使用TEGa和TMGa为镓源MOCVD生长GaN的研究

采用自行研制的立式MOCVD生长系统 ,以TMGa、TEGa为Ga源 ,在不同的生长条件下生长GaN单晶膜。然后对样品进行室温光致发光光谱测试、范德堡霍尔测量和X射线双晶衍射测试。实验结果表明 ,缓冲层的Ga源不同对GaN单晶膜质量影响很大 ;以TEGa为Ga源生长缓冲层及外延层 ,外延层不连续 ;以TMGa为缓冲层Ga源、TEGa为外延层Ga源 ,在此得到室温载流子浓度为 4 5× 1 0 17cm-3 ,迁移率为 1 98cm2 /V·s的电学性能较好的GaN单晶膜。研究结果表明 :使用TEGa为外延层Ga源生长GaN ,能有效地抑制不期望的蓝带的出现。     

氢化物气相外延生长高质量GaN膜生长参数优化研究

系统研究了低温成核层生长时间、高温生长时的V/Ⅲ 比以及生长温度对氢化物气相外延生长GaN膜晶体质量的影响. 研究发现合适的低温成核层为后续高温生长提供成核中心, 并能有效降低外延膜与衬底间的界面自由能, 促进成核岛的横向生长; 优化的V/Ⅲ比和最佳生长温度有利于降低晶体缺陷密度, 促进横向生长, 增强外延膜的二维生长. 利用扫描电子显微镜、原子力显微镜、高分辨X射线衍射、 低温光致发光谱和室温拉曼光谱对优化条件下生长的GaN外延膜进行了结构和光电特性表征. 测试结果表明, 膜表面平整光滑, 呈现二维生长模式表面形貌; (002)和(102)面摇摆曲线半高宽分别为317和343 arcsec; 低温光致发光谱中近带边发射峰为3.478 eV附近的中性施主束缚激子发射峰, 存在11 meV的蓝移, 半高宽为10 meV, 并且黄带发光强度很弱;常温拉曼光谱中E₂ (high) 峰发生1.1 cm^-1蓝移.结果表明, 优化条件下生长的GaN外延膜具有良好的晶体质量和光电特性, 但GaN 膜中存在压应力. 关键词： 氮化镓 氢化物气相外延 低温成核层     

氧离子注入微晶金刚石薄膜的微结构与光电性能研究

本文系统研究了氧离子注入剂量和退火温度对含有Si-V发光中 心的微晶金刚石薄膜的微结构和光电性能的影响. 结果表明, 氧离子注入并在较高温度退火有利于提高薄膜中Si-V中心的发光强度. 当氧离子注入剂量从10¹⁴ cm^-2增加到10¹⁵ cm^-2时, 薄膜中Si-V发光强度增强. Hall效应测试结果表明退火后薄膜的面电阻率降低. 不同温度退火时, 氧离子注入薄膜的Si-V发光强度较强时, 薄膜的面电阻率增加, 说明Si-V发光中心不利于提高薄膜的导电性能. Raman光谱测试结果表明, 薄膜中缺陷数量的增多会增强Si-V的发光强度, 而降低薄膜的导电性能. 关键词： 金刚石薄膜 氧离子注入 电学性能 Si-V缺陷     

MOVPE低温生长的n型GaN电学特性研究

系统研究了采用金属有机物化学气相外延方法在740℃和900℃条件下生长的n型GaN的电学特性. 电化学电容-电压测试表明,在低温条件下采用三乙基镓作为Ga源生长有利于降低非故意掺杂n型GaN的背景杂质浓度. 另外,对重掺Si的n型GaN的霍耳效应测试表明,随着Si掺杂浓度增大,电子浓度相应线性增大,表现出杂质带导电特性,而迁移率则相应减小. 同时,原子力显微镜测试和X射线衍射测试均表明生长温度和掺杂浓度对外延材料的表面形貌和晶体质量有影响,特别是在高掺杂浓度的情况下,样品的表面形貌恶化更严重. 在所研究的 关键词： n型GaN 电子浓度 迁移率     

硅基GaN微腔制作及其激射特性(特邀)

提出了一种新的Si衬底上GaN微盘谐振腔的制备方式,避免了传统Si基GaN器件中晶体质量较差以及外延层较厚对器件性能的影响.本工作中GaN的外延生长使用蓝宝石衬底,随后将外延层转移至硅衬底上进行微盘谐振腔的制备.外延生长时靠近衬底侧的GaN富缺陷层可使用减薄抛光的方式去除,并且通过简单湿法刻蚀二氧化硅牺牲层即可实现Ga...     

