Defect reduction in GaN epilayers and HFET structures grown on (0 0 0 1)sapphire by ammonia MBE

The quality of GaN epilayers grown by molecular beam epitaxy on substrates such as sapphire and silicon carbide has improved considerably over the past few years and in fact now produces AlGaN/GaN HEMT devices with characteristics among the best reported for any growth technique. However, only recently has the bulk defect density of MBE grown GaN achieved levels comparable to that obtained by MOVPE and with a comparable level of electrical performance. In this paper, we report the ammonia-MBE growth of GaN epilayers and HFET structures on (0 0 0 1)sapphire. The effect of growth temperature on the defect density of single GaN layers and the effect of an insulating carbon doped layer on the defect density of an overgrown channel layer in the HFET structures is reported. The quality of the epilayers has been studied using Hall effect and the defect density using TEM, SEM and wet etching. The growth of an insulating carbon-doped buffer layer followed by an undoped GaN channel layer results in a defect density in the channel layer of 2×10⁸ cm⁻². Mobilities close to 490 cm²/Vs at a carrier density of 8×10¹⁶ cm⁻³ for a 0.4 μm thick channel layer has been observed. Growth temperature is one of the most critical parameters for achieving this low defect density both in the bulk layers and the FET structures. Photo-chemical wet etching has been used to reveal the defect structure in these layers.     

Single‐crystal sapphire microstructure for high‐resolution synchrotron X‐ray monochromators

We report on the growth and characterization of sapphire single crystals for X‐ray optics applications. Structural defects were studied by means of laboratory double‐crystal X‐ray diffractometry and white‐beam synchrotron‐radiation topography. The investigations confirmed that the main defect types are dislocations. The best quality crystal was grown using the Kyropoulos technique. Therein the dislocation density was 10²–10³ cm⁻² and a small area with approximately 2*2 mm² did not show dislocation contrast in many reflections. This crystal has suitable quality for application as a backscattering monochromator. A clear correlation between growth rate and dislocation density is observed, though growth rate is not the only parameter impacting the quality.     

Reduction of dislocations in a (1 1 2¯ 2)GaN grown by selective MOVPE on (1 1 3)Si

Two-step selective epitaxy (SAG/ELO) of (1 1 2¯ 2)GaN on (1 1 3)Si substrate is studied to reduce the defect density in the epitaxial lateral overgrowth. The first SAG/ELO is to prepare a (1 1 2¯ 2)GaN template on a (1 1 3)Si and the second SAG/ELO is to get a uniform (1 1 2¯ 2)GaN. It is found that the reduction of the defect density is improved by optimizing the mask configuration in the second SAG/ELO. The minimum dark spot density obtained is 3×10⁷/cm², which is two orders of magnitude lower than that found in a (0 0 0 1)GaN grown on (1 1 1)Si.     

MOCVD growth of GaN on Si(1 1 1) substrates using an ALD-grown Al2O3 interlayer

GaN thin films have been grown on Si(1 1 1) substrates using an atomic layer deposition (ALD)-grown Al₂O₃ interlayer. This thin Al₂O₃ layer reduces strain in the subsequent GaN layer, leading to lower defect densities and improved material quality compared to GaN thin films grown by the same process on bare Si. XRD ω-scans showed a full width at half maximum (FWHM) of 549 arcsec for GaN grown on bare Si and a FWHM as low as 378 arcsec for GaN grown on Si using the ALD-grown Al₂O₃ interlayer. Raman spectroscopy was used to study the strain in these films in more detail, with the shift of the E₂(high) mode showing a clear dependence of strain on Al₂O₃ interlayer thickness. This dependence of strain on Al₂O₃ thickness was also observed via the redshift of the near bandedge emission in room temperature photoluminescence (RT-PL) spectroscopy. The reduction in strain results in a significant reduction in both crack density and screw dislocation density compared to similar films grown on bare Si. Screw dislocation density of the films grown on Al₂O₃/Si substrates approaches that of typical GaN layers on sapphire. This work shows great promise for the use of oxide interlayers for growth of GaN-based LEDs on Si.     

High carbon doping of Ga1−xInxAs (x≈0.01) grown by molecular beam epitaxy

We have grown layers of Ga_1−xIn_xAs:C (x ≈ 0.01) on (100) GaAs by molecular beam epitaxy. As C source a graphite filament was used. Structures coherent with the substrate were obtained by adjusting properly the In and C concentrations. With simultaneous incorporation of In and C the strain is compensated and, consequently, the defect density is reduced. A maximum hole concentration value of p = 6×10¹⁹ cm⁻³ was achieved, which is twice higher than the saturation value of C doping of GaAs produced under the same conditions. There is evidence that this value is not in the saturation limit. The product of the hole density times the mobility increases, so the resistance decreases with higher C doping. Raman spectra show that the C_As peak broadens and shifts to lower frequencies for increasing concentration of indium. In H-passivated samples, Raman spectroscopy shows that C_As is surrounded by Ga atoms only. Indium atoms are thus present only in the second group III shell.     

