溶液电沉积法制备苝酰亚胺类化合物薄膜

溶液电沉积法是一种具有沉积时间短,可以常温沉积以及沉积物在基底上附着力高等优点的薄膜制备方法.本文用水合肼增溶苝酰亚胺类化合物(PTCDI)的方法制备了可用于溶液电沉积的苝酰亚胺类化合物溶液.用紫外-可见分光光度法(UV-Vis)对溶解的过程进行了表征,并用顺磁共振(ESR)验证了水合肼对PTCDI的增溶过程实质上是化学反应过程.在制备苝酰亚胺类化合物溶液的基础上,采用阳极电沉积法在ITO导电玻璃上沉积出了薄膜.采用UV-Vis,扫描电镜(SEM)和X射线衍射仪(XRD)对薄膜进行了表征,证实得到了表面较为平整、具有可控结晶结构和形貌的PTCDI薄膜以及具有较宽光谱吸收范围的复合薄膜.     

聚合物辅助设计生长高质量多功能薄膜

随着薄膜材料的日益发展和新型薄膜材料的不断涌现,开发薄膜生长技术对于半导体和光电等科技领域的作用日益突出。本文主要介绍最近发展的聚合物辅助沉积从分子层面上控制生长高质量的薄膜材料。聚合物辅助沉积是一种生长高质量薄膜的化学水性溶液方法,将金属离子与聚合物通过络合、氢键或静电等方式形成一种均匀稳定的前驱体溶液,再经过超滤、成膜和热处理形成高质量的金属氧化物、金属碳化物、金属氮化物、金属单质、金属硫/硒化物等薄膜以及纳米粒子等化合物或复合功能材料。该方法中水溶性的聚合物能通过络合作用抑制金属离子的水解使得溶液稳定,并能精确控制薄膜的组分从而形成高质量的薄膜。该化学溶液方法的提出为科学技术领域提供了一种低成本和大面积制备薄膜的技术路线。本文最后总结和展望了聚合物辅助沉积法未来的挑战和发展方向。     

电沉积铁族薄膜的磁性圆二色研究

采用循环伏安法在GaAs(100)单晶表面电沉积了铁族金属单质薄膜. 扫描电子显微镜(SEM)结果显示, Fe族金属薄膜的晶粒较小, 薄膜平整度较高。通过X射线衍射(XRD)谱分析了Fe, Co, Ni在GaAs(100)晶面上的外延生长. 使用磁光克尔效应装置研究了Fe族金属薄膜的宏观磁性, 用同步辐射圆偏振软X射线测量了铁族单质磁性薄膜的吸收谱, 获得了X射线磁性圆二色谱, 并通过加和定则计算了磁性薄膜中Fe族金属原子的轨道磁距和自旋磁矩.     

一步法电化学沉积Cu(In1-x,Gax)Se2薄膜的特性

在CuCl2、InCl3、GaCl3及H2SeO3组成的酸性水溶液电沉积体系中, 对Mo/玻璃衬底上一步法电沉积Cu(In1-x, Gax)Se2(简写为CIGS)薄膜进行了研究. 为了稳定溶液的化学性质, 在溶液中加入邻苯二甲酸氢钾和氨基磺酸作为pH缓冲剂, 将溶液的pH值控制在约2.5, 并提高薄膜中Ga的含量. 通过大量实验优化了溶液组成及电沉积条件, 得到接近化学计量比贫Cu 的CIGS薄膜(当Cu与In+Ga的摩尔比为1时, 称为符合化学计量比的CIGS薄膜; 当其比值为0.8-1时, 称为贫Cu或富In的CIGS 薄膜)预置层, 薄膜表面光亮、致密、无裂纹. 利用循环伏安法初步研究了一步法电沉积CIGS薄膜的反应机理, 在沉积过程中, Se4+离子先还原生成单质Se, 再诱导Cu2+、Ga3+和In3+发生共沉积. 电沉积CIGS薄膜预置层在固态硒源280 ℃蒸发的硒气氛中进行硒化再结晶, 有效改善了薄膜的结晶结构, 且成份基本不发生变化,但是表面会产生大量的裂纹.     

