基于数字散斑相关方法测定Ⅰ型裂纹应力强度因子

提出了一种通过数字散斑相关方法测定金属材料Ⅰ型裂纹尖端位置和应力强度因子的实验方法.实验采用疲劳试验机对含Ⅰ型缺口的Cr12MoV钢试件预制裂纹,通过数字散斑相关方法测试试件在三点弯曲加载条件下裂纹的扩展过程及裂尖区域的位移场.将位移场数据代入裂尖位移场方程组,采用牛顿-拉普森方法求解含未知参量的裂尖非线性位移场方程组,计算裂尖位置和应力强度因子.实验结果表明,采用该方法可以准确地测定金属材料Ⅰ型裂纹应力强度因子、裂尖位置及裂纹扩展长度,解决了以往研究中因不能准确测定裂纹尖端位置,而无法准确计算Ⅰ型裂纹裂尖断裂参数的难题,揭示了金属材料裂纹扩展过程中应力强度因子演化特征.     

NiTi形状记忆合金裂纹尖端热力耦合行为研究

本文对NiTi形状记忆合金I型裂纹尖端热力耦合行为进行了数值仿真分析和实验验证。建立了包含相变和热力耦合的本构模型,通过有限元计算得到了裂纹尖端附近的纵向应变、马氏体体积分数和温度场分布,依据马氏体相变情况对裂纹尖端有效应力强度因子进行了修正,揭示了加载速率对形状记忆合金裂纹尖端有效应力强度影子的影响规律。参数研究表明,随着加载频率的增加,裂纹尖端附近温度逐渐升高,马氏体相变区域逐渐缩小,有效应力强度因子呈下降趋势,形状记忆合金表现出增韧效应,有助于减缓裂纹扩展。本研究结果对于揭示热力耦合作用下超弹性形状记忆合金疲劳裂纹扩展规律具有重要参考意义。     

含直对称裂纹的一维六方压电准晶对SH波的散射Scattering of SH wave by a linear symmetric crack at one-dimensional piezoelectric hexagonal quasicrystals

利用积分变换技术,结合Copson方法,研究了含直线型对称裂纹的一维六方压电准晶对SH波的散射问题。通过求解对偶积分方程,得到声子场、相位子场应力、位移及电场电位移分量的解析解。定义了裂纹尖端应力强度因子及电位移强度因子,给出了电非渗透性条件下应力强度因子及电位移强度因子的解析解。此研究结果对压电准晶材料的工程应用有一定的理论价值。     

两种材料组成弹性体的界面裂纹问题

本文研究了两种材料的半空间组成的弹性体在交界面上含半无限平面裂纹时的裂纹尖端应力场与应力强度因子,应用弹性力学位移场的通解以及Kontorovitch-Lebedev积分变换求解出了在裂纹面上作用有对称法向载荷时的裂纹尖端应力场以及应力强度因子的具体形式。     

复合材料断裂力学参量的实验测定

本文采用三维云纹干涉仪同步测量含裂纹复合材料弯曲板的面内位移场及离面位移场，并对离面位移场云纹图进行计算机自动采集和处理，编制了云纹数字图像处理软件。文中推导了正交异性复合材料弯曲问题的离面位移场表达式，得到了弯曲板裂纹尖端位移w与应力场强度因子K1的关系式。通过实测位移，结合裂尖位移场推导出应力强度因子K1值。     

含直对称裂纹的一维六方压电准晶对SH波的散射

利用积分变换技术,结合Copson方法,研究了含直线型对称裂纹的一维六方压电准晶对SH波的散射问题。通过求解对偶积分方程,得到声子场、相位子场应力、位移及电场电位移分量的解析解。定义了裂纹尖端应力强度因子及电位移强度因子,给出了电非渗透性条件下应力强度因子及电位移强度因子的解析解。此研究结果对压电准晶材料的工程应用有一定的理论价值。     

