功率型白光LED光学特性退化分析

将GaN基蓝光芯片涂敷YAG荧光粉和透明硅胶制成额定功率为1 W的白光发光二极管(LED),对其施加900mA的电流应力,在老化过程中测量白光LED的主要光学参数,考察其光学特性的退化情况。经过4 200 h的老化,样品光通量退化为初始值的15%~18% 。样品的漏电流明显增大,表明芯片有源区缺陷密度提高,但光谱分布图中蓝光部分的辐射量未减少,仅观察到黄光部分辐射量的减少,推断出YAG荧光粉的转换效率降低。同时,从原理上分析了样品色温逐渐增大,显色指数基本不变的原因,对大功率白光LED在照明领域的应用有一定的借鉴意义。     

InGaN/GaN多量子阱结构发光二极管发光机理转变的低频电流噪声表征

本文对InGaN/GaN多量子阱结构发光二极管开启后的电流噪声进行了测试, 结合低频电流噪声的特点和载流子之间的复合机理, 研究了低频电流噪声功率谱密度与发光二极管发光转变机理之间的关系. 结论表明, 当电流从0.1 mA到10 mA逐渐增大的过程中, InGaN/GaN发光二极管的电流噪声行为从产生-复合噪声逐渐接近于低频1/f噪声, 载流子的复合机理从非辐射复合过渡为电子与空穴之间载流子数的辐射复合, 并具有标准1/f噪声的趋势, 此时多量子阱中的电子和空穴之间的复合趋向于稳定. 本文的结论提供了一种表征InGaN/GaN多量子阱发光二极管发光机理转变的有效方法, 为进一步研究发光二极管中载流子的复合机理、优化和设计发光二极管、提高其发光量子效率提供理论依据.     

基于电容和电导特性分析GaN蓝光发光二极管老化机理

采用正向交流小信号方法测试和分析老化前后GaN发光二极管（LED）的电容-电压特性,结合串联电阻、理想因子、隧穿电流参数讨论负电容以及电导变化情况.基于L-V曲线定性分析老化前后负电容的阈值电压,老化之后样管的受主浓度降低,辐射复合概率下降,大量缺陷以及非辐射复合中心出现,对载流子俘获作用增强,造成负电容降低.反向偏压以及小正向偏压下,隧穿效应导致老化之后样管的电导增大;正向偏压大于2.2 V区域,考虑串联电阻效应,老化后样管电导减小.在分析LED电容-电压、光输出、电学特性曲线与老化机理基础上,通过实验论证以及理论解释表明,负电容以及电导特性可作为分析LED老化特性的参考依据. 关键词： GaN发光二极管 负电容 电导 老化机理     

多基色混合白光LED显色性优化研究

为优化多基色混合白光LED的显色性,得到色彩生动的白光LED照明效果,以评价饱和红色的特殊显色指数R₉为研究对象,通过多基色光源混合白光LED的光谱功率分布的高斯数学模型,选取峰值波长λ_m、半波宽Δλ和幅值A为基色光源光谱功率分布的主要参量,并以“蓝光芯片+YAG黄色荧光粉”和“红、绿和蓝基色LED”为分析模型分别进行二基色和三基色混合白光LED显色性研究,讨论两种基色混合情况下三个参量对混色白光LED的显色性R₉贡献。结果表明：为使多基色混合白光LED的显色性更好,首先确定光源S1的峰值波长λ_m1、半波宽Δλ₁及幅值A₁;然后设定其他基色光源幅值A_i以求此条件下峰值波长λ_mi和半波长Δλ_i取值范围;最后在求得的峰值波长λ_mi和半波长Δλ_i取值范围,反求基色光源的最佳幅值A_iopt,从而使多基色混合白光LED的显色性达到最佳效果。该方法对分析基色混合白光LED的显色性具有理论参考价值。     

纳米银焊膏烧结大功率LED模块的高温可靠性研究

介绍了一种加速老化试验模型对LED模块进行寿命预测。分别采用纳米银焊膏、锡银铜焊料、导电银胶作为芯片粘结材料。控制环境温度和正向电流,在特定的时间测量光输出。比较了不同粘接材料及环境温度对LED老化过程的影响,并针对老化过程进行分析推导,建立老化数学模型,对其进行寿命预测。试验结果表明,纳米银焊膏粘接的模块对温度的抗性最好,纳米银焊膏有潜力在未来固态照明、投影和其他高功率器件领域得到应用。     

