ECR-PECVD制备Si3N4薄膜沉积工艺的研究

由偏心静电单探针诊断了电子回旋共振等离子体增强化学汽相沉积(ECR-PECVD)反应室内等离子体密度的空间分布规律．结果表明在轴向位置Z=50cm处,直径Φ12cm范围内等离子体密度分布非常均匀．分析了等离子体密度径向均匀性对沉积速率均匀性和薄膜厚度均匀性的影响．讨论了沉积制备一定薄膜厚度的Si₃N₄薄膜的工艺重复性．研究了各种沉积工艺参数与Si₃N₄薄膜沉积速率的相互关系．得到了ECR-PECVD技术在沉积薄膜时的工 关键词：     

AlN/Si3N4纳米多层膜的外延生长与力学性能

采用射频磁控溅射方法制备单层AlN, Si₃N₄薄膜和不同调制周期的AlN/Si₃N₄纳米多层膜.采用X射线衍射仪、高分辨透射电子显微镜和纳米压痕仪对薄膜进行表征.结果发现,多层膜中Si₃N₄层的晶体结构和多层膜的硬度依赖于Si₃N₄层的厚度.当AlN层厚度为4.0nm、 Si₃N₄层厚度 关键词： 3N₄纳米多层膜')" href="#">AlN/Si₃N₄纳米多层膜 外延生长 应力场 超硬效应     

Ti-Si-N复合膜的界面相研究

为了揭示Ti_Si_N复合膜中Si₃N₄界面相的存在方式及其对薄膜力学 性能的影响 ，采用x射线衍射仪、高分辨透射电子显微镜、俄歇电子能谱仪和显微硬度仪对比研究了磁 控溅射Ti_Si_N复合膜和TiN/Si₃N₄多层膜的微结构和力学性能. 实 验结果表明 ，Ti_Si_N复合膜均形成了Si₃N₄界面相包裹TiN纳米晶粒的微结构. 其中低Si 含量的Ti_Si_N复合膜中Si₃N₄界面相的厚度小于1nm，且以晶体态 存在，薄膜 呈现高硬度. 而高Si含量的Ti_Si_N复合膜中的Si₃N₄界面相以非晶 态存在，薄 膜的硬度也相应降低. 显然，Ti_Si_N复合膜中Si₃N₄界面相以晶体 态形式存在 是薄膜获得高硬度的重要微结构特征，其强化机制可能与多层膜的超硬效应是相同的. 关键词： Ti－Si－N复合膜 界面相 微结构 超硬效应     

Si3N4在h-AlN上的晶体化与AlN/Si3N4纳米多层膜的超硬效应

采用反应磁控溅射法制备了一系列具有不同Si₃N₄层厚度的AlN/Si₃N₄纳米多层膜,利用X射线衍射仪、高分辨透射电子显微镜和微力学探针表征了多层膜的微结构和力学性能.研究了Si₃N₄层在AlN/Si₃N₄纳米多层膜中的晶化现象及其对多层膜生长结构与力学性能的影响.结果表明,在六方纤锌矿结构的晶体AlN调制层的模板作用下,通常溅射条件下以非晶态存在的Si₃N₄层在其厚度小于约1nm时被强制晶化为结构与AlN相同的赝形晶体,AlN/Si₃N₄纳米多层膜形成共格外延生长的结构,相应地,多层膜产生硬度升高的超硬效应.Si₃N₄随层厚的进一步增加又转变为非晶态,多层膜的共格生长结构因而受到破坏,其硬度也随之降低.分析认为,AlN/Si₃N₄纳米多层膜超硬效应的产生与多层膜共格外延生长所形成的拉压交变应力场导致的两调制层模量差的增大有关. 关键词： 3N₄纳米多层膜')" href="#">AlN/Si₃N₄纳米多层膜 外延生长 赝晶体 超硬效应     

微波等离子体化学气相沉积法制备C3N4薄膜的结构研究

采用微波等离子体化学气相沉积法,用高纯氮气(99.999%)和甲烷(99.9%)作反应气体,在单晶Si(100)基片上沉积C₃N₄薄膜.利用扫描电子显微镜观察薄膜形貌,表明薄膜由密排的六棱晶棒组成.X射线衍射和透射电子显微镜结构分析说明该薄膜主要由β-C₃N₄和α-C₃N₄组成,并且这些结果与α-C₃N₄相符合较好.由虎克定律近似关 关键词： 3N₄')" href="#">C₃N₄ 微波等离子体化学气相沉积法 薄膜沉积     

a-Si3N4纳米粒子的激光法制备及能级结构研究

给出激光化学汽相沉积法制备a-Si₃N₄纳米粒子的原理和经验公式,在特定工艺参数下获得平均粒径为6.5nm的优质a-Si₃N₄纳米粒子,用紫外光谱研究其能级结构,发现与小粒子有关的峰状光谱结构和能带分裂现象,描述了a-Si₃N₄纳米粒子的物理结构图象,确认硅错键≡Si—Si≡,硅悬挂键≡Si₃⁰在富硅a-Si₃ 关键词：     

