Degradation mechanisms for polycrystalline silicon thin-film transistors with a grain boundary in the channel under negative gate bias stress

The negative gate bias stress (NBS) reliability of n-type polycrystalline silicon (poly-Si) thin-film transistors (TFTs) with a distinct defective grain boundary (GB) in the channel is investigated. Results show that conventional NBS degradation with negative shift of the transfer curves is absent. The on-state current is decreased, but the subthreshold characteristics are not affected. The gate bias dependence of the drain leakage current at V_ds of 5.0 V is suppressed, whereas the drain leakage current at V_ds of 0.1 V exhibits obvious gate bias dependence. As confirmed via TCAD simulation, the corresponding mechanisms are proposed to be trap state generation in the GB region, positive-charge local formation in the gate oxide near the source and drain, and trap state introduction in the gate oxide.     

Time-dependent transport through a quantum dot with the over-dot (bridge) additional tunneling channel

The time-dependent electron transport through a quantum dot with the additional over-dot (bridge) tunneling channel within the evolution operator technique has been studied. The microwave field applied to the leads and quantum dot has been considered and influence of the time-dependent shift of corresponding energy levels on the quantum dot charge and current flowing in the system, its time-averaged values and derivatives of the average current with respect to the gate and source–drain bias voltages have been investigated. The influence of the over-dot tunneling channel on the photon-assisted tunneling has been also studied.     

65 nm互补金属氧化物半导体场效应和晶体管总剂量效应及损伤机制

对65 nm互补金属氧化物半导体工艺下不同尺寸的N型和P型金属氧化物半导体场效应晶体管(NMOSFET和PMOSFET)开展了不同偏置条件下电离总剂量辐照实验.结果表明:PMOSFET的电离辐射响应与器件结构和偏置条件均有很强的依赖性,而NMOSFET表现出较强的抗总剂量性能;在累积相同总剂量时,PMOSFET的辐照损伤远大于NMOSFET.结合理论分析和数值模拟给出了PMOSFET的辐射敏感位置及辐射损伤的物理机制.     

Quantum transport andI–Vcharacteristics of quantum size field effect transistor

Quantum electron transport is expected to occur in nanometer-size field effect transistors. We show that the amplitude of the transmitted wave equals 1 only when the electric field in the conducting channel is zero. By reducing the dimension of the quantum transport from bulk to a two-dimensional electron gas system, and further to a one-dimensional quantum wire, the current-bias relation is not affected while the gate control over the drain current weakens. Starting from the Poisson and Schrödinger equations, we have studied numerically the quantum wave transport through the conduction channel where scattering processes are neglected, theI–Vcharacteristic of a typical heterojunction high electron mobility transistor shows a linear relationship between drain current and voltage at low drain bias, but the drain current decreases with increasing drain voltage at a high bias.     

单晶金刚石氢终端场效应晶体管特性

基于微波等离子体化学气相淀积生长的单晶金刚石制作了栅长为2μm的耗尽型氢终端金刚石场效应晶体管,并对器件特性进行了分析.器件的饱和漏电流在栅压为-6 V时达到了96 mA/mm,但是在-6 V时栅泄漏电流过大.在-3.5 V的安全工作栅压下,饱和漏电流达到了77 mA/mm.在器件的饱和区,宽5.9 V的栅电压范围内,跨导随着栅电压的增加而近线性增大到30 mS/mm.通过对器件导通电阻和电容-电压特性的分析,氢终端单晶金刚石的二维空穴气浓度达到了1.99×10~(13)cm~(-2),并且迁移率和载流子浓度均随着栅压向正偏方向的移动而逐渐增大.分析认为,沟道中高密度的载流子、大的栅电容以及迁移率的逐渐增加是引起跨导在很大的栅压范围内近线性增加的原因.     

开态应力下电压和电流对AlGaN/GaN高电子迁移率晶体管的退化作用研究

通过采集等功率的两种不同开态直流应力作用下AlGaN/GaN高电子迁移率晶体管(HEMTs)漏源电流输出特性、源区和漏区大信号寄生电阻、转移特性、阈值电压随应力时间的变化, 并使用光发射显微镜观察器件漏电流情况, 研究了开态应力下电压和电流对AlGaN/GaN高电子迁移率晶体管的退化作用. 结果表明, 低电压大电流应力下器件退化很少, 高电压大电流下器件退化较明显. 高电压是HEMTs退化的主要因素, 栅漏之间高电场引起的逆压电效应对参数的永久性退化起决定性作用. 除此之外, 器件表面损坏部位的显微图像表明低电压大电流下器件失效是由于局部电流密度过高, 出现热斑导致器件损伤引起的.     