退火对AlGaInP/GaInP多量子阱 LED外延片性能的影响

采用LP-MOCVD技术在n-GaAs衬底上生长了AlGaInP/GaInP多量子阱红光LED外延片.研究表明退火对外延片性能有重要影响.与未退火样品相比,460℃退火15min,外延片p型GaP层的空穴浓度由5.6×10¹⁸cm^-3增大到6.5×10¹⁸cm^-3,p型AlGaInP层的空穴浓度由6.0×10¹⁷cm^-3增大到1.1×10¹⁸cm^-3.但退火温度为780℃时,p型GaP层和p型AlGaInP层的空穴浓度分别下降至8×10¹⁷cm^-3和1.7×10¹⁷cm^-3,且Mg原子在AlGaInP系材料中的扩散加剧,导致未掺杂AlGaInP/GaInP多量子阱呈现p型电导.在460～700℃退火范围内,并没有使AlGaInP/GaInP多量子阱的发光性能发生明显变化.但退火温度为780℃时,AlGaInP/GaInP多量子阱的发光强度是退火前的2倍.     

离子注入n型GaN光致发光谱中宽黄光发射带研究

利用离子注入方法和光致发光技术系统研究了注入离子对n型GaN宽黄光发射带的影响.实验采用的注入离子为：N，O，Mg，Si和Ga，剂量分别为10¹³，10¹⁴，10¹⁵和10¹⁶/cm²，注入温度为室温.注入后的样品在900 ℃流动氮气环境下进行热退火，退火时间为10 min，并对退火前后的样品分别进行室温光致发光测量.通过实验数据的分析，独立提出了提取注入离子对晶体黄光发光特性影响的半经验模型.利用该模型导出的公式，可以确定注入的N，O，Ga，Mg和Si离子对黄光发射带的影响随注入剂量的变化关系以及该影响的相对强弱. 关键词： 氮化镓 光致发光谱 离子注入     

Si掺杂对AlGaInP/GaInP多量子阱性能的影响

采用LP-MOCVD技术在n-GaAs衬底上生长了AlGaInP／GaInP多量子阱红光LED外延片。以X射线双晶衍射技术和光致发光技术对外延片进行了表征,研究了Si掺杂对AlGaInP／GaInP多量子阱性能的影响。研究表明：掺Si能大大提高(Al0．3Ga0.7)0.5In0.5P／Ga0.5In0.5P多量子阱的发光强度。相对于未故意掺杂的样品,多量子阱垒层掺Si使多量子阱的发光强度提高了13倍,阱层和垒层均掺Si使多量子阱的发光强度提高了28倍。外延片的X射线双晶衍射测试表明,Si掺杂并没有使多量子阱的界面质量变差。     

镶嵌在氧化硅薄膜中纳米晶硅的可见光荧光谱与发光机制的研究

采用对非晶氧化硅薄膜退火处理方法，获得纳米晶硅与氧化硅的镶嵌结构．室温下观察到峰位为2.40eV光致发光．系统地研究了不同退火温度对薄膜的Raman谱、光荧光谱及光电子谱的影响．结果表明，荧光谱可分成两个不随温度变化的峰位为1.86和2.30eV的发光带．Si2p能级光电子谱表明与发光强度一样Si⁴⁺强度随退火温度增加而增加．Si平均晶粒大小为4.1—8.0nm，不能用量子限制模型解释蓝绿光的发射．纳米晶硅与SiO₂界面或SiO₂中与氧有关的缺陷可能是蓝绿光发射的主要原因 关键词：     

