倒装芯片上金属布线/凸点互连结构中原子的定向扩散

采用倒装芯片互连凸点串联回路研究了高温、高电流密度条件下倒装芯片上金属布线/凸点互连结构中原子的定向扩散现象,分析了互连结构中受电应力和化学势梯度作用的各相金属原子的扩散行为.在电迁移主导作用下,Ni(V)镀层中的Ni原子的快速扩散导致原本较为稳定的Ni(V)扩散阻挡层发生快速的界面反应,造成Al互连金属与焊料的直接接触.Al原子在电子风力作用下沿电子流方向向下迁移造成窗口附近焊料中Al原子含量逐步上升,同时,空位的反向迁移、聚集形成过饱和,导致Al互连中形成大面积空洞.焊料中的Sn,Pb原子在化学势梯度 关键词： 倒装芯片 凸点 电迁移 扩散     

热-电应力下Cu/Ni/SnAg_(1.8)/Cu倒装铜柱凸点界面行为及失效机理

微互连铜柱凸点因其密度高、导电性好、噪声小被广泛应用于存储芯片、高性能计算芯片等封装领域,研究铜柱凸点界面行为对明确其失效机理和组织演变规律、提升倒装封装可靠性具有重要意义.采用热电应力实验、在线电学监测、红外热像测试和微观组织分析等方法,研究Cu/Ni/SnAg_1.8/Cu微互连倒装铜凸点在温度100—150℃、电流密度2×10~4—3×10~4 A/cm~2热电应力下的互连界面行为、寿命分布、失效机理及其影响因素.铜柱凸点在热电应力下的界面行为可分为Cu_6Sn_5生长和Sn焊料消耗、Cu_6Sn_5转化成Cu_3Sn、空洞形成及裂纹扩展3个阶段,Cu_6Sn_5转化为Cu_3Sn的速率与电流密度正相关.热电应力下,铜凸点互连存在Cu焊盘消耗、焊料完全合金化成Cu_3Sn、阴极镍镀层侵蚀和层状空洞4种失效模式.基板侧Cu焊盘和铜柱侧Ni镀层的溶解消耗具有极性效应,当Cu焊盘位于阴极时,电迁移方向与热迁移方向相同,加速Cu焊盘的溶解以及Cu_3Sn生长,当Ni层为阴极时,电迁移促进Ni层的消耗,在150℃,2.5×10~4 A/cm~2下经历2.5h后,Ni阻挡层出现溃口,导致Ni层一侧的铜柱基材迅速转化成(Cu_x,Ni_y)_6Sn_5和Cu_3Sn合金.铜柱凸点互连寿命较好地服从2参数威布尔分布,形状参数为7.78,为典型的累积耗损失效特征.研究结果表明:相比单一高温应力,热电综合应力显著加速并改变了铜柱互连界面金属间化合物的生长行为和失效机制.     

电迁移对Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P倒装焊点界面反应的影响

本文研究了150 ℃, 1.0× 10⁴ A/cm²条件下电迁移对Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P倒装焊点界面反应的影响. 回流后在solder/Ni和solder/Ni-P的界面上均形成(Cu,Ni)₆Sn₅类型金属间化合物. 时效过程中两端界面化合物都随时间延长而增厚, 且化合物类型都由(Cu,Ni)₆Sn₅转变为(Ni,Cu)₃Sn₄. 电迁移过程中电子的流动方向对Ni-P层的消耗起着决定性作用. 当电子从基板端流向芯片端时, 电迁移促进了Ni-P层的消耗, 600 h后阴极端Ni-P层全部转变为Ni₂SnP层. 阴极界面处由于Ni₂SnP层的存在, 使界面Cu-Sn-Ni三元金属间化合物发生电迁移脱落溶解, 而且由于Ni₂SnP层与Cu焊盘的结合力较差, 在Ni₂SnP/Cu界面处会形成裂纹. 当电子从芯片端流向基板端时, 阳极端Ni-P层并没有发生明显的消耗. 电流拥挤效应导致了阴极芯片端Ni层和Cu焊盘均发生了局部快速溶解, 溶解到钎料中的Cu和Ni原子沿电子运动的方向往阳极运动并在钎料中形成了大量的化合物颗粒. 电迁移过程中(Au,Pd,Ni)Sn₄的聚集具有方向性, 即(Au,Pd,Ni)Sn₄因电流作用而在阳极界面处聚集.     

