铜电结晶的研究进展*

铜具有的优良导电性和机械加工性能以及其电沉积工艺的诸多优点,决定了铜电沉积在各行业特别是近年在高新技术中的广泛应用。铜的电结晶过程是铜电沉积的初期阶段,它决定了后续的电沉积过程及最终镀层的结构和性能,因此一直是研究的热点。本文综述了铜电结晶的研究方法、电结晶理论研究的进展,详细讨论了pH值、添加剂、金属离子、基体以及电沉积条件等因素对铜电结晶的机理和成核动力学的影响,并对研究中存在的问题提出了展望。     

烟酸对酸性硫酸盐体系铜电沉积的影响

对溶液A: 0.8 mol•L－1硫酸铜,0.6 mol•L－1硫酸,5.0×10－5 mol•L－1氯离子,1.0×10－4 mol•L－1聚乙二醇的溶液,溶液B:在溶液A中加入2.0×10－2 mol•L－1烟酸,pH为0.5,运用循环伏安和计时安培法研究玻碳电极上铜的电沉积行为.结果表明,铜的电沉积过程经历了晶核形成过程,其电结晶按瞬时成核和三维生长方式进行.烟酸的加入对铜的电沉积具有阻化作用,但不改变铜的电结晶机理.沉积层的X射线衍射表明Cu为面心立方结构,在烟酸存在下沉积层出现(220)高择优取向,这可能是烟酸在Cu(220)晶面上发生强烈吸附作用的结果.     

添加剂3-巯基-1-丙烷磺酸钠对铜电沉积影响的研究

采用循环伏安(CV)、线性电位扫描(LSV)、计时安培(CA)和交流阻抗(AC impedance)电化学方法结合扫描电镜(SEM)研究了不同浓度的3-巯基-1-丙烷磺酸钠(MPS)对CuSO₄-H₂SO₄体系中铜在玻碳电极(GCE)上的电沉积过程的影响. CV, LSV和AC impedance实验结果一致表明 MPS阻化铜的电沉积, 并且随着MPS浓度的增加, 其阻化作用增强. 但是MPS对Cu的电结晶过程表现为促进作用, CA与SEM研究结果一致表明, MPS不改变Cu的电结晶成核机理, 仍然按瞬时成核和三维生长方式进行, 并且成核数目随着MPS浓度的增大而增加.     

2,4,6—三（N,N—甲基,羧甲基氨基）—1,3,5—三嗪的合成

近代研究结果表明,不少含氮的杂环化合物对铜或其它金属有较好的缓蚀效果,同时也发现苯骈三唑(BTA)、巯基苯骈噻唑(MBT)虽然对铜有很好的缓蚀性,但在含氯或高浓度     

CuCl2硅溶胶和水溶液中铜的电化学行为研究

采用循环伏安法和计时安培法研究了CuCl2硅溶胶和水溶液中铜在玻碳电极上的电沉积和电结晶行为.结果表明在两种CuCl2电解质中,铜的电沉积分两个步骤完成,Cu2+还原为Cu+在硅溶胶中较水溶液中容易;采用吸附-成核模型解析电流-时间暂态曲线,并确定铜的电结晶机理为扩散控制下的连续成核三维生长(3DP),Cu2+在水溶液中的扩散系数较硅溶胶中的大,但相同电位下在硅溶胶中的饱和成核数密度高于水溶液中.     

硼化合物研究(ⅩⅨ)——以抗病毒剂2-(α-羟基烃基)苯骈咪唑为螯合剂的新二芳基硼化合物

本文报道通过2-(α-羟基甲基)苯骈咪唑和2-(α-羟基苄基)苯骈咪唑(HBB)与一些二芳基硼酸反应,合成了八个新化合物,并经元素分析,MS、IR和UV测定了结构。     

Electrochemical Behavior of Copper in CuCI2 Silica Sol and Aqueous Solutions

采用循环伏安法和计时安培法研究了CuCl2硅溶胶和水溶液中铜在玻碳电极上的电沉积和电结晶行为．结果表明在两种CuCl2电解质中，铜的电沉积分两个步骤完成，Cu^2＋还原为Cu^＋在硅溶胶中较水溶液中容易；采用吸附一成核模型解析电流一时间暂态曲线，并确定铜的电结晶机理为扩散控制下的连续成核三维生长（3DP），Cu^2＋在水溶液中的扩散系数较硅溶胶中的大，但相同电位下在硅溶胶中的饱和成核数密度高于水溶液中．     

