Degradation behaviors of high power GaN-based blue light emitting diodes

The degradation mechanism of high power InGaN/GaN blue light emitting diodes(LEDs)is investigated in this paper.The LED samples were stressed at room temperature under 350-mA injection current for about 400 h.The light output power of the LEDs decreased by 35%during the first 100 h and then remained almost unchanged,and the reverse current at 5 V increased from 10 9A to 10 7A during the aging process.The power law,whose meaning was re-illustrated by the improved rate equation,was used to analyze the light output power-injection current(L–I)curves.The analysis results indicate that nonradiative recombination,Auger recombination,and the third-order term of carriers overflow increase during the aging process,all of which may be important reasons for the degradation of LEDs.Besides,simulating L–I curves with the improved rate equation reveal that higher-than-third-order terms of carriers overflow may not be the main degradation mechanism,because they change slightly when the LED is stressed.     

Barrier Enhancement Effect of Postannealing in Oxygen Ambient on Ni/AIGaN Schottky Contacts

Al0.2 Ga0.8N/GaN samples are grown by metalorganic chemical vapour deposition （MOCVD） method on （0001） sapphire substrates. A 10nm-thick Ni layer is deposited on AlGaN as the transparent Schottky contact. The effect of postannealing in oxygen ambient on the electrical properties of Ni/AlGaN is studied by current-voltage- temperature （I-V-T） measurement. The annealing at a relatively low temperature of 300℃ for 90 s results in a decrease of the ideality factor from 2.03 to 1.30 and an increase of the Schottky barrier height from 0.77eV to 0.954 e V. The I-V-T analysis confirms the improvement originated from the formation of NiO, a layer with higher resistance, which could passivate the surface states of AlGaN and suppress the tunnelling current. Furthermore, the annealing also leads to an increase of the transmittance of the contacts from 57.5% to 78.2%, which would be favourable for A1GaN-based photodetectors.     

Electrical Characteristics of InGaN/AlGaN and InGaN/GaN MQW Near UV-LEDs

Electrical characteristics of In0.05 Ga0.95N/Al0.07Ga0.9aN and In0.05 Ga0.95N/GaN multiple quantum well （MQW） ultraviolet light-emltting diodes （UV-LEDs） at 400hm wavelength are measured. It is found that for InGaN/AlGaN MQW LEDs, both ideality factor and parallel resistance are similar to those of InGaN/GaN MQW LEDs, while series resistance is two times larger. It is suggested that the Al0.07Ga0.93N barrier layer did not change crystal quality and electrical characteristic of p-n junction either, but brought larger series resistance. As a result, InGaN/AlGaN MQW LEDs suffer more serious thermal dissipation problem although they show higher light output efficiency.     

Quasi-homoepitaxial GaN-based blue light emitting diode on thick GaN templateQuasi-homoepitaxial GaN-based blue light emitting diode on thick GaN templateQuasi-homoepitaxial GaN-based blue light emitting diode on thick GaN templateQuasi-homoepitaxial GaN-based blue light emitting diode on thick GaN template

The high power GaN-based blue light emitting diode （LED） on an 80%tm-thick GaN template is proposed and even realized by several technical methods like metal organic chemical vapor deposition （MOCVD）, hydride vapor-phase epi- taxial （HVPE）, and laser lift-off （LLO）. Its advantages are demonstrated from material quality and chip processing. It is investigated by high resolution X-ray diffraction （XRD）, high resolution transmission electron microscope （HRTEM）, Rutherford back-scattering （RBS）, photoluminescence, current-voltage and light output-current measurements. The width of （0002） reflection in XRD rocking curve, which reaches 173＂ for the thick GaN template LED, is less than that for the conventional one, which reaches 258＂. The HRTEM images show that the multiple quantum wells （MQWs） in 80%tm- thick GaN template LED have a generally higher crystal quality. The light output at 350 mA from the thick GaN template LED is doubled compared to traditional LEDs and the forward bias is also substantially reduced. The high performance of 80-~m-thick GaN template LED depends on the high crystal quality. However, although the intensity of MQWs emission in PL spectra is doubled, both the wavelength and the width of the emission from thick GaN template LED are increased. This is due to the strain relaxation on the surface of 80%tin-thick GaN template, which changes the strain in InGaN QWs and leads to InGaN phase separation.     

