Temperature and drain bias dependence of single event transient in 25-nm FinFET technology

In this paper,we investigate the temperature and drain bias dependency of single event transient(SET) in 25-nm fin field-effect-transistor(FinFET) technology in a temperature range of 0-135°C and supply voltage range of 0.4 V-1.6 V.Technology computer-aided design(TCAD) three-dimensional simulation results show that the drain current pulse duration increases from 0.6 ns to 3.4 ns when the temperature increases from 0 to 135°C.The charge collected increases from 45.5 fC to 436.9 fC and the voltage pulse width decreases from 0.54 ns to 0.18 ns when supply voltage increases from 0.4 V to 1.6 V.Furthermore,simulation results and the mechanism of temperature and bias dependency are discussed.     

The modulation effect of substrate doping on multi-node charge collection and single-event transient propagation in 90-nm bulk complementary metal-oxide semiconductor technology

Variation of substrate background doping will affect the charge collection of active and passive MOSFETs in complementary metal-oxide semiconductor (CMOS) technologies, which are significant for charge sharing, thus affecting the propagated single event transient pulsewidths in circuits. The trends of charge collected by the drain of a positive channel metal-oxide semiconductor (PMOS) and an N metal-oxide semiconductor (NMOS) are opposite as the substrate doping increases. The PMOS source will inject carriers after strike and the amount of charge injected will increase as the substrate doping increases, whereas the source of the NMOS will mainly collect carriers and the source of the NMOS can also inject electrons when the substrate doping is light enough. Additionally, it indicates that substrate doping mainly affects the bipolar amplification component of a single-event transient current, and has little effect on the drift and diffusion. The change in substrate doping has a much greater effect on PMOS than on NMOS.     

带有n+深阱的三阱CMOS工艺中寄生NPN双极效应及其对电荷共享的影响

基于三维TCAD器件模拟, 研究了带有 n⁺深阱的90 nm三阱CMOS器件在重离子辐照下产生的电荷共享效应. 研究结果表明在重离子辐照时, n⁺深阱会导致寄生的NPN双极型晶体管触发, 显著增强NMOS间的电荷共享, 其放大因子达到双阱工艺中寄生PNP晶体管放大因子的2---4倍. 进而分别研究了n阱接触和p 阱接触对寄生NPN双极放大的影响, 结果表明增大p阱接触的面积和减小 n 阱接触的距离将抑制NPN晶体管的放大作用, 而增大n 阱接触的面积将增强NPN的放大作用.     

单粒子瞬变中的双极放大效应研究

采用三维数值模拟的方法对比研究了单个NMOS晶体管和反相器链中的单粒子瞬变（single event transient,SET）电流脉冲,发现深亚微米工艺下双极放大电流在单管的SET电流脉冲中占主要成分,而在反相器链的SET模拟中不明显,分析二者的区别解释了源/体结偏压的形成过程和放大机理,并证明了双极放大效应受源/体结偏压影响的结论.在此基础上分析了NMOS管中源极的正向电流及其机理,发现台阶区的源极正向电流主要是由扩散作用形成的. 关键词： 单粒子瞬变 双极放大 混合模拟 台阶区电流     

Recovery of single event upset in advanced complementary metalben oxide semiconductor static random access memory cells

Using computer-aided design three-dimensional (3D) simulation technology, the recovery mechanism of single event upset and the effects of spacing and hit angle on the recovery are studied. It is found that the multi-node charge collection plays a key role in recovery and shielding the charge sharing by adding guard rings. It cannot exhibit the recovery effect. It is also indicated that the upset linear energy transfer (LET) threshold is kept constant while the recovery LET threshold increases as the spacing increases. Additionally, the effect of incident angle on recovery is analysed and it is shown that a larger angle can bring about a stronger charge sharing effect, thus strengthening the recovery ability.     

