柠檬酸溶胶-凝胶法制备的Ce1-xZrxO2: 结构及其氧移动性

采用 XRF、XRD、Raman、XPS、H₂-TPR 以及与氩离子刻蚀相结合的XPS等表征技术对柠檬酸溶胶-凝胶法制备的Ce_1-xZr_xO₂ (0≤x≤1)样品的结构及其氧移动性进行了研究. 结果表明, Ce_1-xZr_xO₂ 样品的晶型结构对其中氧的移动性有明显影响. 当x≤0.15 时, Ce_1-xZr_xO₂ 以立方CeO₂相 Ce-Zr-O 固溶体存在, 随着Zr含量的逐渐增加, CeO₂晶胞体积减小、氧空位浓度增加, 氧移动性逐渐增强; 当x＞0.15时, 形成四方ZrO₂相和立方CeO₂相Ce-Zr-O固溶体的混合物, 随着Zr含量的逐渐增加, 四方ZrO₂相的含量增加、氧空位浓度减小, 氧移动性逐渐减弱. 因此, Ce_0.852Zr_0.152O₂样品具有最高的氧移动性.     

金属富勒烯Y＠C36结构和性能的密度泛函研究

采用Cerius 2中的GGA/PW91密度泛函方法对具有D6h对称性的C36及其衍生物Y＠C36进行结构全优化, 系统地分析了Y在C36笼内不同占位时系统的能量及稳定性等, 并在同一方法下对结构全优化后的C36和Y＠C36进行了能量、能级、态密度及光学性能分析, 研究了Y原子的嵌入对C36结构和性能的影响.     

Curing behavior and toughening performance of epoxy resins containing hyperbranched polyester

The effects of the hyperbranched polyester with hydroxyl end groups (HBPE‐OH) on the curing behavior and toughening performance of a commercial epoxy resin (diglycidyl ether of bisphenol A, DGEBA) were presented. The addition of HBPE‐OH into DGEBA strongly increased its curing rate and conversion of epoxide group due to the catalytic effect of hydroxyl groups in HBPE‐OH and the low viscosity of the blend at curing temperature. The improvements on impact strength and critical stress intensity factor (or fracture toughness, K_1c) were observed with adding HBPE‐OH. The impact strength was 8.04 kJ m^?1 when HBPE‐OH reached 15 wt% and the K_1c value was approximately two times the value of pure epoxy resin when HBPE‐OH content was 20 wt%. The morphology of the blends was also investigated, which indicated that HBPE‐OH particles, as a second phase in the epoxy matrix, combined with each other as the concentration of HBPE‐OH increased. Copyright © 2004 John Wiley & Sons, Ltd.     

A New Activation Method for Electroless Metal Plating：Palladium Laden via Bonding with Self—Assembly Monolayers

A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl2 sensitization and roughening condition.A closely packed electroless copper film with strong adhesion is successfully formed by AFM observation.XPS study indicates that palladium chemisorption occurred via palladium chloride bonding to the pendant amino group of the SAMs.     

稳态荧光探针法测定三聚季铵盐表面活性剂的胶束聚集数

以芘为荧光探针, 十六烷基氯化吡啶(CPC)为猝灭剂, 以芘的饱和水溶液为溶剂配制表面活性剂溶液, 根据芘的荧光强度之比I1/I3随表面活性剂水溶液浓度的变化, 测定了三聚季铵盐表面活性剂CTTTA的cmc值, 测定值与表面张力法测定的cmc值一致；当猝灭剂CPC的浓度取0.1~0.3 mmol·L-1范围时, 用稳态荧光探针法测定了CTTTA的胶束聚集数. 实验数据表明, 表面活性剂溶液浓度为6~10倍cmc时, 胶束聚集数N随表面活性剂浓度增大而线性增大, 并用外推法得到CTTTA的临界胶束聚集数.     

C4/C5烃催化裂解制低碳烯烃的研究进展

从催化剂类型、裂解工艺、催化裂解的影响因素和裂解机理4个方面对国内外C4/C5烃催化裂解制低碳烯烃的研究进行了综述。催化裂解制低碳烯烃催化剂主要采用ZSM-5分子筛系列催化剂,在此基础上发展了酸改性或水热改性高硅ZSM系列分子筛及介孔MCM-41分子筛。总结了国内外C4/C5烃的裂解工艺,认为影响催化裂解的主要因素是裂解原料、催化剂类型及工艺条件。目前,裂解机理主要是自由基与碳正离子机理相结合的机理。并简述了本课题组目前有关C4烷烃催化裂解的主要研究进展。     

含羟基和咪唑基团新手性肽核酸的设计与合成

以含丝氨酸和组氨酸残基的手性肽核酸单体替换经典肽核酸单体, 采用固相合成方法设计合成了五个新序列含羟基和咪唑基团的10聚体手性肽核酸, 经ESI-MS或MALDI-TOF-MS证实目标物结构正确.     

CS-CMC聚合物电解质膜的制备及在电生成FeO_4~(2-)中的应用

以戊二醛为交联剂,制备了壳聚糖(CS)-羧甲基纤维素(CMC)聚合物电解质膜.用电子显微镜观察其表面形貌.IR分析表明该聚合物薄膜含有COOH,NH 3官能团,具有两性离子的特征.与CS膜或CMC膜相比,该膜能稳定存在于酸碱溶液中.膜特性研究表明CS-CMC聚合物电解质膜具有离子交换和选择性渗透能力,可作为隔膜电解制备高铁酸盐.     

单氧代-二硒烷基-1, w-二氧取代杯[4]衍生物的合成,结构及萃取性能研究

Novel macrocyclic monooxa-diselkylene-1,ω-dioxy substituted calix[4]arene derivatives 1a-5a were synthesized by the reaction of calix[4]arene dibromides 1-5 with the disodium salt of bis（2-selenylethyl）ether in the yields between 28% and 64%. Their structures were characterized by proton and carbon NMR spectra. X-Ray structure analysis of la further confirmed the cone conformation of compounds 1a-5a. An interesting host-guest complex of la with dichloromethane via CH/π and C1/π interactions was elucidated. Extraction experiments showed that these novel monooxa-diselkylene-1,ω-dioxy substituted calix[4]arene derivatives 1a-5a had strong extraction ability towards mercury ion. The interaction of Hg^2＋with the calix ligand has also been investigated by 1^H NMR titration.     

高能工业CT用新型X射线源焦斑测量

 为了获得较高的空间分辩率，设计了一种新型小束斑驻波电子直线加速器，该加速器取消了加速腔中的鼻锥结构，而在耦合腔中设置鼻锥结构。用狭缝法代替小孔法测得X射线源的焦斑尺寸为1.4mm。讨论了射线源焦点对成像质量的影响，分析了在高能条件下小孔法不适合用于焦点测量的物理原因，用4种测量方法测量了该高能X射线源的参数，测得该系统的成像极限分辩率为2.5 lp/mm，最后对实验结果进行了分析。