红外薄膜中热应力的研究

由于红外薄膜材料和基板热膨胀系数显著不同,所以在高温基板上镀膜后降温将产生热应力,进而引起边界分层破裂现象,影响薄膜器件的牢固性.对薄膜厚度、杨氏模量和热膨胀系数对薄膜分层破裂的影响进行了研究,同时分析了薄膜设计对减小分层破裂的作用.这对减小红外薄膜系统因热应力引起的分层破裂现象具有实际应用价值. 关键词： 多层介质薄膜 红外 热应力 分层破裂     

下电极对ZnO薄膜电阻开关特性的影响

本文采用直流磁控溅射法在三种不同的下电极(BEs)上制备了ZnO薄膜, 获得了W/ZnO/BEs存储器结构. 研究了不同的下电极材料对器件电阻开关特性的影响. 研究结果表明, 以不同下电极所制备的器件都具有单极性电阻开关特性. 在低阻态时, ZnO薄膜的导电机理为欧姆传导, 而高阻态时薄膜的导电机理为空间电荷限制电流. 不同下电极与ZnO薄膜之间的肖特基势垒高度对电阻开关过程中的操作电压有较大的影响, 并基于导电细丝模型对不同下电极上ZnO薄膜的低阻态阻值及reset电流的变化进行了解释. 关键词： ZnO薄膜 电阻开关 下电极     

胶粘光学元件的热应力和变形分析

由于光学元件和装配材料热膨胀系数的不匹配,在环境温度变化时会导致光学元件中产生热应力,并引起光学元件表面产生变形,影响光学系统的性能.针对光学元件的粘接固定方式讨论了连续边缘粘接引起的热应力和变形的分析方程,得出连续边缘粘接无热厚度的解析方程.采用有限元分析软件对胶粘固定光学元件进行了建模和热应力分析,得出光学元件边界...     

纳米金属掩膜和离子辐照技术制备高温超导约瑟夫森结

研究了一种利用纳米金属掩膜和离子辐照技术在高温超导YBCO薄膜上制备Josephson结的方法.首先用在YBCO薄膜甩上一层800nm左右的光刻胶(PMMA),继而在光刻胶上用直流磁控溅射的方法镀上一层大约300nm左右的Cr膜,利用紫外曝光和离子刻蚀的方法在YBCO薄膜上形成覆盖有Cr膜的微桥,然后,利用聚焦离子束系统(FIB)在微桥上刻出一个50nm左右的狭缝,最后利用120keV的H2 对狭缝内的材料进行辐照,从而使狭缝部分的材料超导电性减弱,形成类似SNS型的Josephson结.     

柔性复合薄膜成形极限曲线的视觉测定方法

针对柔性复合薄膜成形试验中极限应变难以测量的问题,提出一种基于双目立体视觉结合数字图像相关法的测量方法.首先对于薄膜材料成形过程中产生大变形或裂纹时图像难以匹配的问题,根据系列图像相邻状态变形的连续性,提出了一种图像匹配基准自适应更新的弱相关分步匹配方法;然后根据薄膜材料表面应变分布不同于钢制件的特性,提出了一种构建应...     

GMI/超导复合磁强计的超导磁通变换器设计和研究

介绍了一种基于高温超导薄膜材料的具有微弱磁场放大能力的超导磁通变换器。该磁通变换器是本课题组提出的超高精度GMI/超导复合磁强计的核心部件。其基本结构是一个带有轭形微桥结构的闭合超导环,超导环的微桥部分只有几十微米宽,此种高质量的微桥结构是通过半导体光刻精密微加工技术获得的。其较大的超导环面积可以增大磁通汇集区域,提高磁场分辨率;狭窄的微桥结构形成磁场增强的区域,是低场磁敏感器件的工作区域。对此种超导磁通变换器的磁通放大能力进行了分析,并通过仿真对不同尺寸的超导环磁场放大倍数进行了计算。理论计算的结果在磁光成像实验中获得了初步的验证,为复合传感器的实现和优化设计奠定了技术基础。     

La0.3Sr0.7TiO3模板层对Pb(Zr0.5Ti0.5)O3薄膜的铁电性能增强效应的研究

通过sol-gel法在si(111)基片上分别制备了LaNiO3(LNO)底电极和LaNiO3/Sr0.7TiO3(LNO/LSTO)底电极.然后采用sol-gel方法,在两种衬底上分别制备了Pb(Zr0.5Ti0.5)O3(PZT)铁电薄膜.XRD分析表明,两种PZT薄膜均具有钙钛矿结构,且在LNO底电极上的PZT薄膜呈(100)择优取向,而在LNO/LSTO底电极上的PZT薄膜呈随机取向.铁电性能测试表明,相对LNO衬底上制备的PZT薄膜,在LNO/LSTO底电极上制备的PZT薄膜的剩余极化强度得到了有效的增强,同时矫顽场也增大.介电常数和漏电流的测试表明,LNO/LSTO底电极上制备的PZT薄膜具有大的介电常数和漏电流.     