铋对铜电解精炼中阴极铜沉积的微观结构的影响

采用扫描电镜、Ｘ射线衍射仪、原子吸收光度计和电子探针等仪器,研究了含有铋离子的酸性硫酸铜电解液中阴极铜沉积的电结晶生长形态、结晶的晶面取向以及铜沉积层的化学组成．研究结果表明：６５℃时,在通常的电流密度ｉ＝２００Ａ·ｍｏｌ／Ｌ－２下电解,铋不会在阴极沉积;铋离子对铜沉积层的晶面取向（２２０）基本不影响,电解液中存在高浓度铋离子时对（２２０）晶面生长起促进作用,对其它晶面生长起较强的抑制作用;铋离子影响铜沉积的电结晶生长形态和铜沉积层的晶胞尺寸．     

CO32-对羟基乙叉二膦酸体系铜电结晶的影响

采用循环伏安和计时安培法研究了羟基乙叉二膦酸(HEDPA)镀铜液中铜在玻碳电极上电结晶的初期行为。结果表明：羟基乙叉二膦酸(HEDPA)镀铜体系中,铜的电沉积过程经历了晶核形成过程;当溶液中不含CO32-时,其电结晶按连续三维成核方式进行,而CO32-的加入,使得铜电结晶按瞬时三维成核方式进行;成核数密度都随着电位的提高而增加。这可能是CO32- -以第二配体形式进入HEDPA和Cu2+构成的络合结构,从而形成更稳定的络合物吸附在电极表面所致。     

CO2-3对羟基乙叉二膦酸体系铜电结晶的影响

采用循环伏安和计时安培法研究了羟基乙叉膦酸(HEDPA)镀铜液中铜在玻碳电极上电结晶的初期行为.结果表明:羟基乙叉二膦酸(HEDPA)镀铜体系中,铜的电沉积过程经历了晶核形成过程;当溶液中不含CO32-时,其电结晶按连续三维成核方式进行,而随着CO32-的逐渐加入,使得铜电结晶按瞬时三维成核方式过渡;成核数密度都随着电位的提高而增加.这可能是CO32-以第二配体形式进入HEDPA和CU2+构成的络合结构,从而形成更稳定的络合物吸附在电极表面所致.     

高序石墨电极上单分散纳米铜粒子的电结

Mechanism of copper electrocrystallization on highly oriented pyrolytic graphite electrode from a solution of 1 mmol/L CuSO4 and 1.0 mol/L H2SO4 has been studied using cyclic voltammogram and chronoamperometry. The results show that in copper electrodeposition the charge-transfer step is fast and the rate of growth is controlled by the rate of mass transfer of copper ions to the growing centers. Reduction of Cu(Ⅱ) ions did not undergo underpotential deposition. The initial deposition kinetics of Cu electrocrystallization corresponds to a model including progressive nucleation and diffusion controlled growth. Copper nanocrystals with size of 75.6 nm and relative standard deviation of 9% can be obtained by modulation potential electrodeposition.     

氯离子对铜在玻碳电极上电结晶的影响

采用线性扫描伏安法和计时安培法研究了硫酸铜溶液中铜在玻碳电极上电结晶 的初期行为。在含与不含氯离子的0.05mol·L~(-1) cUso_4-0.5 mol·L~(-1) H_2SO_4电解液中,循环伏安实验结果表明铜在玻碳基体上的沉积没有经过UPD过 程;氯离子明显使Cu的沉积和氧化峰变得尖锐,促进Cu的沉积速度。计时安培实验 结果表明,Cu的电结晶按瞬时成核和三维生长方式进行。氯离子不改变Cu的结晶机 理,但在I～t曲线中,导致电流达最大(I_m)所需的时间t_m减小、晶核数密度和生 长速度增大,从而明显改变Cu沉积层的质量。当Cl~-浓度在10～20mg·L~(-1)范围 内,成核的晶核数密度达较大,即氯离子的最适宜添加量。     

ITO上电沉积Pd的成核机理及电催化性质

采用循环伏安技术和计时电流技术, 研究了ITO上电沉积Pd的过程, 发现Pd在ITO表面的电沉积是过电位成核且为不可逆的扩散控制过程; 根据Cottrell方程计算得到[PdCl₄]^2-的扩散系数为2.19×10^-5 cm²/s; 根据Scharifker的理论模型, 归一化处理电流-时间曲线, 与理论成核曲线对照, 判断Pd 的成核机理. 通过场发射扫描电子显微镜(FESEM)对Pd 的形貌进行分析, 讨论了沉积电位和沉积时间对Pd纳米粒子形貌的影响. 用X射线粉末衍射(XRD)对Pd纳米粒子进行结构分析, 并在0.5 mol/L H₂SO₄溶液中研究了其电化学性质及在碱性条件下乙醇分子的电催化性质.     

