离子轰击引起的表面形貌对Ag的溅射产额的影响

用捕获膜技术和卢瑟福背散射(RBS)谱仪测定Ag靶在27keV Ar⁺离子轰击下的溅射原子角分布,从而确定不同剂量下Ag的溅射产额,并对其靶点表面形貌进行扫描电子显微镜(SEM)观察。结果发现,所有的角分布都呈over-cosine形状,但其溅射产额却随着表面形貌不同而不同。根据溅射产额Y与轰击离子入射角φ变化关系,讨论不同轰击剂量下溅射产额的差别,肯定了表面形貌是影响溅射产额的一个重要因素,并由此提出“表观产额”的新概念。 关键词：     

NiPd合金在升温过程中择尤溅射的研究

用卢瑟福背散射技术,测定了NiPd(48.2wt%Pd)合金在不同温度时的溅射原子角分布,从而确定了Ni和Pd原子的部分产额随样品温度的变化关系。结果发现:Ni和Pd的部分溅射产额在居里温度附近均有较大变化,而且Pd的产额变化幅度比Ni的变化幅度大;Ni是择尤溅射元素,但是在磁相转变过程中,其择尤溅射程度却随样品温度的升高而减小。经讨论后指出,上述现象可能是由于在磁相转变过程中原子表面结合能减小和离子轰击引起的表面偏析共同引起的。 关键词：     

高电荷态离子^207Pb^36＋与金属Nb表面作用产生的二次离子产额

本文报道了利用兰州重离子加速器国家实验室ECR源引出的高电荷态离子^207Pb^36＋入射到金属Nb表面产生二次离子溅射的实验测量结果，实验发现。二次离子产额Y随入射初动能B的增加有先增加后减小的关系，二次离子产额有一个峰值。理论分析认为，这一过程是势能沉积作用与线性级联碰撞过程协同作用的结果。     

高电荷态离子207Pb36+与金属Nb表面作用产生的二次离子产额

本文报道了利用兰州重离子加速器国家实验室ECR源引出的高电荷态离子207Pb36+入射到金属Nb表面产生二次离子溅射的实验测量结果.实验发现,二次离子产额Y随入射初动能Ek的增加有先增加后减小的关系,二次离子产额有一个峰值.理论分析认为,这一过程是势能沉积作用与线性级联碰撞过程协同作用的结果.     

替位杂质对低能Pt原子与Pt(111)表面相互作用影响的分子动力学模拟

采用嵌入原子方法的原子间相互作用势，通过分子动力学方法模拟了低能Pt原子与Cu，Ag，Au，Ni，Pd替位掺杂Pt(111)表面的相互作用过程，系统研究了替位原子对表面吸附原子产额、溅射产额和空位缺陷产额的影响规律，分析了低能沉积过程中沉积原子与基体表面的相互作用机理以及替位原子的作用及其影响规律.研究结果显示：替位原子的存在不仅影响着沉积能量较低时的表面吸附原子的产额与空间分布，而且对沉积能量较高时的低能表面溅射过程和基体表面空位的形成产生重要影响.替位原子导致的表面吸附原子产额、表面原子溅射以及空位形 关键词： 分子动力学 低能粒子 替位掺杂 表面原子产额 溅射 空位     

Al-50wt% Sn合金的离子溅射研究

用捕获膜技术和卢瑟福背散射(RBS)分析,测定Al-Sn多相合金在30keV Ar⁺离子轰击时Al和Sn的溅射原子角分布。溅射后的样品用扫描电子显微镜(SEM)进行观察,并用电子微探针分析仪(EPMA)对轰击样品(靶点)和未轰击样品作成分分析。结果表明,Al的溅射原子角分布近于cosine形状,而Sn却是over-cosine型角分布。本文给出一个按不同表面形貌特征划分的各元素富集区i进行叠加的产额表达式,Y(θ)=∑Y_i(θ),解释了实验结果。 关键词：     

高电荷态离子207Pb36+与金属Nb表面作用产生的二次离子产额

本文报道了利用兰州重离子加速器国家实验室的ECR离子源引出的高电荷态离子207Pb36 入射到金属Nb表面产生的二次离子的实验测量结果.实验发现,二次离子产额Y随入射初动能Ek的增加有先增加后减小的关系,在初动能为576 keV时二次离子产额达到最大.通过对实验点做高斯拟合发现,曲线峰值对应的入射初动能为602 keV.分析表明,这是势能沉积作用与线性级联碰撞过程协同作用的结果.高电荷态离子本身携带的高势能沉积在靶表面引起势能溅射,促进了二次离子的发射;而主导二次离子溅射的过程是动能溅射,它与靶表面的动量沉积(核能损)过程密切相关.     