一种新的磷化铟复合沟道高电子迁移率晶体管小信号物理模型

针对磷化铟(InP)复合沟道高电子迁移率晶体管(HEMT)的特点，对常规单沟道HEMT的小信号物理模型进行了修正，提出了一种新的用于复合沟道HEMT的小信号物理模型，用商用器件模拟软件ISE(integrated systems engineering)对其进行了仿真验证，对比了实测和仿真的I-V特性及转移特性曲线，重点研究了在InGaAs/InP双层沟道中考虑量子效应后的电场和电流密度随着不同栅电压的变化趋势，研究结果表明，由于在沟道中存在量子效应，在栅下靠源端低电场区域，电流主要分布在InGaAs沟道 关键词： 高电子迁移率晶体管 复合沟道 物理模型 磷化铟     

Ferroelectric effect and equivalent polarization charge model of PbZr_(0.2)Ti_(0.8)O_3 on AlGaN/GaN MIS-HEMT

PbZr_(0.2)Ti_(0.8)O_3(PZT) gate insulator with the thickness of 30 nm is grown by pulsed laser deposition(PLD) in AlGa N/Ga N metal–insulator–semiconductor high electron mobility transistors(MIS-HEMTs). The ferroelectric effect of PZT Al Ga N/Ga N MIS-HEMT is demonstrated. The polarization charge in PZT varies with different gate voltages. The equivalent polarization charge model(EPCM) is proposed for calculating the polarization charge and the concentration of two-dimensional electron gas(2 DEG). The threshold voltage(Vth) and output current density(IDS) can also be obtained by the EPCM. The theoretical values are in good agreement with the experimental results and the model can provide a guide for the design of the PZT MIS-HEMT. The polarization charges of PZT can be modulated by different gate-voltage stresses and the Vthhas a regulation range of 4.0 V. The polarization charge changes after the stress of gate voltage for several seconds. When the gate voltage is stable or changes at high frequency, the output characteristics and the current collapse of the device remain stable.     

双面次级电子倍增效应向单面次级电子倍增效应发展规律的研究

次级电子倍增效应引起的输出窗失效问题往往给微波器件造成灾难性的影响, 是限制微波器件功率进一步提升的瓶颈. 以S波段高功率盒形窗为研究对象, 针对盒形窗内无氧铜金属边界与陶瓷介质窗片相对的区域, 建立了研究法向电场作用下次级电子倍增效应的Monte-Carlo模型. 通过拟合这两种材料间双面次级电子倍增以及单面次级电子倍增效应的敏感曲线, 对次级电子倍增发展特点进行详细分析, 获得了金属与介质之间的次级电子由双面倍增向单面倍增演变的规律.     

电离辐射环境下的部分耗尽绝缘体上硅n型金属氧化物半导体场效应晶体管可靠性研究

随着半导体技术的进步, 集成小尺寸绝缘体上硅器件的芯片开始应用到航空航天领域, 使得器件在使用中面临了深空辐射环境与自身常规可靠性的双重挑战. 进行小尺寸器件电离辐射环境下的可靠性试验有助于对器件综合可靠性进行评估. 参照国标GB2689.1-81恒定应力寿命试验与加速寿命试验方法总则进行电应力选取, 对部分耗尽绝缘体上硅n型金属氧化物半导体场效应晶体管进行了电离辐射环境下的常规可靠性研究. 通过试验对比, 定性地分析了氧化物陷阱电荷和界面态对器件敏感参数的影响, 得出了氧化物陷阱电荷和界面态随着时间参数的变化, 在不同阶段对器件参数的影响. 结果表明, 总剂量效应与电应力的共同作用将加剧器件敏感参数的退化, 二者的共同作用远大于单一影响因子.     

