Analysis of secondary electron emission using the fractal method

Based on the rough surface topography with fractal parameters and the Monte–Carlo simulation method for secondary electron emission properties, we analyze the secondary electron yield(SEY) of a metal with rough surface topography. The results show that when the characteristic length scale of the surface, G, is larger than 1 × 10^-7, the surface roughness increases with the increasing fractal dimension D. When the surface roughness becomes larger, it is difficult for entered electrons to escape surface. As a result, more electrons are collected and then SEY decreases. When G is less than 1 × 10^-7,the effect of the surface topography can be ignored, and the SEY almost has no change as the dimension D increases. Then,the multipactor thresholds of a C-band rectangular impedance transfer and an ultrahigh-frequency-band coaxial impedance transfer are predicted by the relationship between the SEY and the fractal parameters. It is verified that for practical microwave devices, the larger the parameter G is, the higher the multipactor threshold is. Also, the larger the value of D,the higher the multipactor threshold.     

金属规则表面形貌影响二次电子产额的解析模型

表面形貌是影响二次电子发射特性的重要因素, 但目前仍缺乏刻画这一影响规律的解析模型. 本文通过分析发现表面结构的遮挡作用是影响二次电子发射特性的主要因素. 基于二次电子以余弦角分布出射的规律, 提出了建立表面形貌参数与二次电子产额之间定量关系的方法, 并以矩形槽和三角槽为例, 建立了电子正入射和斜入射时的一代二次电子产额的解析模型. 将推导的解析模型与Monte Carlo模拟结果和实验结果进行了比较, 结果表明本文建立的模型能够正确反映规则表面形貌的二次电子产额. 本文的模型对于反映常用规则结构影响二次电子出射的规律以及指导通过表面结构调控二次电子发射特性都具有参考价值.     

An efficient multipaction suppression method in microwave components for space application

Multipaction,caused by the secondary electron emission phenomenon,has been a challenge in space applications due to the resulting degradation of system performance as well as the reduction in the service life of high power components.In this paper we report a novel approach to realize an effective increase in the multipaction threshold by employing micro-porous surfaces.Two micro-porous structures,i.e.,a regular micro-porous array fabricated by photolithography pattern processing and an irregular micro-porous array fabricated by a direct chemical etching technique,are proposed for suppressing the secondary electron yield(SEY) and multipaction in components,and the benefits are validated both theoretically and experimentally.These surface processing technologies are compatible with the metal plating process,and offer substantial flexibility and accuracy in topology design.The suppression effect is quantified for the first time through the proper fitting of the surface morphology and the corresponding secondary emission properties.Insertion losses when using these structures decrease dramatically compared with regular millimeter-scale structures on high power dielectric windows.SEY tests on samples show that the maximum yield of Ag-plated samples is reduced from 2.17 to 1.58 for directly chemical etched samples.Multipaction testing of actual C-band impedance transformers shows that the discharge thresholds of the processed components increase from 2100 W to 5500 W for photolithography pattern processing and 7200 W for direct chemical etching,respectively.Insertion losses increase from 0.13 d B to only 0.15 d B for both surface treatments in the transmission band.The experimental results agree well with the simulation results,which offers great potential in the quantitative anti-multipaction design of high power microwave components for space applications.     

基于微陷阱结构的金属二次电子发射系数抑制研究

近年来,金属二次电子发射系数的抑制研究在加速器、大功率微波器件等领域得到了广泛关注.为评估表面形貌对抑制效果的影响,利用唯象概率模型计算方法对三角形沟槽、矩形沟槽、方孔及圆孔4种不同形状微陷阱结构的二次电子发射系数进行了研究,分析了微陷阱结构的形状、尺寸对二次电子发射系数抑制特性的影响规律.理论研究结果表明:陷阱结构的深宽比、孔隙率越大,则其二次电子发射系数抑制特性越明显;方孔形和圆孔形微陷阱结构的二次电子发射系数抑制效果优于三角形沟槽和矩形沟槽;具有大孔隙率的微陷阱结构表面的二次电子发射系数对入射角度的依赖显著弱于平滑表面.制备了具有不同表面形貌的金属样片并进行二次电子发射系数测试,所得实验规律与理论模拟规律符合较好.     

