| 高择优取向铜镀层的电化学形成及其表面形貌 |
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| 引用本文： | 辜敏,杨防祖,黄令,姚士冰,周绍民.高择优取向铜镀层的电化学形成及其表面形貌[J].物理化学学报,2002,18(11):973-978. |
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| 作者姓名： | 辜敏 杨防祖 黄令 姚士冰 周绍民 |
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| 作者单位： | Department of Chemistry , Shantou Universitry, Shantou 515063;Department of Chemistry, State Key Laboratory for Physical Chemistry of Solid Surfaces, Institute of Physical Chemistry, Xiamen University, Xiamen 361005 |
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| 基金项目： | 国家自然科学基金(20073037)，优秀国家重点实验室基金(20023001) |
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| 摘 要： | 采用电化学方法在H2SO4-CuSO4电解液中获得高择优取向的Cu电沉积层.XRD结果表明,在1.0 ～6.0和15.0 A?dm－2的电流密度下可分别获得(220)和(111)晶面高择优取向的Cu镀层.在同一电流密度下获得的Cu电沉积层织构度随镀层厚度增大而提高.SEM结果表明,在4.0和15.0 A?dm－2的电流密度下可分别获得(220)和(111)织构Cu沉积层,其表面形貌在(220)晶面取向时呈现为细长晶粒连结成的网状，在(111)取向时则呈六棱锥状.提出了可能的机理，认为电流密度变化引起的Cu镀层择优取向晶面的转化归因于电结晶晶面生长方向及生长速度竞争的结果.
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| 关 键 词： | 电沉积 Cu镀层 高择优取向 表面形貌 |
| 收稿时间： | 2002-02-18 |
| 修稿时间： | 2002-04-05 |
The Formation of Copper Electrodeposits with Highly Preferred Orientation and Their Surface Morphology |
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| Gu Min , Yang Fang-Zu Huang Ling Yao Shi-Bing Zhou Shao-Min.The Formation of Copper Electrodeposits with Highly Preferred Orientation and Their Surface Morphology[J].Acta Physico-Chimica Sinica,2002,18(11):973-978. |
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| Authors: | Gu Min Yang Fang-Zu Huang Ling Yao Shi-Bing Zhou Shao-Min |
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| Institution: | Department of Chemistry , Shantou Universitry, Shantou 515063;Department of Chemistry, State Key Laboratory for Physical Chemistry of Solid Surfaces, Institute of Physical Chemistry, Xiamen University, Xiamen 361005 |
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| Abstract: | Cu electrodeposits with highly preferred orientations were obtained from H2SO4-CuSO4 electrolytic solution. XRD results indicated that at current densities 1.0～6.0 A?dm－2 and 15.0 A?dm－2,the obtained Cu electrodeposits were respectively shown in (220) and (111) highly preferred orientations. The value of texture coefficient of Cu electrodeposited at a stationary current density was increased with its thickness. SEM results revealed that the surface morphology of the electrodeposits with (220) texture obtained at 4.0 A?dm－2 appeared in network combined with needle crystals, and texture with (111) at 15.0 A?dm－2 in hexagonal pyramid. The changes of the preferred orientation effected by current density were mainly attributed to the competitions between the grains growing direction and the rate during Cu electro crystallization. |
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| Keywords: | Electrodeposition Copper electro deposit Highly preferred orientat ion Surface morphology |
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