Pivotal role of ballistic and quasi-ballistic electrons on LED efficiency

Significant progress in the power conversion efficiency and brightness of InGaN-based light emitting diodes (LEDs) has paved the way for these devices to be considered for LED lighting. In this realm, however, the efficiency must be retained at high injection levels in order to generate the lumens required. Unfortunately, LEDs undergo a monotonic efficiency degradation starting at current densities even lower than 50 A/cm² which would hinder LED insertion into the general lighting market. The physical origins for the loss of efficiency retention are at present a topic of intense debate given its enormous implications. This paper reviews the current status of the field regarding the mechanisms that have been put forward as being responsible for the loss of efficiency, such as Auger recombination, electron overflow (spillover), current crowding, asymmetric injection of electrons and holes, and poor transport of holes through the active region, the last one being applicable to multiple quantum well designs. While the Auger recombination received early attention, increasing number of researchers seem to think otherwise at the moment in that it alone (if any) cannot explain the progressively worsening loss of efficiency reduction as the InN mole fraction is increased. Increasing number of reports seems to suggest that the electron overflow is one of the major causes of efficiency degradation. The physical driving force for this is likely to be the relatively poor hole concentration and transport, and skewed injection favoring electrons owing to their relatively high concentration. Most intriguingly there is recent experimental convincing evidence to suggest that quasi-ballistic electrons in the active region, which are not able to thermalize within the residence time and possibly longitudinal optical phonon lifetime, contribute to the carrier overflow which would require an entirely new thought process in the realm of LEDs.     

反射式倒装对1 300 nm激光器性能改善的分析

对AlGaInAs多量子阱1 300 nm FP激光器进行反射式倒装封装,在热沉上靠近激光器出光端面约10~20 μm的区域采用Au反射层,对器件垂直方向出光进行反射。测试结果显示,与常规封装相比,采用这种结构封装芯片垂直发散角从34.5°降低至17°,器件单模光纤的平均耦合功率从1 850 μW提高至2 326 μW,耦合效率从21.1%提高到26.5%。对两种激光器进行光电参数的测量,结果表明：与常规封装器件相比,采用反射式倒装结构器件的饱和电流从135 mA提高至155 mA,饱和输出功率从37 mW提高至42 mW,热阻从194 K/W降低至131 K/W。最后对两种器件在95℃环境温度、100 mA电流下进行加速老化实验,老化结果显示：在老化条件下,器件衰退系数从常规封装的4.22×10^-5降低至1.06×10^-5,寿命从5 283 h提高至21 027 h。     

结温与热阻制约大功率LED发展

LED结温高低直接影响到LED出光效率、器件寿命、可靠性、发射波长等。保持LED结温往允许的范围内,是大功率LED芯片制备、器件封装和器件应用等每个环节都必须重点研究的关键因素,尤其是LED器件封装和器件应用设计必须着重解决的核心问题。首先介绍pn结结温对LED器什性能的影响,接着分析大功率LED结温与器件热阻的关系．基于对器件热阻的分析,得出了结温与热阻已经制约大功率LED进一步向更大功率发展的结论,并提出了如下两个观点：1．要在保持低成本和自然散热方式下提高LED器件的功率,根本的出路是提高光转换效率;2．在日前没有提高光转换效率的情况下,发展超过5W的大功率器件对工程应肘没有实质意义。     

High power and high reliability GaN/InGaN flip-chip light-emitting diodes

High-power and high-reliability GaN/InGaN flip-chip light-emitting diodes (FCLEDs) have been demonstrated by employing a flip-chip design, and its fabrication process is developed. FCLED is composed of a LED die and a submount which is integrated with circuits to protect the LED from electrostatic discharge (ESD) damage. The LED die is flip-chip soldered to the submount, and light is extracted through the transparent sapphire substrate instead of an absorbing Ni/Au contact layer as in conventional GaN/InGaN LED epitaxial designs. The optical and electrical characteristics of the FCLED are presented. According to ESD IEC61000-4-2 standard (human body model), the FCLEDs tolerated at least 10\,kV ESD shock have ten times more capacity than conventional GaN/InGaN LEDs. It is shown that the light output from the FCLEDs at forward current 350mA with a forward voltage of 3.3\,V is 144.68\,mW, and 236.59\,mW at 1.0\,A of forward current. With employing an optimized contact scheme the FCLEDs can easily operate up to 1.0\,A without significant power degradation or failure. The life test of FCLEDs is performed at forward current of 200\,mA at room temperature. The degradation of the light output power is no more than 9\% after 1010.75\,h of life test, indicating the excellent reliability. FCLEDs can be used in practice where high power and high reliability are necessary, and allow designs with a reduced number of LEDs.     