Bi0.5Ba0.5Fe0.5Ti0.49Nb0.01O3热敏陶瓷的微结构和电学性能研究

采用固相合成工艺,制备了Bi_05Ba_05Fe_05Ti_049Nb_001O₃（BBFTN）热敏陶瓷,借助X射线衍射仪、扫描电子显微镜、阻温测试仪和交流阻抗谱考察其微结构、直流电阻、介电特性、阻抗和电学模量方面的电学性能. 结果表明：BBFTN材料依然为立方钙钛矿结构,平均晶粒尺寸约为10 μm,晶格常数相对于BaTiO₃的晶格常数有所变大;室温电 关键词： 05Ba_05Fe_05Ti_049Nb_001O₃')" href="#">Bi_05Ba_05Fe_05Ti_049Nb_001O₃ 微结构 电学性能     

热迁移对Cu/Sn/Cu焊点液-固界面Cu6Sn5生长动力学的影响

电子封装技术中, 微互连焊点在一定温度梯度下将发生金属原子的热迁移现象, 显著影响界面金属间化合物的生长和基体金属的溶解行为. 采用Cu/Sn/Cu焊点在250℃和280℃下进行等温时效和热台回流, 对比研究了热迁移对液-固界面Cu₆Sn₅生长动力学的影响. 等温时效条件下, 界面Cu₆Sn₅生长服从抛物线规律, 由体扩散控制. 温度梯度作用下, 焊点冷、热端界面Cu₆Sn₅表现出非对称性生长, 冷端界面Cu₆Sn₅生长受到促进并服从直线规律, 由反应控制, 而热端界面Cu₆Sn₅生长受到抑制并服从抛物线规律, 由晶界扩散控制. 热端Cu 基体溶解到液态Sn中的Cu原子在温度梯度作用下不断向冷端热迁移, 为冷端界面Cu₆Sn₅的快速生长提供Cu 原子通量. 计算获得250℃和280℃下Cu原子在液态Sn中的摩尔传递热Q^*分别为14.11和14.44 kJ/mol, 热迁移驱动力F_L分别为1.62×10^-19和1.70×10^-19 N.     

衬底温度对PLD法生长的Mg0.05Zn0.95O薄膜结构和发光特性的影响

用脉冲激光沉积(PLD)法在不同温度的Si(111)衬底上成功制备了c轴择优取向的Mg_005Zn_095O薄膜.通过X射线衍射(XRD)和光致发光谱(PL)研究了衬底温度对Mg_005Zn_095O薄膜结构和发光特性的影响,探讨了薄膜的结晶质量与发光特性之间的关系.结果表明,在衬底温度为450℃时生长的Mg_005Zn_095O薄膜具有很好的c轴取向和较强的光致发光峰.室温下分别用激发波长为240,300和325nm的氙灯作为激发光源得到不同样品的PL谱,分析表明紫外发光峰和紫峰来源于自由激子的复合辐射且发光强度与薄膜的结晶质量密切相关,蓝绿发光峰与氧空位有关.此外,探讨了衬底温度影响紫外光致发光峰红移和蓝移的可能机理. 关键词： 005Zn_095O薄膜')" href="#">Mg_005Zn_095O薄膜 PLD 衬底温度 光致发光     

两个子带占据的In0.53Ga0.47As/In0.52Al0.48As量子阱中填充因子的变化规律

研究了低温(15K)和强磁场(0—13T)条件下, InP基In_053Ga_047As/In_052Al_048As量子阱中电子占据两个子带时填充因子随磁场的变化规律.结果表明,在电子自旋分裂能远小于朗道能级展宽的情况下,如果两个子带分裂能是朗道分裂能的整数倍时,即ΔE₂₁=kω_c(其中k为整数),填充因子为偶数;当两个子带分裂能为朗道分裂能的半奇数倍时,即ΔE₂₁=(2k+1)ω_c/2,填充因子出现奇数. 关键词： 053Ga_047As/In_052Al_048As量子阱')" href="#">In_053Ga_047As/In_052Al_048As量子阱 填充因子 磁输运     

YBa2Cu3O7－δ/SrNb0.01Ti0.99O3 p-n结的制备及其特性

采用脉冲激光沉积技术，在n型SrNb001Ti099O3(SNTO)单晶基片上生长p型YBa2Cu3O7-δ(YBCO)薄膜，制备出YBCO/SNTO p n结.YBCO薄膜是高度c轴织构的超导薄膜，且具有良好的超导电性.YBCO/SNTO p n结具有较好的整流特性和很好的温度与磁场稳定性. 关键词： YBa2Cu3O7-δ SrNb001Ti099O3 p n结     

NiAl中空位迁移机制的计算机模拟

运用分子动力学方法采用F-S多体势函数从原子尺度上模拟了NiAl金属间化合物中单空位的迁移运动行为，认为空位随成分的变化而采取不同的迁移方式：成分在理想化合比附近空位迁移主要以六步循环方式进行，其中V_Al主要以直型［100］六步循环方式迁移，V_Ni以［110］型六步循环方式占优势；当成分偏离时在富Ni一侧空位迁移则以ASB方式占很大的优势.计算所得NiAl金属间化合物中单空位迁移激活能与实验值相符，从微观上合理地解释了NiAl金属间化合物淬火实验中较高淬火温度对 关键词：     

基于沉淀工艺制作四脚氧化锌纳米材料场致发射阴极的研究

采用沉淀法制备四脚氧化锌纳米材料场致发射阴极,将阴极和荧光屏封装起来抽真空并对屏施加电压,测试阴极的发射电流和荧光屏的发光亮度.利用沉淀法制备出面积为(13×15) cm²的阴极,测试结果表明,硅酸钾体积百分比在50×10^-3—83×10^-3范围,硝酸钡浓度在50×10^-4—77×10^-4 M范围,四脚氧化锌的浓度在82×10^-4—12×10^{-3关键词： 场致发射 沉淀法 显示屏亮度}     

Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads

Effects of High Temperature Storage (HTS) and bonding toward microstructure change of intermetallic compound (IMC) at the wire bonding interface of 3 types of bond pad (Al, AlSiCu and NiPdAu) were presented in this paper. Optical and electron microscope analyses revealed that the IMC growth rate of samples under 175 and 200 °C HTS increased in the order of Al > AlSiCu > NiPdAu. Besides, higher HTS and bonding temperatures also promoted higher IMC thickness. The compositional study showed that higher HTS and bonding temperature developed rapid interdiffusion in bonding interface. In the mechanical ball shear test, a decrease of the shear force of Al and AlSiCu bond pads after 500 h HTS was believed due to poorly developed IMC at bonding interface. On the other hand, shear force degradation at 1000 h was due to excessive growth of IMC that in turn causes the formation of defects. For NiPdAu bond pad, increasing trend of shear force with HTS duration at 175 °C implied a good reliability of the Cu wire bonding. The rapid microscopic inspection on Cu wired Al bond pad under HTS 175 °C showed the IMC development from the periphery to the center of the ball bond. However, after 500 h voids started to develop until the crack was observed at 1000 h.     

Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering

Techniques to improve solder joint reliability have been the recent research focus in the electronic packaging industry. In this study, Cu/SAC305/Cu solder joints were fabricated using a low-power high-frequency ultrasonic-assisted reflow soldering approach where non-ultrasonic-treated samples were served as control sample. The effect of ultrasonic vibration (USV) time (within 6 s) on the solder joint properties was characterized systematically. Results showed that the solder matrix microstructure was refined at 1.5 s of USV, but coarsen when the USV time reached 3 s and above. The solder matrix hardness increased when the solder matrix was refined, but decreased when the solder matrix coarsened. The interfacial intermetallic compound (IMC) layer thickness was found to decrease with increasing USV time, except for the USV-treated sample with 1.5 s. This is attributed to the insufficient USV time during the reflow stage and consequently accelerated the Cu dissolution at the joint interface during the post-ultrasonic reflow stage. All the USV-treated samples possessed higher shear strength than the control sample due to the USV-induced-degassing effect. The shear strength of the USV-treated sample with 6 s was the lowest among the USV-treated samples due to the formation of plate-like Ag₃Sn that may act as the crack initiation site.     

烧结空洞对半导体激光器热分布的影响

在半导体激光器芯片与热沉的焊接过程中不可避免地会在焊料层产生一些空洞,而空洞会在铟的电迁移以及电热迁移作用下慢慢变大,使芯片局部温度迅速上升,进而影响半导体激光器的性能。针对10 W的808 nm单管焊装半导体激光器建立三维有限元模型,分别模拟计算了空洞面积、空洞厚度和空洞位置与结温的关系。芯片出光面边缘的有源区区域形成的空洞对芯片的结温影响更为显著,最后得到空洞面积与器件结温的关系,并表明对空洞率控制的重要性。     

Numerical investigation on thermal properties at Cu-Al interface in micro/nano manufacturing

A hybrid model by integrating TTM (two-temperature model) and MD (molecular dynamics) is proposed to investigate the properties on interface of dissimilar materials under thermal flux conditions. This model can describe the electron phonon coupling and phonon scattering at the interface of different metals easily. By comparing the Cu-Cu interface and Cu-Al interface, the atoms of the Cu-Cu interface at different sides tend to move together; while, the atoms displacements of Cu and Al are opposite along the interface, which may cause stress and voids at the interface. Moreover, the propagation mechanisms of nanocracks and the corresponding change of temperature distribution and thermal flux are investigated. The results show that the interfaces of dissimilar materials are prone to crack initiations, leading to delaminations because of the high temperature. All these are useful for understanding the deformation and failure of the interfaces structures. It implies a potential method for design and analysis of interface structure in micro/nano manufacturing.     

Decomposition behavior and properties for tin–antimony alloy with bismuth content

The peritectic alloy Sn–10Sb, was chosen as one of the lead-free solder alloys to be subjected to many studies. Bi atoms were added to this alloy in the range of 1–3 wt%. The experimental results obtained from this study show a complete solubility of Bi atoms when added by 2 wt%. More additions of Bi tend to increase the formation of the intermetallic compound SnSb by reducing the precipitations of Sb as a single phase. This intermetallic compound with the precipitation of Bi as a third phase tends to improve the mechanical properties of this alloy.     

Electromigration revisited: competition between Kirkendall shift and backstress in pure metals and two-phase alloys

The simple phenomenological model and analytical approach of electromigration in the two-phase alloy (solder) under combined influence of the Kirkendall effect, backstress and sedimentation is presented. It is compared with electromigration in pure metal under condition of quasi-equilibrium vacancies (unlimited power of vacancy sinks-sources) and electromigration in pure metal with account of nonequilibrium vacancies.