磁控溅射制备氧化硅薄膜生长速率

氧化硅薄膜是半导体工业中常见的薄膜材料,通常采用化学气相沉积方法制备。但是这种制备方法存在缺欠。采用磁控溅射的方法首先在石英衬底上制备了氧化硅薄膜。研究了射频功率、氧气含量和溅射压强对氧化硅薄膜沉积速率的影响。发现沉积速率随着射频功率的增加而增加;随着氧气含量的增加,先减小后增大;当溅射压强在0.4~0.8 Pa之间变化时,沉积速率变化很小,当溅射压强超过0.8 Pa时沉积速率迅速下降。讨论了不同生长条件下造成氧化硅薄膜生长速率变化的原因。     

GeC薄膜的射频磁控反应溅射制备及性质

用射频磁控反应溅射法在ZnS衬底上制备了GeC薄膜,研究了工艺参数对Ge靶溅射及GeC薄膜红外透射性能的影响.衬底温度较低时GeC薄膜中含有H,形成了CH₂,CH₃,Ge-CH₃等,使薄膜产生红外吸收;随衬底温度升高,薄膜红外吸收明显减小.靶基距、射频功率、Ar:CH₄气体流量比、总气压对靶面中毒及溅射影响较大,但对GeC薄膜红外吸收影响较小.靶面中毒严重时,所制备无氢GeC薄膜附着性能差,随靶中毒减弱薄膜附着性能变好.优化工艺后,在ZnS衬底上制备了附着性能良好的无氢GeC薄膜,其折射率约为1.78,薄膜中C的含量比Ge的大,二者主要形成了C—Ge键.所制备的GeC/GaP红外增透保护膜系对ZnS衬底有良好的增透效果. 关键词： GeC薄膜 红外透射光谱 射频磁控溅射 XPS     

等离子体发射光谱诊断用于射频磁控溅射GaP薄膜的工艺参数优化

以GaP为靶材、Ar为工作气体,采用射频磁控溅射法制备了厚层GaP膜.对沉积过程中的辉光放电等离子体进行了发射光谱诊断,发现只有ArⅠ发射谱线.研究了工艺参数对发射谱线强度的影响规律,并在此基础上通过同时改变射频功率、Ar气流量及工作气压,使ArⅠ发射谱线强度保持相同.发现通过增大射频功率、减小工作气压而保持ArⅠ发射谱线强度不变可以提高GaP膜的沉积速率,并使GaP膜的沉积工艺参数得到优化.在优化后的工艺参数下制备出了符合化学计量比、红外透过性能好的厚层GaP膜. 关键词： GaP薄膜 射频磁控溅射 等离子体发射光谱 红外透射     

射频磁控溅射法制备ZnS多晶薄膜及其性质

实验采用射频磁控溅射法在玻璃衬底上沉积了ZnS多晶薄膜,研究了沉积气压、退火温度和衬底温度对ZnS薄膜质量的影响.利用X射线衍射(XRD)分析了薄膜的微结构,并计算了内应力值.通过紫外-可见光分光光度计测量了薄膜的透过谱,计算了Urbach能量和禁带宽度.利用扫描电子显微镜(SEM)观察了薄膜的表面形貌.结果表明: 衬底温度为室温时沉积的ZnS薄膜具有较大的压应力,并且内应力值随着工作气压增大而增大,在300 ℃下进行退火处理后内应力松弛,衬底温度为350 ℃时制备的ZnS薄膜内应力小,透过率高,经300 ℃退火处理后结晶质量有所提高. 关键词： ZnS薄膜 射频磁控溅射 内应力     

溅射工艺参数对硅薄膜微结构影响的Raman分析

为了解决碳化硅难以进行光学加工的问题,该文采用射频磁控溅射方法,在碳化硅反射镜坯体上沉积与碳化硅具有相近热膨胀系数且易于进行光学加工的硅薄膜。利用拉曼光谱(Raman)对衬底温度、射频功率、衬底偏压等溅射工艺条件对硅膜微结构的影响进行了分析。研究发现：随着衬底温度的升高,薄膜的晶化率先增大后减小;衬底偏压的增加不利于薄膜有序结构的形成;射频功率对薄膜微结构的影响比较复杂,随着功率的升高,薄膜晶粒尺寸减小,晶化率降低,当射频功率进一步升高时,薄膜中有序团簇尺寸和晶化率逐渐升高。但过高的射频功率反而不利于薄膜的晶化。     

常温溅射DLC膜的工艺研究

常温下,采用磁控溅射技术成功地在Ge基底上制备了类金刚石膜,并研究了溅射功率、碳氢气体与氩气流量比、溅射频率、基底负偏压等工艺参数对类金刚石膜沉积速率的影响和薄膜的光学性能。结果表明：溅射功率、溅射频率、碳氢气体与氩气流量比对沉积速率有显著的影响。沉积速率随着溅射功率的增大而增大,随着溅射频率的减小而增大。随着碳氢气体与氩气流量比、基底负偏压的增大沉积速率先增大后降低。制备的类金刚石膜具有较宽的光谱透明区,Ge基底单面沉积的类金刚石膜其峰值透过率最高达到63．99％。     

