质子注入MBE碲镉汞n-on-p结性能研究

基于中波响应波段的分子束外延碲镉汞薄膜材料成功制备出不同质子注入剂量的大光敏元(5 00μm×500μm)的n-on-p结构的p-n结，并对相应的p-n结的电流-电压（I-V）特性进行 了研究.质子注入剂量为2×10¹⁵cm^-2时R₀A达312.5Ω ·cm²，低温热处理后达490Ω·cm². 关键词： I-V特性 碲镉汞薄膜 质子注入 p-n结     

HgCdTe器件中载流子扩散长度的硼离子注入效应研究

报道了非直接接触、高分辨率的激光束诱导电流谱表征技术在检测半导体材料、器件工艺中的应用.研究结果表明:p型HgCdTe薄膜经硼离子注入后形成的n型区面积大于实际的离子注入区域；对不同注入剂量系列单元不同区域载流子扩散长度进行了提取,表明n区载流子扩散长度随硼离子注入剂量增加而减小.     

氧非正分La0.9Ba0.1MnO3-δ/SrTiO3:Nb p-n异质结的整流特性研究

利用脉冲激光沉积技术在掺Nb的SrTiO₃衬底上制备了氧非正分La_0.9Ba_0.1MnO_3-δ/SrTiO₃:Nb p-n异质结.在20—300K这一较宽的温度范围内获得了光滑的整流曲线.整流实验表明：该p-n异质结的正向扩散电压V_D随着温度升高在薄膜金属—绝缘转变温度附近出现极大值,表现出与氧正分La_0.9Ba_{0. 关键词： 0.9}Ba_0.1MnO_3-δ薄膜')" href="#">La_0.9Ba_0.1MnO_3-δ薄膜 锰氧化物p-n结 整流性质     

硼掺杂对四面体非晶碳膜电导性能的影响

以单质硼和高纯石墨的混合粉末压制成型的靶材作为靶源,采用过滤阴极真空电弧技术制备不同硼含量的掺硼四面体非晶碳膜.分别采用四探针法、阻抗分析仪和电化学界面对薄膜的变温电导率、I-V特性和C-V特性进行了测试和研究.实验结果表明,当B含量由0增加至6.04 at%时,薄膜的室温电导率先逐渐增大而后逐渐减小,相应薄膜的电导激活能先逐渐减小而后逐渐增大,并在2.13 at%时分别出现最大和最小值1.42×10^-7S/cm和0.1eV.此外,掺硼四面体非晶碳/n型硅异质结的I-V曲线表现出典型的整流特性,表明p-n结二极管已经形成,且结两端的掺杂能级在空间上连续统一. 关键词： 四面体非晶碳 电导率 I-V曲线')" href="#">I-V曲线 C-V曲线')" href="#">C-V曲线     

N2掺杂p型ZnO及ZnO同质p-n结LED的制备

采用射频等离子体辅助分子束外延方法,以N₂作为掺杂源,以O₂作为辅助分解的气体和氧源,通过等离子体光谱的实时监测来控制掺杂源中各组分的含量,制备了p型ZnO薄膜及同质p-n结。I-V曲线显示该p-n结具有整流特性,直流驱动下获得了稳定的室温电致发光,包括位于420nm附近的发光峰和500~700nm的发光带。     

碲镉汞异质结能带结构的优化设计

分别对带隙较宽(较窄)的p型材料在带隙较窄(较宽)的n型材料之上的碲镉汞(MCT)异质结的能带结构进行了理论分析.在应用的理论模型中提出了一个简单的载流子浓度近似模型用于计入载流子简并效应和导带非抛物线性，同时还考虑到了价带失配的影响.就p-n结位置(z_B)和界面电荷密度(Q)两个参数对MCT异质结能带结构的影响进行了系统分析，发现这些影响是不可忽略的.根据这些影响特征，进一步得出了z_B和Q参数之间的优化设计规律. 关键词： 碲镉汞(MCT) 异质结 载流子浓度近似     

硼离子注入多晶铁薄膜的非晶化作用的研究

不同剂量的硼离子注入的多晶铁薄膜的磁导率随注入剂量增加呈现非单调上升,其⁵⁷Fe转换电子穆斯堡尔谱显示了非晶态合金的生成,结果支持临界缺陷密度非晶化模型。 关键词：     

氧离子注入微晶金刚石薄膜的微结构与光电性能研究

本文系统研究了氧离子注入剂量和退火温度对含有Si-V发光中 心的微晶金刚石薄膜的微结构和光电性能的影响. 结果表明, 氧离子注入并在较高温度退火有利于提高薄膜中Si-V中心的发光强度. 当氧离子注入剂量从10¹⁴ cm^-2增加到10¹⁵ cm^-2时, 薄膜中Si-V发光强度增强. Hall效应测试结果表明退火后薄膜的面电阻率降低. 不同温度退火时, 氧离子注入薄膜的Si-V发光强度较强时, 薄膜的面电阻率增加, 说明Si-V发光中心不利于提高薄膜的导电性能. Raman光谱测试结果表明, 薄膜中缺陷数量的增多会增强Si-V的发光强度, 而降低薄膜的导电性能. 关键词： 金刚石薄膜 氧离子注入 电学性能 Si-V缺陷     

