热应力作用降低LPE层中的位错

提出由温差造成热剪切应力,引起衬底穿线位错滑移,形成<110>界面位错,从而降低LPE层中位错的模型。稳定自然对流下的温度梯度液相外延,存在衬底厚度方向的温差,能在边缘固定的衬底中造成热剪切应力。生长了厚GaAs和Ga_1-xAl_xAs层(x<0.3),估算的热剪切应力大于产生<110>暗线缺陷的临界剪切应力。表面腐蚀坑观察表明,外延层位错密度下降,或无位错。界面蚀槽和阴极荧光观察表明,衬底穿线位错在界面弯曲成<110>界面位错。透射电子显微镜观察表明,界面位错多 关键词：     

Ga30Sb70/Sb80Te20纳米复合多层薄膜的相变特性研究

采用磁控二靶(Ga₃₀Sb₇₀和Sb₈₀Te₂₀)交替溅射方法制备了新型Ga₃₀Sb₇₀/Sb₈₀Te₂₀纳米复合多层薄膜, 对多层薄膜周期中Ga₃₀Sb₇₀层厚度对相变特性的影响进行了研究. 结果表明, 多层薄膜的结晶温度可以通过周期中Ga₃₀Sb₇₀层厚度进行调节, 且随着Ga₃₀Sb₇₀层厚度的增加而升高. Ga₃₀Sb₇₀/Sb₈₀Te₂₀纳米复合多层薄膜的光学带隙随Ga₃₀Sb₇₀层厚度的增加而增大. 采用皮秒激光脉冲抽运光探测技术研究了多层薄膜的瞬态结晶动力学过程, 利用不同能量密度的皮秒激光脉冲可以实现Ga₃₀Sb₇₀/Sb₈₀Te₂₀多层薄膜非晶态和晶态的可逆转变.     

重复稳定的掺氮磷化镓液相外延

本文简要地评述磷化镓外延生长技术,指出采用气相掺杂过补偿液相外延技术,适合于制备较高外量子效率的磷化镓绿色发光器件所需的外延生长层.从既能获得较高发光效率又能满足工业批量生产要求出发,设计制造了采用滑板技术及气相掺氮和掺锌的过补偿液相外延生长装置.装置具有结构简单,操作方便,便于控制等特点.应用该装置进行试验,总结了外延生长主要工艺和典型的生长条件.连续十余次外延生长的实验结果表明,所采用的液相外延生长技术,能稳定重复地生长出符合于制备较高外量子效率的绿色发光器件所需的掺氮磷化镓外延生长层.用该材料制成绿色发光二极管,当发光面积为500×500微米2,电流密度为12A/cm2时,总光通量一般大于10毫流明.最高的达到了19.85毫流明.由此说明,本文所报导的液相外延技术适合于工业上批量生产磷化镓绿色发光二极管.     

常压MOCVD生长Ga2O3薄膜及其分析

以去离子水(H₂O)和三甲基镓(TMGa)为源材料,用常压MOCVD方法在蓝宝石(0001)面上生长出β-Ga₂O₃薄膜.用原子力显微镜(AFM)、X射线衍射(XRD)以及二次离子质谱(SIMS)实验表征Ga₂O₃外延膜的质量.在X射线衍射谱中有一个强的Ga₂O₃(102)面衍射峰,其半峰全宽(FWHM)为0.25°,表明该Ga₂O₃外延膜是(102)择优取向.在二次离子质谱中除了C、H、O和Ga原子外,没有观测到其他原子.     

热原子层沉积钛掺杂氧化镓薄膜的光学性能

在250℃的低温下，以三甲基镓、四(二甲氨基)钛为前躯体源，O₃为反应气体，采用热原子层沉积制备了Ti掺杂Ga₂O₃(TGO)薄膜。Ga₂O₃和TiO₂的生长速率分别为0.037 nm/cycle和0.08 nm/cycle,TGO薄膜厚度低于理论计算值。X射线光电子能谱仪测试结果表明膜中Ti浓度随Ga₂O₃/TiO₂循环比减少而增加，O 1s、Ga 2p和Ti 2p的峰位置向较低的结合能移动，这是因为Ti原子取代了Ga原子的某些位点引起了结合能降低，表明Ti元素成功掺杂到Ga₂O₃薄膜中。TiO₂和Ga₂O₃的芯能级光谱分析表明薄膜中存有Ti⁴⁺和Ga³⁺离子。TGO薄膜的O 1s芯能级光谱中Ga-O键随着Ti-O键含量增加而下降，表明T...     