GS-MBE生长的GaP/Si的XPS研究

利用X射线光电子能谱(XPS)深度剖析方法对气体源分子束外延(GS-MBE)生长的GaP/Si异质结构进行了详细的分析.其结果表明:(1)外延层内Ga、P光电子峰与GaP相相符,且组份分布均匀,为正化学比GaP.(2)在不同富PH₃流量条件下生长的样品,其表面富P量稍有不同,而GaP外延层内的测试结果相同.界面也未见有P的富集.(3)XPS剖析至GaP/Si界面附近,随外延层界面向衬底过渡,Si2p光电子峰向高结合能方向移动,且其结合能高于原衬底p型Si,接近于n型Si.但Ga、P光电子峰未发现有明显能移.(4)在XPS检测限内,外延层内和界面都未见有C、O等沾污.这一研究表明:无污染的本底超高真空、相对过剩的富₃生长环境、成功的Si衬底清洗方法等措施保证了GS-MBE生长出正化学比GaP/Si外延异质结构.     

Relation between interdiffusion and polarity for MBE growth of GaN epilayers on ZnO substrates

We report on GaN growth on Zn-polar ZnO substrates using plasma-assisted molecular-beam epitaxy (P-MBE). Before GaN growth, ZnO substrate annealing conditions were optimized. Reflection high-energy electron diffraction (RHEED) patterns after low-temperature GaN buffer layer annealing changed from streaky to spotty, suggesting that zinc and oxygen atoms interdiffuse from the ZnO substrate into the GaN epilayer. This interdiffusion results in a mix-polar GaN epilayer.     

MOVPE 生长GaN薄膜的 光致黄带发光与激发光源的相关性

用四种不同光源作为激发光源,研究了蓝宝石衬底金属有机物汽相外延方法生长的氮化镓薄膜的光致发光特性。结果发现用连续光作为激发光源时,光致发光谱中除出现365 nm的带边发射峰外,同时观察到中心波长位于约550 nm 的较宽黄带发光;而用脉冲光作为激发光源时其发光光谱主要是365 nm附近的带边发光峰,未观察到黄带发光。氮化镓薄膜的光致发光特性依赖于所用的激发光源性质。     

Stress evolution influenced by oxide charges on GaN metal–organic chemical vapor deposition on silicon-on-insulator substrate

GaN epilayers have been deposited on silicon-on-insulator (SOI) and bulk silicon substrates. The stress transition thickness and the initial compressive stress of a GaN epilayer on the SOI substrate are larger than those on the bulk silicon substrate, as shown in in situ stress measurement results. It is mainly due to the difference of the three-dimensional island density and the threading dislocation density in the GaN layer. It can increase the compressive stress in the initial stage of growth of the GaN layer, and helps to offset the tensile stress generated by the lattice mismatch. PACS 81.15.Gh     

Temperature-dependent photoluminescence of GaN grown on β-Si3N4/Si (1 1 1) by plasma-assisted MBE

Photoluminescence (PL) of high quality GaN epitaxial layer grown on β-Si₃N₄/Si (1 1 1) substrate using nitridation-annealing-nitridation method by plasma-assisted molecular beam epitaxy (PA-MBE) was investigated in the range of 5-300 K. Crystallinity of GaN epilayers was evaluated by high resolution X-ray diffraction (HRXRD) and surface morphology by Atomic Force Microscopy (AFM) and high resolution scanning electron microscopy (HRSEM). The temperature-dependent photoluminescence spectra showed an anomalous behaviour with an ‘S-like’ shape of free exciton (FX) emission peaks. Distant shallow donor-acceptor pair (DAP) line peak at approximately 3.285 eV was also observed at 5 K, followed by LO replica sidebands separated by 91 meV. The activation energy of the free exciton for GaN epilayers was also evaluated to be ∼27.8±0.7 meV from the temperature-dependent PL studies. Low carrier concentrations were observed ∼4.5±2×10¹⁷ cm⁻³ by measurements and it indicates the silicon nitride layer, which not only acts as a growth buffer layer, but also effectively prevents Si diffusion from the substrate to GaN epilayers. The absence of yellow band emission at around 2.2 eV signifies the high quality of film. The tensile stress in GaN film calculated by the thermal stress model agrees very well with that derived from Raman spectroscopy.     

