Semiconductor patterning technologies for nano devices

In the era of nano devices, patterning technology encounters many challenges, which arise from not only lithography but also plasma etching. Water-immersion lithography (193 nm) is clearly within sight and many lithography technologies, including extreme ultra-violet (EUV) and other methods, are being developed as the next generation lithography technologies. For nano device etching, introduction of very thin photoresist and more complex device structure requires subtle improvement of etching. Also, the adoption of new materials such as high-k dielectric, metal gate, and phase change materials require more improvement in the view point of profile and selectivity. Finally, since the process window is getting narrower, control and monitoring technologies such as advanced process control (APC) and advanced equipment control (AEC) are strongly required.     

纳米光刻技术

纳米科学技术将成为新世纪信息时代的核心。纳米量级结构作为研究微观量子世界的重要基础之一,其制作技术是整个纳米技术的核心基础,已成为当前世界科学研究急需解决的问题。文章针对上前的科技发展情况,介绍了几种纳米光刻技术的实现新途径、发展现状和关键问题。详细阐述了波前工程、电子束光刻、离子束光刻、Ｘ射线光刻原子光刻、干涉光刻、极紫外光刻以及１５７光刻的原理和实现难点。作为下一代各种光刻技术,它们都有望实现     

193nm光刻曝光系统的现状及发展

投影曝光工艺是集成电路制造过程中的关键环节，曝光系统的工艺水平已成为衡量微电子制造技术的重要标志。重点介绍了目前193nm光刻设备曝光系统的发展现状和趋势，以及为提高曝光质量所采用的相关分辨率增强技术；通过分析曝光系统的构成和其中的关键技术，探讨了国内研制相关曝光设备所面临的挑战。     

New aspects of micromachining and microlithography using 157-nm excimer laser radiation

The use of F₂ excimer laser sources, emitting at 157 nm, constitutes a new promising tool for scientific, industrial and lithography applications. The 157-nm laser emission enables high-resolution processes and the high photon energy offers the unique possiblity of photoionizing molecules in a single step. Therefore a lower fragmentation or thermal loading takes place. The 157-nm radiation will enable fundamental research and development for deep UV (DUV) high-resolution optical microlithography in the manufacturing of integrated circuits. This is the next step from the technology of ArF lasers at 193 nm. Furthermore, benefits are expected for key technologies requiring high-resolution processing and the micromachining of tough materials like Teflon or fused silica for micro-optics fabrication. Such applications require F₂ excimer laser sources with high performance, reliability and efficiency. The world of nanotechnology is just beginning to reveal its potential.     

超大规模集成电路光学光刻技术的现状与展望

光学光刻是目前超大规模集成电路(VLSI)制备中主要的微米和亚微米的图形加工技术,这一技术将继续保持其主导地位成为90年代VLSI发展的关键。本文综述了近年来光学光刻工艺的发展,主要介绍了G线(436nm)、Ⅰ线(365nm)和准分子激光光刻的现状,并对实现高的光学光刻分辨率所必须解决的透镜设计、套准精度和像场面积等问题作了详细描述。最后展望了发展方向、     

纳米压印多孔硅模板的研究

纳米压印模板通常采用极紫外光刻、聚焦离子束光刻和电子束光刻等传统光刻技术制备,成本较高.寻找一种简单、低成本的纳米压印模板制备方法以提升纳米压印光刻技术的应用成为研究的重点与难点.本文以多孔氧化铝为母模板,采用纳米压印光刻技术对纳米多孔硅模板的制备进行了研究.在硅基表面成功制备出纳米多孔阵列结构,孔间距为350—560 nm,孔径在170—480 nm,孔深为200 nm.在激发波长为514 nm时,拉曼光谱的测试结果表明,相对于单面抛光的硅片,纳米多孔结构的硅模板拉曼光强有了约12倍左右的提升,对提升硅基光电器件的应用具有重要的意义.最后,利用多孔硅模板作为纳米压印母模板,通过热压印技术,成功制备出了聚合物纳米柱软模板.     