Growth of 1.55 μm DH laserstructures using TBAs and TBP in MOMBE

In a comparative study we have chosen TBAs and TBP as well as AsH₃ and PH₃ for the growth of InP/GaInAs(P) heterostructures for laser applications in a production metalorganic molecular beam epitaxy (MOMBE) system. The n-type doping was performed with Si from an effusion cell, whereas for the p-type doping Be and DEZn were utilized. InP layers using TBP under optimized cracking conditions exhibit excellent surface morphology with good electrical properties in the low 10¹⁵ cm⁻³ range of carrier concentrations. The MOMBE growth mechanism is not disturbed by the hydride replacement compound. This allows for a convenient replacement without losing calibration data from the hydride process. Broad-area DH laserstructures with GaInAsP (λ = 1.55 μm) active regions were grown with AsH₃/PH₃ and TBAs/TBP. Comparable threshold current densities in the range of 1.6-2.3 kA/cm² are achieved for the lasers, grown with both sets of precursors combined with DEZn source doping. These results are in good agreement with the standard set by the hydride MOVPE process.     

Growth of (1 0 1¯ 3¯ ) semipolar GaN on m-plane sapphire by hydride vapor phase epitaxy

The crystalline, surface, and optical properties of the (1 0 1¯ 3¯) semipolar GaN directly grown on m-plane sapphire substrates by hydride vapor phase epitaxy (HVPE) were investigated. It was found that the increase of V/III ratio led to high quality (1 0 1¯ 3¯) oriented GaN epilayers with a morphology that may have been produced by step-flow growth and with minor evidence of anisotropic crystalline structure. After etching in the mixed acids, the inclined pyramids dominated the GaN surface with a density of 2×10⁵ cm⁻², revealing the N-polarity characteristic. In the low-temperature PL spectra, weak BSF-related emission at 3.44 eV could be observed as a shoulder of donor-bound exciton lines for the epilayer at high V/III ratio, which was indicative of obvious reduction of BSFs density. In comparison with other defect related emissions, a different quenching behavior was found for the 3.29 eV emission, characterized by the temperature-dependent PL measurement.     

Replacement of hydrides by TBAs and TBP for the growth of various III–V materials in production scale MOVPE reactors

Besides the standard group V precursors AsH₃ and PH₃, so-called alternative precursors like TBAs and TBP (tertiary-butyl-arsine and tertiary-butyl-phosphine) are more and more important in today's MOVPE processes. A lot of publications have demonstrated that these precursors can be successfully used for the growth of different III–V materials. In this study we want to demonstrate that TBAs and TBP can be used as the group V precursor in a complete family of production scale reactors. It is shown that these precursors can be used for the growth of InP-based as well as for GaAs-based materials. The reactors that have been employed are medium scale reactors (AIX 200/4; 1 × 2 inch, 3 or 4 inch or 3 × 2 inch capability) and large scale Planetary Reactors®, in particular the AIX 2400 system (15 × 2 inch or 5 × 4 inch). Materials that have been grown are (Al)GaInP on GaAs and GaInAsP on InP. The lower cracking energy of these precursors compared to PH₃ and AsH₃ allows one to use lower growth temperatures and lower V/III ratios, particularly in combination with the high cracking efficiencies of the used reactors. For the growth of GaInAsP on InP, the consumption of TBP and TBAs is up to 8 times lower than using PH₃ and AsH₃. GaInP on GaAs could be grown with a V/III ratio as low as 25 in a Planetary Reactor®. Good crystalline quality is demonstrated by DCXD (e.g. for GaInP: FWHM = 35 arcsec, substrate 32 arcsec). PL intensity and growth rate are not affected by using the alternative precursors. The compositional uniformity is similar to layers grown with arsine and phosphine (e.g. 1.5 nm uniformity for GaInAsP (λ = 1.5 μm) on 2 inch; approximately 1 nm uniformity for GaInP) [1,2]. The purity of the grown layers depends mainly on the quality of the TBP and TBAs. Using high purity TBP, InP revealed background carrier concentration in the mid 10¹⁴ cm⁻³ regime. Our investigation shows that TBP and TBAs can replace phosphine and arsine in state of the art MOVPE reactors. Both for single and multi-wafer production MOVPE reactors these compounds can be used successfully for the growth of the entire material spectrum in the Al---Ga---In---As---P system.     

