添加剂的吸附行为及其对Ni沉积层性能的影响

采用电化学及X射线衍射等方法研究有机添加剂苯磺酸钠、苯亚磺酸钠和糖精的吸附作用及其对Ni电沉积层的电化学活性、晶粒尺寸、织构及显微硬度的影响．结果表明，苯亚磺酸钠和糖精使Ni沉积层的电化学活性提高，（111）晶面的织构系数明显增大，而使（290）晶面的织构系数减小，还导致沉积层的晶粒尺寸显著减小和显微硬度提高；然而，苯磺酸钠对沉积层的活性及织构影响很小．讨论了上述添加剂的作用．     

退火前后镍钨硼合金电沉积层的结构与性能

采用电化学技术、XPS、DSC、XRD等方法研究Ni W B合金电沉积及热处理前后合金镀层的结构和显微硬度.结果表明,在Ni W B合金电沉积过程中伴随着化学沉积镍等过程以及Na2B4O7在镀层中的夹杂;Ni W和Ni W B合金电沉积层分别表现为纳米晶结构和非晶态结构;热处理过程中合金电沉积层发生晶粒粗化过程以及Ni W B合金镀层发生新相形成过程,产生Ni4W和镍硼化物如Ni2B、Ni3B等沉淀物;400 ℃热处理2 h后Ni W合金镀层有最大的显微硬度达919.8 kg•mm－2,而在500 ℃下Ni W B合金有最大的硬度达1132.2 kg•mm－2.     

钇系涂层超导体金属基带再结晶织构及显微组织

用轧制－再结晶热处理方法制备了强立方织构的纯Ni基带和无磁性Cu-Ni合金基带，为第二代钇钡铜氧高温超导带材提供了较好的基带材料，用三维取向分布函数（ODF）和ψ扫描曲线研究了织构，用金相显微镜研究了截面显微组织。分析表明，Cu0.70Ni0.30合金和纯Ni在再结晶温度为1000℃时，获得最强的立方结构；Cu0.85Ni0.15在900℃时获得最强的立方织构，立方织构强度大小各不相同，3种不同组分金属都获得了均匀的等轴的等轴晶粒组织，其中Cu0.85N0.15的晶粒大于Cu0.70Ni0.30和纯Ni的晶粒，Cu0.85Ni0.15和Cu0.70Ni0.30都出现了退火孪晶。     

电沉积条件对锌镀层织构的影响

采用ＸＲＤ方法研究添加剂，络合剂，以及电流密度对锌酸盐镀锌层的织构和晶粒尺寸的影响，结果表明，添加剂ＡＡ－１的存在有利于（１０１）晶面取向；而ＤＩＥ则使镀层转变为１１０择优；两种添加剂同时存在下，可在一定的电流密度范围内获得高择优取向的锌镀层，而当又有络合剂ＴＥＡ和ＥＤＴＡ同时存在时，则可在更宽广的电流密度范围内制得日 粒细密、表面光亮、择优系数ＴＣ（１１０）在９８５以上的高择优取向锌沉积层。     

高择优取向铜镀层的电化学形成及其表面形貌

采用电化学方法在H2SO4-CuSO4电解液中获得高择优取向的Cu电沉积层.XRD结果表明,在1.0 ～6.0和15.0 A•dm－2的电流密度下可分别获得(220)和(111)晶面高择优取向的Cu镀层.在同一电流密度下获得的Cu电沉积层织构度随镀层厚度增大而提高.SEM结果表明,在4.0和15.0 A•dm－2的电流密度下可分别获得(220)和(111)织构Cu沉积层,其表面形貌在(220)晶面取向时呈现为细长晶粒连结成的网状，在(111)取向时则呈六棱锥状.提出了可能的机理，认为电流密度变化引起的Cu镀层择优取向晶面的转化归因于电结晶晶面生长方向及生长速度竞争的结果.     

硫化态NiW／AI2O3催化剂加氢脱硫活性相的研究 I．XPS和HREM表征

采用孔饱和共浸法制备了一系列具有相同W含量和不同Ni含量的NiW／AI2O3催化剂，并对相应的硫化态催化剂进行了XPS和HREM表征．结果表明，引入的助剂Ni优先修饰WS2晶粒的边角位置，形成高活性的NiWS相．催化剂中助剂Ni在噻吩加氢脱硫反应中的显著促进效应(活性提高了约30倍)与形成的NiWS活性相数量有关．同时，助剂Ni的引入使得催化剂表面WS2晶粒的堆叠程度略有增加，晶片长度略有减小；而且引入助剂后WO，相的硫化度提高了近20％．但相比之下，活性相织构的变化和硫化度的增大对催化脱硫活性的贡献较小，不是Ni产生助剂效应的主要原因．     

