等离子体增强化学气相沉积法制备立方氮化硼薄膜过程中的表面生长机理

利用感应耦合等离子体增强化学气相沉积法以Ar，He，N₂和B₂H₆为反应气体制备了高纯立方氮化硼薄膜.用四极质谱仪对等离子体状况进行了系统的分析，发现B₂H₆完全被电离而N₂只是部分被电离.H₂和过量的N₂在等离子体中生成大量中性的H原子和活化的N^*₂，它们与表面的相互作用严重地阻碍了立方 关键词： 立方氮化硼薄膜 等离子体 质谱     

脉冲偏压电弧离子镀TiO2薄膜的力学与光学性能

用脉冲偏压电弧离子镀技术在玻璃基片上制备均匀透明的TiO₂薄膜.利用X射线衍射仪、原子力显微镜、扫描电子显微镜、紫外-可见透射光谱仪和纳米压痕仪等手段,对不同脉冲负偏压下合成薄膜的相结构、微观结构、表面形貌、力学和光学性能进行表征.结果表明，沉积态薄膜为非晶态.脉冲负偏压对薄膜性能有明显的影响.随偏压的增加，薄膜厚度、硬度和弹性模量均先增大后减小，前者峰值出现在100—200 V负偏压范围，后两者则在250—350V范围.300 V负偏压时薄膜硬度最高，薄膜达到原子级表面光滑度，均方 关键词： 2薄膜')" href="#">TiO₂薄膜 脉冲偏压电弧离子镀 硬度 折射率     

脉冲偏压电弧离子镀CNx薄膜研究

用脉冲偏压电弧离子镀通过控制不同的氮流量在(100)单晶Si基片上制备了不同成分的CN_x薄膜.用光学显微镜,XPS,XRD,激光Raman和Nanoindenter等方法研究了薄膜的形貌、成分、结构和性能.结果表明,薄膜表面平整致密、氮含量随着氮流量的降低而降低、结构为非晶且为类金刚石薄膜;随着氮含量从18.9%降低到5.3%(摩尔百分比,全文同),薄膜的硬度和弹性模量单调增加而且增幅较大,其中硬度从15.0 GPa成倍增加到30.0 GPa;通过氮流量的调整能够敏感地改变薄膜中的sp³键的含量,是CN_x薄膜的硬度和弹性模量获得大幅度调整的本质原因. 关键词： x薄膜')" href="#">CN_x薄膜 脉冲偏压 电弧离子镀 硬度     

用射频溅射法制备立方氮化硼薄膜

利用射频溅射方法在n型Si(111)衬底上制备出立方相含量接近100%且粘附性较高的立方氮化硼(c-BN)薄膜.傅里叶变换红外谱(FTIR)的结果表明，基底负偏压对薄膜立方相含量和薄膜压应力有很大影响，另外，衬底的电阻率对c-BN生长和薄膜的压应力也有一定的影响. 关键词： 立方氮化硼 射频溅射 压应力 基底负偏压     

常压He气和N$lt;sub$gt;2$lt;/sub$gt;气均匀介质阻挡放电的伏安特性

对带有多电流峰的常压He气均匀介质阻挡放电与常压N₂气均匀介质阻挡放电的伏安特性进行了实验分析. 分析结果表明：实验结果与模拟结果相符. 在带有多电流峰的常压He均匀介质阻挡放电中,辉光放电模式和汤森放电模式可以共存于一个多电流放电序列内. 此外,在放电电流增长阶段,可以根据常压均匀介质阻挡放电的伏安特性曲线的微分电导来判断均匀介质阻挡放电的放电模式. 在放电电流增长阶段,如果电流脉冲的伏安特性曲线呈现负微分电导,则电流脉冲为辉光放电模式;如果呈现正微分电导,则为汤森放电模式. 由此可以判断,常压N₂气均匀介质阻挡放电为汤森放电模式. 关键词： 伏安特性 辉光放电模式 汤森放电模式 常压均匀介质阻挡放电     

溅射气氛对N掺杂ZnO薄膜性能的影响

利用磁控溅射系统,N₂和Ar作为溅射气体,生长N掺杂ZnO薄膜。溅射气氛中氮气流量分别为0,8,20,32 mL/min,通过改变氮气的流量,研究薄膜性能的变化。结果发现,随着溅射气氛中氮气流量的增加,薄膜的电阻率增加,薄膜中N_O与(N₂)_O的掺杂浓度同时在变大。当氮气流量为8 mL/min时,N的有效掺杂效率最高。另外,随着溅射气氛中氮气流量的增加,薄膜的厚度在减小。     