基于高温超导本征约瑟夫森效应的新型两端恒流器件

我们利用高温超导本征约瑟夫森效应,研制了一种超导薄膜两端恒流器件.恒流器件是将生长在斜切20度LaAlO3基片上的Tl-2212超导薄膜光刻成微桥得到的.对于6μm×8μm的微桥器件,其最高工作电压可达15V以上,当两端电压在1V～11V之间变化时,电流基本稳定在4.3mA,误差不超过±5%,动态内阻大于104 Ω,在最佳工作位置(3V～8V)动态内阻可以达到105 Ω.通过数字模拟,对实际应用中两端恒流器件的rf调制进行了较详细的分析,并可使恒定电流上rf调制小于1%.     

新型电极材料Sb掺杂BaSnO_3薄膜的外延生长及其在铁电薄膜电容器中的应用

本文利用脉冲激光沉积技术在SrTiO_3单晶衬底上生长了Sb掺杂BaSnO_3(BSSO)外延薄膜.结构和输运性质测量结果显示BSSO薄膜是一种具有立方钙钛矿结构导电性很好的薄膜材料,80K时呈现金属绝缘体转变,室温下薄膜的电阻率、载流子浓度和迁移率分别为ρ=2.43 mΩcm,n=1.65×1021 cm~(-3)和μ=1.75 cm~2/Vs.以BSSO薄膜为底电极制备了具有比较好电滞回线的Pb(Zr_(0.52)Ti_(0.48))O_3和Bi(Mn_(0.05)Fe_(0.95))O_3铁电电容器,表明BSSO薄膜是一种具有应用前景的新型电极材料.     

脉冲激光辐照TiO2/SiO2薄膜热效应研究

 采用1.06 μm单脉冲激光在不同能量密度下辐照特殊光电系统中典型薄膜光学元件，理论分析了激光辐照薄膜元件产生的温度场和热应力场，在此基础上建立了激光辐照多层薄膜的物理模型，计算软件使用ANSYS软件的热分析模块对激光辐照薄膜元件产生的温度场和热应力场进行了模拟，分别给出不同激光能量密度下薄膜表面光斑中心的温度场、径向温度场和轴向温度场分布；同时给出不同能量密度下薄膜的轴向、径向和环向热应力分布。并对激光辐照薄膜元件产生的温度场、热应力场进行了分析，阐明了原因。     

Resistively shunted Josephson tunnel junctions

SIS tunnel junctions have externally been shunted by a thin metallic film. It is shown that such devices exhibit radiation induced steps as point contacts or microbridges. This result agrees qualitatively with the commonly used lumped circuit model of Josephson junctions.     

Output beam drift and deformation in high-power COIL

During the operation of a chemical oxygen iodine laser (COIL) with an unstable resonator of a large Fresnel number, as the output power increases, an instability of the output laser beam will appear, behaving mainly as far-field beam spot drift and deformation. In order to interpret this phenomenon, thermal expansion analysis on the scraper with finite element analysis method and a simulation of the output beam mode of this kind of laser by the method of Fast Fourier Transform were developed. From the experimental measurement and the calculation, we proposed that the presence of the nonuniform temperature distribution of scraper causes the front surface of the scraper to tilt and bulge due to thermal expansion. As the output power is increasing, all the mirror surfaces, especially the scraper's, will absorb more and more heat, causing thermal expansion of the mirror front surface to occur more seriously, thus resulting in the tilting and deformation of the far-field beam spot. The initial misalignment of the direction is also an important factor leading to the far-field beam spot drift and deformation.     

Numerical investigation on thermal properties at Cu-Al interface in micro/nano manufacturing

A hybrid model by integrating TTM (two-temperature model) and MD (molecular dynamics) is proposed to investigate the properties on interface of dissimilar materials under thermal flux conditions. This model can describe the electron phonon coupling and phonon scattering at the interface of different metals easily. By comparing the Cu-Cu interface and Cu-Al interface, the atoms of the Cu-Cu interface at different sides tend to move together; while, the atoms displacements of Cu and Al are opposite along the interface, which may cause stress and voids at the interface. Moreover, the propagation mechanisms of nanocracks and the corresponding change of temperature distribution and thermal flux are investigated. The results show that the interfaces of dissimilar materials are prone to crack initiations, leading to delaminations because of the high temperature. All these are useful for understanding the deformation and failure of the interfaces structures. It implies a potential method for design and analysis of interface structure in micro/nano manufacturing.     