High-performance InGaN/GaN MQW LEDs with Al-doped ZnO transparent conductive layers grown by MOCVD using H_2O as an oxidizer

In this study,the high performance of InGaN/GaN multiple quantum well light-emitting diodes(LEDs) with Aldoped ZnO(AZO) transparent conductive layers(TCLs) has been demonstrated.The AZO-TCLs were fabricated on the n~+-InGaN contact layer by metal organic chemical vapor deposition(MOCVD) using H_2O as an oxidizer at temperatures as low as 400 ℃ without any post-deposition annealing.It shows a high transparency(98%),low resistivity(510 ~4 Ω·cm),and an epitaxial-like excellent interface on p-GaN with an n+-InGaN contact layer.A forward voltage of 2.82 V @ 20 mA was obtained.Most importantly,the power efficiencies can be markedly improved by 53.8%@20 mA current injection and 39.6%@350 mA current injection compared with conventional LEDs with indium tin oxide TCL(LED-Ⅲ),and by28.8%@20 mA current injection and 4.92%@350 mA current injection compared with LEDs with AZO-TCL prepared by MOCVD using O_2 as an oxidizer(LED-Ⅱ),respectively.The results indicate that the AZO-TCL grown by MOCVD using H_2O as an oxidizer is a promising TCL for a low-cost and high-efficiency GaN-based LED application.     

Large-scale SiO2 photonic crystal for high efficiency GaN LEDs by nanospherical-lens lithography

Wafer-scale SiO2 photonic crystal （PhC） patterns （SiO2 air-hole PhC, SiO2-pillar PhC） on indium tin oxide （ITO） layer of GaN-based light-emitting diode （LED） are fabricated via novel nanospherical-lens lithography. Nanoscale polystyrene spheres are self-assembled into a hexagonal closed-packed monolayer array acting as convex lens for expo- sure using conventional lithography instrument. The light output power is enhanced by as great as 40.5% and 61% over those of as-grown LEDs, for SiO2-hole PhC and SiO2-pillar PhC LEDs, respectively. No degradation to LED electrical properties is found due to the fact that SiO2 PhC structures are fabricated on ITO current spreading electrode. For SiO2- pillar PhC LEDs, which have the largest light output power in all LEDs, no dry etching, which would introduce etching damage, was involved. Our method is demonstrated to be a simple, low cost, and high-yield technique for fabricating the PhC LEDs. Furthermore, the finite difference time domain simulation is also performed to further reveal the emission characteristics of LEDs with PhC structures.     

转移基板材质对Si衬底GaN基LED芯片性能的影响

在Si衬底上生长了GaN基LED外延材料,分别转移到新的硅基板和铜基板上,制备了垂直结构蓝光LED芯片。研究了这两种基板GaN基LED芯片的光电性能。在切割成单个芯片之前,对大量尺寸为(300μm×300μm)的这两种芯片分别通高达1 A的大电流在测试台上加速老化1 h。结果显示,铜基板Si衬底GaN基LED芯片有更大的饱和电流,光输出效率更高,工作电压随驱动电流的变化不大,光输出在老化过程中衰减更小。铜基板芯片比硅基板芯片可靠性更高,在大功率半导体照明器件中前景诱人。     

星上定标光源LED长期工作的稳定性

为配合空间相机研制任务,对LED作为星上定标光源的可行性进行了研究。介绍了试验用LED的结构。从理论上分析了深能级的产生对LED发光效率的影响,引入阿仑尼斯模型对LED的衰减进行了分析。根据任务需要,对LED进行了老化试验,利用积分球法测量LED的相对发光强度,定时监测,得到LED发光强度随时间变化的曲线及趋势。根据试验结果,研究和分析了LED长时间工作的稳定性。试验结果显示,老化初期LED相对发光强度变化明显,经过250h的持续工作后,变化趋于平稳。3000h后LED相对发光强度总的衰减量约为3%,期间峰值变化量小于1.5%,满足星上定标的要求。给出了试验过程中LED的衰减情况,作为校正参考。最后根据实验结果对LED的寿命进行了理论的估算。     

GaN基功率LED电应力老化早期的退化特性

对InGaN/GaN多量子阱蓝光和绿光LED进行了室温900 mA电流下的电应力老化,发现蓝光LED老化到24h隧穿电流最小,绿光LED到6h隧穿电流最小;同时,两种LED的反向漏电也最小、光通量最大,随后绿光LED的反向漏电增加较快且光通量衰减较快.把热退火效应和电应力下缺陷的产生分别看成正负加速因子,绿光LED的负...     