低能Pt原子与Pt(111)表面相互作用的分子动力学模拟

利用分子动力学模拟方法详细研究了低能Pt原子与Pt(111)表面的相互作用所导致的表面吸附原子、溅射原子、表面空位的产生及分布规律,给出了表面吸附原子产额、溅射原子产额和表面空位产额随入射Pt原子能量的变化关系.模拟结果显示:溅射产额、表面吸附原子产额和表面空位产额随入射原子的能量的增加而增加,溅射原子、表面吸附原子的分布花样呈3度旋转对称性质;当入射粒子能量高于溅射阈值时,表面吸附原子主要是基体最表面原子的贡献,入射粒子直接成为表面吸附原子的概率很小.其主要原因是:当入射粒子能量高于溅射能量阈值时,入射 关键词： 分子动力学 低能粒子 表面原子产额 空位缺陷 溅射     

低速Xe~(q+)(4≤q≤20)离子与Ni表面碰撞中的光辐射

实验中测量了0.38V_(Bohr)(460 keV)高电荷态Xe~(q+)(4≤q≤20)离子轰击高纯Ni表面发射的400-510 nm光谱.实验结果包括NiⅠ原子谱线,NiⅡ离子谱线,以及入射离子中性化发射的XeⅠ,XeⅡ和XeⅢ谱线.研究了谱线XeⅡ410.419,XeⅢ430.444,XeⅡ434.200,XeⅡ486.254,NiⅠ498.245,NiⅠ501.697,NiⅠ503.502,NiⅠ505.061和NiⅠ508.293 nm的光子产额随着入射离子电荷态的变化.结果表明,入射离子中性化和溅射Ni原子发射谱线的光子产额随着入射离子电荷态的增加而增加,其趋势与入射离子势能一致.     

快中子引起的背向溅射

描述了用实验方法测量快中子引起的背向溅射,测量了Mg、Al、Sc、V、Fe、CO、Cu、Zr、Au和316型不锈钢等10种材料的背向溅射产额,并与正向产额进行了比较,发现背向和正向溅射产额的比值与核反应的类型有关.本实验的结果同其它小组的结果进行了比较,并用溅射理论对实验结果进行了解释.     

Sputtering of A 3 B 5 materials (GaP, GaAs, GaSb, InP, and InSb) by 2-to 14-keV N 2 + ions

Investigations of the general characteristics and distinctive features of sputtering of A ³ B ⁵ materials (GaP, GaAs, GaSb, InP and InSb) under bombardment with N ₂ ⁺ ions have been carried out. From the experimental data, dependences of the sputtering yield of these materials on the incidence angle and ion energy have been obtained and the surface relief patterns produced by target etching have been studied. It has been shown that the dependence on energy of the sputtering yield for GaP, GaAs, and InP can be adequately described by the Haffa-Switkovski formula for binary materials and Yudin’s approximation for elemental targets. Sputtering of GaSb and InSb proceeds in the surface layer recrystallization mode, and the sputtering yield agrees with calculations based on Onderlinden’s model. From a comparison of the experimental and calculated dependences, the surface bonding energies have been determined.     

On the influence of reactive gases on sputtering and secondary ion emission

As a continuation of earlier sputtering yield measurements in an ion microprobe, the influence of oxygen and nitrogen on sputtering yield, ionisation efficiency and depth resolutions has been studied. For inert gas bombardment the yield of Ti and V falls sharply at a certain oxygen exposure. While this decrease in yield can be correlated with an increase in surface binding energy in the case of titanium, cone formation causes the yield to drop for oxygen exposed vanadium. In contrast, during nitrogen bombardment the only effect of oxygen exposure is a drastic increase of the ionisation efficiency; the sputtering yield or the depth resolution Δz/z is hardly influenced by oxygen coverage. As was observed earlier in the case of Cu?Ni layers, Δz is essentially constant for erosion depthsz?800 Å, thus yielding better resolution at large depths than is to beexpected from a sequential layer removal model. The extent of the transition zone Δz, is determined by surface topography and thus depends on the target composition as well as its structure.     

Determination of angle dependence of sputtering yield for a multicomponent target by the time characteristics of the sputtering process

A method for determining the variations of sputtering yield of multicomponent target based on studies of time characteristics of the sputtered particles flux has been proposed and tested on an example of the angle dependence of sputtering yield. Time dependences of variation in the fluxes of the sputtered atoms of multicomponent oxides at different incidence angles of Ar ions were studied. Angular dependences of the sputtering yield for these compounds were obtained by direct measurements and computations. It has been shown that the angular dependence of the sputtering yield in a stationary mode can be obtained from the time dependences of the fluxes of the sputtered particles.     