Fabrication of high aspect ratio subwavelength gratings based on X-ray lithography and electron beam lithography

In this paper, we present two nano-fabrication technologies that provide effective approaches for low-cost, large-scale manufacturing of nano-gratings. One grating is fabricated on polymethylmethacrylate (PMMA) with the pitch of 500 nm, and height of 2000 nm, and the other is fabricated on silicon wafer with the pitch of 666 nm, and height of 200 nm. High aspect ratio PMMA nanostructures which use X-ray lithography and electron beam lithography (EBL) are reported in this paper. These gratings can be used as molds, making it possible for industrial nano-imprinting technology to significantly cut cost and shorten process time.     

The future of focused electron beam-induced processing

A perspective is sketched for the field of focused electron beam-induced processing (FEBIP). The FEBIP lithography technique is compared to the very successful resist-based electron beam lithography (EBL) technique. The advantages of FEBIP over EBL are identified, the main advantage being its high spatial resolution. This will enable FEBIP to become an important lithography technique for the fabrication of devices with critical dimension in the range between 1 and 20 nm and serve as a complementary technique to EBL. It will be discussed what needs to be done to achieve this and what the potential applications are.     

Ultraviolet wave plates based on monolithic integration of two fully filled and planarized nanograting layers

We successfully fabricated a high-performance half-wave plate for the 405 nm wavelength based on monolithic integration of two nanograting layers. Each of the nanograting layers functions as a quarter-wave plate. Both of the nanograting layers were fully filled and planarized to achieve the monolithic integration. UV-nanoimprint lithography, along with thin-film deposition, high-aspect-ratio reactive ion etching, and trench-filling technologies, was used in fabrication and integration of the individual nanograting layers. High-aspect-ratio nanogratings with sub-50 nm linewidths and 100 nm spacing were fabricated to achieve good optical performance at the near-UV wavelength. The ability to integrate multiple nanostructure-based optical layers opens a path for integrated multifunction devices, as well as a new strategy for driving both miniaturization and cost.     

大面积10000线/毫米软X射线金属型透射光栅的设计、制作与检测

基于严格的矢量耦合波理论,优化设计了用于13.4nm软X射线干涉光刻的透射型双光栅掩模版. 采用电子束光刻技术,在国内首次成功制作了周期为100nm的大面积金属型透射光栅.光栅面积为1.5mm ×1.5mm,Cr浮雕厚度为50nm,Gap/period为0.6,衬底Si₃N₄厚度为100nm. 此光栅将用于上海光源软X射线干涉光刻实验站.利用其1级衍射光和2级衍射光将可以经济高效地制作周期为50和25nm的大面积周期结构.最后,测量了该光栅对波长为13.4nm 同步辐射光的衍射光强度,并且推算得出该光栅的1级和2级衍射效率分别为4.41%和0.49%,与理论设计值比较符合.实验结果与理论模拟结果的对比表明该光栅侧壁陡直,Gap/period的控制也与设计值符合. 关键词： 软X射线金属型透射光栅 严格耦合波方法 衍射效率 软X射线干涉光刻     

193nm光刻曝光系统的现状及发展

投影曝光工艺是集成电路制造过程中的关键环节,曝光系统的工艺水平已成为衡量微电子制造技术的重要标志。重点介绍了目前193 nm光刻设备曝光系统的发展现状和趋势,以及为提高曝光质量所采用的相关分辨率增强技术;通过分析曝光系统的构成和其中的关键技术,探讨了国内研制相关曝光设备所面临的挑战。     

物理学研究与微电子科学技术的发展

回顾了微电子学的诞生和微电子技术的发展历史，展望了微电子技术未来的发展趋势。在微电子技术延生和发展中具有一些里程碑式的发明，如晶体管、集成电路、集成电路平面工艺、MOS器件、微处理器、光刻技术、铜互连工艺的发明等，其中物理学研究和突破起子关键的基础作用。在社会需求、物理学研究和技术进步的推动下，微电子技术一直并将继续以特征尺寸缩小、集成度提高的模式，按摩尔定律预测的指数增长率发展。微电子技术的发展，不仅为物理学的研究提供了崭新的技术基础，而且为物理学研究展现了更为广阔的空间。但随着器件特征尺寸逐渐缩小并逼近期物理极限，微电子技术的发展将受到来自于材料、工艺和物理基础等方面的挑战，并呈现出多维发展的趋势，这些挑战涉及了微电子学与物理学的共同理论基础，需要二者互相锲合，期待新的突破。     

