高能、超短脉冲、可调谐激光器用掺镱氟磷酸盐玻璃研究进展

Yb^3 与其它稀土离子相比有最简单的能级结构，这使它具有一些独特的性质，如避免激发态吸收，消除上转换和浓度猝灭等，因此它是高能输出激光器介质的理想掺杂离子。氟磷玻璃综合了氟化物玻璃和磷酸盐玻璃的优点，可降低磷酸盐的声子能量，改善其易吸湿性；提高氟化物玻璃的物理化学性能等，这使它成为稀土掺杂可调谐光纤激光器的很好的掺杂介质。众多研究表明，Yb^3 掺杂氟磷玻璃是一种很有前途的激光工作物质。本文总结了Yb^3 掺杂氟磷玻璃的特点，性质，结构及存在的问题。     

电子束在LB抗蚀层及衬底中散射轨迹的Monte—Carlo模拟

研究了高能电子束在ＬＢ膜及多层膜中的输运特性，用Ｍｏｎｔｅ－Ｃａｒｌｏ技术模拟电子在ＬＢ聚甲基丙燃酸甲酯抗蚀层及蒸镀有铬膜的硅衬中的散射轨迹，并讨论了电子束曝光刻蚀应用ＬＢ膜作抗蚀层的优越性。     

二维过渡金属硫化物激子能级的理论计算——介质屏蔽的氢原子模型

根据介质屏蔽的氢原子模型求解了单层过渡金属硫化物MoS_2中A激子的结合能及能级谱图,所得结果与二维空间里的玻尔氢原子理论所得结果进行比较发现,介质的屏蔽效应导致处于激发态的激子结合能增大,激发态与基态间的能级间距减小,当主量子数n8时,激子的量子化特性才消失而呈现出连续的能级谱.     

磁控溅射结合脉冲激光制备钛掺杂硅薄膜的研究（英文）

发展了一种改进的新型超掺杂工艺,通过真空磁控溅射多层镀膜后结合532nm波长可见纳秒脉冲激光熔融处理,进行超掺杂钛的硅薄膜材料的制备,并对材料的超掺杂层的性质和红外吸收性能进行了探究.结果表明,硅膜层中掺杂的钛原子的百分比浓度超过1%左右,对应钛原子浓度约为5×10~(20) cm~(-3)左右,超过钛在硅中形成超掺杂所对应的原子浓度.钛超掺杂层的厚度超过200nm左右,相对传统工艺具有明显提升,并且钛原子的浓度变化范围不超过20%,分布比较均匀.小角度X射线衍射测试表明经过可见脉冲激光熔融处理后的硅薄膜层材料结晶度为25%左右,呈多晶结构.同时红外吸收谱测试表明,样品的钛掺杂硅膜层在大于1 100nm波长的区域具有很高的红外吸收效果,最高的红外吸收系数达到1.2×10~4 cm~(-1),远超过单晶硅材料.具有比较明显的亚能带吸收的特征,呈现出Ec-0.26eV的掺杂能级.霍尔效应测试表明硅膜层具有较高的载流子浓度,超过了8×10~(18)cm~(-3).     

多孔硅发光与量子尺寸效应的实验研究

利用电化学阳极腐蚀的方法制备了多孔硅膜,实验发现多孔硅膜为多层结构,表面层为纳米结构,其余为微米结构,多孔硅的物理及化学结构的研究表明多孔硅是一种表面上含硅、氧、氢、氟元素组成的化合物包覆着的纳米晶硅粒和微米硅丝.多孔硅的发光主要来自表面纳米结构层,亚微米结构层并未见发光,从实验上证实了多孔硅的发光与量子尺寸效应紧密关联.     

PdMn/Co多层膜的磁性和磁光特性研究

用磁控溅射法制备了不同Mn含量的PdMn/Co磁性多层膜，通过x射线衍射对该多层膜系列进行结构分析；测定了不同Mn含量系列样品的磁滞回线、垂直各向异性及磁力显微镜图，分析了饱和磁化强度、磁畴和垂直各向异性变化的原因；通过测定该多层膜体系的克尔谱，简要分析了一定波长下克尔角随Mn含量增加而变化的物理机制. 关键词： 多层膜 磁性 磁光     

Pt974Mn26/Co多层膜的磁性与磁光性质研究

用磁控溅射法制备了Mn含量一定、不同PtMn层厚度的Pt974Mn26/Co磁性多层膜系列，通过x射线衍射对该多层膜系列进行结构分析；测定了不同PtMn层厚度系列样品的磁滞回线、有效垂直各向异性，分析了饱和磁化强度和有效垂直各向异性变化的原因；通过测定该多层膜体系的克尔谱，分析了一定波长下克尔角随PtMn层厚度变化的规律.认为克尔角的变化是由于界面的合金化以及原子的极化减小所致. 关键词： 多层膜 磁性 磁光     