Heteroepitaxial GaN films on silicon substrates with porous buffer layers

New complex buffer layers based on a porous material have been developed for epitaxial growth of GaN films on Si substrates. The characteristics of gallium nitride heteroepitaxial layers grown on silicon substrates with new buffer layers by metal-organic vapor phase epitaxy are investigated. It is shown that the porous buffer layers improve the electric homogeneity and increase the photoluminescence intensity of epitaxial GaN films on Si substrates to the values comparable with those for reference GaN films on Al₂O₃ substrates. It is found that a fianite layer in a complex buffer is a barrier for silicon diffusion from the substrate into a GaN film.     

Air-gap embedding GaN template for enhanced emission from light-emitting diodes

Selective growth by metal-organic chemical vapor deposition (MOCVD), and electrochemical etching of a heavily Si-doped GaN (n⁺-GaN) interlayer were employed to obtain air-gaps embedded in a u-GaN layer. As confirmed by Raman spectroscopy, the introduction of an n⁺-GaN, which was later etched to obtain air-gaps, also enhanced the strain-compliance of GaN epilayer on sapphire substrate. An enhanced electroluminescence emission was observed from the light-emitting diodes (LEDs) fabricated on the air-gap embedding template. Using theoretical LED simulation, it was discerned that the increase in optical emission from the LED was caused predominantly by the redirection of photons at GaN/air-gap interface. Finite-difference time domain (FDTD) simulation method was employed to understand the mechanism of optical emission enhancement and its spatial variation over the LED surface.     

硅衬底氮化镓基LED薄膜转移至柔性黏结层基板后其应力及发光性能变化的研究

本文将硅(Si)衬底上外延生长的氮化镓(GaN)基发光二极管(LED)薄膜转移至含有柔性黏结层的基板上, 获得了不受衬底和支撑基板束缚的LED薄膜. 利用高分辨率X射线衍射仪(HRXRD)研究了薄膜转移前后的应力变化, 同时对其光致发光(PL)光谱的特性进行了研究. 结果表明: 硅衬底GaN基LED薄膜转移至柔性基板后, GaN受到的应力会由转移前巨大的张应力变为转移后微小的压应力, InGaN/GaN量子阱受到的压应力则增大; 尽管LED薄膜室温无损转移至柔性基板其InGaN阱层的In组分不会改变, 然而按照HRXRD倒易空间图谱通用计算方法会得出平均铟组发生了变化; GaN基LED薄膜从外延片转移至柔性基板时其PL谱会发生明显红移.     

Effects of the sputtering time of ZnO buffer layer on the quality of GaN thin films

ZnO thin films with different thickness (the sputtering time of ZnO buffer layers was 10 min, 15 min, 20 min, and 25 min, respectively) were first prepared on Si substrates using radio frequency magnetron sputtering system and then the samples were annealed at 900 °C in oxygen ambient. Subsequently, a GaN epilayer about 500 nm thick was deposited on ZnO buffer layer. The GaN/ZnO films were annealed in NH₃ ambient at 950 °C. X-ray diffraction (XRD), atom force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and photoluminescence (PL) were used to analyze the structure, morphology, composition and optical properties of GaN films. The results show that their properties are investigated particularly as a function of the sputtering time of ZnO layers. For the better growth of GaN films, the optimal sputtering time is 15 min.     

三甲基镓流量对GaN外延层和GaN缓冲层生长的影响

采用金属有机物气相外延法在蓝宝石衬底上生长了以GaN为缓冲层的GaN薄膜.研究了不同三甲基镓流量下所生长缓冲层对GaN外延层质量的影响.对样品采用X线双晶衍射法测试其结晶质量,光致发光法测试其光学特性.实验结果显示高三甲基镓流量下生长的缓冲层可以提高GaN外延层的质量.对缓冲层进行的原子力显微镜测试分析表明不同三甲基镓流量会显著地影响缓冲层的生长模式.根据试验结果构造了一个GaN缓冲层的生长模型.