Repair of Pd/α-Al_2O_3 composite membrane with defects

A palladium composite membrane with a large number of defects was repaired using the electroless plating combined with the technique of osmosis. The loose structure of palladium film prepared by the conventional electroless plating was densified. Defects were repaired. Hydrogen selectivity was thus significantly increased without significantly increasing palladium film thickness and reducing hydrogen permeability.     

A New Approach on the Active Treatment for Electroless Copper Plating on Glass

A new method is described for the electroless deposition of copper onto glass.Commercially available glass slide was modified with γ-aminopropyltrimethoxysilane to form self-assembled monolayer (SAM) on it .Then it was dipped directly into PdCl2 solution instead of the conventional SnCl2 sensitization followed by PdCl2 activation.Experimental results showed that the Pd^2 ions from PdCl2 solution were coordinated to the amino groups on the glass surface resulting in the formation of N-Pd complex.In an electroless copper bath containin a formaldehyde reducing agent,the N-Pd complexes were reduced to Pd^0 atoms,which then acted as catalysts and initiated the deposition of copper metal.Although the copper deposition rate on SAM-modified glass was slow at the beginning,it reached to that of conventional method in about 5min.     

A Solid Ag Film Deposited from Solution on Self—assembled Mercaptopropyltrimethoxysilane （MPTS） Monolayer

Mercaptopropyltrimethoxysilane (MPTS) bearing mercapto groups was used to form self-assembly monolayers (SAMs) on glass substrates by solution extraction.SEM,XRD and rubbing test analysis illustrated that the Ag film on the SAMs-modified glass was more durable than that on the commonly-modified glass and that the crystallinity of Ag film on the SAMs-modified glass was identical with those of the Ag film on the commonly-modified glass and pure Ag.     

Micro—patterning of Copper Based on Photolithographed Self—assembly Monolayers

A new method has been develoed for fabrication of copper micro-pattern by selective chemical copper deposition based on photolithographed (3-mercaptopropyl)-trimethoxysilane (MPTS) self-assembly monolayers (SAMs). As confirmed by scanning electron microscopy (SEM), Cu closely replicated the mask features. The present approach makes this technic to be cheap and may be applicable to assembly of microelectronic circuits.     

金属酞菁化合物在TiO2表面的分散研究

Dispersion of copper(Ⅱ) phthalocyanine (CuPc), copper(Ⅱ) phthalocyaninesulfonate (CuPcS) and cobalt(Ⅱ)phthalocyaninetetrasulfonate (CoPcTS) on the surface of titanium dioxide was investigated by XRD, XPS, FT-IR and UV-Vis techniques. Results show that interaction between CuPc and TiO2 was very weak and CuPc was difficult to disperse on the surface of the support. While partly sulfurized CuPcS could be dispersed on the surface of support through sulfo-groups and its dispersion capacity was determined to be 0.085 g CuPcS/g TiO2. Completely sulfurlzed CoPcTS could also be dispersed on the surface of TiO2 as a monolayer and its dispersion capacity was 0.12 g CoPcTS/g TiO2. Interactions of the sulfo-groups as well as the electrons of CoPcTS with the surface of TiO2 could be evidenced by FT-IR characterization. Therefore, it was suggested that CoPcTS molecules be adsorbed on the surface of TiO2 in a flat-lying mode while CuPcS in a slanting one. UV-Vis spectra show that the dispersed CuPcS and CoPcTS molecules exist in both forms of monomers and dimers.     

Pd nanoparticles on boron doped graphene catalyst for electrochemical detection of hydrogen peroxide prepared by electroless deposition methodEI北大核心CSCD

Taking advantage of large conjugated structure and reductivity of boron-doped graphenethe palladium nanoparticles/boron-doped graphene catalyst was prepared by electroless deposition method using boron-doped graphene as reductant and stabilizer. The average size of palladium nanoparticles highly dispersed on the surface of boron-doped graphene was about 6.5 nm. The electrochemical sensor was prepared by modifying the as-formed catalyst on the surface of glassy carbon electrode. The obtained electrochemical sensor exhibited an excellent electrochemical catalytic activity for H2 O2 . It exhibited high sensitivity with the detection limit as low as 830 nmol/L and good linearity in the range of 2.5-300 μµmol/L for detection of H2 O2 . It could be utilized for the determination of H2 O2 in milk samples. © 2022, Youke Publishing Co.,Ltd. All rights reserved.     