冲击载荷下两裂纹间的连通规律

脆性材料内部含有大量裂纹，当某一裂纹扩展时，其他裂纹会对扩展裂纹产生影响。为了研究冲击载荷下，脆性材料内两裂纹的相互影响、连通规律及裂纹尖端应力强度因子的变化规律，利用有机玻璃板制作了含非平行双裂纹的实验试件，利用落板冲击设备进行了中低速冲击实验，结合有限元分析软件ABAQUS计算出裂纹尖端应力强度因子，利用有限差分软件AUTODYN进行了动态数值模拟研究，并将其模拟结果与实验结果进行对比分析。实验及模拟结果表明:裂纹破坏形态与AUTODYN数值模拟破坏形态基本一致；试件的断裂形态随着两裂纹间距不同而不同；裂纹间的相互影响程度随着裂纹间间距增大而减小；裂纹尖端应力强度因子K_I随着裂纹间距的增大而减小，而K_II随着裂纹间距增大而增大。     

NUMERICAL MODELING FOR FLUID-STRUCTURE INTERACTION UNDER BLAST AND IMPACT LOADING RESPONSE

建立了基于位移相等条件的流固耦合数值模拟程序框架,通过串联弱耦合方式对爆炸冲击波作用下流固耦合效应进行数值模拟. 其中非线性固体位移场采用基于Lagrange方法描述的时域间断伽辽金有限元方法进行处理. 基于修正弹簧近似的非结构动网格新技术,非定常流场采用格心格式的有限体积方法进行求解. 数值模拟结果表明: 该文所发展的弱耦合分析程序在流固耦合数值模拟过程中具有可靠的计算精度. 同时,程序对于爆炸强间断气动冲击载荷冲击作用下固体变形引起流场的反射和叠加效应, 以及流场变化引起复杂的固体响应具有良好的耦合求解能力.     

热、机械载荷作用下夹杂对应力强度因子的影响

推导了远场应力、热应力耦合作用下含夹杂裂纹体的应力强度因子求解公式,改进了体积力法中的裂纹面合力平衡条件,将应力强度因子的求解归结为解一组积分方程,再将积分方程转化为线性方程组进行数值求解。算例分析结果表明方法正确、有效。将该算法应用于含Al2O3夹杂的FGH95材料应力强度因子分析中,计算结果表明热应力对应力强度因子影响很小。     

求解混合型裂纹应力强度因子的围线积分法

本文用复变函数理论推导出裂纹的辅助场，并用Betti功互等定理给出求解混合型裂纹应力强度因子的远场围绕积分法．此方法与积分路径的选择无关，用有限元法计算出远离裂纹尖端的位移场和应力场，就可通过计算绕裂端的围线积分，精确地给出混合型裂纹的应力强度因子KⅠ和KⅡ的数值解．     

基于奇异强度因子的V型切口应力场和N-SIF评估方法

根据线弹性断裂力学理论，V形切口处的应力场具有奇异性，应力值趋于无穷大，峰值应力不能直接用于评定疲劳强度。通过引入了奇异强度因子“as”，单边缺口应力分布和缺口应力强度因子(N-SIF)的半解析公式被推导。考虑张开角和几何尺寸等因素，基于奇异强度因子拟合得到了切口应力评估的简易公式，可用于切口应力场和N-SIF值的快速评估。将简易公式评估结果与有限元结果以及传统文献结果进行对比分析，结果表明，本文简易公式可以准确地预报拉伸载荷下单边V型切口角平分线上的应力场和N-SIF值，实现了切口试样应力场的快速评估。     

