Si衬底对ZnO薄膜性能影响的研究

使用脉冲激光沉积(pulsed laser deposition, PLD)技术,采用两种不同纯度(99.5%和99.99%)的ZnO靶材,在p型Si衬底上制备了两种ZnO/Si薄膜.原子力显微镜与X射线衍射分析表明,两种样品具有相似的显微形貌与相同的晶体结构.霍尔效应测试发现,两种ZnO/Si薄膜都展现出了低电阻率、高迁移率的电学性能,但是其导电类型完全相反.研究结果表明,衬底的性能对霍尔效应测试有巨大影响.利用二次离子质谱仪,发现了在低纯度的样品中存在着S杂质向Si衬底中扩散的现象,并直接导致了衬底的导电性能的反型.     

原子力显微术研究进展

原子力显微术是微纳米尺度实空间形貌成像与结构表征的关键技术之一。近些年,原子力显微术衍生发展出了一系列令人瞩目的功能化探测模式和新技术。文章从以下两个方面论述了原子力显微术的前沿进展:(1)原子力显微术的功能化探测模式及其在微纳米尺度物性研究与测量以及微纳加工等领域的应用;(2)原子力显微术自身在更高精度、更高分辨率、更快速度、更多功能等方面的进展及在基础和应用研究领域中的应用。文章还展望了原子力显微术的下一步发展方向和正在不断扩展的研究领域。     

Li掺杂ZnO纳米棒的导电和发光特性(英文)

利用气相输运方法,在(111)面硅衬底上制备了名义上原子数分数为2%的Li掺杂的ZnO纳米棒(样品A)。作为比较,我们在相同的生长条件下制备了没有任何掺杂的ZnO纳米棒(样品B)。XRD分析测试表明:样品A和样品B中的ZnO纳米棒具有纤锌矿六边形结构,没有其他氧化物,例如Li2O。Hall效应测量表明:样品A导电类型为p型,空穴载流子浓度为6.72×1016cm-3,空穴载流子迁移率为2.46 cm2.V-1.s-1。样品B为n型,电子载流子浓度为7.16×1018cm-3,电子载流子迁移率为4.73 cm2.V-1.s-1。低温光致发光光谱测试表明,样品A和样品B发光峰明显的区别是位于3.351 eV(样品B)和3.364 eV(样品A)处。根据文献报道,在没有掺杂的ZnO中,3.364 eV发光峰源于施主束缚激子发光。通过变温光致发光光谱的测试,证明了在样品A中,位于3.351 eV的发光峰源于受主束缚激子发光,其光学受主能级位于价带顶142meV处。     

Ge掺杂n型Sn基VIII型单晶笼合物的制备及热电传输特性

采用Sn自熔剂法制备了具有n型传导的VIII型Ba8Ga16 xGexSn30(0 x 1.0)单晶笼合物,并对其结构和热电特性进行研究.研究结果表明:Ge在单晶中的实际含量较少,随着掺杂量的增加样品的晶格常数略有减小,Ge掺杂后样品的载流子浓度较掺杂前低,迁移率增加;所有样品的Seebeck系数均为负值,且绝对值较未掺杂样品低,但Ge掺杂后样品的电导率提高了62%;x=0.5的样品在500 K附近取得最大ZT值1.25.     

溶胶-凝胶法制备ZnO纳米薄膜的工艺和应用

ZnO是一种重要的功能材料和新型的Ⅱ-Ⅵ族宽禁带半导体材料.采用溶胶-凝胶(Sol-gel)工艺在Si(100)、Si(111)和c面蓝宝石衬底上成功制备出高质量的ZnO纳米薄膜,并用XRD、SEM、AFM等方法研究了薄膜的特性.首次以制备的ZnO纳米薄膜为缓冲层,在n型Si(100)衬底上采用低压化学气相沉积(LPCVD)工艺外延生长了SiC薄膜,得到了低载流子浓度、高电子迁移率和高空穴迁移率的两种SiC薄膜样品,分析了该薄膜的性能.     