柔性PI衬底上ITO薄膜的制备及性能研究

利用射频磁控溅射的方法在柔性PI衬底上制备ITO薄膜,通过SEM(扫描电子显微镜)、XRD(X射线衍射仪)、四探针测试仪、分光光度计,分析了通氧量、溅射功率、工作气压及衬底温度对ITO薄膜表面形貌、成膜质量和光电特性的影响。结果显示:在纯氩气环境下,溅射功率为200W,工作气压为1.5Pa,在衬底温度为185℃~225℃时,薄膜的光电特性最好,ITO薄膜的电阻率为3.64×10-4Ω·cm,透过率为97%。     

直流磁控溅射制备AlN薄膜的结构和表面粗糙度

采用直流磁控反应溅射法,在Si(111)基底上成功制备了多晶六方相AlN薄膜.研究了溅射过程中溅射气压对薄膜结构和表面粗糙度的影响.结果表明:当溅射气压低于0.6 Pa时,薄膜为非晶态,在傅里叶变换红外光谱中,没有明显的吸收峰;当溅射气压不低于0.6 Pa时,薄膜的X射线衍射图中均出现了六方相的AlN(100)、(110)和弱的(002)衍射峰,说明所制备的AlN薄膜为多晶态,在傅里叶变换红外光谱中,在波数为677 cm-1处有明显的吸收峰;随着溅射气压的增大,薄膜表面粗糙度先减小后增大,而薄膜的沉积速率先增大后减少,且沉积速率较大有利于减小薄膜的表面粗糙度;在溅射气压为0.6 Pa时,薄膜具有最小的表面粗糙度和最大的沉积速率.     

溅射工艺参数对AgInSbTe相变薄膜光学性质的影响

采用射频磁控溅射工艺,在K9玻璃片上用Ag-In-Sb-Te合金靶制备了相变薄膜,对沉积态薄膜在300℃下进行了热处理,测量了薄膜的光学性质。通过改变本底气压,溅射气压及溅射功率,研究了工艺参数对薄膜光学性质的影响,实验表明,本底气压,溅射气压及射功率综合决定了AgInSbTe薄膜的光学性质,对AgInSbTe薄膜的制备,选择较高的本底真空度,适当的溅射气压及溅射功率是非常重要的。     

室温射频磁控溅射制备纳米晶ZnSX薄膜及其性能研究

为获得性能优异的透明介质薄膜,采用射频磁控溅射技术,以ZnS陶瓷靶为靶材,在玻璃衬底上室温沉积纳米晶富锌ZnS薄膜,通过X射线衍射仪、场发射扫描电子显微镜、拉曼光谱仪、分光光度计、光谱椭偏仪重点研究了不同射频功率对制备的纳米晶ZnS_X薄膜的晶相结构、表面形貌及光学性能的影响。结果表明:射频功率对ZnS_X薄膜晶相形成和结晶度具有重要影响;随着溅射功率的增加,ZnS_X薄膜中Zn和S元素的比例、特征拉曼峰的强度以及折射率的值都先增大后减小,薄膜的光学带隙从3.86 eV降低至3.76 eV;当溅射功率为150 W时,为ZnS_X薄膜具有立方相结构及高结晶度的最优条件,薄膜的Zn/S比接近于标准化学计量比,达到1.23,可见光平均透过率大于80%,550 nm下ZnS_X薄膜的光学折射率为2.03。     

ZnS衬底上GeC/GaP增透保护膜系的制备及红外光学性质

把GeC/GaP双层膜用作ZnS衬底的长波红外(8~11.5μm波段)增透保护膜系。采用射频磁控溅射法,以高纯Ar为工作气体、单晶GaP圆片为靶制备了GaP薄膜;用射频磁控反应溅射法在高纯Ar和CH4的混合气体中,以单晶Ge圆片为靶制备了GeC薄膜。分别用柯西(Cauchy)公式和乌尔巴赫(Urbach)公式表示折射率和吸收系数,对薄膜的红外透射率曲线进行最小二乘法拟合,得到了它们的厚度及折射率、吸收系数等光学常数。GaP膜的折射率与块体材料的相近,在波长10μm处约为2.9;GeC膜的折射率较小,在波长10μm处约为1.78。用所得到的薄膜折射率,通过计算机膜系自动设计软件在ZnS衬底上设计并制备出了GeC/GaP双层增透保护膜系,当GaP膜厚较大时,由于吸收增大膜系增透效果较差;当GaP膜厚较小时,膜系有较好的增透效果。     

离子束反应溅射沉积SiO2薄膜的光学特性

 主要研究采用离子束反应溅射（RIBS）制备SiO2薄膜的折射率、消光系数、化学计量比与氧气在氩氧混合工作气体中含量及其沉积速率的关系。研究结果表明：RIBS制备的SiO2薄膜在0.63 μm处折射率n= 1.48,消光系数小于10-5;随着沉积速率的增加,薄膜的折射率和消光系数随之变大,当沉积速率超过0.3 nm/s,即使是在纯氧环境溅射,折射率值也不低于1.5;通过对红外透射光谱的主吸收峰位置研究得到沉积的SiO2薄膜为缺氧型,化学计量比不超过1.8,且红外吸收峰位置和SiO2折射率存在对应关系,因此在不加热衬底情况下使用RIBS制备SiO2薄膜时,会限制沉积速率的提高。     