大气压空气纳秒脉冲阵列式线-线SDBD等离子体的电学及发射光谱特性研究

提出了一种阵列式线-线沿面介质阻挡放电结构,利用双极性高压纳秒脉冲电源,在大气压空气中激励产生了相对大面积的放电等离子体。其中,高压电极、地电极均为圆柱形金属,放电反应器由20组相间排列的阵列式线型高压电极和套有介质管的阵列式线型地电极组成。利用电压探头、电流探头、示波器等测量了放电电压和放电总电流,并计算得出了放电的实际电流。利用光纤、光栅光谱仪、CCD等测量了波长范围在300～440 nm和766～778 nm的发射光谱,即氮分子第二正带N₂ (C3Π_u→B3Π_g)包括Δν= +1, 0, -1, -2, -3、氮分子离子第一负带N+₂(B2Σ+_u→X2Σ+_g),N₂ (B3Π_g→A3Σ+_u)和O (3p5P→3s5S₂)的发射光谱。比较了氮分子第二正带N₂ (C3Π_u→B3Π_g)的各个振动峰和各个活性物种的发射光谱强度,以及这些发射光谱强度随着脉冲峰值电压的变化。测量了N₂(C3Π_u→B3Π_g, 0-0)的二次、三次衍射光谱,与原始光谱在转动带、背景光谱等方面进行了比较,并计算了二次衍射和原始光谱之间的峰值比。利用氮分子第二正带N₂ (C3Π_u→B3Π_g, Δν=+1, 0, -1, -2)和氮分子离子第一负带N+₂ (B2Σ+_u→X2Σ+_g, 0-0)模拟了等离子体的转动温度和振动温度,对模拟结果进行了比较,并研究了脉冲峰值电压对等离子体振动温度和转动温度的影响。通过测量放电的电压和计算得到的放电电流发现,当脉冲峰值电压为22 kV,脉冲重复频率为150 Hz时,阵列式线-线沿面介质阻挡放电的放电电流在正脉冲、负脉冲两个方向上均可达75 A左右。通过诊断放电等离子体的发射光谱发现,在测量的波长范围内,放电产生的活性物种主要有氮分子第二正带N₂ (C3Π_u→B3Π_g)、氮分子离子第一负带N+₂(B2Σ+_u→X2Σ+_g),N₂ (B3Π_g→A3Σ+_u)和O (3p5P→3s5S₂)。在脉冲峰值电压22～36 kV的变化范围内,氮分子第二正带N₂(C3Π_u→B3Π_g, 0-0)的发射光谱强度始终保持最强,N₂ (B3Π_g→A3Σ+_u)次之,而氮分子离子第一负带N+₂(B2Σ+_u→X2Σ+_g)和O (3p5P→3s5S₂)的发射光谱强度较弱。同时,当脉冲峰值电压升高时,氮分子第二正带N₂ (C3Π_u→B3Π_g)的所有振动峰,以及氮分子离子第一负带N+₂(B2Σ+_u→X2Σ+_g),N₂ (B3Π_g→A3Σ+_u)和O (3p5P→3s5S₂)的发射光谱强度均随之升高。通过比较氮分子第二正带N₂(C3Π_u→B3Π_g, 0-0)的原始、二次衍射、三次衍射光谱发现,二次、三次衍射光谱的转动带更清晰,但三次衍射光谱的背景更强,因此氮分子第二正带N₂(C3Π_u→B3Π_g)的二次衍射光谱更有利于模拟等离子体的转动温度。通过比较模拟得到的振动温度和转动温度发现,氮分子第二正带N₂ (C3Π_u→B3Π_g, Δν=-2)在N₂ (C3Π_u→B3Π_g)四个谱带Δν=+1, 0, -1, -2中最适于模拟等离子体振动温度,而利用氮分子离子第一负带N+₂ (B2Σ+_u→X2Σ+_g,0-0)模拟得到的等离子体转动温度要比N₂ (C3Π_u→B3Π_g, Δν=-2)的模拟结果高约10～15 K。同时,当脉冲峰值电压升高时,由N₂ (C3Π_u→B3Π_g, Δν=-2)和N+₂ (B2Σ+_u→X2Σ+_g, 0-0)模拟得到等离子体的转动温度均出现了略微上升的趋势,而利用N₂ (C3Π_u→B3Π_g, Δν=-2)模拟得出的振动温度则略微下降。     