电沉积Bi2Te3基薄膜的电化学阻抗谱研究

以不锈钢为基底,利用电化学沉积方法制备Bi2Te3基薄膜材料,并采用X射线衍射技术、电子探针微观分析等方法对薄膜进行结构和成分表征,通过电化学阻抗谱技术对不锈钢表面Bi2Te3的电化学沉积机理进行了初步探讨.结果表明Bi-Te和Bi-Te-Se体系具有相似的电化学沉积机理,即Bi3+和2HTeO+或H2SeO3首先被还原为Bi单质和Te或Se单质,然后Bi单质与Te或Se单质反应生成Bi2Te3基化合物,而Bi-Sb-Te体系中,2HTeO+首先被还原为Te单质,生成的Te再与Bi3+和Sb(III)反应生成Bi2Te3基化合物,三种体系的沉积都受电化学极化控制.     

单一稀土镧在不同基底上的电沉积及其性能的研究

研究在低温熔融盐体系中于不同基底上电沉积单一稀土金属镧（La）。经X-射线能谱仪测定,在镍片基底上沉积的La的质量分数为100％,铜片基底上沉积的La质量分数为72．84％;在镍铁合金灯丝上沉积得到La-Ni合金薄膜,其中La的质量分数为50．02％,Ni的质量分数为2．48％。经扫描电子显微镜观察,所得的沉积膜为均匀、光滑、致密的黑色沉积薄膜。经X-射线衍射仪分析,镧在不同基底上沉积所得的沉积膜为不同晶型,以镍片为基底得到的单质镧为α-六方晶型;以铜片为基底得到的单质镧为面心立方晶;均与基底晶型相匹配。在镍铁合金灯丝上电沉积所得的La-Ni合金薄膜致密均匀,在无水乙醇中久浸而不脱落,并呈现强磁性。     

电沉积种子层化学控制生长氧化锌纳米棒和纳米管

采用水溶液法在电沉积的ZnO种子层上制备了高度取向的ZnO纳米棒阵列,并通过碱溶液化学腐蚀法获得了ZnO纳米管。对ZnO纳米棒和纳米管的溶液生长和腐蚀过程进行了分析。结果表明,种子层的结构和性能对ZnO纳米棒有着重要的影响,在-700 mV电位下沉积的种子层薄膜均匀性好,生长的纳米棒密度大、与基底垂直性好;碱溶液对纳米棒的腐蚀具有选择性,通过控制腐蚀液的浓度和时间,可获得中空的ZnO纳米管。     

YBCO涂层导体CeO2,Y2O3缓冲层的生长研究

采用反应溅射的方法在具有立方织构的Ni基底上制备了CeO2,Y2O3缓冲层.Ar/H2气氛下预沉积的引入,有效地抑制了基底的氧化.同时,为保证薄膜的外延取向,预沉积时间必须和总沉积时间满足线性关系.对比CeO2,Y2O3的生长条件,发现CeO2的外延生长区间比Y2O3宽,Y2O3的生长对温度、气压等条件更为敏感.最终制备的CeO2缓冲层是纯的(100)取向,其平面内φ扫描半高宽(FWHM)为8.5°;而Y2O3存在两种平面取向,一种是Y2O3(110)‖Ni(100),另一种是Y2O3(100)‖ Ni(100).俄歇能谱观察表明,CeO2/Ni界面优于Y2O3/Ni界面.扫描电镜照片显示,CeO2,Y2O3缓冲层的表面均匀致密,无裂纹生成,但两种薄膜中,都有呈三角形的胞状突起.     