势垒硅掺杂对GaN基LED极化电场及其光电性能的影响

势垒硅掺杂对InGaN量子阱中的电场及LED器件的光电性能有着重要的影响。采用6×6 K·P方法计算了不同势垒硅掺杂浓度对量子阱中电场的变化,研究表明当势垒硅掺杂浓度>1e¹⁸ cm^-3时,阱垒界面处的电场强度会变大,这主要是由于硅掺杂浓度过高导致量子阱中界面电荷的聚集。进一步发现随着势垒掺杂浓度的升高,总非辐射复合随之增加,其中俄歇复合增加,而肖克莱-霍尔-里德复合随之减少,这是由于点陷阱的增大形成了缺陷能级。电流电压曲线表明势垒掺杂可有效改善GaN基LED的工作电压,这归于掺杂浓度的提高改善了载流子的传输特性。当掺杂浓度为1e¹⁸ cm^-3时,获得了较高的内量子效率,这主要是由于适当的势垒掺杂降低了量子阱中界面电荷的损耗。     

薄膜厚度对GZO透明导电膜及其LED器件性能的影响

采用射频磁控溅射的方法制备了GZO透明导电薄膜,通过原子力显微镜(AFM)、X射线衍射仪(XRD)、霍尔效应测试仪及紫外-可见光分光光度计等手段研究了厚度对于GZO薄膜性能的影响,并制备了相应的LED器件。实验结果表明:随着薄膜厚度增加,薄膜结晶质量提高,薄膜的电阻率也随之降低。当厚度为500 nm时,薄膜的电阻率最低为2.79×10^-4 Ω·cm,同时其在460 nm蓝光区域的光透过率高达97.9%。对所制备的以GZO薄膜为透明电极的LED器件进行了测试分析,发现GZO薄膜厚度对LED的正向电压影响不大,但对LED芯片的出光效率有较大影响。     

Effect of AlGaN interlayer on luminous efficiency and reliability of GaN-based green LEDs on silicon substrate

The effect of AlGaN interlayer in quantum barrier on the electroluminescence characteristics of GaN-based green light emitting diodes(LEDs)grown on silicon substrate was investigated.The results show that AlGaN interlayer is beneficial to improve the luminous efficiency of LED devices and restrain the phase separation of In GaN.The former is ascribed to the inserted AlGaN layers can play a key role in determining the carrier distribution and screening dislocations in the active region,and the latter is attributed to the increased compressive stress in the quantum well.However,when the electrical stress aging tests were performed at a current density of 100 A/cm^2,LED devices with AlGaN interlayers are more likely to induce the generation/proliferation of defects in the active region under the effect of electrical stress,resulting in the reduced light output power at low current density.     

GaN基蓝绿光LED电应力老化分析

对InGaN/GaN多量子阱蓝光和绿光LED进行了室温20,40,60 mA加速电流下的电应力老化研究,发现蓝光与绿光样品经过60 mA电流老化424 h后,其电学性能表现出一定的共性与差异性:在小测量电流下,绿光样品的光衰减幅度较蓝光样品大~9%;而在较大测量电流 (20 mA)下,两者的光衰减幅度基本相同 (18%)。同时,蓝绿光样品的正向电学性能随老化时间的变化幅度基本一致,反映出它们具有相似的退化机制,绿光样品老化后增多的缺陷大部分体现为简单的漏电行为,而并非贡献于非辐射复合中心。在此基础上对GaN基外延结构进行了优化,优化后的LED长期老化的光衰减幅度较参考样品降低了3%。     

Casimir Force at a Finite Cut-Off

We calculate the Casimir force at a finite cut-off Λ by summing the forces induced by the all fluctuation modes. We show that the Casimir force is independent of the cut-off function in the limit LΛ → ∞. There is a correction in the order of (LΛ)^-2, when LΛ is finite and large. This correction becomes remarkable when L is comparable with the microscopic length scale Λ^-1. It has been demonstrated that the Casimir force at a finite cut-off should be defined by summing forces of all fluctuation modes, instead of the derivative of Casimir energy with respect to L where an additional derivative of the cut-off function has been introduced.     

Si(110)和Si(111)衬底上制备InGaN/GaN蓝光发光二极管

分别在Si(110)和Si(111)衬底上制备了In Ga N/Ga N多量子阱结构蓝光发光二极管(LED)器件.利用高分辨X射线衍射、原子力显微镜、室温拉曼光谱和变温光致发光谱对生长的LED结构进行了结构表征.结果表明,相对于Si(111)上生长LED样品,Si(110)上生长的LED结构晶体质量较好,样品中存在较小的张应力,具有较高的内量子效率.对制备的LED芯片进行光电特性分析测试表明,两种衬底上制备的LED芯片等效串联电阻相差不大,在大电流注入下内量子效率下降较小;但是,相比于Si(111)上制备LED芯片,Si(110)上LED芯片具有较小的开启电压和更优异的发光特性.对LED器件电致发光(EL)发光峰随驱动电流的变化研究发现,由于Si(110)衬底上LED结构中阱层和垒层存在较小的应力/应变而在器件中产生较弱的量子限制斯塔克效应,致使Si(110)上LED芯片EL发光峰随驱动电流的蓝移量更小.