The detection of nitrate using in-situ copper nanoparticle deposition at a boron doped diamond electrode.

Electrochemical deposition from a 0.1 M sodium sulphate solution, containing Cu2+ (adjusted to pH 3 with hydrochloric acid) produced a well defined copper nanoparticle deposit on the surface of a boron doped diamond electrode. Changing conditions such as potential (-0.8, -1.0 and -1.2 V), time (5, 2 and 0.5 s) and concentration of Cu2+ (500, 250 and 100 microM) was found to give copper nanoparticles of varying size and particle density. The electrocatalytic properties of the copper surface towards nitrate reduction were explored. An in-situ copper nanoparticle production method was developed for the detection of nitrate; this involves electrodeposition, followed by linear sweep voltammetry for the reduction of nitrate and then application of a stripping potential to renew the electrode surface. The linear sweep was discovered to have homogenised the size of the nanoparticles but their number density was still dependant on the initial conditions of deposition. Some particles were still present at the surface after the stripping potential had been applied but repetitions of the procedure showed these did not have an effect on subsequent deposits. Optimisation of the method lead to applying a deposition potential of -0.8 V, at a BDD electrode for 5 s in a 0.1 M sodium sulphate solution (pH 3) containing 100 microM Cu2+ followed by a linear sweep at 1 V/s; this yielded a limit of detection of 1.5 microM nitrate. The analytical applicability of the technique was evaluated for nitrate detection in a natural mineral water sample and was found to agree well with that stated by the manufacturer.     

Long-term acid resistance and selectivity of NF membranes in very acidic conditions

The aim of the study was to test commercial and experimental NF membranes for their separation efficiency and acid resistance in a long-term filtration experiment. Several NF membranes (NF 270, Desal-5 DK, Desal KH, BPT-NF-1 and BPT-NF-2) were tested for their separation efficiency and stability when a solution containing 25 g/L CuSO₄ and 8 wt.% H₂SO₄ was continuously filtered at 40 °C for 2 months. Filtration experiments were carried out with a new five-cell flat-sheet laboratory apparatus. Commercial NF membranes showed good selectivity, retaining most of the copper sulphate and letting most of the sulphuric acid pass into the permeate. However, only the membranes designed to be acid resistant (Desal KH and BPT-NF-2) maintained their separation efficiency during the 2 months of separation. The Desal KH membrane gave better copper retention values (92–95%) than the BPT-NF-2 (60–88%), but the overall selectivity was best with the BPT-NF-2 membrane due to its good sulphuric acid permeation.     

铜在储氢合金表面包铜电极中的行为

在密封的电池体系中，包铜储氢合金电极具有较好的抗氧化能国和；而在强碱性溶淤 中，铜在电极工作的电位范围内具有一定的稳定性，但当扩展扫描范围，将出现铜的氧化不这原反应。     

电化学沉积制备纳米结构铜电极及其葡萄糖检测性能

利用电化学沉积法制备了高电活性的纳米结构铜电极材料, 采用扫描电子显微镜和电化学方法分别对电极表面形貌和电化学性能进行了表征, 研究了实验参数对葡萄糖电氧化活性的影响. 结果表明, 改变沉积条件可以调控沉积铜的形貌及电催化活性. 在最佳条件下制备的铜纳米结构电极对葡萄糖检测的灵敏度为1310 μA·L/mmol, 检出限为5.0×10^-7 mol/L(S/N=3).     

Enhanced capacity of chitosan for transition-metal ions in sulphate-sulphuric acid solutions

Batch measurements have shown that the collection yields of chitosan for chromium(III), iron(III), nickel, copper(II), zinc and mercury(II) from sulphuric acid solutions are higher when the solutions contain ammonium sulphate, or when chitosan conditioned in ammonium sulphate is used, particularly at pH 3.0 and 5.0. The contrary is verified for the oxy-anions vanadate, chromate and molybdate. Manganese is never collected. At pH 1.0 no collection occurs. A procedure for recycling chromatographic columns includes fixation of Cu or Ni from a sulphate solution at pH 3-5 on sulphate-conditioned chitosan, and elution with 0.1M sulphuric acid/0.1M ammonium sulphate at pH 1.0; the presence of sulphate in the eluent obviates the detrimental effect of sulphuric acid on the next cycle. Sulphate is the favoured counter-ion of the chelated cations and its action produces shorter chromatographic bands. The interaction of sulphate with chitosan is discussed in terms of crystallinity and steric distribution of the protonated amino-groups in the polymer. Data on the new diethylaminohydroxypropylcellulose are included.