Calculation of ion and fast atom contributions to the sputtering non-uniformity of the target with a surface relief in glow discharge

The energy spectra of ion and fast atom flows at the target with a periodical surface relief of small amplitude in glow discharge are calculated. Distributions of the effective sputtering yield of the target and the sputtered atom flow density along its surface are found. It is shown that contributions of the fast atom flow non-uniformity in them are much less than that of the ion flow non-uniformity and may not be taken into account in the simulation of target sputtering in glow discharge when its surface relief element dimensions are small in comparison with the discharge cathode sheath length.     

Influence de la chimisorption de l'oxygéne et l'azote sur l'émission ionique secondaire d'échantillons monocristallins de nickel et d'alliage nickel-chrome

The influence of an active gas adsorption on the secondary ion emission yields of a mono-crystalline target bombarded with a primary argon beam has been investigated. On the one hand, the chemisorption changes the electronic structure on the surface metal atoms and increases the positive ion emission yields, on the other hand, channeling conditions of the primary ions through the target lattice are modified according to the relation of the chemisorbed layer with the metal lattice. Two samples were examinated: pure nickel and a nickel chromium alloy in either an oxygen or a nitrogen partial pressure. Important modifications of the coverage are due to the sputtering yield variations. The experiments described here suggest that secondary ion emission could be used for chemisorption studies.     

Sputtering in the high-voltage electron microscope

The 1.0 MeV electron microscope has been used to observe and analyse transmission sputtering caused by the electrons in the incident beam. The method, reviewed here, is particularly suitable for investigating low energy collision events. Total sputtering yields and angular distributions of sputtered atoms have been measured for (111) gold films to within a few eV of the sputtering threshold energy. It is shown that the results can be explained by the sputtering of surface atoms either directly by electrons, or indirectly by collision sequences generated down 〈110〉 directions. The necessity of using a many-body collision model to interpret the results is stressed. High resolution electron microscopy has been used to study the surface structure of (111) gold films during sputtering on a near-atomic level. It is shown how the results confirm a model where surface roughness develops due to the migration and agglomeration of surface vacancies produced during sputtering. The future scope of the 1.0 MeV electron microscope as an analytical tool for sputtering is also discussed. It is suggested that the rôle of long range focussed collision sequences in sputtering may be determined for materials of medium atomic number. A need for further high resolution studies of sputtered surfaces is identified; such studies are seen as complementary to those by other surface analysis techniques.     

Pt(111)表面低能溅射现象的分子动力学模拟

利用嵌入原子方法的原子间相互作用势，通过分子动力学模拟，详细研究了贵金属原子在Pt (111)表面的低能溅射现象.模拟结果显示：对于垂直入射情况，入射原子的质量对Pt (11 1)表面的溅射阈值影响不大.当入射原子的能量小于溅射阈值时，入射原子基本以沉积为主 ；当入射原子的能量大于溅射阈值时，溅射产额随入射原子能量的增加而线性增大；当入射 原子能量达到200 eV时，各种入射原子的溅射产额都达到或接近1，此时入射原子主要起溅 射作用.溅射原子发射的角分布概率和溅射花样与高能溅射相类似.研究表明：与基于二体碰 撞近似的线性级联溅射理论不同，当入射原子能量大于溅射阈值时，低能入射原子的溅射产 额正比于入射原子的约化能量和入射原子与基体原子的质量比.通过对低能入射原子的钉扎 能力分析，提出了支配低能溅射的入射原子反射物理机理. 关键词： 分子动力学模拟、低能溅射     

Experimental investigation on divertor tungsten sputtering with neon seeding in ELMy H-mode plasma in EAST tokamak

Neon (Ne) seeding is used to cool the edge plasma by radiation to protect the divertor tungsten (W) target in the Experimental Advanced Superconducting Tokamak (EAST). The W sputtering in the outer divertor target with Ne seeding is assessed by the divertor visible spectroscopy system. It is observed that the W sputtering flux initially increases with Ne concentration in the divertor despite the decreasing plasma temperature. After reaching a maximum around 25 eV, the W sputtering rate starts to decrease, presenting a suppression effect. The effect on the divertor W sputtering flux and yield due to the competition between the increase of the Ne concentration and the decrease of the plasma temperature is discussed. The results show that enough Ne seeding is essential to effectively reduce the electron temperature and thus to suppress W sputtering. Moreover, ELM suppression is observed when Ne and W impurities enter the core plasma, which could be correlated to the enhanced turbulence transport in the pedestal.     

STM and AES study of the relation between ion sputter induced roughness and depth resolution

Scanning tunneling microscopy has been applied to characterize the enhancement of surface roughness by ion sputtering. A certified Ni/Cr multilayer film was employed as a target. It was found that the roughness induced by ion sputtering increased with the increase of sputtered depth, and that this increase in roughness accounted for most of the reduction in depth resolution in Auger depth profiling.