Co离子注入TiO2薄膜的显微结构和磁性研究

利用直流磁控溅射技术在玻璃衬底上沉积了TiO₂薄膜,并对其进行了Co离子注入,最后在真空中500 ℃退火50 min,得到系列薄膜样品. 利用剥离-分散方法制备了薄膜的透射电镜样品,并用扫描电镜(SEM)、X射线能量散射谱(EDX)和高分辨透射电镜(HRTEM)对样品做了近似原位观察,研究了薄膜样品中不同Co离子注入深度的成分分布和显微结构. 结果表明,薄膜呈锐钛矿结构,Co元素主要分布在薄膜表层,Co离子的注入使TiO₂薄膜的晶粒被部分破坏,并形成CoO,而5 关键词： 2薄膜')" href="#">Co注入TiO₂薄膜 电镜原位观察 室温铁磁性     

YBa2 Cu3 O7-δ/SrNb0.01 Ti0.99 O3 p-n结的制备及其特性

采用脉冲激光沉积技术,在n型SrNb0.01Ti0.99O3(SNTO)单晶基片上生长p型YBa2Cu3O7-δ(YBCO)薄膜,制备出YBCO/SNTO p-n结.YBCO薄膜是高度c轴织构的超导薄膜,且具有良好的超导电性.YBCO/SNTO p-n结具有较好的整流特性和很好的温度与磁场稳定性.     

Spatial distribution of defects produced by boron ion implantation of silicon

A simple technique for the study of the spatial distribution of the damage produced by ion implantation of silicon has been developed. The damage depth distribution for 40 keV boron ions in silicon has been studied at irradiation doses from 7 × 10¹¹ to 3.9 × 10¹⁴ ions/cm² and the relative defect peak depth R _d/R _p = 0.85 determined. An increase of layer conductivity as the surface part of the implanted layer is removed has been revealed. This effect is caused by the presence of radiation defects in the surface region of the layer. The “electrical” cluster diameter is about 28 A and the overlapping cluster dose is close to 1 × 10¹³ ions/cm².     

The performance of Hg1−x Zn x Te photodiodes

This paper considers the Hg_1–x Zn _x Te alloy system as a potential material for the fabrication of infrared photodiodes. The influence of different junction current components (diffusion, tunneling and depletion layer currents) on the R ₀ A product of n⁺-pHg_1–x Zn _x Te photodiodes is analysed. The upper theoretical limits of the R ₀ A product and detectivity are determined. Results of calculations are compared with experimental data reported by other authors and those measured in our laboratory. Preliminary results on related technology and the properties of Hg_1–x Zn _x Te prepared by the ion-etching technique are presented.     

Linear HgCdTe IR FPA 288×4 with bidirectional scanning

The long wavelength (8–12 μm) IR FPA 288×4 based on a hybrid assembly of n⁺-p diode photosensitive arrays (PA) of HgCdTe (MCT) MBE-grown structures and time delay integration (TDI) readout integrated circuits (ROIC) with bidirectional scanning have been developed, fabricated, and investigated. The p-type MCT structures were obtained by thermal annealing of as-grown n-type material in inert atmosphere. The MCT photosensitive layer with the composition 0.20–0.23 of mole fraction of CdTe was surrounded by the wide gap layers to decrease the recombination rate and surface leakage current. The diode arrays were fabricated by planar implantation of boron ions into p-MCT. The typical dark currents were about 4–7 nA at the reverse bias voltage of 150 mV. The differential resistance R was up to R₀ = 1.6×10⁷ Ω zero bias voltage, which corresponded to R₀A ～70 Ω ·cm² and to the maximal value R_max = 2.1 × 10⁸ Ω. The bidirectional TDI deselecting ROIC was developed and fabricated by 1.0-μm CMOS technology with two metallic and two polysilicon layers. The IR FPAs were free of defect channels and have the average values of responsivity S_λ = 2.27×10⁸ V/W, the detectivity D_λ ^* = 2.13 × 10¹¹ cm × Hz^1/2 × W^t1, and the noise equivalent temperature difference NETD = 9 mK.     

Two-colour HgCdTe infrared detectors operating above 200 K

The performance of dual waveband HgCdTe photodiodes fabricated using metaloorganic chemical vapour deposition operated at high temperatures is presented. The effect of additional separating layer on the quantum efficiency and cross-talk of the photodiodes is analyzed. The photodiodes with cutoff wavelengths up to 6 μm, good R₀A product, and high quantum efficiency at 200 K have been demonstrated. The temperature dependence of the differential resistance is discussed. It is shown that the multilayer heterojunction P-n-N-n-P structure operating in a simultaneous mode has better performance than a structure operating in a sequential mode.     