氯化钯掺杂的羧基丁苯胶乳薄膜的制备及用于化学镀铜性能

利用羧基丁苯胶乳优良的成膜性能,并通过氯化钯掺杂使薄膜具备催化化学镀的活性,在其表面进行化学镀铜研究,选用次亚磷酸钠和硼氢化钠为还原剂,将硫酸铜还原成单质铜。 采用扫描电子显微镜（SEM）、能量色散谱（EDS）和X射线衍射（XRD）等对其形貌、成分进行表征。 测试了胶膜的增重率、表面金属及沉积层的结合牢度。 结果表明,薄膜的表面形成均匀致密、导电性优良和结合力良好的铜层。 该方法可应用于平面非金属材料如聚酯透明材料、装饰板材等,获得了良好导电表面,形成具有电磁屏蔽功能的面型材,具有广阔应用前景。     

黑色微弧氧化膜的制备及其表征

利用二次微弧氧化法,通过在磷酸盐体系的电解液中添加柠檬酸铁,在AZ40M镁合金基底表面成功制备了黑色的微弧氧化膜层。并利用扫描电子显微镜（SEM）、能谱仪（EDS）、X射线衍射（XRD）和X射线光电子能谱（XPS）分别对黑色膜层的形貌和成分组成进行了表征,探讨了黑色微弧氧化膜层的形成过程及机理。结果显示,黑色膜层的主要成分为氧化镁,同时伴随着一定量的铁氧化物,包括四氧化三铁、氧化亚铁和单质铁。因此镁基底表面黑色膜层的形成可归因于柠檬酸铁中的铁离子在成膜过程中参与反应形成了黑色的四氧化三铁、氧化亚铁和单质铁混合物,并均匀地沉积在氧化膜中。     

Effect of Anionic Electrolytes and Precursor Concentrations on the Electrodeposited Pt Structures

Electrodeposition of functional metal surfaces has received great attention because of their useful applications. Recently, interesting electrodeposition behavior of Pt at −0.8 V (vs. Ag/AgCl) was reported, where underpotential deposited H (H_upd) layers played a unique role in the electrodeposition. Here, we report the effect of anionic electrolytes and precursor concentrations on the electrochemical deposition behavior of Pt. Depending on these two experimental parameters, two distinct Pt structures, monolayer Pt films and Pt spheres, were electrodeposited at −0.8 V. In addition to the underpotential deposited H (H_upd) layers formed at −0.8 V, the adsorption of Cl⁻ also plays a significant role in determining the electrodeposited Pt structures. When the PtCl₄²⁻ concentration was low and the Cl⁻ concentration was high enough for the adsorption of PtCl₄²⁻ to be blocked by the H_upd and Cl⁻ layers, monolayer Pt films were electrodeposited. Otherwise, further electrodeposition of Pt spheres over the monolayer Pt films occurred. The effect of other halide ion adsorption and the controlled growth of Pt spheres during the Pt electrodeposition were also investigated. The electrochemical deposition behavior of Pt demonstrated in this work provides insight into the fabrication of functional Pt surfaces.     

Buffer layer effect in nanostructured tin electrodeposition on insulating and conducting substrates

The electroplating techniques for metal aggregates and films deposition commonly use an electric current to reduce metal ions in solution, but are restricted to conducting substrate. This new electrochemical technique permits coating of insulating or conducting substrates with metals having controlled aggregate size and growth speed. The basis of our approach is the progressive outward growth of the metal from an electrode in contact with the substrate, with the cell geometry chosen in such a way that the electron current providing the reduction passes through the growing deposit. The nanostructured deposit is composed of branched nanoaggregates from a quasi-continuous film to a more dendritic morphology dependant on current conditions. This approach has been used to elaborate tin electrodeposited thin films composed of a homogeneous distribution of nanoparticles on conducting or insulating substrates. In our works, when a non-continuous buffer gold coating is used, spontaneous mixing of tin atoms into AuSn nanoparticles takes place even at room temperature forming a nanostructured fractal film, if the substrate is conducting or insulating. Without a gold buffer layer, the deposit is composed of large pure tin micro-crystals with a large size distribution, less adapted to tin oxide nanoparticle formation. Indeed, from these tin metal deposits, the final goal is to elaborate functional nanostructured tin oxide films by oxidation for gas sensor applications.     