KDP single crystal growth via three‐dimensional motion growth method

A novel system for rapid crystal growth, namely three‐dimensional motion growth method (“3D MGM”) was proposed. Using this system, a potassium dihydrogen phosphate (KDP) seed was grown to a single crystal with a final size of 50×55×85 mm³. The KDP crystal was characterized by Raman spectroscopy, UV‐vis‐NIR spectroscopy, extinction ratio, laser damage threshold, and etching studies. Raman spectrum shows KDP crystal grown by “3D MGM” maintains good crystallinity as that grown by rotating‐crystal method (“RCM”). The “3D MGM” grown KDP crystal has much better transmittance, higher extinction ratio, higher damage threshold and less dislocation density, compared to “RCM” grown crystal.     

Heteroepitaxial growth of GaP on silicon

Epitaxial gallium phosphide layers have been grown on silicon substrates by the metal-organic process. This process involves the reaction between trimethylgallium (CH₃)₃Ga and PH₃ and gives a high density of nucleation sites on the silicon. The influence of the substrate orientation and of the deposition temperature on the crystallinity of the layers has been studied. Best results were obtained on (001) oriented substrate at a deposition temperature of 800°C. X-ray reflection topographs of the layers have revealed the formation of cracks extending along the [110] direction, which are explained by the lattice mismatch and the difference in thermal expansion coefficients. The cracking is asymmetric with the main direction parallel to [110]. The density of cracks can be reduced by a two stage epitaxy. The electrical properties of undoped and n-type doped layers have been assessed by Hall and C(V) measurements. It shows auto-doping with silicon coming from the substrate.     

N‐GaN column arrays on the vertical InGaN/GaN blue LEDs formed by maskless dry etching

The InGaN/GaN blue light emitting diodes (LED) structures have been grown on sapphire substrates with a hexagonal array of hemispherical patterns by low‐pressure metalorganic chemical vapor deposition. Vertical LED structures on Cu carriers are fabricated using electroplating and KrF laser lift‐off techniques. After removal of the patterned sapphire substrate, an inductively coupled plasma etching is carried out to expose the n‐GaN layer for n‐metal contact. It is observed that GaN columns are formed at the center of the concave hemispheres after dry etching processes. Cathodoluminescence and wet chemical etching investigations reveal that a high density of dislocations is found to be generated at these specific positions. The possible mechanism for these observations is attributed to the defect distribution and defect‐dependent selective etching of the GaN.     

ZnO(n)/ZnSe(i)/c-Si(p)异质结太阳电池的模拟研究

近年来,HIT(heterojunction with intrinsic thin-layer)结构太阳能电池由于具有转化效率高和可低温生产等优点获得了广泛的关注,但是转化原材料成本高、生产技术条件苛刻和缺陷态控制等问题制约了其进一步的发展。本文采用AFORS-HET软件模拟了ZnO(n)/ZnSe(i)/c-Si(p)异质结太阳电池结构吸收层掺杂浓度、缺陷密度和界面缺陷态密度等参数对该结构短路电流、开路电压、填充因子和光电转换效率的影响。优化后的结果显示,当吸收层掺杂浓度为1×10²¹ cm^-3,ZnO层和c-Si层缺陷密度小于10¹⁷ cm^-3时,ZnSe/c-Si界面缺陷密度小于10²⁵ cm^-3时,该结构太阳能电池光电转换效率可达24.29%。     

MBE growth of PbSe thin film with a 9×10 cm etch-pits density on patterned (1 1 1)-oriented Si substrate

PbSe thin film was grown on a patterned Si substrate with (1 1 1)-orientation by molecular-beam epitaxy (MBE). On the mesa, a low dislocation density of 9×10⁵ cm⁻² was confirmed by the etch-pits density (EPD) wet-etching technique. The photoluminescence (PL) intensity at room temperature from the low dislocation PbSe film was much higher than that from the PbSe film grown on the planar area, which further indicated the high-quality of PbSe thin film grown on patterned Si substrate.     

Nanostructured Crystals of Fluorite Phases Sr1 – xRxF2 + x (R Are Rare-Earth Elements) and Their Ordering. 14: Concentration Dependence of the Defect Structure of Nonstoichiometric Phases Sr1 – xNdxF2 + x As Grown (x = 0.10, 0.25, 0.40, 0.50)

Crystallography Reports - The defect structure of as grown Sr1 – xNdxF2 + x (x = 0.10–0.50) crystals grown from a melt by...     