对流作用下枝晶形貌演化的数值模拟和实验研究

合金凝固过程中存在于枝晶尖端液相区的强制对流和自然对流均能改变溶质扩散层厚度,从而会对枝晶形貌产生较大影响.在元胞自动机模型基础上,耦合液体流动方程、热传导方程和溶质对流扩散方程,建立了新的计算微观组织演化的数值模型,并利用该模型研究了强制对流和自然对流对枝晶生长的影响.三维数值模拟结果再现了强制对流作用下等轴枝晶的生长过程,揭示了强制对流对枝晶生长速率和尖端半径的影响特点.同时利用该模型模拟了NH₄Cl-H₂O溶液定向凝固过程中自然对流对柱状晶生长的影响,并采用相应的实验进行验证.模拟结果与实验结果符合良好,从而证明该模型是可靠的,可推广到实际合金系中. 关键词： 元胞自动机 对流 4Cl-H₂O溶液')" href="#">NH₄Cl-H₂O溶液 定向凝固     

缓冲层对InSb/GaAs薄膜质量的影响

InSb是制作3~5μm红外探测器的重要材料。在GaAs衬底上外延生长InSb,存在的主要问题在于两种材料间14.6%的晶格失配度,会引入较大的表面粗糙度以及位错密度,使外延材料的结构和电学性能均会受到不同程度的影响。通过系列实验,研究了在生长过程中缓冲层对薄膜质量的影响。利用高能电子衍射仪(RHHEED)得到了合适的生长速率和Ⅴ/Ⅲ比,研究了异质外延InSb薄膜生长中低温InSb缓冲层对材料生长质量以及不同外延厚度对材料电学性质的影响。采用原子力显微镜(AFM)、透射电子显微镜(TEM)、X射线双晶衍射(DCXRD)等方法研究了InSb/GaAs薄膜的表面形貌、界面特性以及结晶质量。通过生长合适厚度的缓冲层,获得了室温下DCXRD半高峰宽为172″,77 K下迁移率为64300 cm²·V^-1·s^-1的InSb外延层。     

Ga6N6团簇结构性质的理论计算研究

在密度泛函理论的基础上，对Ga₆N₆团簇进行了第一性原理、全电子、从头计算，得到了10种可能的三维空间结构及其电子结构.其中最稳定结构的一对GaN原子的平均结合能为9.748 eV，因此是可能存在的.但与他人计算的Ga₃N₃和Ga₅N₅相比，Ga₆N₆团簇可能不属于“幻数”团簇.最稳定结构的Ga₆N_{6 关键词： GaN 团簇 电子结构}     

Si1-xGex/Si异质结构中热应力对临界厚度的影响

系统分析了Si_1-xGe_x/Si外延生长中热应力对外延生长的影响．假设Si Ge的线膨胀系数是随Ge的组分线性变化的，由此计算出热应变和应变能密度．根据能量平衡原理，当失配应变能密度加热应变能密度等于位错能密度时，外延层达到临界厚度，在People的基础上得出了改进的临界厚度计算公式．理论计算值与People的实验值更相近． 关键词：     

YBa2Cu3O7-x涂层导体的外延生长和性能对CeO2缓冲层的依赖性

利用倾斜衬底沉积法在无织构的金属衬底上生长了MgO双轴织构的模板层,在这一模板层上实现了YBa₂Cu₃O_7-x薄膜的外延生长.在外延YBa₂Cu₃O_7-x薄膜前,依次沉积了钇稳定的立方氧化锆和CeO₂作为缓冲层.利用X射线衍射2θ扫描、扫描、Ω扫描和极图分析测定了这些膜的结构和双轴织 关键词： 2Cu₃O_7-x镀膜导体')" href="#">YBa₂Cu₃O_7-x镀膜导体 2缓冲层')" href="#">CeO₂缓冲层 厚度依赖性 外延生长     