A domino desulfitative coupling and decarboxylative coupling of 3,4-dihydropyrimidine-2-thiones with copper(Ⅰ) carboxylates

A novel and general carbon-nitrogen and carbon-carbon cross-coupling reaction between 3,4-dihydropyrimidine-2-thiones and copper(Ⅰ) carboxylates were performed in the presence of palladium acetate.The copper(Ⅰ) carboxylates act not only as desulfurative reagents but also as sources of carbon nudeophiles.A wide array of highly substituted and functionalized pyrimidines scaffolds were synthesized in good yields.     

ADSORPTION OF 2,4-DICHLOROPHENOL IN AQUEOUS SOLUTION ONTO ADSORPTION RESIN MODIFIED BY N-ACETYLANILINE

A hypercrosslinked adsorption resin （ZH-05） modified by N-acetylaniline in the post crosslinking process was prepared. The adsorption properties of ZH-05 toward 2,4-dichlorophenol in comparison with granular activated carbon （GAC） and Amberlite XAD-4 were observed. The present study mainly focuses on the static equilibrium adsorption behaviors, desorption profiles and the proof of chemisorption. The results show that the Langmuir equation can give a perfect fitting to experimental data, and high temperature was favorable for adsorption of 2,4-dichlorophenol on ZH-05. A related equation was used to correlate the amount of chemisorption and the suppositionai chemisorption equilibrium concentration of adsorbate in aqueous solution. The adsorption capacities from different ranges of temperature and the static desorption experiment both reveal the same conclusion, i.e., the adsorption of 2,4-dichlorophenol from water on ZH-05 is a coexistent process of physical adsorption and chemical transition as on GAC.     

Some problems in adsorption and calorimetric studies of the steps of catalytic processes

Principal side factors as well as technical and procedural peculiarities capable of distorting the results of measurements of adsorbed and desorbed amounts, of falsifying the nature of the processes proceeding in the systems under study, and of promoting artifacts in calorimetric and other studies of gas chemisorption on powders are considered. Modified techniques and procedures allowing the elimination of sources of side phenomena and artifacts and freeing traditional glass static adsorption apparatuses and experimental procedures from undesirable factors and peculiarities are proposed. Some available chemisorption and calorimetric data representing artifacts and also some data that are not artifacts but,due to imperfections of chemisorption techniques, show up as artifacts are presented and discussed. Several applications of the improved techniques and procedures to calorimetric and adsorption studies of the steps of catalytic processes proceeding on the basis of natural gas and of products of its processing are presented and discussed.     

Ag活化的p型硅(111)表面化学镀Ag膜表面形貌研究

A method of electroless silver deposition on silver activated p-type silicon（111） wafer was proposed. The silver seed layer was deposited firstly on the wafer in the solution of 0.005 mol/L AgNO3 ＋0.06 mol/L HE Then the silver film was electrolessly deposited on the seed layer in the electroless bath of AgNO3＋NH3＋acetic acid＋NH2NH2 （pH 10.2）. The morphology of the seed layer and the silver films prepared under the condition of the different bath composition was compared by atomic force microscopy. The reflectance of the silver films with different thickness was characterized by Fourier transform infrared spectrometry. The experimental results indicate that the seed layer possesses excellent catalytic activity toward electroless silver deposition and rotating of the silicon wafer during the electroless silver deposition could lead to formation of the smoother silver film.     

自组装膜吸附钯的化学镀前活化研究

提出了一种无需氯化亚锡敏化、基于分子自组装膜（SAMs）吸附钯的活化方法,成功地引发了在氧化铝粉末表面的化学镀铜.用XPS、AES、FTIR研究了钯的吸附机理,认为是由于氯化钯与SAMs上向外突出的氨基形成了化学键,并提出了相应的活化机理.金属化产物经XRD、FTIR、剖面金相显微表征分析与压片电阻率测定,示为金属铜完全包覆氧化铝的复合材料.该活化工艺具有活性引发层厚度薄、寿命长和与基底结合力强等优点,也可应用于其它表面富羟基的基底材料.     

吡咯烷二硫代氨基甲酸铵自组装膜对铜的缓蚀作用

吡咯烷二硫代氨基甲酸铵(APDTC)是一种环境友好型金属缓蚀剂, 以其在铜表面制备了自组装单分子膜(SAMs), 用电化学方法研究在0.5 mol·L-1 HCl介质中APDTC SAMs对铜的缓蚀作用及其吸附行为. 结果表明, APDTC分子易在铜表面形成稳定的APDTC SAMs, 改变了电极表面的双电层结构, SAMs同时抑制了铜的阳极氧化过程和阴极还原过程, 铜电极的电荷转移电阻明显提高, 双电层电容明显降低. 电化学阻抗和极化曲线测试结果显示, 在0.5 mol·L-1 HCl介质中, 铜表面APDTC SAMs表现出良好的缓蚀效果. 研究结果还表明, APDTC的吸附行为符合Langmuir吸附等温式, 吸附机理是介于化学吸附和物理吸附之间的一种吸附.     