Deformation and stress-induced transformation of polybutene-1

The deformation at room temperature of thick (ca. 2 mm) and thin (ca. 1000 Å) films of polybutene was characterized by electron microscopy and electron x-ray diffraction. The thin films, as studied, draw by micronecking whereas the thick films draw uniformly. In both types of samples the details of the deformation process varied with the orientation of the lamellae in the original spherulitic structure; in all cases, however, the lamellae broke up into “mosaic” blocks prior to uniform fibril formation. The tetragonal-hexagonal phase transformation accompanying the deformation of fresh polybutene films generally appeared to occur within the blocks except in those situations in which the lamellae are being drawn perpendicular to the molecular axes, that is, parallel to the lamella surface; in the latter case the tetragonal form can be at least partially retained until unfolding and fibril formation occurs.     

Experimental simulation and theoretical analysis of the thermal deformation of dielectric plates under submicrosecond radiation heating

The flexural deformation of dielectric plates subjected to submicrosecond thermal stresses generated by volume and surface sources is studied. The action of such stresses is simulated by laser irradiation of colored glass plates with different optical absorption factors. Such an approach to simulating the thermomechanical action of radiation on dielectric materials allows researchers to visualize the qualitative and quantitative thermoelastic response of the plates to the action of pulsed sources of thermal stresses with different spatial parameters. For volume sources of thermal stresses, it is shown that the thermal deformation of a dielectric plate can be viewed as a set of quasi-harmonic extension-compression wave processes combined with the quasi-static bend of the plate. Under the action of surface sources of submicrosecond thermal stresses, the deformation mechanism is a superposition of the thermal deformation of a thin surface layer and a pulse wave process resulting in the bend of the plate when the pulses reverberate between the surfaces of the plate. Approximate analytical models of thermal deformation due to pulsed thermal disturbances are suggested that make it possible to predict the extent of bend versus the absorbed energy dose under the action of both volume and surface sources of thermal stresses.     

The effects of plasma treatment on the thermal stability of HfO2 thin films

The thermal stability of pure HfO₂ thin films is not high enough to withstand thermal processes, such as S/D activation or post-metal annealing, in modern industrial CMOS production. In addition, plasma nitridation technology has been employed for increasing the dielectric constant of silicon dioxide and preventing boron penetration. In this experiment, atomic layer deposition (ALD) technology was used to deposit HfO₂ thin films and inductively coupled plasma (ICP) technology was used to perform plasma nitridation process. The C-V and J-V characteristics of the nitrided samples were observed to estimate the effect of the nitridation process. According to this study, plasma nitridation process would be an effective method to improve the thermal stability of HfO₂ thin films.     

Study of the Thermal Diffusivity of Optical Coating by Photo－thermal Deformation Technique

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Thermal behaviour of high-temperature superconducting fault current limiters: Application to microlimiters

Fault current limiters are one of the most promising applications of high-temperature superconductors. Two important and interrelated aspects of these devices are their thermal behaviour and their refrigeration. Here we will present some results of our recent researches about this topic concerning the possibility of using superconducting thin-film microbridges as very efficient microlimiters intended to operate at very low powers as could be superconducting microelectronics applications (SQUID based electronics, infrared detectors, etc.).     

Molecular Dynamic Simulation of High Speed Deformation Effect on Microstructure Change in Thermal Heated Metals

In the present paper computer simulation of high-speed deformation (shock wave propagation) by molecular dynamic method is performed in thin copper sample, having the form of rectangular parallelepiped (10 a ‐ 10 a ‐ 20 a , where a is the lattice constant) with 8000 atoms. On the surfaces Z 0 =0 and Z max =20 a the mirror boundary conditions with rigid walls and the periodic boundary conditions along X and Y directions corresponding to short sides of deformed crystal are used, which allows to investigate the reflection of shock wave from the surfaces in Z direction. The changes of microstructure have been investigated up to 12 ps. The numerical calculations of microstructure changes have been performed here taking into account the effect of thermal heating of crystal lattice before shock wave front. The numerical results show that comparing with the propagation of shock waves under room temperature in thermal heated structure additional displaced atoms (vacancies and interstitials) are produced. The obtained results show that the production of point defects during high-speed deformation is determined by the thermal softening of microstructure and generation rate of point defects very strong increases with an increasing of high speed deformation rate. The peculiarities of microstructure changes in deformed copper are analyzed here at the different initial temperatures and various high-speed deformations (average ion velocities behind shock wave).     

Parameter Optimizing Experiment for Laser Shock-procesing on Anti-fatigue and-Fracture Property of Metal

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