集成电路中的物理问题讲座 第六讲 硅-二氧化硅系统中的电荷和界面陷阱

包括大规模集成电路在内的现代半导体器件,绝大部分是用硅平面工艺制造的.在抛光的硅片上进行热氧化、光刻窗口、热扩散、蒸金属膜等操作之后,器件的芯片就制成了.平面工艺少不了硅表面的一层SiO2膜,该膜不仅在器件制造过程中作为杂质选择扩散的掩膜,在器件制成后也作为金属布线的支撑物和绝缘物,因此这些器件都包含Si- SiO3系统.在MOS器件中,还有较薄的优质SiO2作栅极的介质,它是决定该类器件功能的关键组成部分.在硅表面上制备热氧化层比较方便,与其它介质相比,SiO2与Si的衔接最好,至今还没有一种介质可代替热生长SiO2直接与硅匹配.…     

掺铜及掺铝多孔硅的光致发光及其发光机理

分别将特定杂质铜和铝引入多孔硅后，观察到了杂质铜和铝所引起的附加发光带：对于没有掺铜的多孔硅，其光致发光谱只有一个发光带；而掺过铜的多孔硅，其光致发光谱出现两个发光带，其中能量较低的发光带随主发光带而变化。在掺铝多孔硅的光致发光谱中，则出现4个与铝杂质能级有关发光带。我们认为上述与杂质有关的发光带是由截流子在杂质深能级上复合所致。     

TeSeIn相变记录薄膜的微观特性研究

TeSeIn是一种可逆光存贮介质.分别用单源热蒸发和磁控溅射制备TeSeIn膜.利用透射电镜(TEM)研究了膜的结构和微观形貌.利用俄歇剖面技术(AES-PRO)给出了膜的组分深度剖面,分析了TeSeIn记录介质膜与ZnS保护膜界面间的互扩散大小.利用X光电子能谱(XPS)分析了组元深能级结合能的化学位移.最后根据上面实验结果简要讨论了制备稳定的多元记录介质膜的方法.     

Epitaxial growth of Al on Si(1 1 1) with Cu buffer layers

The structure of thin Al films grown on Si(1 1 1) with thin Cu buffer layers has been investigated using synchrotron radiation photoemission spectroscopy. A thin Cu(1 1 1) layer between the Si(1 1 1) substrate and an Al film may enhance quantum well effects in the Al film significantly. The strength of quantum well effects has been investigated qualitatively with respect to the thickness of the Cu buffer layer and to the Al film thickness. Deposition of Cu on Si(1 1 1)7 × 7 leads to formation of a disordered silicide layer in an initial regime before a well-ordered Cu(1 1 1) film is formed after deposition of the equivalent of 6 layers of Cu. In the regime below 6 layers of Cu the disorder is transferred to Al layers subsequently grown on top. The initial growth of up to 8 layers of Al on a well-ordered Si/Cu(1 1 1) layer leads to a disordered film due to the lattice mismatch between the two metals. When the Cu buffer layer and the Al over-layer are above 6 and 8 layers, respectively the Al film shows sharp low energy electron diffraction patterns and very sharp quantum well peaks in the valence band spectra signalling good epitaxial growth.     

Si(001)基片上反应射频磁控溅射ZnO薄膜的两步生长方法

利用反应射频磁控溅射技术，采用两步生长方法制备了ZnO薄膜，探讨了基片刻蚀时间和低温过渡层沉积时间对ZnO薄膜生长行为的影响.研究结果表明，低温ZnO过渡层的沉积时间所导致的薄膜表面形貌的变化与过渡层在Si(001)表面的覆盖度有关.当低温过渡层尚未完全覆盖基片表面时，ZnO薄膜的表面岛尺度较小、表面粗糙度较大，薄膜应力较大；当低温过渡层完全覆盖Si(001)基片后，ZnO薄膜的表面岛尺度较大、表面粗糙度较小，薄膜应力较小.基片刻蚀时间对薄膜表面形貌的影响与低温过渡层的成核密度有关.随着刻蚀时间的增加，ZnO薄膜的表面粗糙度逐渐下降，表面形貌自仿射结构的关联长度逐渐减小. 关键词： ZnO薄膜 反应射频磁控溅射 两步生长 形貌分析     