沉积参数对SiNx薄膜结构及阻透性能的影响

利用直流脉冲磁控溅射法在室温下制备无氢SiN_x薄膜.通过傅里叶变换红外光谱、台阶仪、紫外—可见分光光度计、接触角测量仪、透湿测试仪等表征技术,分析了N₂流量、Si靶溅射功率等实验参数对SiN_x薄膜成分、结构、及阻透性能、透光性能、接触角等性能的影响.研究结果表明,Si靶溅射功率固定时,在低N₂流量条件下,或N₂流量固定时,在高Si靶溅射功率条件下,制备的SiN _{关键词： x}')" href="#">SiN_x 磁控溅射 微观结构 阻透性能     

氮化硅薄膜中纳米非晶硅颗粒的键合结构及光致发光

采用螺旋波等离子体化学气相沉积技术以N₂/SiH₄/H₂为反应气体制备了镶嵌有纳米非晶硅颗粒的氢化氮化硅薄膜,通过改变N₂流量实现了薄膜从红到蓝绿的可调谐光致发光.傅里叶红外透射和紫外-可见光吸收特性分析表明,所生长薄膜具有较高的氢含量,N₂流量增加使氢的键合结构发生变化,非晶硅颗粒尺寸减小,所对应的薄膜的光学带隙逐渐增加和微观结构有序度减小.可调光致发光(PL)主要来源于纳米硅颗粒的量子限制效应发光,随N₂流量增加,PL的谱线展宽并逐渐增强. 关键词： 傅里叶红外透射谱 光吸收谱 纳米硅粒子镶嵌薄膜 光致发光     

微波ECR磁控溅射制备SiNx薄膜的XPS结构研究

利用微波电子回旋共振等离子体增强非平衡磁控溅射法在不同N₂流量下制备无氢SiN_x薄膜.通过X光电子能谱、纳米硬度仪等表征技术,研究了不同N₂流量下制备的SiN_x薄膜的化学键结构、化学键含量、元素配比及各元素沿深度分布.研究结果表明,N₂流量是影响SiN_x薄膜化学键结构、元素配比、元素延深度分布等性质的主要因素.在N_{2关键词： x}')" href="#">SiN_x 磁控溅射 XPS 化学键结构     

Influence of sputtering power and Ar–N2 flow on the structure and optical properties of indium nitride films prepared by magnetron sputtering

ABSTRACT

This paper discusses the deposition of indium nitride (InN) thin films on Si (100) substrates by using pulsed DC magnetron sputtering. Effects of varying sputtering power and Ar–N₂ flow ratio on the structural, morphological, and optical properties of indium nitride (InN) films were investigated. The structural characterization indicated nanocrystalline InN film with preferred orientation towards (101) plane that exhibited the optimum crystalline quality at 130?W and for 40:60 Ar–N₂ ratio. The surface morphology of InN, as observed through FESEM, contained irregularly shaped nanocrystals with size that increases with higher sputtering power and Ar:N₂ flow ratio. The optical properties of InN films were studied using ellipsometer at room temperature. The band gap of InN was decreased with the increase of sputtering power to 130?W, whereas an increase in the band gap was noticed with the increase of the Ar:N₂ flow ratio.     

Investigation of Ti/TiN multilayered films in a reactive mid-frequency dual-magnetron sputtering

Influence of the process parameters like (i) sputtering gas pressure, (ii) target current, (iii) substrate bias voltage and (iv) substrate temperature of a reactive mid-frequency dual-magnetron sputtering on (a) surface defects and (b) mechanical properties of Ti/TiN multilayered films was investigated. The forming mechanisms of the observed droplets and craters were analyzed. Results showed when: (1) pressure of Ar/N₂ gases PAr/N₂ was at 0.31 Pa and substrate temperature was in certain range, the size and the density of the surface defects on the TiN films tended to decrease with increasing the target current and the pulsed bias voltage; (2) the optimal deposition parameters for accomplishing fewer surface defects were used, increasing the thickness of the Ti buffer layer decreased the microhardness in certain level, and the adhesion was firstly increased and then decreased as thickness reaching and/or beyond a critical value. Results also showed that selection of optimized process parameters evidently minimized the surface defects and improved the mechanical properties of the film.     