The dual role of multiple-transistor charge sharing collection in single-event transients

As technologies scale down in size, multiple-transistors being affected by a single ion has become a universal phenomenon, and some new effects are present in single event transients (SETs) due to the charge sharing collection of the adjacent multiple-transistors. In this paper, not only the off-state p-channel metal-oxide semiconductor field-effect transistor (PMOS FET), but also the on-state PMOS is struck by a heavy-ion in the two-transistor inverter chain, due to the charge sharing collection and the electrical interaction. The SET induced by striking the off-state PMOS is efficiently mitigated by the pulse quenching effect, but the SET induced by striking the on-state PMOS becomes dominant. It is indicated in this study that in the advanced technologies, the SET will no longer just be induced by an ion striking the off-state transistor, and the SET sensitive region will no longer just surround the off-state transistor either, as it is in the older technologies. We also discuss this issue in a three-transistor inverter in depth, and the study illustrates that the three-transistor inverter is still a better replacement for spaceborne integrated circuit design in advanced technologies.     

A-Z-A型石墨烯场效应晶体管吸附 效应的第一性原理研究

利用第一性原理的计算方法, 研究了A-Z-A型GNR-FET的电子结构和输运性质及其分子吸附效应. 得到了以下结论: 纯净的A-Z-A型GNR-FET具有典型的双极型晶体管特性, 吸附分子的存在会使纳米带能隙变小. 对于吸附H, H₂, H₂O, N₂, NO, NO₂, O₂, CO₂和SO₂分子的情况, A-Z-A型GNR-FET仍然保持着场效应晶体管的基本特征, 但吸附不同类型的分子会使GNR-FET的输运特性发生不同程度的改变; 对于吸附OH分子的情况, 输运特性发生了本质的改变, 完全不具有场效应晶体管的特性. 这些研究结果将有助于石墨烯气体探测器的工程实现, 并对应用于不同环境中GNR-FET的设计具有重要指导意义.     

p型金属氧化物半导体场效应晶体管界面态的积累对单粒子电荷共享收集的影响

由于负偏置温度不稳定性和热载流子注入,p型金属氧化物半导体场效应晶体管(pMOSFET)将在工作中不断退化,而其SiO₂/Si界面处界面态的积累是导致其退化的主要原因之一. 采用三维器件数值模拟方法,基于130 nm体硅工艺,研究了界面态的积累对相邻pMOSFET之间单粒子电荷共享收集的影响. 研究发现,随着pMOSFET SiO₂/Si界面处界面态的积累,相邻pMOSFET漏端的单粒子电荷共享收集量均减少. 还研究了界面态的积累对相邻反相器中单粒子电荷共享收集 关键词： 负偏置温度不稳定性 电荷共享收集 双极放大效应 单粒子多瞬态     

An analytical model for nanowire junctionless SOI Fin FETs with considering three-dimensional coupling effect

In this paper, the three-dimensional(3D) coupling effect is discussed for nanowire junctionless silicon-on-insulator(SOI) Fin FETs. With fin width decreasing from 100 nm to 7 nm, the electric field induced by the lateral gates increases and therefore the influence of back gate on the threshold voltage weakens. For a narrow and tall fin, the lateral gates mainly control the channel and therefore the effect of back gate decreases. A simple two-dimensional(2D) potential model is proposed for the subthreshold region of junctionless SOI Fin FET. TCAD simulations validate our model. It can be used to extract the threshold voltage and doping concentration. In addition, the tuning of back gate on the threshold voltage can be predicted.     

Recovery of single event upset in advanced complementary metal-oxide semiconductor static random access memory cells

Using computer-aided design three-dimensional (3D) simulation technology,the recovery mechanism of single event upset and the effects of spacing and hit angle on the recovery are studied.It is found that the multi-node charge collection plays a key role in recovery and shielding the charge sharing by adding guard rings.It cannot exhibit the recovery effect.It is also indicated that the upset linear energy transfer (LET) threshold is kept constant while the recovery LET threshold increases as the spacing increases.Additionally,the effect of incident angle on recovery is analysed and it is shown that a larger angle can bring about a stronger charge sharing effect,thus strengthening the recovery ability.