应力导致InAs/In0.15Ga0.85As量子点结构中In0.15Ga0.85As阱层的合金分解效应研究

利用固源分子束外延技术，在In_0.15Ga_0.85As/GaAs量子阱生长了两个InAs/In_0.15Ga_0.85As量子点(DWELL)样品.通过改变其中一个InAs DWELL样品中的In_0.15Ga_0.85As阱层的厚度和生长温度，获得了量子点尺寸增大而且尺寸分布更均匀的结果.结合光致发光光谱(PL)和压电调制光谱(PzR)实验结果，发现该样品量子点的光学性质也同时得到 关键词： 合金分解效应 0.15Ga_0.85As量子点')" href="#">InAs/In_0.15Ga_0.85As量子点 光致发光光谱 压电调制光谱     

Band offsets in In0.15Ga0.85As/ GaAs and In0.15Ga0.85As/Al0.15Ga0.85As studied by photoluminescence and cathodoluminescence

Photoluminescence and cathodoluminescence measurements of strained undoped In_0.15Ga_0.85As/GaAs and In_0.15Ga_0.85As/Al_0.15Ga_0.85As quantum well structures with emission lines attributed to the first electron–first heavy hole and first electron–first light hole excitonic transitions have been analysed theoretically within the eight-band effective mass approximation. For In_0.15Ga_0.85As/GaAs the results are consistent with either type I or type II alignment of the light hole band. In the case of In_0.15Ga_0.85As/Al_0.15Ga_0.85As our results indicate type II alignment for the light hole band and offset ratio ofQ = 0.83.     

Photoluminescence and dark current of p-doped InGaAs/AlxGa1−xAs strained multiple quantum wells

We report the temperature dependence of the photoluminescence spectra and current-voltage (I_d-V) characteristics of p-doped In_0.15Ga_0.85As/AlGaAs quantum well infrared photodetectors (QWIPs) with different barrier heights grown by molecular beam epitaxy (MBE). The dark current at low temperatures is found to be about three orders of magnitude lower than that reported for the n- and p-doped QWIPs made of other material systems. The PL spectra show two emission peaks which correspond to an intersubband absorption and are tunable by changing the mole fraction of Al. The low energy emission peak of the In_0.15Ga_0.85As/Al_0.45Ga_0.55As QWIP is found to be much lower in intensity than that of the high one, due possibly to excess Al which may result in defects or imperfection at/or near well-barrier interfaces.     

Confinement-enhanced dots-in-a-well QDIPs with operating temperature over 200 K

LWIR InAs/Al_0.3Ga_0.7As/In_0.15Ga_0.85As confinement-enhanced DWELL (CE-DWELL) QDIPs with operation temperatures higher than 200 K are reported. A thin Al_0.3Ga_0.7As barrier layer was inserted above the InAs QDs to improve the confinement of QD states in the In_0.15Ga_0.85As DWELL structure and the device performance. The better confinement of the electronic states increases the oscillator strength of the infrared absorption. The higher excited state energy also improves the escape probability of the photoelectrons. Compared with the conventional DWELL QDIPs, the quantum efficiency increases for more than 20 times and the detectivity is an order of magnitude higher at 77 K. With better device parameters of CE-DWELL, it is possible to achieve high quantum efficiency, high operating temperature and long wavelength detection at the same time.     

Interfacial roughnes and alloy scattering in the InGaAs/InAlAs/InP system grown by ALE and LAMBE

Molecular beam epitaxial growth of In_xGa_1−xAs and In_yAl_1−yAs on Inp has been carried out by atomic layer epitaxy (ALE) and laser assisted molecular beam epitaxy (LAMBE). It is shown that these growth techniques have minimized both alloy clustering and interface roughness in the InGaAs/InAlAs system. Splitting of the PLE spectra indicates a roughness of 2–3 monolayers while transport measurements have placed an upper limit to the roughness at 4 monolayers.     

High temperature electron transport properties of AlGaN/GaN heterostructures with different Al-contents

Electron transport properties in AlGaN/GaN heterostructures with different Al-contents have been investigated from room temperature up to 680 K. The temperature dependencies of electron mobility have been systematically measured for the samples. The electron mobility at 680 K were measured as 154 and 182 cm²/V·s for Al_0.15Ga_0.85N/GaN and Al_0.40Ga_0.60N/GaN heterostructures, respectively. It was found that the electron mobility of low Al-content Al_0.15Ga_0.85N/GaN heterostructure was less than that of high Al-content Al_0.40Ga_0.60N/GaN heterostructure at high temperature of 680 K, which is different from that at room temperature. Detailed analysis showed that electron occupations in the first subband were 75% and 82% at 700 K for Al_0.15Ga_0.85N/GaN and Al_0.40Ga_0.60N/GaN heterostructures, respectively, and the two dimensional gas (2DEG) ratios in the whole electron system were 30% and near 60%, respectively. That indicated the 2DEG was better confined in the well, and was still dominant in the whole electron system for higher Al-content AlGaN/GaN heterostructure at 700 K, while lower one was not. Thus it had a higher electron mobility. So a higher Al-content AlGaN/GaN heterostructure is more suitable for high-temperature applications.     

