Elemental analysis of particulate matter in a metal workshop and of biological samples from exposed workers

During metal welding and cutting, large amounts of particulate matter (PM) are produced that might represent a significant health risk for the exposed workers. In the present pilot study, we performed an elemental analysis of fine PM collected in a metal workshop. Also, elemental analysis of the hair and nail samples collected from workers exposed to the workshop dust and control group was done. Concentrations of 15 elements in PM were measured with X‐Ray Fluorescence (XRF) and Particle Induced X‐ray Emission (PIXE), whereas inductively coupled plasma mass spectrometry (ICP‐MS) was used to determine 12 elements in hair and nail samples. Mean 8‐hr concentrations of PM_2.5, Fe, and Mn in the vicinity of welders were up to 1803, 860, and 30 μg/m³, respectively, whereas in the nearby city, daily PM_2.5 concentrations are on average 11 μg/m³. We found that several elements, especially Fe and Mn, had substantially higher concentrations in hair and nail samples of exposed workers than in the control group, which indicates the accumulation of metals in workers' tissues, although limit values were not exceeded.     

Shooting flexible electronics

The trends of the future electronic devices should be miniaturized,flexible,stable,portable,light,and highly integrated.Although flexible electronic products(i.e.,flexible display products^[1-3],batteries^[4,5],cell phones[6])have been commercially available recently,which represents the starting of a new era in electronics,these progresses are still in their infancy and more efforts are required to boom their multifunction and speed up their marketization from lab.Considering their low-cost and mass-productive synthesis technologies,rich species,high performances,and especially,the excellent flexibility and stability,organic materials(insulating,conductive and semiconducting)have triggered the tide of the development of"plastic electronics",especially in transistors,an indispensable logic device in these logic-control based devices(i.e.,intelligent electronics).     

极大3限制边连通二部图的充分条件

设G=(V,E)是一个连通图.称一个边集合S■E是一个k限制边割,如果G-S的每个连通分支至少有k个顶点.称G的所有k限制边割中所含边数最少的边割的基数为G的k限制边连通度,记为λ_k(G).定义ξ_k(G)=min{[X,■]:|X|=k,G[X]连通,■=V(G)\X}.称图G是极大k限制边连通的,如果λ_k(G)=ξ_k(G).本文给出了围长为g>6的极大3限制边连通二部图的充分条件.     

Multi-scale finite element simulation on large deformation behavior of wood under axial and transverse compression conditions

Acta Mechanica Sinica - Multi-scale finite element method is adopted to simulate wood compression behavior under axial and transverse loading. Representative volume elements (RVE) of wood...     

Lower Bounds for the Robustness of Multilevel Coherence

International Journal of Theoretical Physics - Quantum coherence, coming from quantum superposition, occupies a significant position in the field of physics. We put forward a lower bound of the...     

硅和锗纳米线的原子排布和电荷分布的密度泛函紧束缚方法研究

低维硅锗材料是制备纳米电子器件的重要候选材料，是研发高效率、低能耗和超高速新一代纳米电子器件的基础材料之一，有着潜在的应用价值。采用密度泛函紧束缚方法分别对厚度相同、宽度在0.272 nm~0.554 nm之间的硅纳米线和宽度在0.283 nm~0.567 nm之间的锗纳米线的原子排布和电荷分布进行了计算研究。硅、锗纳米线宽度的改变使原子排布，纳米线的原子间键长和键角发生明显改变。纳米线表层结构的改变对各层内的电荷分布产生重要影响。纳米线中各原子的电荷转移量与该原子在表层内的位置相关。纳米线的尺寸和表层内原子排列结构对体系的稳定性产生重要影响。     

Optimal control of an SIQRS epidemic model with three measures on networks

Nonlinear Dynamics - At present, the main measures for disease control are vaccination, quarantine and treatment. Taking the three measures into consideration, time-varying optimal control problems...     

Model and nonlinear dynamic analysis of linear guideway subjected to external periodic excitation in five directions

Nonlinear Dynamics - Investigation of the dynamic characteristics of linear guideway is essential for enhancing structural performance of machine tools. However, few mechanical models are...     

Majorana Representation for a Composite System

International Journal of Theoretical Physics - The Majorana representation, which provides an intuitive way to represent the quantum state by stars on the Bloch sphere, has drawn considerable...     

Scaling Behavior between Heat Capacity and Thermal Expansion in Solids

We experimentally analyze the heat capacity and thermal expansion of reference solids in a wide temperature range from several Kelvin to melting temperature,and establish a universal double-linear relation between the experimental heat capacity C_p and thermal expansion β,which is different from the previous models.The universal behavior between heat capacity and thermal expansion is important to predict the thermodynamic parameters at constant pressure,and is helpful for understanding the nature of thermal properties in solids.