Structure,phase evolution and properties of Ta films deposited using hybrid high-power pulsed and DC magnetron co-sputtering

Crystalline phase and microstructure control are critical for obtaining desired properties of Ta films deposited by magnetron sputtering. Structure, phase evolution and properties of Ta films deposited by using hybrid high power impulse magnetron sputtering (HiPIMS) and direct current magnetron sputtering (DCMS) under different fractions of DCMS power were investigated, where Ta ion to Ta neutral ratios of the deposition flux were changed. The results revealed that the number of Ta ions arriving on the substrate/growing film plays an important role in structure and phase evolution of Ta films. It can effectively avoid the unstable arc discharge under low pressure and show a higher deposition rate by combining HiPIMS and DCMS compared with only HiPIMS. Meanwhile, the high hardness α -Ta films can be directly deposited by hybrid co-sputtering compared to those prepared by DCMS. In the co-sputtering technology, pure α -Ta phase films with extremely fine, dense and uniform crystal grains were obtained, which showed smooth surface roughness (3.22 nm), low resistivity (38.98 μΩ · cm) and abnormal high hardness (17.64 GPa).     

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用射频等离子体增强非平衡磁控溅射在Si100基底上沉积了金属Cu膜。研究了偏压,射频功率和磁场等沉积参数对膜性能的影响。用扫描电子显微镜(SEM)、原子力显微镜(AFM)、X射线衍射(XRD)和电子能谱(EM)检测了膜的表面形貌,结构和成分。结果表明,射频放电有利于表面均匀光滑、电导率高的Cu沉积膜的形成;沉积参数对沉积膜的性能有重要的影响。     

Study on the orientation of silver films by ion-beam assisted deposition

Low energy ion beam assisted deposition (IBAD) was employed to prepare Ag films on Mo/Si (100) substrate. It was found that Ag films deposited by sputtering method without ion beam bombardment were preferred (111) orientation. When the depositing film was simultaneously bombardment by Ar⁺ beam perpendicular to the film surface at ion/atom arrival ratio of 0.18, the prepared films exhibited weak (111) and (200) mixed orientations. When the direction of Ar⁺ beam was off-normal direction of the film surface, Ag films showed highly preferred (111) orientation. Monte Carlo method was used to calculate the sputtering yields of Ar⁺ ions at various incident and azimuth angles. The effects of channeling and surface free energy on the crystallographic orientation of Ag films were discussed.     

Direct Monitoring of Thickness and Refractive Index of Optical Thin Film Deposited on Fiber End-face

We propose a system for depositing thin films on waveguides which enables low-temperature deposition and precise control of the refractive index and film thickness. It is composed of a conventional ion-beam sputtering (IBS) system and a new system for directly monitoring film characteristics during deposition. We controlled refractive indices over a wide range from 1.52 to 1.97 by moving the sputtering targets (SiO₂ and Si₃N₄) in the IBS system. The refractive index or film thickness was in-situ monitored by observing the optical power reflected from the end-face of a monitoring fiber set in the deposition chamber. Antireflection coating films were successfully deposited on a fiber end-face and a laser diode chip facet with low reflectivity from 0.05 to 0.07%. This deposition system is attractive for constructing highly functional optical devices for future photonic networks.     

沉积温度对钛硅共掺杂类金刚石薄膜生长、结构和力学性能的影响

采用中频磁控溅射Ti80Si20复合靶在单晶硅表面制备了共掺杂的类金刚石薄膜.研究了沉积温度对薄膜生长速率、化学成分、结构、表面性质和力学性能的影响.结果表明:随沉积温度升高,薄膜生长速率降低,薄膜Ti和Si原子浓度增加,C原子浓度降低;在高温下沉积的薄膜具有低sp3C含量、低表面接触角、低内应力和高的硬度与弹性模量.基于亚表层注入生长模型分析了沉积温度对薄膜生长和键合结构的影响,从薄膜生长机制和微观结构解释了表面性质和力学性能的变化.     

Surface morphology for ion-beam sputtered Al layer with varying sputtering conditions

We study the growth morphology of thin macrostructure films which is known to be largely affected by the deposition conditions as thin film nucleation and formation is dependent on the kinetic energy and chemical free energy of the atoms. The ion-beam sputtering technique used for depositing thin layers is due to the advantage over other techniques, e.g. the independent control of many process parameters, such as the pressure and/or the energy of the ion-beam and the substrate temperature. Therefore, the dependence of various sputtering parameters such as: (i) sputtering pressure and/or the rate of deposition and (ii) the effect of substrate temperature on the growth has been studied by depositing a single layer of Al. The variations show some interesting dependencies on the structural parameters for the Al layer deposited which has been understood in terms of thin film growth and nucleation theory.