Influences of total ionizing dose on single event effect sensitivity in floating gate cells

The influences of total ionizing dose(TID) on the single event effect(SEE) sensitivity of 34-nm and 25-nm NAND flash memories are investigated in this paper. The increase in the cross section of heavy-ion single event upset(SEU) in memories that have ever been exposed to TID is observed, which is attributed to the combination of the threshold voltage shifts induced by γ-rays and heavy ions. Retention errors in floating gate(FG) cells after heavy ion irradiation are observed.Moreover, the cross section of retention error increases if the memory has ever been exposed to TID. This effect is more evident at a low linear energy transfer(LET) value. The underlying mechanism is identified as the combination of the defects induced by γ-rays and heavy ions, which increases the possibility to constitute a multi-trap assisted tunneling(mTAT) path across the tunnel oxide.     

Impact of energy straggle on proton-induced single event upset test in a 65-nm SRAM cell

This paper presents a simulation study of the impact of energy straggle on a proton-induced single event upset(SEU)test in a commercial 65-nm static random access memory cell. The simulation results indicate that the SEU cross sections for low energy protons are significantly underestimated due to the use of degraders in the SEU test. In contrast, using degraders in a high energy proton test may cause the overestimation of the SEU cross sections. The results are confirmed by the experimental data and the impact of energy straggle on the SEU cross section needs to be taken into account when conducting a proton-induced SEU test in a nanodevice using degraders.     

重离子辐照带有ECC的65 nm SRAM器件“伪多位翻转”特性研究

为了提高纠错编码（ECC）的有效性,先进的静态随机存储器（SRAM）多采用位交错结构。但是,在没有物理版图信息的情况下,位交错设计使得从辐照测试数据中提取出多单元翻转（MCU）变得更加困难。运用Bi离子辐照带有ECC的65 nm SRAM器件,研究了该款器件在重离子辐照下的敏感性。为"伪多位翻转（FMBU）"以及MCU的数据分析提供了理论指导和帮助,完善了判别MCU的基本法则。除此之外,研究结果表明,ECC的汉明编码对于纳米器件的效果不够理想。在未来的空间应用中,需考虑更高层次的编码算法来抵抗单粒子翻转。In order to improve the robustness of error-correcting codes (ECC), modern static random access memory (SRAM) always use bit-interleaving structure. However, in the absence of physical layout information, the bit-interleaving design makes it more difficult to extract the multiple-cell upset (MCU) from the test data. In this paper, the sensitivity of Bi ion irradiation was investigated in a 65 nm technology SRAM with ECC. The experimental results provide a theoretical guidance and help for the fake multiple-bit upset (FMBU) and MCU data analyzing, which improve and perfect the basic rules extracting MCU from the test data. In addition, the results show that the performance of hamming encoding is not ideal in Nano scale SRAM. In the future of space applications, it is necessary to consider more advanced algorithms to against SEU.     

电离总剂量对纳米SRAM器件单粒子翻转敏感性的影响

电离总剂量（TID）与单粒子效应（SEE）是纳米SRAM器件在航天应用中的主要威胁。随着CMOS工艺的进步,两种辐射效应在纳米SRAM器件中的协同效应出现了一些新现象,有必要进一步开展深入研究。利用γ射线以及不同种类重离子对两款纳米SRAM器件开展了辐照实验,研究了不同辐照参数、测试模式以及数据图形条件下,电离总剂量对单粒子翻转（SEU）敏感性的影响。研究结果表明,γ射线辐照过后,存储单元中反相器开关阈值减小,漏电流增大,导致SRAM存储单元抗翻转能力降低,SEU截面有明显增大;未观察到"印记效应",数据图形对测试结果没有明显影响;多位翻转（MBU）比例无明显变化。     

重离子辐照引起磁性隧道结功能失效类型及机理研究

重点研究了磁性隧道结(MTJ)的电学性能受离子注量影响的物理规律。实验首次发现了高能Ta离子辐射损伤导致MTJ电学功能失效的现象,主要失效模式为:高、低电阻态失效,其中79.9%的功能失效为高电阻态失效。计算表明,单个10.9 MeV/u的Ta离子辐照引入的损伤无法导致MTJ宏观电学功能失效。结合理论计算与Monte Carlo模拟分析,MTJ中的绝缘势垒层与铁磁薄膜的损伤是出现高、低电阻态失效的内因。