PHOTOELECTROCHEMISTRY OF ELECTRODEPOSITED POLYCRYSTALLINE CuInSe_2 THIN FILMS (Ⅰ)——ELECTRODEPOSITION OF CuInSe_2 FILMS

Electrodeposition of CulnSe, was investigated in acidic solutions containing Cu~(2+), In~(3+) and HSeO_2~+ ions. The electrodeposition condition was optimized with the aim of obtaining uniform thin films on titanium substrate. The mechanism of the electrodeposition process is discussed. Structure analysis of the deposited film shows a typical polycrystalline chalcopyrite structure, good crystallinity and homogeneous dispersion. The photoelectrochemical cells made of these kinds of deposited films in polysulfide redox solution give distinct photoresponse.     

铅在铜上电沉积的原位椭圆偏振法

采用循环伏安法(CV)和原位椭圆偏振法(SE)研究铅在铜电极上的电沉积行为。 原位椭圆偏振参数Ψ和Δ值的变化率在CV图峰电位处同时出现极值。 通过建立单层膜模型描述“电极-溶液”界面的结构并对椭圆偏振光谱数据进行拟合得到铅沉积层厚度随电位的变化规律。 拟合结果显示,铅在铜电极上的电沉积有3个不同的沉积速率,-0.20～-0.35 V之间沉积速率为0.003 nm/mV,-0.35～-0.48 V之间沉积速率为0.025 nm/mV,-0.48～-0.60 V之间沉积速率为0.116 nm/mV,由此表明铅的电沉积分为3个不同阶段：欠电位沉积阶段、欠电位沉积向本体沉积的过渡阶段和本体沉积阶段。     

Epitaxial electrodeposition of ZnO on Au(111) from alkaline solution: exploiting amphoterism in Zn(II)

The amphoteric nature of ZnO is used to produce the material from strongly alkaline solution. The solution pH is lowered globally to produce ZnO powder, and it is lowered locally at a Au(111) surface to produce epitaxial films. ZnO powder is precipitated from a solution of 10 mM Zn(II) in 0.25 M NaOH by simply adding 1 M HNO3 to the solution. For the film electrodeposition, the local pH at the electrode surface is decreased by electrochemically oxidizing the ascorbate dianion. The chemically precipitated ZnO powder grows with a sea urchin-like nanostructure, whereas the electrodeposited films have a columnar structure. ZnO electrodeposited onto a Au(111) single crystal has a ZnO(0001)[1011]//Au(111)[110] orientation relationship.     

Toward Cost‐Effective Manufacturing of Silicon Solar Cells: Electrodeposition of High‐Quality Si Films in a CaCl2‐based Molten Salt

Electrodeposition of Si films from a Si‐containing electrolyte is a cost‐effective approach for the manufacturing of solar cells. Proposals relying on fluoride‐based molten salts have suffered from low product quality due to difficulties in impurity control. Here we demonstrate the successful electrodeposition of high‐quality Si films from a CaCl₂‐based molten salt. Soluble Si^IV−O anions generated from solid SiO₂ are electrodeposited onto a graphite substrate to form a dense film of crystalline Si. Impurities in the deposited Si film are controlled at low concentrations (both B and P are less than 1 ppm). In the photoelectrochemical measurements, the film shows p‐type semiconductor character and large photocurrent. A p–n junction fabricated from the deposited Si film exhibits clear photovoltaic effects. This study represents the first step to the ultimate goal of developing a cost‐effective manufacturing process for Si solar cells based on electrodeposition.     