原位氧化Zn3N2制备p型ZnO薄膜的性能研究

采用射频反应溅射法在玻璃衬底上制备Zn₃N₂薄膜，然后向真空室中通入纯氧气进行热氧化制备ZnO薄膜.利用X射线衍射、扫描电子显微镜、霍尔效应测量、透射光谱和光致发光光谱等表征技术，研究了氧化温度和氧化时间对ZnO薄膜的结晶质量、电学性质和光学性能的影响.研究结果显示，450 ℃ 下氧化2 h后的样品中除含有ZnO外，还有Zn₃N₂成分，500 ℃下氧化2 h可以制备出电阻率为0.7 Ωcm，空穴载流子浓度为10^{关键词： p型ZnO薄膜 3N₂薄膜')" href="#">Zn₃N₂薄膜 射频溅射 原位氧化}     

C3N4/TiN交替复合膜的微结构研究

采用双阴极封闭型非平衡磁场dc反应磁控溅射离子镀制备C₃N₄/TiN复合交替膜,用X射线光电子能谱法分析了薄膜的组成,测量了薄膜的X射线衍射谱和氮化碳的透射电子衍射图像.氮化碳经氮化钛的强迫晶化作用,生成了β-C₃N₄和c-C₃N₄. 关键词：     

Si3N4/Si表面Si生长过程的扫描隧道显微镜研究

利用原位扫描隧道显微镜和低能电子衍射分析了Si的纳米颗粒在Si₃N₄/Si(111)和Si₃N₄/Si(100)表面生长过程的结构演变.在生长早期T为350—1075K范围内,Si在两种衬底表面上都形成高密度的三维纳米团簇,这些团簇的大小均在几个纳米范围内,并且在高温退火时保持相当稳定的形状而不相互融合.当生长继续时,Si的晶体小面开始显现.在晶态的Si₃N₄(0001)/S 关键词： 氮化硅 扫描隧道显微镜 纳米颗粒     

Cu掺杂β-Si3N4的力学性能和电子结构的第一性原理研究

采用基于密度泛函的第一性原理方法研究了(Si_3-xCu_x)N₄(x=0,0.25,0.5,0.75,1)晶体的稳定性、力学性能和电子结构,分析了Cu掺杂对β-Si₃N₄力学性能的影响机制.结果表明,(Si_3-xCu_x)N₄为热力学稳定结构,Cu掺杂降低了β-Si₃N₄的稳定性.由弹性常数和Voigt-Reuss-Hill近似看出,(Si_3-xCu_x)N₄满足波恩力学稳定性判据,Cu掺杂使得β-Si₃N₄的体模量、剪切模量和杨氏模量降低,当x=0时,(Si_3-xCu_x)N₄的体模量、剪切模量和杨氏模量最大,分别为234.3 GPa、126.7 GPa和322.1 GPa.根据泊松比和G/B值判断出(...     

ECR-PECVD制备Si3N4薄膜的光学特性研究

本文研究了ECR-PECVD制备的Si₃N₄薄膜的光学特性.得到的Si₃N₄薄膜具有光致发光效应,在280℃沉积制备的Si₃N₄薄膜的光致发光波长为400nm,具有较好的单色性.测试分析了Si₃N₄薄膜对可见光、红外光具有较高的透射性能,Si₃N₄薄膜可作为红外光的增速减反射膜.     

INVESTIGATION ON THE COMPOSITION AND STRUCTURE OF SILICON NITRIDE FILM PREPARED BY ECR-PECVD

In this paper, the effect of temperature on the composition and structure of the Si₃N₄ thin film is investigated. X-ray diffraction pattern and transmission electron microscope (TEM) analyses show that the Si₃N₄ film undergoes the transition from amorphous to crystalline phase with increasing deposition temperature. Infra-red qualitative analysis shows that the content of hydrogen decreases with increasing deposition temperature.The stoichiometric of Si₃N₄ is investigated by X-ray photoelectron spectroscopy or electron spectroscopy for chemical analysis.     

Electrical characteristics of metal-dielectric-semiconductor structures with silicon nitride prepared by reactive cathode atomization

The effect of the technology of preparation of silicon nitride in a low temperature gas discharge plasma upon the volt-ampere and volt-farad characteristics of metal-dielectricsemiconductor (MDS) structures (Al-Si₃N₄-Si-Al) is studied. It is shown that by using a heterogeneous Si₃N₄ formation reaction with ionic purification of the silicon surface, it is possible to obtain MDS structures with lower and more stable surface charge in comparison to similar structures in which the Si₃N₄ is grown by other methods (for example, gas transport reaction methods). The conductivity of the Si₃N₄ film is described approximately by the well known Frankel model, and its value is close to that of Si₃N₄ films prepared by other methods.     