应用通用权函数法计算热机载荷作用下三维界面裂纹的应力强度因子

热机载荷共同作用下双材料、复合材料中的裂纹扩展往往发生在界面处,并且工程中实际遇到的裂纹大多数是三维裂纹,传统的求解热冲击及机械载荷共同作用下界面裂纹应力强度因子的数值方法如有限元、边界元法计算量大,计算效率低。由于通用权函数仅仅与裂纹体的几何形状有关,与载荷、时间无关,求解应力强度因子时避免了反复的应力分析,计算效率大大提高, 通用权函数法非常适合计算复杂冲击载荷下应力强度因子分布的过渡过程。根据Betti互易原理,本文推导出了三维界面裂纹问题通用权函数法的普遍表达式,并给出了热机载荷共同作用下三维界面I型、Ⅱ型和Ⅲ型裂纹问题通用权函数法的有限元格式. 通过实例计算比较,表明此方法得到的结果可以达到满意的工程应用精度。     

Transient response of a cracked piezoelectric strip under arbitrary electro-mechanical impact

By using the well-developed integral transform methodology, the dynamic response of stress and electric displacement around a finite crack in an infinite piezoelectric strip are investigated under arbitrary dynamic anti-plane loads. The dynamic stress intensity factors and electric displacement are obtained analytically. It is shown that the dynamic crack-tip stress and electric field still have a square-root singularity. Numerical computations for the dynamic stress intensity factor show that the electric load has a significant influence on the dynamic response of stress field. The higher the ratio of the crack length to the width of the strip, the higher the peak value of the dynamic stress intensity factor is. On the other hand, the dynamic response of the electric field is determined solely by the applied electric load. The electric field will promote or retard the propagation of the crack depending on the time elapse since the application of the external electro-mechanical loads. The project supported by the National Natural Science Foundation of China and the Post-Doctor Science Foundation of China     

有限尺寸下双材料界面附近裂纹位置对裂纹尖端的影响

随着复合材料的应用和发展,不同材料组成的界面结构越来越受到人们的重视。界面层两侧材料的性能相异会引起材料界面端奇异性,同时界面和界面附近存在裂纹会引起裂尖处的应力奇异性。因此双材料界面附近的力学分析是比较复杂的。本文建立双材料直角界面模型,在材料界面附近预设初始裂纹,计算了有限材料尺寸对界面应力场及其附近裂纹应力强度因子的影响。运用弹性力学中的 Goursat 公式求得直角界面端在有限尺寸下的应力场以及其应力强度系数。通过叠加原理和格林函数法进一步得到在直角界面端附近的裂纹尖端应力强度因子。计算结果表明,在适当范围内改变材料内裂纹与界面之间的距离,界面附近裂纹尖端的应力强度因子随着裂纹与界面距离的增加而减少,并且逐渐趋于稳定。分析结果可以为预测双材料结构复合材料界面失效位置提供参考。     

Transient thermal elastic fracture of a piezoelectric cylinder specimen

A finite piezoelectric cylinder with an embedded penny-shaped crack is investigated for a thermal shock load on the outer surface of the cylinder. The theory of linear electro-elasticity is applied to solve the transient temperature field and the associated thermal stresses and electrical displacements without crack. These thermal stresses and electrical displacements are added to the surfaces of the crack to form an electromechanical coupling and mixed mode boundary-value problem. The electrically permeable crack face boundary condition assumption is used, and the thermal stress intensity factor and electrical displacement intensity factor at the crack border are evaluated. The thermal shock resistance of the piezoelectric cylinder is evaluated for the analysis of piezoelectric material failure in practical engineering applications.     

A crack perpendicular to the bimaterial interface in finite solid

The dislocation simulation method is used in this paper to derive the basic equations for a crack perpendicular to the bimaterial interface in a finite solid. The complete solutions to the problem, including the T stress and the stress intensity factors are obtained. The stress field characteristics are investigated in detail. It is found that when the crack is within a weaker material, the stress intensity factor is smaller than that in a homogeneous material and it decreases when the distance between the crack tip and interface decreases. When the crack is within a stiffer material, the stress intensity factor is larger than that in a homogeneous material and it increases when the distance between the crack tip and interface decreases. In both cases, the stress intensity factor will increase when the ratio of the size of a sample to the crack length decreases. A comparison of stress intensity factors between a finite problem and an infinite problem has been given also. The stress distribution ahead of the crack tip, which is near the interface, is shown in details and the T stress effect is considered.     