22nm极紫外光刻物镜热和结构变形及其对成像性能影响

极紫外光刻技术(EUVL)是半导体制造实现22nm及其以下节点的下一代光刻技术。在曝光过程中,EUVL物镜的每一面反射镜吸收35%～40%的入射极紫外(EUV)能量,使反射镜发生热和结构变形,影响投影物镜系统的成像性能。基于数值孔径为0.3,满足22nm技术节点的产业化EUV投影物镜,采用有限元分析(FEA)的方法研究反射镜变形分布,再将变形导入光学设计软件CODE V中,研究反射镜变形其对成像特性的影响。研究结果表明:当达到硅片的EUV能量为321mW,产量为每小时100片时,反射镜最高升温9.77℃,通光孔径内的最大变形为5.89nm;若采用相干因子0.5的部分相干光照明,变形对22nm线宽产生6.956nm的畸变和3.414%的线宽误差。     

Nanotechnology in the Chemical Industry – Opportunities and Challenges

The traditional chemical industry has become a largely mature industry with many commodity products based on established technologies. Therefore, new product and market opportunities will more likely come from speciality chemicals, and from new functionalities obtained from new processing technologies as well as new microstructure control methodologies. It is a well-known fact that in addition to its molecular structure, the microstructure of a material is key to determining its properties. Controlling structures at the micro- and nano-levels is therefore essential to new discoveries. For this article, we define nanotechnology as the controlled manipulation of nanomaterials with at least one dimension less than 100nm. Nanotechnology is emerging as one of the principal areas of investigation that is integrating chemistry and materials science, and in some cases integrating these with biology to create new and yet undiscovered properties that can be exploited to gain new market opportunities. In this article market opportunities for nanotechnology will be presented from an industrial perspective covering electronic, biomedical, performance materials, and consumer products. Manufacturing technology challenges will be identified, including operations ranging from particle formation, coating, dispersion, to characterization, modeling, and simulation. Finally, a nanotechnology innovation roadmap is proposed wherein the interplay between the development of nanoscale building blocks, product design, process design, and value chain integration is identified. A suggestion is made for an R&D model combining market pull and technology push as a way to quickly exploit the advantages in nanotechnology and translate these into customer benefits.     

Design and analysis of the single-step nanoimprinting lithography equipment for sub-100 nm linewidth

Nanoimprint lithography (NIL) is the cutting-edge technology to produce sub-100 nm scale features on substrates. The fundamental procedure of nanoimprint lithography is replicating the patterns defined in the stamp to any deformable materials such as photoresist spun on substrates by pressing and the physical shape of the resist is deformed during the imprinting process. In this study, for the single-step nanoimprinting process, the 4-in. imprinting head, the fabricated 4-in. mask, the alignment system for multi-layer processes, and the six-DOF compliant mechanism of a wafer stage for single-step nanoimprinting on a 4-in. wafer are proposed. Using the designed nanoimprinting equipment, the nanoscale patterns with 100 nm linewidth and 150 nm height were clearly patterned on the substrate. Finally, the nanoimprinting results show the validity of the developed equipment.     