新型扫描微波显微术

微波是整个电磁频谱非常重要的组成部分,可以与物质发生丰富的相互作用;而原子力 显微术(Atomic Force Microscopy,AFM) 有超高的空间分辨率,是纳米研究的核心工具。将 微波技术与AFM 结合将实现一种全新的扫描微波显微术(Scanning Microwave Microscopy, SMM)。该技术可以探测各种样品（包括导体、半导体、绝缘体及其它新型材料）在微纳米尺度 的多种电学性质,如载流子类型、介电常数、电导率和导磁系数等;以及实现微纳米尺度下微波 探测技术,如NMR、ESR 等,具有非常广阔的应用前景。文中综述了SMM 的基本原理,仪器 组成,并介绍了其在电学性质探测、各种新型材料、生物等方面的前沿应用实例。最后,文章展 望了扫描微波显微术的进一步技术发展和应用研究。     

基于变温霍尔效应方法的一类n-GaN位错密度的测量

结合莫特相变及类氢模型,采用浅施主能量弛豫方法,计算了一类常见n-Ga N光电子材料的载流子迁移率,给出了精确测定其刃、螺位错密度的电学方法.研究表明,对于莫特相变材料(载流子浓度超过1018cm~(-3)),以位错密度Ndis、刃螺位错密度比β、刃位错周围浅施主电离能εD1、螺位错周围浅施主电离能εD2为拟合参数的载流子迁移率模型与实验曲线高度符合,拟合所得刃、螺位错密度与X射线衍射法或化学腐蚀方法的测试结果也基本一致.实验结果表明,莫特相变材料虽然载流子浓度高、霍尔迁移率低,但其位错密度却并不一定高过载流子浓度低、霍尔迁移率高的材料,应变也无明显差异,因此,莫特相变与刃、螺位错密度及两类位置最浅的施主均无关系,可能是位置较深的施主或其他缺陷所致,需要比一般杂质带高得多的载流子浓度.该方法适合霍尔迁移率在0 K附近不为零,霍尔迁移率曲线峰位300 K左右及以上的各种生长工艺、各种厚度、各种质量层次的薄膜材料,能够对迁移率曲线高度拟合,迅速给出莫特相变材料的相关精确参数.     

MOVPE低温生长的n型GaN电学特性研究

系统研究了采用金属有机物化学气相外延方法在740℃和900℃条件下生长的n型GaN的电学特性. 电化学电容-电压测试表明,在低温条件下采用三乙基镓作为Ga源生长有利于降低非故意掺杂n型GaN的背景杂质浓度. 另外,对重掺Si的n型GaN的霍耳效应测试表明,随着Si掺杂浓度增大,电子浓度相应线性增大,表现出杂质带导电特性,而迁移率则相应减小. 同时,原子力显微镜测试和X射线衍射测试均表明生长温度和掺杂浓度对外延材料的表面形貌和晶体质量有影响,特别是在高掺杂浓度的情况下,样品的表面形貌恶化更严重. 在所研究的 关键词： n型GaN 电子浓度 迁移率     

Ge掺杂n型Sn基Ⅷ型单晶笼合物的制备及热电传输特性

采用Sn自熔剂法制备了具有n型传导的Ⅷ型Ba₈Ga_16-xGe_xSn₃₀ （0 ≤ x ≤ 1.0）单晶笼合物,并对其结构和热电特性进行研究. 研究结果表明：Ge在单晶中的实际含量较少,随着掺杂量的增加样品的晶格常数略有减小,Ge掺杂后样品的载流子浓度较掺杂前低,迁移率增加;所有样品的Seebeck系数均为负值,且绝对值较未掺杂样品低,但Ge掺杂后样品的电导率提高了62%;x=0.5的样品在500 K附近取得最大ZT值1.25. 关键词： Ⅷ型笼合物 n型传导 热电性能     

厚度对MOCVD生长InN薄膜位错特性与光电性质的影响

研究了金属有机物化学气相沉积法制备的不同厚度InN薄膜的位错特性与光电性质.基于马赛克微晶模型,通过X射线衍射非对称面摇摆曲线测量,拟合出样品刃型位错密度分别为4.2×10¹⁰cm^-2和6.3×10¹⁰cm^-2,并发现样品的微晶扭转角与位错密度随薄膜厚度增加而减小.通过室温霍尔效应测量得到样品载流子浓度分别为9×10¹⁸cm^-3和1.2×10¹⁸cm关键词： 氮化铟 位错 载流子起源 局域态     

Structure and electrical properties of Bi5GexSe95−x thin films

Bi₅Ge_xSe_95−x (30, 35, 40 and 45 at.%) thin films of thickness 200 nm were prepared on glass substrates by the thermal evaporation technique. The influence of composition and annealing temperature, on the structural and electrical properties of Bi₅Ge_xSe_95−x films was investigated systematically using X-ray diffraction (XRD), energy dispersive X-ray analysis (EDX). The XRD patterns showed that the as-prepared films were amorphous in nature with few tiny crystalline peaks of relatively low intensity for 30 and 45 at.% and the Bi₅Ge₄₀Se₅₅ annealed film was polycrystalline. The chemical composition of the Bi₅Ge₃₀Se₆₅ film has been checked using energy dispersive X-ray spectroscopy (EDX). The electrical conductivity was measured in the temperature range 300-430 K for the studied compositions. The effect of composition on the activation energy (ΔE) and the density of localized states at the Fermi level N(E_F) were studied, moreover the electrical conductivity was found to increase with increasing the annealing temperature and the activation energy was found to decrease with increasing the annealing temperature. The results were discussed on the basis of amorphous-crystalline transformations.     