Valence control of cobalt oxide thin films by annealing atmosphere

The cobalt oxide (CoO and Co₃O₄) thin films were successfully prepared using a spin-coating technique by a chemical solution method with CH₃OCH₂CH₂OH and Co(NO₃)₂·6H₂O as starting materials. The grayish cobalt oxide films had uniform crystalline grains with less than 50 nm in diameter. The phase structure is able to tailor by controlling the annealing atmosphere and temperature, in which Co₃O₄ thin film was obtained by annealing in air at 300-600, and N₂ at 300, and transferred to CoO thin film by raising annealing temperature in N₂. The fitted X-ray photoelectron spectroscopy (XPS) spectra of the Co2p electrons are distinguishable from different valence states of cobalt oxide especially for their satellite structure. The valence control of cobalt oxide thin films by annealing atmosphere contributes to the tailored optical absorption property.     

The impact of ultra thin silicon nitride buffer layer on GaN growth on Si (1 1 1) by RF-MBE

Ultra thin films of pure silicon nitride were grown on a Si (1 1 1) surface by exposing the surface to radio-frequency (RF) nitrogen plasma with a high content of nitrogen atoms. The effect of annealing of silicon nitride surface was investigated with core-level photoelectron spectroscopy. The Si 2p photoelectron spectra reveals a characteristic series of components for the Si species, not only in stoichiometric Si₃N₄ (Si⁴⁺) but also in the intermediate nitridation states with one (Si¹⁺) or three (Si³⁺) nitrogen nearest neighbors. The Si 2p core-level shifts for the Si¹⁺, Si³⁺, and Si⁴⁺ components are determined to be 0.64, 2.20, and 3.05 eV, respectively. In annealed sample it has been observed that the Si⁴⁺ component in the Si 2p spectra is significantly improved, which clearly indicates the crystalline nature of silicon nitride. The high resolution X-ray diffraction (HRXRD), scanning electron microscopy (SEM) and photoluminescence (PL) studies showed a significant improvement of the crystalline qualities and enhancement of the optical properties of GaN grown on the stoichiometric Si₃N₄ by molecular beam epitaxy (MBE).     

Deposition of nanocomposite TiN-Si3N4 thin films by hybrid cathodic arc and chemical vapor process

A hybrid technique is described for the synthesis of nanocomposite TiNSi₃N₄ thin films based on the reactive deposition of Ti produced from a cathodic arc source and Si from a liquid tetramethylsilane (TMS), precursor. The technique combines both the physical vapour of Ti and chemical vapour of silicon in a nitrogen background pressure in a single system. The influence of the TMS flow rate on the structure and mechanical properties has been investigated. The film structure was found to comprise of TiN crystallites and amorphous Si₃N₄. The X-ray diffraction data showed that with increasing TMS flow, there is a decrease in the TiN crystalline size from 33 nm to 4 nm. The hardness of the films was found to be strongly dependent on the Si content and reached a maximum value of 41 GPa at 5% Si content at a total pressure of nitrogen and TMS of 0.8 Pa. Hardness enhancement was found to arise from the nanostructural change induced due to the addition of an amorphous Si₃N₄ phase into the film. Transmission electron microscopy (TEM) analysis confirmed the structure of the ncTiN/aSi₃N₄ composites. Films with 4 at.% or more silicon were found to maintain the hardness after annealing at 500 °C in vacuum. PACS 68.55.Jk; 81.15.-z; 81.15.Ef     

High‐mobility solution‐processed zinc oxide thin films on silicon nitride

A high effective electron mobility of 33 cm² V^–1 s^–1 was achieved in solution‐processed undoped zinc oxide (ZnO) thin films. The introduction of silicon nitride (Si₃N₄) as growth substrate resulted in a mobility improvement by a factor of 2.5 with respect to the commonly used silicon oxide (SiO₂). The solution‐processed ZnO thin films grown on Si₃N₄, prepared by low‐pressure chemical vapor deposition, revealed bigger grain sizes, lower strain and better crystalline quality in comparison to the films grown on thermal SiO₂. These results show that the nucleation and growth mechanisms of solution‐processed films are substrate dependent and affect the final film structure accordingly. The substantial difference in electron mobilities suggests that, in addition to the grain morphology and crystalline structure effects, defect chemistry is a contributing factor that also depends on the particular substrate. In this respect, interface trap densities measured in high‐κ HfO₂/ZnO MOSCAPs were about ten times lower in those fabricated on Si₃N₄ substrates. (© 2014 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)

     

Crystallisation kinetics of amorphous Si–C–N ceramics: Dependence on nitrogen partial pressure

The crystallisation kinetics of amorphous precursor-derived ceramics of composition Si₂₆C₄₁N₃₃ is investigated as a function of temperature and nitrogen partial pressure using X-ray diffractometry. Isothermal annealing at a pressure of 1 bar leads to simultaneous crystallisation of Si₃N₄ and SiC, while only crystalline SiC is formed with annealing at a reduced pressure of 1 mbar. Rate constants of crystallisation are determined using the Johnson–Mehl–Avrami–Kolmogorov (JMAK) formalism. For temperatures below 1700°C, crystallisation rates are significantly higher for annealing at 1 mbar compared to 1 bar. For an explanation of the results, a model is proposed, which is based on diffusion-controlled nucleation and growth of crystalline Si₃N₄ and SiC in an amorphous matrix combined with thermal decomposition of Si₃N₄ at high temperatures.