纳米晶镍—钼合金电沉积层的结构与性能

通过控电流沉积制备出纳米晶镍钼合金沉积层,沉积层的ＸＲＤ、ＸＰＳ结果表明,纳米晶镍钼合金沉积层存在较大的晶格畸变,其微晶尺寸为１７ｎｍ,纳米合金各元素的结合能发生了不同程度的位移．在３０％的ＫＯＨ溶液中纳米晶镍钼合金电极对析氢反应表现出较高的电催化活性．电化学交流阻抗谱表明,析氢过程按ＶｏｌｍｅｒＨｅｙｒｏｖｓｋｙ机理进行．     

Ni-Mo合金电沉积层织构及形成机理

在组成为：０．２２ｍｏｌ／Ｌ硫酸镍、０．０６ｍｏｌ／Ｌ钼酸钠和０．３ｍｏｌ／Ｌ柠檬酸钠的溶液,于纯铜片上采用恒电流沉积,所得Ｎｉ－Ｍｏ合金沉积层经Ｘ射线衍射测定,结果表明在温度为２５℃～５０℃,电流密度为１０ｍＡ·ｃｍ－２～３０ｍＡ·ｃｍ－２范围,Ｎｉ－Ｍｏ合金沉积层表现为（１１１）择优取向．循环伏安和电位阶跃实验表明镍钼合金电结晶过程按照连续成核和三维生长方式进行．Ｎｉ－Ｍｏ合金电沉积过程的电化学交流阻抗谱表明Ｎｉ－Ｍｏ共沉积过程经历了吸附中间产物步骤,由于吸附态物种氢氧化镍和钼的氧化物将阻化晶粒（１１１）晶面的生长,从而使镍钼沉积层表现为（１１１）择优取向．     

双羟基复合金属氧化物的晶面生长选择性及晶粒尺寸控制

采用成核／晶化隔离法合成镁铝双羟基复合金属氧化物（LDH）,考察了晶化温度及晶化时间对晶体结构,晶面生长选择性及晶粒尺寸的影响规律。结果发现晶化温度相同时,随晶化时间延长,LDH的晶体结构趋于完整,晶粒尺寸增大;晶化时间相同时,随晶化温度升高,晶体结构趋于完整,晶粒尺寸显著增大,实验条件下得到的LDH,其沿a轴方向的尺寸均大于沿c轴方向的尺寸,即共沿a轴方向的生长速率比沿c轴方向的生长速度快,亦即[110]晶面的生长速率比[003]晶面的生长速率快。根据LDH晶粒尺寸随晶化时间及晶化温度的变化规律,选择合适的晶化条件,制备得到了粒径分布窄的纳米LDH。     

纳米复合永磁材料晶粒择优取向的研究

利用熔体快淬技术制备了（Nd11.4Fe82.9B5.7）0．99M1（其中M=Zr，Nb，Ga，Zr＋Ga，Nb＋Ga）快淬带。发现Ga元素的添加对Nd2Fe14B相晶粒的C轴垂直于带面取向是有利的。复合添加Zr＋Ga或Nb＋Ga可获得较好的磁性能，并且进一步提高了快淬带晶粒的择优取向。取向度随厚度改变发生明显的变化，当带厚约为120μm时取向度最高。热处理可使淬带织构度增加，但导致晶粒粗化。利用深冷技术对纳米晶复合快淬带进行超低温处理。发现深冷处理有利于快淬带织构度的增强，且晶粒尺寸几乎不变。     

An EQCM study on the influence of saccharin on the corrosion properties of nanostructured cobalt and cobalt-iron alloy coatings

Nanostructured cobalt (Co) and cobalt-iron (CoFe) alloy coatings were electrodeposited from sulfate solutions in the presence and absence of saccharin. The effects of saccharin on the corrosion behavior of Co and CoFe alloy coatings were investigated using the electrochemical quartz crystal microbalance (EQCM) technique coupled with cyclic voltammetry (CV) measurements. Saccharin was added to the electrolyte as a grain refiner and brightener. Interestingly, opposite corrosion behaviors were found for all nanostructured coatings in 0.1 M H₂SO₄ and 0.1 M NaOH. The use of saccharin as an additive in the plating solution accelerated the anodic reaction for all deposits in acidic medium. The mass decreases while dissolution rate increased with higher saccharin concentration. Meanwhile, formation of a thick passive film on the Co electrode surface were enhanced while a hindering effect was observed for CoFe alloy coatings deposited in the presence of saccharin in alkaline solution. The anodic and cathodic curves obtained from potentiodynamic polarization experiments were also in agreement with the EQCM results.     

以硼氢化钠为还原剂化学镀镍的电化学研究

采用线性电位扫描伏安法研究了以硼氢化钠为还原剂的化学镀镍体系, 考查了镀液组成及工艺条件对化学镀镍硼阴、阳极过程的影响, 结果表明: 乙酸镍和硼氢化钠含量的提高分别促进了Ni²⁺的还原反应和BH₄^-的氧化反应; 乙二胺、氢氧化钠以及添加剂硫脲、糖精钠对阴、阳极反应均有不同程度的抑制作用, 同时添加剂中的硫元素加速了镍的氧化; 升高温度有利于阴、阳极反应的进行.     