Fast-switching SOI-LIGBT with compound dielectric buried layer and assistant-depletion trench

A lateral insulated gate bipolar transistor (LIGBT) based on silicon-on-insulator (SOI) structure is proposed and investigated. This device features a compound dielectric buried layer (CDBL) and an assistant-depletion trench (ADT). The CDBL is employed to introduce two high electric field peaks that optimize the electric field distributions and that, under the same breakdown voltage (BV) condition, allow the CDBL to acquire a drift region of shorter length and a smaller number of stored carriers. Reducing their numbers helps in fast-switching. Furthermore, the ADT contributes to the rapid extraction of the stored carriers from the drift region as well as the formation of an additional heat-flow channel. The simulation results show that the BV of the proposed LIGBT is increased by 113% compared with the conventional SOI LIGBT of the same length L_D. Contrastingly, the length of the drift region of the proposed device (11.2 μ) is about one third that of a traditional device (33 μ) with the same BV of 141 V. Therefore, the turn-off loss (E_OFF) of the CDBL SOI LIGBT is decreased by 88.7% compared with a conventional SOI LIGBT when the forward voltage drop (V_F) is 1.64 V. Moreover, the short-circuit failure time of the proposed device is 45% longer than that of the conventional SOI LIGBT. Therefor, the proposed CDBL SOI LIGBT exhibits a better V_F-E_OFF tradeoff and an improved short-circuit robustness.     

Study on the drain bias effect on negative bias temperature instability degradation of an ultra-short p-channel metal-oxide-semiconductor field-effect transistor

This paper studies the effect of drain bias on ultra-short p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET) degradation during negative bias temperature (NBT) stress. When a relatively large gate voltage is applied, the degradation magnitude is much more than the drain voltage which is the same as the gate voltage supplied, and the time exponent gets larger than that of the NBT instability (NBTI). With decreasing drain voltage, the degradation magnitude and the time exponent all get smaller. At some values of the drain voltage, the degradation magnitude is even smaller than that of NBTI, and when the drain voltage gets small enough, the exhibition of degradation becomes very similar to the NBTI degradation. When a relatively large drain voltage is applied, with decreasing gate voltage, the degradation magnitude gets smaller. However, the time exponent becomes larger. With the help of electric field simulation, this paper concludes that the degradation magnitude is determined by the vertical electric field of the oxide, the amount of hot holes generated by the strong channel lateral electric field at the gate/drain overlap region, and the time exponent is mainly controlled by localized damage caused by the lateral electric field of the oxide in the gate/drain overlap region where hot carriers are produced.     

超短沟道绝缘层上硅平面场效应晶体管中热载流子注入应力导致的退化对沟道长度的依赖性

随着场效应晶体管(MOSFET)器件尺寸的进一步缩小和器件新结构的引入, 学术界和工业界对器件中热载流子注入(hot carrier injections, HCI)所引起的可靠性问题日益关注. 本文研究了超短沟道长度(L=30–150 nm)绝缘层上硅(silicon on insulator, SOI)场效应晶体管在HCI应力下的电学性能退化机理. 研究结果表明, 在超短沟道情况下, HCI 应力导致的退化随着沟道长度变小而减轻. 通过研究不同栅长器件的恢复特性可以看出, 该现象是由于随着沟道长度的减小, HCI应力下偏压温度不稳定性效应所占比例变大而导致的. 此外, 本文关于SOI器件中HCI应力导致的退化和器件栅长关系的结果与最近报道的鳍式场效晶体管(FinFET)中的结果相反. 因此, 在超短沟道情况下, SOI平面MOSFET器件有可能具有比FinFET器件更好的HCI可靠性.     

Thermoelectric response of spin polarization in Rashba spintronic systems

Motivated by the recent discovery of a strongly spin–orbit-coupled two-dimensional (2D) electron gas near the surface of Rashba semiconductors BiTeX (X= Cl, Br, I), we calculate the thermoelectric responses of spin polarization in a 2D Rashba model. By self-consistently determining the energyand band-dependent transport time, we present an exact solution of the linearized Boltzmann equation for elastic scattering. Using this solution, we find a non-Edelstein electric-field-induced spin polarization that is linear in the Fermi energy E_F when E_F lies below the band crossing point. The spin polarization efficiency, which is the electric-field-induced spin polarization divided by the driven electric current, increases for smaller E_F .We show that, as a function of E_F, the temperaturegradient-induced spin polarization increases continuously to a saturation value when EF decreases below the band crossing point. As the temperature tends to zero, the temperature-gradient-induced spin polarization vanishes.     

Theoretical investigation of image states of hydrogen covered Cu(100)

A model for atomic hydrogen covered Cu(100) is presented and the calculated energy spectrum of localized electronic states in the X gap of Cu(100) is discussed. These states form a series of unoccupied adsorption states (for n = 2,3,…) lying below the vacuum level V₀ and having energies E_n which satisfy the formula E_n = V₀−10/n²eV. The lowest state (n = 1) is expected to lie about 5.5 eV below the Fermi level.     