Effects of substrate bias and nitrogen flow ratio on the surface morphology and binding state of reactively sputtered ZrNx films before and after annealing

ZrN_x films were sputtered in an Ar + N₂ atmosphere, with different substrate biases (0 to −200 V) at various nitrogen flow ratios (%N₂ = 0.5-24%). The surface morphology, resistivity, crystllinity, and bonding configuration of ZrN_x films, before and after vacuum annealing, were investigated. As compared with ZrN_x films grown without substrate bias, before and after annealing, the resistivity of 1% and 2% N₂ films decreases with increasing substrate biases. Simultaneously, if the applied bias is too high, the crystallinity of ZrN_x film will decrease. The surfaces of 1% and 2% N₂ flow films deposited without bias have small nodules, whereas the surface morphology of films deposited at −100 V of substrate bias exhibits large nodules and rugged surface. Once a −200 V of substrate bias is applied to the substrate, the surface morphology of ZrN_x films, grown at 1% and 2% nitrogen flow ratios, is smooth. Furthermore, there are two deconvoluted peaks in XPS spectra (i.e., Zr-O and Zr-N) of ZrN_x films deposited at −200 V of substrate bias before and after annealing. On the other hand, the surface morphology changes dramatically from rugged surfaces for film deposited at lower nitrogen flow ratio (%N₂ < 1%) to smoother and denser surfaces for film grown at higher nitrogen flow ratio (%N₂ ≥ 1%). The Zr-N bonding in 2% N₂ films still exist after annealing at 700 °C, while the Zr-N bonding in 0.5% and 16% N₂ flow film vanish at the same temperature. The connection between the resistivity, crystallinity, surface morphology, and bonding configuration of ZrN_x films and how they are influenced by the substrate bias and nitrogen flow ratio are discussed in this paper.     

Effects of deposition parameters on the structure and mechanical properties of high-entropy alloy nitride films

High-entropy alloy (AlCrNbSiTiV)N nitride films are prepared using direct current (dc) reactive magnetron sputtering, with an equiatomic AlCrNbSiTiV alloy target. Experiments using the grey-Taguchi method are conducted to determine the effect of deposition parameters (dc power, substrate temperature, N₂/(N₂+Ar) flow rate and substrate bias) on the microstructure, mechanical and tribological properties. Orthogonal array (L₉ 3⁴), signal-to-noise ratio and analysis of variance are used to analyze the effect of the deposition parameters. The coated films are examined using scanning electron microscopy, an atomic force microscope, transmission electron microscopy (TEM), a tribometer and a nanoindenter. The TEM patterns confirm that the (AlCrNbSiTiV)N nitride films have a simple face-center-cubic structure. The experimental results show that a (AlCrNbSiTiV)N film coating significantly improves the mechanical properties. In the confirmation runs, using grey relational analysis, the improvement in friction coefficient is 32.5%, in corrosion current is 28.6%, in hardness H is 29.4%, in elastic modulus E is −18.3%, in H/E is 57.1 and in H³/E² is 225.0%. The samples with (AlCrNbSiTiV)N film coating are classified as HF1 and exhibit good adhesive strength.     

Influence of substrate crystallography on the room temperature synthesis of AlN thin films by reactive sputtering

A pulsed DC reactive ion beam sputtering system has been used to synthesize aluminium nitride (AlN) thin films at room temperature by reactive sputtering. After systematic study of the processing variables, high-quality polycrystalline films with preferred c-axis orientation have been grown successfully on silicon and Au/Si substrates with an Al target under a N₂/(N₂ + Ar) gas flow ratio of 55%, 2 mTorr processing pressure and keeping the temperature of the substrate holder at room temperature. The crystalline quality of the AlN layer as well as the influence of the substrate crystallography on the AlN orientation has been characterized by high-resolution X-ray diffraction (HR-XRD). Best ω-FWHM (Full Width at Half Maximum) values of the (0 0 0 2) reflection rocking curve in the 1 μm thick AlN layers are 1.3°. Atomic Force Microscopy (AFM) measurements have been used to study the surface morphology of the AlN layer and Transmission Electron Microscopy (TEM) measurements to investigate the AlN/substrate interaction. AlN grew off-axis from the Si substrate but on-axis to the surface normal. When the AlN thin film is deposited on top of an Au layer, it grows along the [0 0 0 1] direction but showing a two-domain structure with two in-plane orientations rotated 30° between them.     

Influence of N2 flow ratio on the properties of hafnium nitride thin films prepared by DC magnetron sputtering

Hafnium nitride (Hf-N) thin films were deposited on fused silica at different N₂ flow ratio (N₂/N₂ + Ar) using a reactive DC magnetron sputtering system. A gradual evolution in the composition of the films from Hf₃N₂, HfN, to higher nitrides was found through X-ray diffraction (XRD). Films of Hf₃N₂ and HfN show positive temperature coefficients of resistivity, while higher nitride has a negative one. Highly oriented growth of (0 0 1) Hf₃N₂ and NaCl-structure (1 0 0) HfN films were fabricated on fused silica substrate at relatively lower temperature of 300 °C. The electrical resistivity values of both as-deposited and post-deposition annealed films were measured by a four-point probe method. The obtained minimum resistivity of as-deposited film is 20 μΩ cm, and this result shows potential application of HfN films as electrode materials in electronic devices.     

