值位置与晶粒尺寸之间的关系，并采用Drude理论计算了Au／SiO2复合体系的吸收峰的峰值位置与微粒尺寸的关系．给出了(Au，Si)／SiO2体系复合薄膜共振吸收峰的位置随Au和Si的掺杂浓度比和微粒尺寸的相关特征．     

Quantitative auger electron analysis of homogeneous binary alloys: Chromium in gold

Quantitative Auger electron analysis of Cr/Au alloys with up to 20% Cr has been accomplished. The surface composition of scribed areas were compared to bulk compositions and it was shown that corrections for variation of density, escape depth, and electron backscattering must be included; these corrections change the measured surface Cr concentrations by approximately 15%. Alloy sputter yield ratios have been calculated from surface concentrations after sputtering with Ar or Ne (0.5, 1.0, 1.5, and 2.0 keV). The sputter yield ratio of Cr to Au was 0.5 at 1% Cr (significant preferred sputtering) but was near unity at 20% Cr (no preferred sputtering). The sputter yield ratio was nearly independent of ion species and ion energy. The 2 keV argon ion sputter yields for pure Cr and Au were determined to be 2.0 and 7.9 atoms/ion, respectively. However, the 2 keV argon ion sputter yield for Au in the alloys drops rapidly from 7.9 atoms/ion for pure Au, to 5 atoms/ion at 10–20% Cr. The sputter yield for Cr in alloys (5 atoms/ion) is relatively independent of composition and is 2.5 times higher than the yield of pure Cr. No simple model is known by which pure elements sputter yields could be used to predict alloy sputtering behavior.     

Study of the interaction of argon and nitrogen ions with the silicon dioxide surface

Angular dependences of the sputtering yield, surface layer composition, and changes in the mass spectra of residual atmosphere upon irradiation of silicon dioxide with argon and nitrogen ions are measured. It is found that the sputtering yield of SiO₂ bombarded by N ₂ ⁺ ions is almost two times higher than for Si. The sputtering yields of SiO₂ and Si irradiated with Ar ions are identical, although the binding energy of atoms in SiO₂ is almost two times higher than in Si. An analysis of the surface composition and residual atmosphere near the sample during its irradiation suggests that a chemical reaction is involved in SiO₂ sputtering. Molecules of SiO and NO gases form in the surface layer, whose subsequent desorption increases the SiO₂ sputtering rate.     

Electroluminescence from Si／SiO2 films deposited on p—Si substrates

The structure of Au/Si/SiO₂/p-Si has been fabricated using the magnetron sputtering technique. It has a very good rectifying behaviour. Visible electroluminescence (EL) has been observed from the Au/Si/SiO₂/p-Si structure at a forward bias of 5V or larger. A broad band with one peak around 650－660 nm appears in all the EL spectra of the structure. The effects of the thickness of the Si layer in the Si/SiO₂ films and of the input electrical power on EL spectra are studied systematically.     

DCEMS Study of Thin Oxide Layers and Interface of Stainless Steel Films Deposited by Sputtering Austenitic AISI304

Hyperfine Interactions - Thin stainless steel films were deposited on surface oxidized Si plate using austenitic AISI304 stainless steel as target with a RF magnetron Ar sputtering method. The...     

Mixing of Au in Si induced by secondary and high-order recoil implantation

The mixing of Au in Si induced by secondary and high-order recoil implantation was investigated using 350 keV Ar⁺ and 350 keV Kr⁺ ions to fluences from 1?×?10¹⁶ to 3?×?10¹⁶ ions/cm² at room temperature. The thickness of the Au layer evaporated on Si substrate was ～2400 Å.The ranges of the Ar and Kr ions were chosen to be lower than the thickness of the Au layer in order to avoid the ballistic mixing produced by the primary knock-on atoms. Rutherford backscattering spectrometry (RBS) experiments were carried out to study the effects induced by Ar and Kr irradiation at the interface of Au–Si system. We observed that in the case of the irradiation with Ar⁺ ions, a broadening of the Au–Si interface occurred only at the fluence of 3?×?10¹⁶ Ar⁺/cm² and it is attributed to the surface roughening induced by ion bombardment. In contrast, the RBS analysis of a sample irradiated with 2?×?10¹⁶ Kr⁺/cm² clearly showed, in addition to the broadening effect, the formation of a mixed zone of Au and Si atoms at the interface. The mixing of Au in Si atoms can be explained by the secondary and high-order recoil implantation followed by subsequent collision cascades.     

Magnetic depth profiling of Fe/Au multilayer using neutron reflectometry

We present unpolarized and polarized neutron reflectometry data on Fe/Au multilayer sample for characterizing the layer structure and magnetic moment density profile. Fe/Au multilayer shows strong spin-dependent scattering at interfaces, making it a prospective GMR material. Fe/Au multilayer with bilayer thickness of 130 Å was grown on Si substrate by RF magnetron sputtering technique. Unpolarized neutron reflectivity measurement yields nuclear scattering length density profile. The magnetic scattering length density profile has been obtained from polarized neutron reflectivity measurements.     

Influence of sputtering power and Ar–N2 flow on the structure and optical properties of indium nitride films prepared by magnetron sputtering

ABSTRACT

This paper discusses the deposition of indium nitride (InN) thin films on Si (100) substrates by using pulsed DC magnetron sputtering. Effects of varying sputtering power and Ar–N₂ flow ratio on the structural, morphological, and optical properties of indium nitride (InN) films were investigated. The structural characterization indicated nanocrystalline InN film with preferred orientation towards (101) plane that exhibited the optimum crystalline quality at 130?W and for 40:60 Ar–N₂ ratio. The surface morphology of InN, as observed through FESEM, contained irregularly shaped nanocrystals with size that increases with higher sputtering power and Ar:N₂ flow ratio. The optical properties of InN films were studied using ellipsometer at room temperature. The band gap of InN was decreased with the increase of sputtering power to 130?W, whereas an increase in the band gap was noticed with the increase of the Ar:N₂ flow ratio.