镁合金于离子液体中电镀铝之研究

本研究利用AlCl3-EMIC离子液体在AZ91D镁合金表面电镀铝金属,探讨离子液体组成及电流密度对电镀层性质的影响.研究结果显示铝金属可以成功地电镀于AZ91D镁合金表面上.在-0.2 V的电位下,在60 m/o AlCl3离子液体中可以获得较佳的电镀铝层.另外,在低定电流密度下进行电镀,电流效率较佳,镀层较厚.于3.5%NaCl(by mass)溶液中,铝金属镀层可以大幅提升镁合金之开路电位,并使其表面活性下降.电化学交流阻抗频谱分析显示,镁合金裸材于3.5%NaCl(by mass)水溶液中之极化阻抗值约为470~510Ω.cm2,镀铝之镁合金极化阻抗值则可提升至5200Ω.cm2.极化曲线则显示,镀铝之镁合金可以被钝化,其钝化电流密度低至5×10-5A/cm2.     

Deposition of polyaniline on RVC electrodes: effect of substrate thickness

Polyaniline films, obtained by either chemical or electrochemical deposition on reticulated vitreous carbon (RVC), were investigated as a function of the substrate thickness. The electrochemical properties of these RVC/Pani electrodes were assessed by cyclic voltammetry and electrochemical impedance spectroscopy (EIS), whereas the morphology of the Pani films on RVC was analyzed by scanning electron microscopy (SEM). The cyclic voltammetric results revealed that the oxidation/reduction charges for electrodeposited polyaniline decrease as the RVC thickness is increased. Conversely, the charge densities for the chemically deposited films do not present a significant dependence on the substrate thickness. Two time constants, appearing in all the EIS spectra, indicate that an ohmic drop effect within the RVC substrate affects the polymer electrodeposition and the electrochemical behavior of the obtained electrodes. Therefore, an electric equivalent circuit considering the different electrochemical environments at the outer and inner RVC surfaces was proposed to analyze the EIS data.     

Electrodeposition of cobalt–tungsten alloys and their application for surface engineering

Applying electrochemically deposited coatings is a convenient way to improve surface properties of a substrate metal. Today materials for applications are frequently selected according to their functional properties. Nowadays theoretical and practical studies of the co-deposition of tungsten with iron group metals are conducted worldwide, and interest for these studies increases. Tungsten alloys of iron group metals have a high melting point and are often considered high-performance alloys, and the attractiveness in those has been driven by their outstanding properties and multiple possible applications. That research is encouraged by the pronounced mechanical, tribological, and magnetic properties as well as the corrosion resistance of tungsten alloys. The magnetic properties of electrodeposited Co–W alloys are of interest in recording media and remotely-actuated micro-/nano-electromechanical systems. The given research presents an overview of versatile possibilities of Co–W alloys as multiscale materials obtained by electrodeposition from citrate solutions at pH 5–8 and temperatures 20–60°C. The paper discusses electrodeposited tungsten alloys as suitable candidates to meet many technological demands at macro-, micro- and nano-scale as coating films, microbumps and nanowires.     

Direct electrodeposition of aluminium nano-rods

Electrodeposition of aluminium within an alumina nano-structured template, for use as high surface area current collectors in Li-ion microbatteries, was investigated. The aluminium electrodeposition was carried out in the ionic liquid 1-ethyl-3-methylimidazolium chloride:aluminium chloride (1:2 ratio). First the aluminium electrodeposition process was confirmed by combined cyclic voltammetry and electrochemical quartz crystal microbalance measurements. Then, aluminium was electrodeposited under pulsed-potential conditions within ordered alumina membranes. A careful removal of the alumina template unveiled free standing arrays of aluminium nano-rods. The nano-columns shape and dimensions are directly related to the template dimensions. To our knowledge, this is the first time that direct electrodeposition of aluminium nano-pillars onto an aluminium substrate is reported.