Pulsed magnetron sputtering and ion-induced annealing of carbon films

Thin carbon films are deposited on a silicon substrate at room temperatures via the biased pulsed magnetron sputtering of graphite in the physical (Ar, Kr, Xe) and reactive (Ar: CH4) modes at a different sputtering power density varying from 40 to 550 W/cm². To ensure ion-assistance, negative bias of the substrate is set during film deposition by means of both DC and pulsed power sources. Some deposition parameters lead to a high hardness of the films (12.5 GPa), optical transparency, a surface resistance of RS > 10⁹ Ω/h, and developed nanomorphology of the sample surface which bears visible inclusions with a lateral size of 35 nm. Some of the films are annealed after deposition with a C⁺-ion beam with an energy of 20 keV. A correlation between the parameters of magnetron deposition and ion-beam modification and the examined characteristics of the films is found. Different R _S values in a wide range can be achieved by means of simple adjustment of the parameters and modes during magnetron sputtering and ion-beam modification.     

衬底材料对制备立方氮化硼薄膜的影响

较系统地研究了不同衬底材料对制备氮化硼薄膜的影响。用热丝增强射频等离子体CVD法,以NH3,B2H6和H2为反应气体,在Si,Ni,Co和不锈钢等衬底材料上,成功生长出高质量的立方氮化硼薄膜,还用13.56MHz的射频溅射系统将c-BN薄膜沉积在Si衬底上,靶材为h-BN(纯度为99.99％）,溅射气体为氩气和氮气的混合气体,所得到的氮化硼薄膜中立方相含量高于90%,用X射线衍射谱和傅里叶变换红谱对样品进行了分析表明,衬底材料与c-BN的晶格匹配情况,对于CVD生长立方氮化硼薄膜影响很大,而对溅射生长立方氮化硼薄膜影响不大。     

Structural and tribological properties of nitrogen doped amorphous carbon thin films synthesized by CFUBM sputtering method for protective coatings

Nitrogen doped amorphous carbon (a-C:N) films are a material that may successfully compete with DLC coatings, which have high hardness, high wear resistance, and a low friction coefficient. The a-C:N films were prepared on silicon substrate by a closed-field unbalanced magnetron sputtering method with a graphite target and using the Ar/N₂ mixture gases. And, we investigated the effects of various DC bias voltages from 0 to −300 V on the structural and tribological properties of the a-C:N films. This study was focused on improving physical properties of the a-C:N film by controlling process parameters like negative substrate DC bias voltage. The maximum hardness of the a-C:N film was 23 GPa, the friction coefficient was 0.08, and the critical load was 25 N on a Si wafer. Consequently, the structural and tribological properties of the a-C:N film showed a clear dependence on the energy of ions bombardment and the density of the sputtering and the reaction gases during film growth.     

Infrared Spectroscopy Investigation of Cubic Boron Nitride Films

Abstract

FT-IR Spectroscopy have been used for identifying both the structure of BN and the intensity of the compressive stress in cubic boron nitride (c-BN) film prepared by a unbalanced of (13.56 MHz) magnetron sputtering of a hexagonal boron nitride target in a mixture argon and nitride discharge. A T(temperature) - V(negative bias) phase diagram was obtained using the phase structure identify by IR spectra. Comparing the reflection infrared spectra (RIR) with the transmission infrared spectra (TIR) measured from same c-BN film, it is firstly found that RIR peak position of c-BN is lower than TIR peak position of c-BN, this means that the compressive stress on the surface layer of c-BN film is smaller than that inside c-BN film, may be this is the reason why thicker c-BN film can not be synthesized. A higher IR peak position of 1064 cm^?1 and a lower peak position 1004.7 cm^?1 were detected from a broken and partly peeled off c-BN film. The peak position of 1064 cm^?1 agrees with that of bulk c-BN at 1065 cm^?1 which was synthesized at high temperature and high pressure, while the peak position of 1004.7 cm^?1 accords well with the result calculated (1004 cm^?1) by Wentzcovitch and it may be closes to that of the stress free value of c-BN. Using the result measured by Ulrich, the shift rate of IR peak position of c-BN in the films is about 3.8 cm^?1/Gpa to be obtained.