Electrolessly Plated Ni-Zn（Fe）-P Alloy and Its Corrosion Resistance Properties

The autocatalytic deposition of Ni-Zn(Fe)-P alloys has been carried out on substrate of carbon steel from a bath containing nickel sulfate, zinc sulfate, sodium hypophosphite, sodium citrate and boric acid. The effects of pH and the molar ratio of NiSO4/ZnSO4 on the deposition rate and the composition of deposits have been studied. It was found that the presence of zinc sulfate in the bath has an inhibitory effect on the alloy deposition. The structure and the surface morphology of Ni-Zn(Fe)-P coatings were characterized with XRD and SEM, respectively. The alloys plated under the experimental conditions consisted of an amorphous phase coexisting with a crystalline cubic Ni phase (poly-crystalline). The surface morphology of the coating is dependent on the deposition parameters. The corrosion resistance of the Ni-Zn(Fe)-P deposits was examined via mass loss tests and anodic polarization measurements, respectively. The results show that the surface morphologies of the deposits and the corrosion resistance of the deposits have been improved. The results of mass loss tests almost accord with those of anodic polarization measurements. The corrosion mechanisms of Ni-Zn(Fe)-P alloys in NaCl and NaOH solutions were investigated by means of EDX. The deposit immersed in an NaCI or an NaOH solution contains more content of oxygen and less contents of the metals(except Fe) than that placed in air, which shows that the NaCl or NaOH solution can accelerate the oxidation of the deposit.     

Fe-Ni-S软磁薄膜的电沉积

酸性镀液中以硼酸为缓冲剂、柠檬酸三钠为配合剂,在紫铜箔上电沉积得到非晶Fe-Ni-S合金薄膜。 采用扫描电子显微镜和能谱分析技术(EDS)研究了镀液组成和沉积条件对镀层表面形貌和组成的影响。 结果表明,在镀液中加入2 g/L C7H5O3NS（糖精）和0.4 g/L 1,4-丁炔二醇可获得表面平整无裂缝和较小内应力的合金镀层;电流密度和镀液pH值对镀层组成影响较小,但施镀温度对镀层组成影响较大。 获得了理想的镀液组成和沉积条件,所得Fe73Ni9.5S17.5薄膜的X射线衍射表明其为非晶结构,在室温下具有较高的饱和磁化强度(Ms约为876.25 kA/m)和较低的矫顽力(Hc约为4.96 kA/m),具有良好的软磁性能。 循环伏安曲线和阴极极化曲线均表明,镀液中CS(NH2)2会促进Fe-Ni-S共沉积。     

Electrochemical deposition of nickel from aqueous electrolytic baths prepared by dissolution of metallic powder

A new method of preparation of aqueous electrolyte baths for electrochemical deposition of nickel targets for medical accelerators is presented. It starts with fast dissolution of metallic Ni powder in a HNO₃-free solvent. Such obtained raw solution does not require additional treatment aimed to removal nitrates, such as the acid evaporation and Ni salt precipitation-dissolution. It is used directly for preparation of the nickel plating baths after dilution with water, setting up pH value and after possible addition of H₃BO₃. The pH of the baths ranges from alkaline to acidic. Deposition of 95% of ca. 50 mg of Ni dissolved in the bath takes ca. 3.5 h for the alkaline electrolyte while for the acidic solution it requires ca. 7 h. The Ni deposits obtained from the acidic bath are physically and chemically more stable and possess smoother and crack-free surfaces as compared to the coatings deposited from the alkaline bath. A method of estimation of concentration of H₂O₂ in the electrolytic bath is also proposed.

     

Electrodeposition of Zn–Ni–P compositionally modulated multilayer coatings: An attempt to deposit Ni–P and Zn–Ni alloys from a single bath

The effects of bath composition and deposition variables on the electrodeposition of Zn–Ni–P alloys were studied in order to develop a single bath for deposition of Ni–P/Zn–Ni compositionally modulated multilayer coatings (CMMCs). The basis for development of the bath was a large increase in the Ni deposition rate compared to that of Zn at low deposition overpotentials combined with the impossibility of codeposition of Zn with P. EDS analysis demonstrated that the deposits obtained from the Zn–Ni–P bath at low overpotentials were practically all Ni–P, while the alloy deposited at high overpotentials was mainly Zn–Ni with around 3.2 wt% P content.     

热轧对涂层导体用镍基带立方织构形成的影响

热机械加工制备的立方织构Ni及其合金带材广泛用于YBCO涂层导体的基带。涂层导体的制备要求基带具有强的立方织构和小的晶界角。通过在冷轧前进行热轧制备了强立方织构的镍基带。用三维取向分布函数（ODF）研究了轧制织构和再结晶织构，通过扫描电镜EBSD的观测，分析了晶粒取向分布和立方织构晶界微取向角分布。结果表明，冷轧前进行热轧有利于形成很强的立方织构和小的晶界微取向角。