50 nm分辨力极端紫外光刻物镜光学性能研究

极端紫外光刻 (EUVL)作为实现 10 0～ 32nm特征尺寸微细加工的优选技术 ,其光刻物镜的光学性能是实现高分辨图形制作的关键。利用光学设计软件CODEV对 6枚非球面反射镜构成的光刻物镜设计和光学性能分析 ,其分辨力可以实现 5 0nm ,曝光面积为 2 6mm× 1mm。结果表明 ,光学性能对曝光场点的依赖关系。在全曝光场中进行了光学性能分析 ,其最大畸变为 3.77nm ,最大波面差为 0 .0 31λ(均方根值 ) ,该缩小投影物镜完全可以满足下一代极端紫外光刻机的性能要求     

Surface phenomena related to mirror degradation in extreme ultraviolet (EUV) lithography

One of the most promising methods for next generation device manufacturing is extreme ultraviolet (EUV) lithography, which uses 13.5 nm wavelength radiation generated from freestanding plasma-based sources. The short wavelength of the incident illumination allows for a considerable decrease in printed feature size, but also creates a range of technological challenges not present for traditional optical lithography. Contamination and oxidation form on multilayer reflecting optics surfaces that not only reduce system throughput because of the associated reduction in EUV reflectivity, but also introduce wavefront aberrations that compromise the ability to print uniform features. Capping layers of ruthenium, films ∼2 nm thick, are found to extend the lifetime of Mo/Si multilayer mirrors used in EUV lithography applications. However, reflectivities of even the Ru-coated mirrors degrade in time during exposure to EUV radiation. Ruthenium surfaces are chemically reactive and are very effective as heterogeneous catalysts. In the present paper we summarize the thermal and radiation-induced surface chemistry of bare Ru exposed to gases; the emphasis is on H₂O vapor, a dominant background gas in vacuum processing chambers. Our goal is to provide insights into the fundamental physical processes that affect the reflectivity of Ru-coated Mo/Si multilayer mirrors exposed to EUV radiation. Our ultimate goal is to identify and recommend practices or antidotes that may extend mirror lifetimes.     

激光超衍射加工机理与研究进展

随着纳米科技和微纳电子器件的发展,制造业对微纳加工技术的要求越来越高.激光加工技术是一种绿色先进制造技术,具有巨大的发展潜力,己广泛应用于不同的制造领域.为实现低成本、高效率、大面积尤其是高精度的激光微纳加工制造,研究和发展激光超衍射加工技术具有十分重要的科学意义和应用价值.本文首先阐述了基于非线性效应的远场激光直写超衍射加工技术的原理与国内外发展状况,包括激光烧蚀加工技术、激光诱导改性加工技术和多光子光聚合加工技术等;然后介绍了几种基于倏逝波的近场激光超衍射加工技术,包括扫描近场光刻技术、表面等离子激元光刻技术等新型超衍射激光近场光刻技术的机理与研究进展;最后对激光超衍射加工中存在的问题及未来发展方向进行了讨论.     

激光等离子体极紫外光刻光源

研究并讨论了下一代光刻的核心技术之一—激光等离子体极紫外光刻光源。简要介绍了欧美和日本等国极紫外光刻技术的发展概况,分析了新兴的下一代13.5 nm极紫外光刻光源的现状,特别讨论了国内外激光等离子体极紫外光刻光源的现状,指出目前其存在的主要问题是如何提高光源的转化效率和减少光源的碎屑。文中同时概述了6.x nm（6.5～6.7 nm）极紫外光刻光源的最新研究工作。最后,介绍了作者所在研究小组近年来在极紫外光源和极紫外光刻掩模缺陷检测方面开展的研究工作。     

Dry etch damage and its effect on electronic and optical nanostructures

The creation of nano-structures in 3–5 semiconductors is currently of great interest. If the conventional route of pattern definition in a resist followed by pattern transfer is used, this implies in most cases electron beam lithography and some form of dry etching. Using electron beam lithography, patterns of 10nm width on 40nm centre to centre spacing can be transfered to metal lines on thin substrates; even on normal wafers, linewidths of 25nm on 60nm spacing are achievable with state of the art machines.If the creation of a raised structure is necessary because of the physics of the situation, it is important to consider the damage which may be introduced by dry etching. The methods by which dry etch damage can be revealed are discussed, and the ways in which it can be reduced mentioned. Progress towards understanding the microscopic nature of the damage will be reviewed. Examples are drawn from etching of GaAs/GaAlAs in Silicon tetrachloride and methane/hydrogen.