铝阳极氧化的多孔结构抑制二次电子发射的研究

针对空间大功率微波部件中的二次电子倍增效应影响微波部件性能的问题,基于铝阳极氧化产生大深宽比、高孔隙率均匀纳米级多孔结构的特性,结合蒸发镀银技术,提出一种有效降低表面二次电子发射系数的方法.结果表明,相比于未阳极氧化的铝样片,在不清洗样片的情况下(实际的样片表面都会存在吸附或沾污),测试得到二次电子发射系数曲线的第一能量交叉点E1从45 eV增加到77 eV,最大二次电子发射系数SEY_(max)从2.68减小到1.52;在清洗样片的情况下(清洗是为了去除吸附或沾污,获得理想的表面),测试得到第一能量交叉点E_1从40 eV增加到211 eV,最大二次电子发射系数SEY_(max)从2.55减小到1.36.为了验证本文所提方法对抑制空间大功率微波部件二次电子倍增效应的有效性,分别将获得的未阳极氧化和阳极氧化后的二次电子发射系数数据用于一个X频段阻抗变换器设计中,结果显示,使用本文所提方法后,阻抗变换器的微放电阈值从7000 W提高到125000 W.本文研究的方法不仅对解决空间大功率微波部件的微放电问题有指导意义,而且对真空电子器件、加速器等领域的研究也具有重要参考价值.     

电子入射角度对聚酰亚胺二次电子发射系数的影响

采用具有负偏压收集极的二次电子发射系数测试系统, 对聚酰亚胺样品的二次电子发射系数与入射电子角度和入射电子能量的关系进行了测量. 测量结果表明, 在电子小角度入射样品的情况下, 随着入射角度的增加, 二次电子发射系数单调增加, 并符合传统的规律, 但是在电子大角度入射时, 却与此不符合. 测量显示, 出现偏差时对应的临界电子入射角度随着入射电子能量的降低而减小. 采用简化的电子弹性散射过程和卢瑟福弹性散射截面公式对这种偏差的出现进行了分析, 并推导出修正后的二次电子发射系数的计算公式. 修正后的二次电子发射系数的计算结果更加符合实验结果.     

磁控溅射铂抑制镀银表面的二次电子发射

降低表面的二次电子产额是抑制微波部件二次电子倍增效应和提升功率阈值的有效途径之一,目前主要采用在表面构造陷阱结构和沉积非金属薄膜的方法降低二次电子产额,其缺点是会改变部件的电性能.针对此问题,采用在表面沉积高功函数且化学惰性的金属薄膜来降低二次电子产额.首先,采用磁控溅射方法在铝合金镀银样片表面沉积100 nm铂,测量结果显示沉积铂后样片的二次电子产额最大值由2.40降至1.77,降幅达26%.其次,用相关唯象模型对二次电子发射特性测量数据进行了拟合,获得了在40-1500 eV能量范围内能够准确描述样片二次电子产额特性的Vaughan模型参数,以及在0-50 eV能量范围内能够很好地拟合二次电子能谱曲线的Chung-Everhart模型参数.最后,将获得的实验数据和相关拟合参数用于Ku频段阻抗变换器的二次电子倍增效应功率阈值仿真研究,结果表明通过沉积铂可将部件的功率阈值由7500 W提升至36000 W,证实了所提方法的有效性.研究结果为金属材料二次电子发射特性的研究提供实验数据参考,对抑制大功率微波部件二次电子倍增效应具有参考价值.     

Effect of Cu doping on the secondary electron yield of carbon films on Ag-plated aluminum alloy

Reducing the secondary electron yield (SEY) of Ag-plated aluminum alloy is important for high-power microwave components. In this work, Cu doped carbon films are prepared and the secondary electron emission characteristics are studied systematically. The secondary electron coefficient δ_max of carbon films increases with the Cu contents increasing at first, and then decreases to 1.53 at a high doping ratio of 0.645. From the viewpoint of surface structure, the higher the content of Cu is, the rougher the surface is, since more cluster particles appear on the surface due to the small solid solubility of Cu in the amorphous carbon network. However, from viewpoint of the electronic structure, the reduction of the sp² hybrid bonds will increase the SEY effect as the content of Cu increases, due to the decreasing probability of collision with free electrons. Thus, the two mechanisms would compete and coexist to affect the SEY characteristics in Cu doped carbon films.