Pb(Zr,Sn,Ti)O3反铁电陶瓷场诱相变性能的改进

为了获得场诱反铁电(AFE_t)—铁电(FE_Ｒ)相变临界电场E_{f小、电滞ΔE小、场致应变x适当的反铁电陶瓷,对Pb(Zr, Sn, Ti)O3采用Ba ^2＋置换Pb^2＋,同时在四方反铁电相AFEt—三方铁电F EＲ相界附近调节Ti/Sn比,来控制FEＲ-AFEt,AFEt关键词： Pb(Zr Sn 3基反铁电陶瓷')" href="#">Ti)O3基反铁电陶瓷 场诱相变 场致应变 掺杂改性}     

21.0%‐efficient co‐diffused screen printed n‐type silicon solar cell with rear‐side boron emitter

Plasma enhanced chemical vapor deposition (PECVD) is applied to deposit boron silicate glasses (BSG) acting as boron diffusion source during the fabrication of n‐type silicon solar cells. We characterize the resulting boron‐diffused emitter after boron drive‐in from PECVD BSG by measuring the sheet resistances R_sheet,B and saturation current densities J_0,B. For process optimization, we vary the PECVD deposition parameters such as the gas flows of the precursor gases silane and diborane and the PECVD BSG layer thickness. We find an optimum gas flow ratio of SiH₄/B₂H₆= 8% and layer thickness of 40 nm. After boron drive in from these PECVD BSG diffusion sources, a low J_0,B values of 21 fA/cm² is reached for R_sheet,B = 70 Ω/□. The optimized PECVD BSG layers together with a co‐diffusion process are implemented into the fabrication process of passivated emitter and rear totally diffused (PERT) back junction (BJ) cells on n‐type silicon. An independently confirmed energy conversion efficiency of 21.0% is achieved on 15.6 × 15.6 cm² cell area with a simplified process flow. This is the highest efficiency reported for a co‐diffused n‐type PERT BJ cell using PECVD BSG as diffusion source. A loss analysis shows a small contribution of 0.13 mW/cm² of the boron diffusion to the recombination loss proving the high quality of this diffusion source. (© 2016 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Possibilities of the formation of carbides and borides by ion implantation

In the system of boron and carbon, the formation of boron carbide was investigated after ion implantation of 25 keV B ions into carbon or of 25 keV C ions into boron and subsequent annealing. TEM and electron diffraction studies showed that the crystallization of boron carbide begins only at temperatures above 1050°C. By implantation of 20 keV C ions into iron (ion dose 10¹⁷ C ions/cm²) only the metastable ε-Fe₂O will be generated, which at above 220°C transforms into the stable cementite Fe₃C. After implantation of 20 keV B ions into iron, no formation of iron boride could be found. These experimental facts can be understood qualitatively with the help of the thermal-spike model. The energy density or the temperature in the thermal spikes is not sufficient for the generation of cementite iron boride or boron carbide.     

Special Features of the Correlation between the Uranium–Oxygen Interatomic Distances and the Frequencies of the Valence Vibrations of the UO2 2+ Group in Complex Compounds of Uranyl

We considered the factors due to which the dependences between the uranium–oxygen distances R ₀ and the frequencies of valence vibrations _as for complex compounds of uranyl are described by two independent expressions generally represented by equations of the type R ₀ = a + b_as ^–2/3 (b > 0) with the coefficients a and b differing in the regions R ₀ < 0.178 nm and R ₀ > 0.178 nm. It is shown that the reason is that there is a mutual effect of the ligands in the uranyl complex responsible for different partial contributions of the uranium orbitals and of the atoms of the first coordination sphere to the chemical bonding.     

Operator formulation of Regge asymptotic behavior

If the appropriate high-energy limits of the amplitudes $\text{W ≡ ?}\text{d}\text{x}\text{e}{}^{\mathrm{<mtext>i</mtext><mtext>q\; ·\; x</mtext>}}\text{<b|j(x)j′(0)|b′ >}$ are Regge pole dominated, then the large distance (x₀ → ∞, x²fixed) behavior of the current product is completely characterized by an operator expression $\text{R}\text{(x : 0)}$, involving only local operators at 0, which is such that $\text{R ≡ ?}\text{d}\text{x}\text{e}{}^{\mathrm{<mtext>i</mtext><mtext>q\; ·\; x</mtext>}}\text{<b|}\text{R}\text{|b′ >}$ and W have the same high-energy behavior. In the only case (|b> a single particle stateand |b′> the vacuum) where W is not Regge behaved, it is shown that R is identical to W, and so the relation $\text{jj′ →}\text{R}$ is established as a large distance operator expansion, valid between all states. $\text{R}$ is expressed as a differential operation B(□_x, ?_x · ?₀, □₀) on the light-cone expansion and some of its properties are deduced by carrying out the differentiations. A second form of $\text{R}$ is given in terms of non-local “reggeon” field operators R_αm(0) (α is a (fixed) spin index and m is a (variable) helicity index) which might be useful coordinate in reggeon field theories. These operators can be used to define reggeon-particle amplitudes and if conventional double-Regge and triple-Regge behaviors are further assumed, the large distance behaviors of the current-reggeon and reggeon-reggeon field products are specified in terms of other reggeon fields.