Investigation of the mechanism of electroless deposition of copper on functionalized alkanethiolate self-assembled monolayers adsorbed on gold

We have investigated the reaction pathways involved in the unseeded electroless deposition of copper on self-assembled monolayers (SAMs) adsorbed on Au, using time-of-flight secondary ion mass spectrometry, optical microscopy, and scanning electron microscopy. At 22 degrees C copper deposits on both -CH3 and -COOH terminated SAMs. No copper deposition is observed on -OH terminated SAMs because the hydroxyl terminal groups react with formaldehyde in the plating solution, forming an acetal which prevents Cu deposition. At higher deposition temperatures (45 degrees C), no Cu is observed to deposit on -CH3 terminated SAMs because Cu2+ ions are not stabilized on the SAM surface. Copper complexes are still able to form with the -COOH terminal group at 45 degrees C, and so copper continues to be deposited on -COOH terminated SAMs. Copper also penetrates through -CH3 and -COOH terminated SAMs to the Au/S interface, suggesting that soft deposition techniques do not prevent the penetration of low-to-moderate reactivity metals through organic films.     

Electroless plating of copper on Si(100) surfaces modified by surface‐initiated atom‐transfer radical polymerization of 4‐vinylpyridine

Surface‐initiated atom‐transfer radical polymerization (ATRP) of 4‐vinylpyridine (4VP) on a pretreated Si(100) surface was carried out. The composition and topography of the Si(100) surface modified by poly(4‐vinylpyridine) (P4VP) were characterized by XPS and atomic force microscopy (AFM), respectively. The P4VP layer on the Si(100) surface was used not only as chemisorption sites for the palladium complexes without prior sensitization by SnCl₂ solution during the electroless plating, but also as an adhesion promotion layer for the electrolessly deposited copper. The electrolessly deposited copper on the Si–P4VP surface exhibited a 180° peel adhesion strength above 6 N/cm. The adhesion strength was much higher than that of the electrolessly deposited copper to the pristine silicon surface. Copyright © 2008 John Wiley & Sons, Ltd.     

The Characterization of Self-Assembled Monolayers on Copper Surfaces by Low-Temperature Plasma Mass Spectrometry

We describe direct analysis of self-assembled monolayers (SAMs) on copper surfaces by low temperature plasma (LTP) mass spectroscopy (MS). Two kinds of SAMs formed from n-dodecylmercaptan (NDM) and l-phenyl-5-mercaptotetrazole (PMTA) were prepared on copper by spontaneous chemisorption. With the LTP probe, desorption and ionization of the SAMs was easily achieved, and the ions produced were introduced into MS for analysis. Characteristic fragment ions from NDM SAMs, mainly [M + M - H](+) (M is the NDM molecule) and from PMTA SAMs, mainly [M + H - S](+) (M is the PMTA molecule), were both absent in the MS spectra of neat NDM and PMTA samples. This provided evidence of the formation of SAMs on copper. As a supplementary method, LTP-MS is helpful in obtaining information on the barrier properties of SAMs on copper, such as inhibitor efficiency (IE) and the surface adsorption concentration of corrosive electrolyte (Γ*) surrounding copper. Aiming for an evaluation of the reliability of LTP-MS, a comparative study of our method and the traditional method of cyclic voltammetry (CV) showed a correlation coefficient higher than 0.97. In addition, a rough, simple procedure for imaging of the distribution of the molecules adsorbed on copper surface was presented. The study supplied a rapid and simple method for direct investigation of SAMs on copper.     

陶瓷表面无敏化活化法微细化学镀铜

本文提出一种新的化学镀铜工艺,与激光微细刻蚀技术相结合可在Al2O3基底上实现无敏化活化化学镀铜,获得光亮致密、分辨率较高(40μm),导电性良好的化学镀层.     