A computational study of local stress intensity factor solutions for kinked cracks near spot welds in lap-shear specimens

In this paper, the local stress intensity factor solutions for kinked cracks near spot welds in lap-shear specimens are investigated by finite element analyses. Based on the experimental observations of kinked crack growth mechanisms in lap-shear specimens under cyclic loading conditions, three-dimensional and two-dimensional plane-strain finite element models are established to investigate the local stress intensity factor solutions for kinked cracks emanating from the main crack. Semi-elliptical cracks with various kink depths are assumed in the three-dimensional finite element analysis. The local stress intensity factor solutions at the critical locations or at the maximum depths of the kinked cracks are obtained. The computational local stress intensity factor solutions at the critical locations of the kinked cracks of finite depths are expressed in terms of those for vanishing kink depth based on the global stress intensity factor solutions and the analytical kinked crack solutions for vanishing kink depth. The three-dimensional finite element computational results show that the critical local mode I stress intensity factor solution increases and then decreases as the kink depth increases. When the kink depth approaches to 0, the critical local mode I stress intensity factor solution appears to approach to that for vanishing kink depth based on the global stress intensity factor solutions and the analytical kinked crack solutions for vanishing kink depth. The two-dimensional plane-strain computational results indicate that the critical local mode I stress intensity factor solution increases monotonically and increases substantially more than that based on the three-dimensional computational results as the kink depth increases. The local stress intensity factor solutions of the kinked cracks of finite depths are also presented in terms of those for vanishing kink depth based on the global stress intensity factor solutions and the analytical kinked crack solutions for vanishing kink depth. Finally, the implications of the local stress intensity factor solutions for kinked cracks on fatigue life prediction are discussed.     

SEMI-ELLIPTIC SURFACE CRACK IN AN ELASTIC SOLID WITH FINITE SIZE UNDER IMPACT LOADING

In this paper a semi-elliptic surface crack problem in an elastic solid of finite size under impact loading is investigated. An analysis is performed by means of fracture dynamics and the finite element method, and a three-dimensional finite element program is developed to compute the dynamic stress intensity factor. The results reveal that the effects of the solid's boundary surface, crack surface, material inertia and stress wave interactions play significant roles in dynamic fracture.     

梯度非均匀有限层-基结构界面裂纹动态断裂的数值分析

研究了具有一个界面裂纹的有限尺寸梯度非均匀层-基结构在面内冲击载荷作用下的动态响应问题;提出了分析这类问题的一种数值方法,其核心是计算具有一定宽度的裂缝位移场,通过对到缝端距离及缝宽的双重插值求裂尖处动态应力强度因子。文中对涂层是弹性模量及密度连续变化的梯度非均匀材料,基体是各向同性均匀材料的层-基结构作了具体计算,数值结果清楚地显示出动态应力强度因子的时程变化规律,及有关参数(梯度参数,层厚,层长)对它的影响。     

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针对多孔介质网状纤维的渗流和生物体内组织液流动等问题，研究多孔介质中圆柱 方形阵列的低$Re$流动，以及流动所导致的圆柱表面的剪切应力. 鉴于迄今为止的研究均限于 圆柱实体模型的情况，重点分析将圆柱实体模型推广到可渗透时所导致的流动特性和表 面剪切应力的变化. 可渗透圆柱及圆柱阵列之间的间隙物使用具有不同渗透率的多孔介质模 型，基于Brinkman方程，配以适当的边界条件，采用有限体积法进行数值求解. 计算结果表 明，圆柱的渗透特性改变了流场的流动特性，显著减小了流动在圆柱表面所产生的剪切应力， 改变了阵列的渗透性.