Annealing effects on the structural and electrical transport properties of n-type Bi2Te2.7Se0.3 thin films deposited by flash evaporation

N-type Bi₂Te_2.7Se_0.3 thermoelectric thin films with thickness 800 nm have been deposited on glass substrates by flash evaporation method at 473 K. Annealing effects on the thermoelectric properties of Bi₂Te_2.7Se_0.3 thin films were examined in the temperature range 373-573 K. The structures, morphology and chemical composition of the thin films were characterized by X-ray diffraction, field emission scanning electron microscope and energy dispersive X-ray spectroscopy, respectively. Thermoelectric properties of the thin films have been evaluated by measurements of the electrical resistivity and Seebeck coefficient at 300 K. The Hall coefficients were measured at room temperature by the Van der Pauw method. The carrier concentration and mobility were calculated from the Hall coefficient. The films thickness of the annealed samples was measured by ellipsometer. When annealed at 473 K, the electrical resistivity and Seebeck coefficient are 2.7 mΩ cm and −180 μV/K, respectively. The maximum of thermoelectric power factor is enhanced to 12 μW/cm K².     

(Bi1-x Agx)2(Te1-ySey)3粉体的机械合金化制备及其放电等离子烧结体的热电输运特性

采用机械合金化制备了n型(Bi_1-xAg_x)₂(Te_1-ySe_y)₃合金粉体,对其进行XRD分析表明Bi,Te,Ag,Se单质粉末,经2h球磨后实现了合金化;SEM分析表明随着机械合金化时间延长粉体颗粒变得均匀、细小,颗粒尺寸在微米至亚微米数量级.采用放电等离子烧结制备了块体样品,研究了合金成分和球磨时间对热电性能的影响.结果表明材料的热电性能与掺杂元素有密切关系,Ag有利于提高功率因子和降低晶格热导率,球磨10h的(Bi_0.99Ag_0.01)₂(Te_0.96Se_0.04)₃合金粉末的烧结块体具有最大的功率因子和最低的晶格热导率,并在323K取得最高ZT值0.52. 关键词： 1-xAg_x)₂(Te_1-ySe_y)₃合金')" href="#">(Bi_1-xAg_x)₂(Te_1-ySe_y)₃合金 机械合金化 放电等离子烧结 热电性能     

TeI4掺杂量对n型Bi2Te3基烧结材料热电性能的影响

采用区熔法结合放电等离子体快速烧结(SPS)技术制备了n型Bi₂Te₃基热电材料.在300—500K的温度范围内测量了各热电性能参数，包括电导率(σ)、塞贝克系数(α)和热导率(κ)，研究了掺杂剂TeI₄的含量(质量百分比分别为0，0.05，0.08，0.10，0.13和0.15wt%)对热电性能的影响.结果表明：试样的载流子浓度(n)随TeI₄含量增加而增大，使电导率增大、塞贝克系数的绝对值先增大而后减小，从而导致品质因子(α²σ)呈先增加后降低的变化趋势；同时，由于异质离子(I^-)以及载流子对声子的散射作用增强，可显著降低其晶格热导率.烧结材料的性能优值(ZT=α²σT/κ)对应于TeI₄含量为0.08wt%有其最大值，约为0.92.此外，烧结材料的抗弯强度增加至80MPa左右，从而可以显著改善材料的可加工性以及元器件的使用可靠性. 关键词： 2Te₃')" href="#">Bi₂Te₃ 放电等离子体快速烧结 热电性能     

Optical and electrical properties of single Sb2Se3 nanorod

In this report, methods of solvothermal synthesis of Sb₂Se₃ nanorods from a single-source precursor Sb[Se₂P(O ⁱPr)₂]₃ were demonstrated. The synthesized Sb₂Se₃ nanorods were expected to have new optical and electrical properties. With the electron beam (E-beam) lithography and focus ion beam (FIB) techniques, we achieved immobilization and positioning of a single Sb₂Se₃ nanorod on a patterned template. By using the confocal Raman microscope and two-point-contact electrical measurement methods, we obtained optical and electrical characteristics from a single Sb₂Se₃ nanorod.     