Reactive coupling of 4-vinylaniline with hydrogen-terminated Si(100) surfaces for electroless metal and "synthetic metal" deposition

Pristine and resist-patterned Si(100) substrates were etched by aqueous HF to produce hydrogen-terminated silicon (H-Si(100)) surfaces. The H-Si(100) surface was then subjected to UV-induced reactive coupling of 4-vinylaniline (VAn) to produce the VAn monolayer-modified silicon (VAn-Si) surface. The VAn-Si surface was first functionalized with a "synthetic metal" by oxidative graft polymerization of aniline with the aniline moieties of the coupled VAn molecules. The composition and topography of the VAn-Si and polyaniline (PAn)-grafted VAn-Si (PAn-VAn-Si) surfaces were characterized by X-ray photoelectron spectroscopy and atomic force microscopy, respectively. The doping-undoping (protonation-deprotonation) and redox-coupling (metal reduction) behavior, as well as the electrical conductivity, of the surface-grafted PAn were found to be similar to those of the aniline homopolymer. The VAn-Si surface was also funtionalized by the electroless plating of copper. Not only did the VAn layer provide chemisorption sites for the palladium catalyst, in the absence of prior sensitization by SnCl2, during the electroless plating process, it also served as an adhesion promotion layer and a low-temperature diffusion barrier for the electrolessly deposited copper. Finally, micropatterning of the grafted PAn and of the electrolessly deposited copper were demonstrated on the resist-patterned VAn-Si surfaces.     

Selective electroless deposition of copper on organic thin films with improved morphology

We have investigated the selective electroless deposition (ELD) of Cu on functionalized self-assembled monolayers (SAMs). Previous studies have demonstrated that Cu deposits on -COOH and -CH(3) terminated SAMs using ELD. However, the deposited films were rough and contained irregular crystallites. Further, the copper penetrated through the film. In this Article, we demonstrate that copper can be selectively deposited on -COOH terminated SAMs with improved morphology and without penetration of copper through the organic layer. The method employs a Cu(II) seed layer and an additive, adenine or guanine. We demonstrate the efficacy of the technique on photopatterned -CH(3)/-COOH SAMs. Copper is observed to deposit only atop the -COOH terminated SAM area and not on the -CH(3) terminated SAM. The use of a Cu(II) seed layer increased the Cu ELD rate on both -COOH and -CH(3) terminated SAMs. The deposited copper layer strongly adheres to the -COOH terminated SAMs because the copper layer nucleates at Cu(2+)-carboxylate complexes. In contrast, the deposited copper layer can easily be removed from the -CH(3) terminated SAM surface because there is no specific copper-surface interaction. The additives adenine and guanine mediate the interaction of Cu(2+) and the deprotonated -COOH terminated SAMs via the formation of additive-carboxylate complexes. These complexes lead to significantly reduced copper penetration through the SAM. In the case of adenine, the diffusion of copper through the organic film was eliminated. This new technique for copper deposition will facilitate the development of inexpensive molecular electronics, sensors, and other nanotechological devices.     

氯化钯掺杂的羧基丁苯胶乳薄膜的制备及用于化学镀铜性能

利用羧基丁苯胶乳优良的成膜性能,并通过氯化钯掺杂使薄膜具备催化化学镀的活性,在其表面进行化学镀铜研究,选用次亚磷酸钠和硼氢化钠为还原剂,将硫酸铜还原成单质铜。 采用扫描电子显微镜（SEM）、能量色散谱（EDS）和X射线衍射（XRD）等对其形貌、成分进行表征。 测试了胶膜的增重率、表面金属及沉积层的结合牢度。 结果表明,薄膜的表面形成均匀致密、导电性优良和结合力良好的铜层。 该方法可应用于平面非金属材料如聚酯透明材料、装饰板材等,获得了良好导电表面,形成具有电磁屏蔽功能的面型材,具有广阔应用前景。     

Unsupported palladium alloy foil membranes fabricated by electroless plating

It is desirable to create thin (<25 μm), unsupported, defect-free palladium and palladium alloy foils in a cost-effective manner in order to study intrinsic material properties exclusive of support effects. We have developed a novel technique for producing unsupported palladium films by electroless plating upon mirror-finished stainless steel supports followed by mechanical removal. High quality pure palladium films as thin as 7.2 μm were produced. Single gas steady state permeation experiments were performed using hydrogen and nitrogen to examine permeability and selectivity. The pure palladium membranes showed hydrogen permeabilities comparable to cold-rolled unsupported foils, and high H₂/N₂ selectivity. Palladium-copper membranes were prepared by sequential electroless plating of copper onto palladium foils followed by in situ annealing. The annealing process produces films of desired composition with permeabilities comparable to those in the literature. The annealing process does not appear to produce defects in the film, and the membranes thus produced have performed 15 days without increased leak rates.