Growth of bismuth tri‐iodide platelets by the physical vapor deposition method

The work reports the growth of single BI₃ crystals with platelets habit. Platelets were grown by physical vapor deposition (PVD) in a high vacuum atmosphere and with argon, polymer or iodine as additives. Crystals grew in the zone of maximum temperature gradient, perpendicular to the ampoule wall. Crystals grown with argon as additive show a very shining surface, have hexagonal (0 0 l) faces, sizes up to 20 x 10 mm² and thicknesses up to 100 μm. They were characterized by optical microscopy and scanning electron microscopy (SEM). Dendritic‐like structures were found to be their main surface defect. SEM indicates that they grow from the staking of hexagonal unities. Electrical properties of the crystals grown under different growth conditions were determined. Resistivities up to 2 x 10¹² Ωcm (the best reported value for monocrystals of this material) were obtained. X‐ray response was measured by irradiation of the platelets with a ²⁴¹Am source of 3.5 mR/h. A comparison of results according to the growth conditions was made. Properties of the crystals grown by this method are compared with the ones measured for others previously grown from the melt. Also, results for bismuth tri‐iodide platelets are compared with the ones obtained for mercuric and lead iodide platelets. (© 2004 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Microscopic lateral overgrowth by physical vapour transport of GaN on self‐organized diamond‐like carbon masks

Techniques to reduce dislocation densities in GaN grown on foreign substrates are an interesting alternative to bulk growth as long as efficient bulk crystals growth techniques are not available. In this paper a new approach for epitaxial lateral overgrowth (ELO) of GaN through an in‐situ grown self‐organized amorphous (diamond‐like) carbon mask is demonstrated. The ELO was done for the first time by physical vapour transport of Ga, using NH₃ as a nitrogen source. The overgrowth results in a decrease of the threading dislocation density by at least one order of magnitude compared to that of the MOCVD GaN/sapphire templates. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Crystal cracking analysis and three‐dimensional effects during Kyropoulos sapphire growth

Kyropoulos (Ky) method is the most suitable technique for the growth of high‐quality sapphire single crystal for substrate applications. Cracks are often observed in the grown ingot that significantly reduces industrial productivity. In the paper, cracking causes are analyzed by examining crystal shape, thermal stress and three‐dimensional effects during the stable growth of sapphire crystal. It is found that locally induced thermal stress around the shoulder of the crystal is the largest. However, thermal stress is not fully responsible for the cracks, since the predicted stress level is lower than a critical value regarding crystal cracking. Polycrystalline growth or/and other crystal defects must be another factor that degrades the critical value and makes the crystal more fragile. Simulation results further show that crystal shape has less effect on the thermal stress level, although experiments have shown that crack‐free crystals usually have smooth surfaces. The initial cracking position in the ingot predicted in simulation agrees well with experimental observation after considering crystal defects in a qualitative discussion. From the view of three‐dimensional simulation, the variation of heating condition during growth may result in high thermal stress locally that leads to the cracks at one side of the crystal. Additionally, three‐dimensionally unexpected temperature drop of the heater may be responsible for the sticking‐to‐crucible phenomenon at the shoulder region of the grown crystal.     

Growth of Bi<Subscript>12</Subscript>GeO<Subscript>20</Subscript> and Bi<Subscript>12</Subscript>SiO<Subscript>20</Subscript> crystals by the low-thermal gradient Czochralski technique

Bi₁₂SiO₂₀ crystals have been grown for the first time by the low-thermal gradient Czochralski technique in the 〈111〉 and 〈110〉 directions. The conditions for reproducible crystal growth with a high-quality polyhedral faceted front are found. The systematic features of shaping Bi₁₂SiO₂₀ and Bi₁₂GeO₂₀ crystals, grown by the low-thermal gradient Czochralski technique, are compared. The defect formation in these crystals is studied and their optical homogeneity is analyzed by interferometry.     

TEM investigation of precipitates in VCz GaAs crystals

Bulk GaAs crystals were grown from various Ga‐rich melts by the vapour‐pressure controlled Czochralski method in order to reduce As precipitates. The correlation of the melt composition with both, structural perfection and solid composition was examined by various methods of transmission electron microscopy (TEM). From transmission electron diffraction and diffraction contrast imaging a direct correlation between melt composition and sample properties is missing. High‐resolution TEM imaging hints to inhomogeneities only for the sample grown from a melt with a mole fraction of y = 0.492. Strain analysis of a selected defect reveals a strained crystal lattice in the surrounding of the defect. For the same sample, high angle annular dark‐field imaging and energy dispersive X‐ray spectroscopy verify the formation of precipitates. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Growth and properties of Ba‐doped KDP crystals

KDP crystals were rapidly grown from solution doped with different Ba²⁺ concentrations. The effects of Ba²⁺ on the growth rate, morphology and quality of KDP crystals were discussed. Significant changes in shapes and volume of the grown crystals have been observed. During the growth process, defect region expands gradually with the increasing Ba²⁺ concentration. Samples were cut from different parts of the as‐grown crystals for investigating the optical quality, including transmission spectrum, scattering centers. Through comparison, it is found that the nonuniform distribution of Ba²⁺ ions causes remarkable difference in optical quality between prismatic and pyramidal sectors. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)