Temperature-controllable spin-polarized current and spin polarization in a Rashba three-terminal double-quantum-dot device

We propose a Rashba three-terminal double-quantum-dot device to generate a spin-polarized current and manipulate the electron spin in each quantum dot by utilizing the temperature gradient instead of the electric bias voltage. This device possesses a nonresonant tunneling channel and two resonant tunneling channels. The Keldysh nonequilibrium Green's function techniques are employed to determinate the spin-polarized current flowing from the electrodes and the spin accumulation in each quantum dot. We find that their signs and magnitudes are well controllable by the gate voltage or the temperature gradient. This result is attributed to the change in the slope of the transmission probability at the Fermi levels in the low-temperature region. Importantly, an obviously pure spin current can be injected into or extracted from one of the three electrodes by properly choosing the temperature gradient and the gate voltages. Therefore, the device can be used as an ideal thermal generator to produce a pure spin current and manipulate the electron spin in the quantum dot.     

Two-dimensional intrinsic ferromagnetism at nitride-boride interfaces

We predict theoretically novel two-dimensional interface ferromagnetism at AlN/MgB(2)(0001) using first-principles calculations, where the interface is employed as an ordered structure of spin sites instead of point defects. Although N dangling bonds are apparently saturated, interfacial states exhibit spin polarization. Hund's coupling of the two N p(∥) orbitals as well as low density of states at the Fermi energy contribute to strong band ferromagnetism. Furthermore, first-principles electron transport calculations demonstrate that this interfacial spin polarization is responsible for quantum spin transport. The magnetization can be controlled by applied gate bias voltages.     

Effect of band structure on quantum interference in multiwall carbon nanotubes

We report conductance measurements on multiwall carbon nanotubes in a perpendicular magnetic field. A gate electrode with large capacitance is used to considerably vary the nanotube Fermi level. This enables us to search for signatures of the unique electronic band structure of the nanotubes in the regime of diffusive quantum transport. We find an unusual quenching of the magnetoconductance and the zero bias anomaly in the differential conductance at certain gate voltages, which can be linked to the onset of quasi-one-dimensional subbands.     

Pure spin-current diode based on interacting quantum dot tunneling junction

A magnetic field-controlled spin-current diode is theoretically proposed, which consists of a junction with an interacting quantum dot sandwiched between a pair of nonmagnetic electrodes. By applying a spin bias V_S across the junction, a pure spin current can be obtained in a certain gate voltage regime,regardless of whether the Coulomb repulsion energy exists. More interestingly, if we applied an external magnetic field on the quantum dot, we observed a clear asymmetry in the spectrum of spin current I_S as a function of spin bias, while the charge current always decays to zero in the Coulomb blockade regime. Such asymmetry in the current profile suggests a spin diode-like behavior with respect to the spin bias, while the net charge through the device is almost zero. Different from the traditional charge current diode, this design can change the polarity direction and rectifying ability by adjusting the external magnetic field, which is very convenient. This device scheme can be compatible with current technologies and has potential applications in spintronics or quantum processing.     

Migration of weakly bonded oxygen atoms in a-IGZO thin films and the positive shift of threshold voltage in TFTs

Amorphous indium-gallium-zinc oxide (a-IGZO) thin films are prepared by pulsed laser deposition and fabricated into thin-film transistor (TFT) devices. In-situ x-ray photoelectron spectroscopy (XPS) illustrates that weakly bonded oxygen (O) atoms exist in a-IGZO thin films deposited at high O₂ pressures, but these can be eliminated by vacuum annealing. The threshold voltage (V_th) of the a-IGZO TFTs is shifted under positive gate bias, and the V_th shift is positively related to the deposition pressure. A temperature variation experiment in the range of 20 K-300 K demonstrates that an activation energy of 144 meV is required for the V_th shift, which is close to the activation energy required for the migration of weakly bonded O atoms in a-IGZO thin films. Accordingly, the V_th shift is attributed to the acceptor-like states induced by the accumulation of weakly bonded O atoms at the a-IGZO/SiO₂ interface under positive gate bias. These results provide an insight into the mechanism responsible for the V_th shift of the a-IGZO TFTs and help in the production of reliable designs.