熔体旋甩法合成n型(Bi_(0.85)Sb_(0.15))_2(Te_(1-x)Se_x)_3化合物的微结构及热电性能

采用熔体旋甩结合放电等离子烧结(MS-SPS)技术制备了单相n型四元(Bi0.85Sb0.15)2(Te1-xSex)3(x=0.15,0.17,0.19,0.21)化合物,并对所得样品的微结构和热电传输性能进行了系统研究.样品自由断裂面的场发射扫描电子显微镜及抛光面的背散射电子成分分析表明:块体材料晶粒细小,晶粒排列紧密,成分分布均匀且相结构单一,样品中存在大量10—100nm的层状结构.随着Se含量x的增加,样品的电导率和热导率逐渐增加,而Seebeck系数逐渐降低.相比商业应用的区熔材料,MS-SPS方法合成的高Se组成的样品均在425K后表现出更高的ZT值,其中(Bi0.85Sb0.15)2(Te0.83Se0.17)3样品具有最高的ZT值,在360K可达到0.96,并在320—500K均保持较高的ZT值,500K时其ZT值相比区熔材料提高了48%.此外,通过调节Se的含量,可以有效地调控材料的ZT峰值出现的温度段,这对多级或梯度热电器件的制备具有重要意义.     

Laser synthesis of thin layers of In4Se3, In4Te3 and modification of their structure and characteristics

Trends of structural modifications and phase composition occurring in In₄Se₃ thin films and In₄Se₃-In₄Te₃ epitaxial heterojunctions under laser irradiations have been investigated. Dynamics of the layer structure modification, depending on laser modes, i.e. pulse duration τ = 2-4 ms, irradiation intensity I₀ = 10-50 kW/cm², number of pulses N = 5-50, was studied by electron microscopy. An increase in laser influence promotes enlargement of the layer grains and transformation of their polycrystalline structure towards higher degree of stoichiometry. As a result of laser solid restructuring heterojunctions of In₄Se₃-In₄Te₃, being photosensitive within 1.0-2.0 μm and showing fast time of response, have been obtained. Laser modification of structure enables one to optimize electrical and optical properties of functional elements on the base of thin films and layers of In₄Se₃, In₄Te₃, widely used as infrared detectors and filters.     

Formation of highly textured (1 1 1) Bi2O3 films by anodization of electrodeposited bismuth films

Highly textured bismuth oxide (Bi₂O₃) thin films have been prepared using anodic oxidation of electrodeposited bismuth films onto stainless steel substrates. The Bi₂O₃ films were uniform and adherent to substrate. The Bi₂O₃ films were characterized for their structural and electrical properties by means of X-ray diffraction (XRD), electrical resistivity and dielectric measurement techniques. The X-ray diffraction pattern showed that Bi₂O₃ films are highly textured along (1 1 1) plane. The room temperature electrical resistivity of the Bi₂O₃ films was 10⁵ Ω cm. Dielectric measurement revealed normal oxide behavior with frequency.     

Fabrication and characterization of Bi2Te3 nanoplates via a simple solvothermal process

Bi₂Te₃ nanoplates have been successfully obtained by a novel solvothermal method in the presence of hexadecyltrimethylammonium bromide (CTAB). Various techniques such as X-ray diffraction (XRD), field-emission scanning electron microscope (FESEM), transmission electron microscope (TEM), selected area electron diffraction (SAED), and Fourier transform infrared spectrometry (FT-IR) have been used to characterize the obtained products. The results show that the as-synthesized samples are rhombohedral-structured Bi₂Te₃ single-crystal nanoplates about 70–200 nm in diagonal and 30 nm in thickness, and the growth direction is perpendicular to c-axis. The existence of CTAB is vital to the formation of the plate-like morphology. In addition, the reaction solvents also have important influence on the shape-control of final products.     

机械合金化过程对硫化铋块体热电性能的影响机理

以机械合金化法(MA)结合放电等离子烧结技术(SPS)制备了Bi₂S₃多晶块体热电材料. 研究了MA过程中干磨转速、湿磨时间和湿磨介质对Bi₂S₃多晶热电材料电传输性能的影响. 分析了样品的物相, 观察了显微组织, 测试了电传输性能和热传输性能. 研究表明, 以无水乙醇为湿磨介质时, 随着湿磨时间的延长, 出现了微量Bi₂O₃第二相, 样品的晶粒尺寸减小, 电阻率大幅增加, 功率因子下降. 以丙酮为湿磨介质时, 虽然不存在微氧化反应, 但是由于样品中存在大量孔洞, 导致功率因子降低. 425 r/min 干磨15 h后未湿磨的样品在573 K取得最大的ZT值0.25, 是目前文献报道的最高值.