磁控共溅射低温制备多晶硅薄膜及其特性研究

多晶硅在光电子器件领域具有较为重要的用途。利用磁控溅射镀膜系统,通过共溅射技术在玻璃衬底上制备了非晶硅铝(α-Si/Al)复合膜,将Al原子团包覆在α-Si基质中,膜中的Al含量可通过Al和Si的溅射功率比来调节。复合膜于N₂气氛中进行350 ℃,10 min快速退火处理,制备出了多晶硅薄膜。利用X射线衍射仪、拉曼光谱仪和紫外-可见光-近红外分光光度计对多晶硅薄膜的性能进行表征,研究了Al含量对多晶硅薄膜性能的影响。结果表明：共溅射法制备的α-Si/Al复合膜在低温光热退火下晶化为晶粒分布均匀的多晶硅薄膜;随着膜中Al含量逐渐增加,多晶硅薄膜的晶化率、晶粒尺寸逐渐增加,带隙则逐渐降低;Al/Si溅射功率比为0.1时可获得纳米晶硅薄膜,Al/Si溅射功率比为0.3时得到晶化率较高的多晶硅薄膜,通过Al含量的调节可实现多晶硅薄膜的晶化率、晶粒尺寸及带隙的可控。     

Optical Analysis of Nanocrystalline ZnO Films Coated on Porous Silicon by Radio Frequency (RF) Magnetron Sputtering

Zinc oxide thin films have been deposited onto porous silicon (PSi) substrates at high growth rates by radio frequency (RF) sputtering using a ZnO target. The advantages of the porous Si template are economical and it provides a rigid structural material. Porous silicon is applied as an intermediate layer between silicon and ZnO films and it contributed a large area composed of an array of voids. The nanoporous silicon samples were adapted by photo electrochemical (PEC) etching technique on n-type silicon wafer with (111) and (100) orientation. Micro-Raman and photoluminescence (PL) spectroscopy are powerful and non-destructive optical tools to study vibrational and optical properties of ZnO nanostructures. Both the Raman and PL measurements were also operated at room temperature. Micro-Raman results showed that the A₁(LO) of hexagonal ZnO/Si(111) and ZnO/Si(100) have been observed at around 522 and 530 cm^–1, re- spectively. PL spectra peaks are distinctly apparent at 366 and 368 cm^–1 for ZnO film grown on porous Si(111) and Si(100) substrates, respectively. The peak luminescence energy in nanocrystalline ZnO on porous silicon is blue-shifted with regard to that in bulk ZnO (381 nm). The Raman and PL spectra pointed to oxygen vacancies or Zn interstitials which are responsible for the green emission in the nanocrystalline ZnO.     

Novel silicon nanowire film on copper foil as high performance anode for lithium-ion batteries

A novel silicon nanowire film anode was successfully prepared by a combination of magnetron sputtering deposition and metal-catalyzed electroless etching technology. Scanning electron microscopy revealed the formation of a Si film composed of nanowires with a diameter of ~70 nm and lengths of ~3.5 μm. As-prepared Si nanowire film is directly grown on current collectors without binders and carbon additives, which provides a good contact and adhesion of them to current collector. Furthermore, the defined spacing of nanoscale Si nanowire allows Si to undergo large volume change during the alloying/dealloying process without loss of its integrity. These structural features of the resulting Si nanowire make it a promising anode for lithium-ion batteries with remarkably improved electrochemical performance compared with the Si film-based electrode prepared without metal-catalyzed electroless etching process.     

Surface morphology for ion-beam sputtered Al layer with varying sputtering conditions

We study the growth morphology of thin macrostructure films which is known to be largely affected by the deposition conditions as thin film nucleation and formation is dependent on the kinetic energy and chemical free energy of the atoms. The ion-beam sputtering technique used for depositing thin layers is due to the advantage over other techniques, e.g. the independent control of many process parameters, such as the pressure and/or the energy of the ion-beam and the substrate temperature. Therefore, the dependence of various sputtering parameters such as: (i) sputtering pressure and/or the rate of deposition and (ii) the effect of substrate temperature on the growth has been studied by depositing a single layer of Al. The variations show some interesting dependencies on the structural parameters for the Al layer deposited which has been understood in terms of thin film growth and nucleation theory.     