GaN-Based Thin Film Vertical Structure Light Emitting Diodes Fabricated by a Modified Laser Lift-off Process and Transferred to Cu

GaN-based thin film vertical structure light-emitting diodes （VS-LEDs） were fabricated by a modified YAG laser lift-off （LLO） process and transferred to Cu substrates. With a comparison of the electrical and optical properties of conventional LEDs on sapphire substrates and of lateral structure thin film LEDs by a KrF LLO process, the vertical structure of LLO LEDs shows obvious superiority. LLO VSLEDs made by modified YAG LLO process show less increase of leakage current than the devices made by conventional/（rE LLO process. Furthermore, owing to the well current spreading and less current path, the ideality factors and series resistance of vertical structure LEDs reduce greatly and the efficiency increases more obviously than the lateral structure LEDs, which is dso reflected on the relative L - I curves. The output power of vertical structure LEDs is over 3 times greater than that of the lateral structure LLO LEDs within 300mA.     

高N2气流下在GaAs(001)上用MBE法生长InN

在N2 气压为 2 6 7× 10 -2 Pa ,5 0 0℃的条件下 ,用MBE方法在GaAs(0 0 1)衬底上生长了InN的外延层。生长期间 ,In流量以 3× 10 14 到 2 4× 10 14 atoms/cm2 ·s范围内变化。用X 射线衍射 (XRD)和反射高能电子衍射 (RHEED)法对InN膜进行了表征。发现在生长的初始阶段 ,所生长的InN属立方相 ,但随着外延层厚度的增加出现了InN层由立方相向六角相的相变。X 射线倒易空间图形测量表明的在GaAs(0 0 1)衬底上生长的六角相InN其c 轴主要沿GaAs的〈111〉B方向取向     

侧向外延法生长的高质量GaN及其外延缺陷的观察

在有条状SiO2图形的GaN“模板”上,侧向外延方法生长了高质量的GaN。荧光显微镜的结果表明在SiO2掩膜区有成核过程发生。原因可能是SiO2的质量不高,为GaN的生长提供了一些成核中心。在GaN层的厚度达到4．5μm后,侧向的融合开始发生。侧向生长的速度与垂直生长速度几乎相同。在所有的SiO：掩膜上方都形成了空洞。样品在240℃熔融的KOH中腐蚀13min。在SiO2掩膜区生长的GaN,其腐蚀坑密度(相当于穿透位错密度)减少到几乎为零。而在窗口区生长的GaN,腐蚀坑密度仍然很高,达到10^8cm^-2量级。同时,我们发现具有不同窗口尺寸的样品在SiO2掩膜区上侧向生长的CaN的晶体质量基本相同,与窗口区的宽度几乎无关。室温光荧光结果表明侧向外延法生长的CaN中的晶格失配应力已被部分释放。     

MOCVD侧向外延GaN的结构特性

侧向外延（EL0）GaN的原子力显微镜（AFM）表面形貌图像表明,ELO—GaN相当平整,而掩膜区中央有线状分布的小丘群,这是由ELO—GaN在掩膜区中央接合时晶向不一致而产生的缺陷造成的。观察ELO—GaN扫描电子显微镜（SEM）截面图,侧向接合处存在着三角空洞,并且侧向接合导致上述小丘群。X射线衍射（XRD）曲线表明,掩膜边界处的GaN晶面有倾斜。拉曼散射谱表明,掩膜区GaN质量相对于窗口区大为提高。ELO—GaN和普通外延GaN的拉曼散射谱比较表明,ELO—GaN中的应力较小,晶体质量较高。     

氮化蓝宝石衬底上GaN薄膜的微结构与光学性质

用透射电子显微镜(TEM),X射线衍射(XRD)和光荧光谱(PL)等测量手段研究了GaN薄膜的微结构和光学性质。样品是用光辐射加热MOCVD在蓝宝石衬底上制备的。随着衬底氮化时间的增加,扩展缺陷的密度显著增加。在位错密度增加一个数量级时,XRD摇摆曲线半宽度(FWHM)由11″增加到15″,PL谱的黄光发射从几乎可忽略增加到带边发射强度的100倍。结合生长条件,我们对黄光与微结构的关系作了讨论。     

GaN基白光LED的结温测量

用正向电压法、管脚法和蓝白比法等三种方法测量GaN基白光LED的结温,获得了较为准确的结温,误差可以控制在4℃以内.正向电压法在恒定电流的条件下,得到了正向电压与结温的线性关系;蓝白比法在不同环境温度和不同注入电流两种情况下,都得到了蓝白比与结温较好的线性关系.提出了蓝白比法可能的物理机制,提高环境温度和增大注入电流都会使结温升高,蓝光峰值波长也会改变,这两个因素都会影响荧光粉的激发和发光效率.降低结温需要考虑的主要因素有白光LED的接触电阻、串联电阻和外量子效率,封装材料的热导率,反射杯和管脚的设计,以及空气散热部分的散热面积等.