Photoluminescence of Al x Ga1−x As/GaAs quantum well heterostructures grown by molecular beam epitaxy

Nominally undoped Al_xGa_1–xAs grown by molecular beam epitaxy from As₄ species at elevated substrate temperatures of 670°C exhibits well-resolved excitonic fine structure in the low-temperature photoluminescence spectra, if the effective As-to-(Al+Ga) flux ratio on the growth surface is kept within a rather narrow range of clearly As-stabilized conditions. In contrast to previous results on Al_xGa_1–xAs of composition 0.15not to shift in energy by changing the excitation intensity. This implies a simple freeelectron carbon-acceptor recombination mechanism for the line without any participation of a donor. In Al_xGa_1–xAs of composition close to the direct-to-indirect cross-over point, two distinct LO-phonons separated by 34 and 48 meV from the (D ⁰,C ⁰) peak position at x=0.43 were observed which were before only detectable by Raman scattering experiments. The intensity of the carbon-impurity related luminescence lines in bulk-type Al_xGa_1–xAs and GaAs layers was found to be strongly reduced, as compared to the excitonic recombination lines, if the respective active layer was covered by a very thin confinement layer of either GaAs on top of Al_xGa_1–xAs or vice versa grown in the same growth cycle.     

Surface confinement of the InN-rich phase in thick InGaN on GaN

The surface confinement of InN-rich phase in thick In_0.15Ga_0.85N epitaxial films on GaN were observed by photoluminescence depth profiling employing an inductively coupled Cl₂ plasma etching technique. The photoluminescence measurements showed that InN-rich phases were present on the surface of the thick In_0.15Ga_0.85N films. After removing the surface layer of 50 nm, the PL peaks corresponding to the InN-rich phases completely disappeared, suggesting that the InN-rich phase region is confined to a depth of 50 nm.     

Manganese-related luminescence in GaInAs/AlInAs multiple quantum wells grown on InP by molecular beam epitaxy

Two Mn-related luminescence peaks have been observed in a series of nominally undoped Ga_0.47In_0.53As/Al_0.48In_0.52As multiple quantum wells (MQW) grown lattice-matched on InP substrates by molecular beam epitaxy. These two peaks correspond to on-center and on-edge impurity states, respectively. The origin of the Mn impurities is outdiffusion from the Fe-doped semiinsulating InP substrate into the epitaxial layer. The binding energy of Mn acceptors, determined to be 53±3 meV in bulk-like Ga_0.47In_0.53As, increases to 80±5 meV for the on-center Mn state in a 58 Å MQW. The strong well-width dependence of the binding energy is explained in terms of the unique behavior of the Mn impurity in III–V semiconductors. The Mn in Ga_0.47In_0.53As and Ga_0.47In_0.53As/Al_0.48In_0.52As MQWs behaves predominantly as a deep impurity.On leave from: A. F. Ioffe Physicotechnical Institute, Leningrad, USSR     

Annealing effect on the optical properties in Si delta-doped Al0.24Ga0.76As/In0.15Ga0.85As/GaAs pseudomorphic high electron mobility transistor structures

The optical properties of Si delta-doped Al_0.24Ga_0.76As/In_0.15Ga_0.85As/GaAs pseudomorphic high electron mobility transistor structure (PHEMTs) are estimated after the process of rapid thermal annealing (RTA) in the temperature range 500–750°C. After layer intermixing and decrease of 2DEG densities of PHEMTs just occurs around the annealing temperature of 650°C, the 12H transition peak at 1.354 eV above the annealing temperature of 650°C is newly observed from the photoluminescence (PL) and photoreflectance (PR) spectra. From the results of PL and PR measurements in the annealed PHEMTs, it is found that remarkable modification of band profile in InGaAs QW occur at annealing temperature above 650°C.