Polycrystalline silicon films prepared by metal-induced crystallisation using pre- and post-deposited aluminium on amorphous silicon

We report on the successful fabrication of polycrystalline silicon films by aluminium-induced crystallisation (AIC) of Radio frequency (rf) plasma-enhanced chemical vapour deposited (PECVD) a-Si films. The effects of annealing at different temperatures (300 and 400°C), below the eutectic temperature of the Si–Al binary system, on the crystallisation process have been studied. This work emphasises the important role of the position of the Al layer with respect to the Si layer on the crystallisation process. The properties of the crystallised films were characterised using X-ray diffraction, Raman spectroscopy, ellipsometry, field-emission scanning electron microscopy (FESEM) and atomic force microscopy (AFM). With an increase in the annealing temperature, it was found that the degree of crystallisation of annealed a-Si/Al and Al/a-Si films increased. The results showed that the arrangement where the Al was on top of the a-Si had a more prominent effect on crystallisation enhancement than when Al was below the a-Si. The interfacial layer between the Al and a-Si film is crucial because it influences the layer-exchange process during annealing. The oxide layer formed between the Al and the a-Si layers greatly retards the crystallisation process in the case of the Al/Si arrangement. Our investigations suggest that polycrystalline Si films formed by AIC can be used as a seed layer in solar cell fabrication.     

Influence of substrate crystallography on the room temperature synthesis of AlN thin films by reactive sputtering

A pulsed DC reactive ion beam sputtering system has been used to synthesize aluminium nitride (AlN) thin films at room temperature by reactive sputtering. After systematic study of the processing variables, high-quality polycrystalline films with preferred c-axis orientation have been grown successfully on silicon and Au/Si substrates with an Al target under a N₂/(N₂ + Ar) gas flow ratio of 55%, 2 mTorr processing pressure and keeping the temperature of the substrate holder at room temperature. The crystalline quality of the AlN layer as well as the influence of the substrate crystallography on the AlN orientation has been characterized by high-resolution X-ray diffraction (HR-XRD). Best ω-FWHM (Full Width at Half Maximum) values of the (0 0 0 2) reflection rocking curve in the 1 μm thick AlN layers are 1.3°. Atomic Force Microscopy (AFM) measurements have been used to study the surface morphology of the AlN layer and Transmission Electron Microscopy (TEM) measurements to investigate the AlN/substrate interaction. AlN grew off-axis from the Si substrate but on-axis to the surface normal. When the AlN thin film is deposited on top of an Au layer, it grows along the [0 0 0 1] direction but showing a two-domain structure with two in-plane orientations rotated 30° between them.     

Aluminum-assisted crystallization and <Emphasis Type="Italic">p</Emphasis>-type doping of polycrystalline Si

Aluminum-doped p-type polycrystalline silicon thin films have been synthesized on glass substrates using an aluminum target in a reactive SiH₄+Ar+H₂ gas mixture at a low substrate temperature of 300 °C through inductively coupled plasma-assisted RF magnetron sputtering. In this process, it is possible to simultaneously co-deposit Si–Al in one layer for crystallization of amorphous silicon, in contrast to the conventional techniques where alternating metal and amorphous Si layers are deposited. The effect of aluminum target power on the structural and electrical properties of polycrystalline Si films is analyzed by X-ray diffraction, Raman spectroscopy, scanning electron microscopy and Hall-effect analysis. It is shown that at an aluminum target power of 100 W, the polycrystalline Si film features a high crystalline fraction of 91%, a vertically aligned columnar structure, a sheet resistance of 20.2 kΩ/□ and a hole concentration of 6.3×10¹⁸ cm⁻³. The underlying mechanism for achieving the semiconductor-quality polycrystalline silicon thin films at a low substrate temperature of 300 °C is proposed.     

On the Discontinuity of Polycrystalline Silicon Thin Films Realized by Aluminum-Induced Crystallization of PECVD-Deposited Amorphous Si

Crystallization of glass/Aluminum (50, 100, 200 nm) /hydrogenated amorphous silicon (a-Si:H) (50, 100, 200 nm) samples by Aluminum-induced crystallization (AIC) is investigated in this article. After annealing and wet etching, we found that the continuity of the polycrystalline silicon (poly-Si) thin films was strongly dependent on the double layer thicknesses. Increasing the a-Si:H/Al layer thickness ratio would improve the film microcosmic continuity. However, too thick Si layer might cause convex or peeling off during annealing. Scanning electron microscopy (SEM) and Energy Dispersive X-ray spectroscopy (EDX) are introduced to analyze the process of the peeling off. When the thickness ratio of a-Si:H/Al layer is around 1 to 1.5 and a-Si:H layer is less than 200 nm, the poly-Si film has a good continuity. Hall measurements are introduced to determine the electrical properties. Raman spectroscopy and X-ray diffraction (XRD) results show that the poly-Si film is completely crystallized and has a preferential (111) orientation.